JPH0541546Y2 - - Google Patents

Info

Publication number
JPH0541546Y2
JPH0541546Y2 JP11444884U JP11444884U JPH0541546Y2 JP H0541546 Y2 JPH0541546 Y2 JP H0541546Y2 JP 11444884 U JP11444884 U JP 11444884U JP 11444884 U JP11444884 U JP 11444884U JP H0541546 Y2 JPH0541546 Y2 JP H0541546Y2
Authority
JP
Japan
Prior art keywords
processed
vacuum
chamber
drying
load lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11444884U
Other languages
Japanese (ja)
Other versions
JPS6130233U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11444884U priority Critical patent/JPS6130233U/en
Publication of JPS6130233U publication Critical patent/JPS6130233U/en
Application granted granted Critical
Publication of JPH0541546Y2 publication Critical patent/JPH0541546Y2/ja
Granted legal-status Critical Current

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  • Drying Of Solid Materials (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は半導体基板やマスク基板等を処理する
真空室に搬入する前に被処理体の乾燥を行えるよ
うにした真空処理装置に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a vacuum processing apparatus capable of drying objects to be processed before carrying them into a vacuum chamber for processing semiconductor substrates, mask substrates, etc.

半導体装置の製造においては、半導体基板やマ
スク基板等を真空中で処理する工程は、例えばエ
ツチング、露光、イオン注入、スパツタ、蒸着等
があり、その数は極めて多い。
In the manufacture of semiconductor devices, there are an extremely large number of processes for processing semiconductor substrates, mask substrates, etc. in vacuum, such as etching, exposure, ion implantation, sputtering, and vapor deposition.

さらに上記の基板の他に、場合により半製品ま
たは完成品を真空処理することもある。
Furthermore, in addition to the above-mentioned substrates, semi-finished products or finished products may be subjected to vacuum treatment in some cases.

このような真空処理を行うときは、処理毎に被
処理体を真空室に入れ所定の真空度まで排気する
ので、排気に時間がかかりすぎると、工程の損失
時間が大きくなるため、一般には被処理体を乾燥
してから真空室に入れるようにしている。
When performing such vacuum processing, the object to be processed is placed in a vacuum chamber and evacuated to a predetermined degree of vacuum for each process, so if evacuation takes too long, the loss of time in the process will increase, so generally The object to be processed is dried before being placed in the vacuum chamber.

被処理体に水分が吸着していると、排気の際真
空度が良くなるに従つてその脱着速度がおそくな
り、所定の真空度に到達するのに長時間を要する
ことになる。
If moisture is adsorbed on the object to be processed, as the degree of vacuum improves during evacuation, the rate of desorption will slow down, and it will take a long time to reach a predetermined degree of vacuum.

そのため真空室に搬入する前の被処理体の乾燥
方法が種々検討されている。
For this reason, various methods of drying the object to be processed before transporting it into a vacuum chamber have been studied.

〔従来の技術〕[Conventional technology]

第3図は従来例による被処理体の乾燥方法を説
明する装置の断面図である。
FIG. 3 is a sectional view of an apparatus illustrating a conventional method of drying an object to be processed.

図において、被処理体1を窒素室2の中に設け
られた搬送ベルト3の上に載せる。窒素室2には
乾燥窒素を10〜20/min程度流す。
In the figure, an object to be processed 1 is placed on a conveyor belt 3 provided in a nitrogen chamber 2. Dry nitrogen is flowed into the nitrogen chamber 2 at a rate of about 10 to 20/min.

被処理体1は十分乾燥された後、ゲートバルブ
4を開いて真空ロードロツク室5に送られる。
After the object 1 to be processed is sufficiently dried, the gate valve 4 is opened and the object 1 is sent to the vacuum load lock chamber 5.

ついでゲートバルブ4を閉じ、真空ロードロツ
ク室5を排気する。このような場合は、被処理体
1を大気中より直接入れた場合に比し、排気時間
は被処理体の表面積が大きいほど短縮される。
Then, the gate valve 4 is closed and the vacuum load lock chamber 5 is evacuated. In such a case, compared to the case where the object to be processed 1 is introduced directly from the atmosphere, the exhaust time is reduced as the surface area of the object to be processed becomes larger.

真空ロードロツク室5が所定の真空度に到達後
ゲートバルブ6を開けて、被処理体1は既に所定
の真空度まで排気された真空室7に送られる。つ
いでゲートバルブ6を閉じ、被処理体1は処理さ
れる。
After the vacuum load lock chamber 5 reaches a predetermined degree of vacuum, the gate valve 6 is opened and the object to be processed 1 is sent to the vacuum chamber 7 which has already been evacuated to a predetermined degree of vacuum. Then, the gate valve 6 is closed and the object 1 to be processed is processed.

被処理体1としてマスク基板のホルダのような
表面積の大きなものを、大気中から直接真空ロー
ドロツク室5に搬入する場合は、大気中の水分が
ホルダ表面に付着しているので排気時間は特に大
きくなるため、前乾燥による効果は大きい。
When an object with a large surface area, such as a holder for a mask substrate, is transported directly from the atmosphere into the vacuum load lock chamber 5 as the object to be processed 1, the evacuation time is particularly long because moisture in the atmosphere adheres to the holder surface. Therefore, the effect of pre-drying is large.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

以上のように窒素室2を設けることにより、排
気時間は短縮されるが、搬送ベルト3を内蔵した
窒素室2は大型化され、使用する窒素等の乾燥気
体の消費量も大きいという欠点がある。
By providing the nitrogen chamber 2 as described above, the exhaust time is shortened, but the nitrogen chamber 2 with the built-in conveyor belt 3 becomes larger and has the disadvantage that the amount of dry gas such as nitrogen used is also large. .

〔問題点を解決するための手段〕[Means for solving problems]

上記問題点の解決は、真空処理室と、該真空処
理室にゲールバルブを介して結合されたロードロ
ツク室と、該ロードロツク室へ大気中から被処理
体を搬入するための搬送装置と、該搬送装置の周
囲に設けられた乾燥ガス吹き出し口とを具備し、
該被処理体を該ロードロツク室へ搬送する直前の
大気中で該被処理体の乾燥処理を行うようにした
本考案による真空処理装置により達成される。
The solution to the above problem is to provide a vacuum processing chamber, a loadlock chamber connected to the vacuum processing chamber via a Gale valve, a transfer device for carrying the object to be processed into the loadlock chamber from the atmosphere, and the transfer device. It is equipped with a dry gas outlet provided around the
This is achieved by the vacuum processing apparatus according to the present invention, which performs a drying process on the object to be processed in the atmosphere immediately before transporting the object to the load lock chamber.

〔作用〕[Effect]

本考案者により、被処理体を真空室に搬入する
前に、被処理体に乾燥気体を吹きつけて乾燥する
際、ノズルと気体の流速を選ぶことにより、真空
ロードロツク室の排気速度は従来例の窒素室経由
で被処理体を搬入した場合と同程度の効果が得ら
れ、かつ乾燥気体の消費量も少なくてすむことが
分かつた。
The inventor of the present invention discovered that when drying the object by blowing dry gas onto it before transporting the object into the vacuum chamber, by selecting the nozzle and the flow rate of the gas, the evacuation speed of the vacuum load lock chamber can be reduced compared to conventional methods. It was found that the same effect as when the object to be processed was carried in via a nitrogen chamber was obtained, and the amount of drying gas consumed was also small.

乾燥の効果が現れているかどうかは、次のよう
に判定した。
Whether or not the drying effect appeared was determined as follows.

いま、被処理体1がシヤワ8を通過する時間は
処理のスループツトを維持する関係であまり大き
くすることはできないため従来と同じにして一定
とすると、乾燥条件は前記のようにノズルと気体
の流速を選んで設定する。シヤワのノズルの形状
と配列が決まれば流速はシヤワに供給する気体の
流量と温度に依存し、その流量はロードロツク室
の目標真空度に到達する時間が飽和して最小値に
達するような値に設定する。
Now, the time it takes for the object to be processed 1 to pass through the shower 8 cannot be increased too much in order to maintain the processing throughput, so if it is kept constant as in the past, the drying conditions are set by changing the nozzle and gas flow rate as described above. Select and set. Once the shape and arrangement of the nozzles of the shower are determined, the flow rate depends on the flow rate and temperature of the gas supplied to the shower, and the flow rate is set to a value that saturates and reaches the minimum value in the time it takes to reach the target vacuum level in the load lock chamber. Set.

さらに被処理体が真空ロードロツク室に入ると
きにのみ、乾燥気体を吹きつけるようにすれば、
乾燥気体の消費を一層節約できる。
Furthermore, if the drying gas is blown only when the object to be processed enters the vacuum load lock chamber,
Drying gas consumption can be further reduced.

〔実施例〕〔Example〕

第1図は本考案による被処理体の乾燥方法を説
明する装置の断面図である。
FIG. 1 is a cross-sectional view of an apparatus for explaining the method of drying objects to be processed according to the present invention.

図において、被処理体1は搬送ベルト3の上に
載せられ、上下より乾燥窒素を吹き出すノズル群
を有するシヤワ8により十分乾燥された後、ゲー
トバルブ4を開いて真空ロードロツク室5に送ら
れる。
In the figure, the object to be processed 1 is placed on a conveyor belt 3, and after being thoroughly dried by a shower 8 having a group of nozzles that blow out dry nitrogen from above and below, the object 1 is sent to a vacuum load lock chamber 5 by opening a gate valve 4.

乾燥の効果が現れるためには、前記のようにシ
ヤワに供給する気体の流量を、ロードロツク室の
目標真空度に到達する時間が飽和して最小値る達
する様な値に設定する必要がある。
In order for the drying effect to appear, the flow rate of the gas supplied to the shower must be set to a value such that the time required to reach the target degree of vacuum in the load lock chamber saturates and reaches the minimum value.

本実施例に於ける上記シヤワ8の諸条件は、以
下の通りである。
Conditions of the shower 8 in this embodiment are as follows.

シヤワ穴径……0.5mm シヤワ穴数……200個 流速……4 m/sec ガス総流量……10 /min 通過時間……約5秒間 ついでゲートバルブ4を閉じ、真空ロードロツ
ク室5を排気する。この場合も従来例同様に、被
処理体1を大気中より直接入れた場合に比し、排
気時間は短縮される。
Shower hole diameter...0.5mm Number of shower holes...200 Flow rate...4 m/sec Total gas flow rate...10/min Passage time...approximately 5 seconds Then, gate valve 4 is closed and vacuum load lock chamber 5 is evacuated. . In this case, as in the conventional example, the evacuation time is shortened compared to the case where the object to be processed 1 is introduced directly from the atmosphere.

例えば、大気中に約10分間放置した被処理体の
場合、大気中からロードロツク室に直接入れた場
合に比し、排気時間は約30%短縮された。
For example, in the case of a workpiece left in the atmosphere for about 10 minutes, the evacuation time was reduced by about 30% compared to when it was placed directly into the load lock chamber from the atmosphere.

真空ロードロツク室5が所定の真空度に到達後
ゲートバルブ6を開けて、被処理体1は既に所定
の真空度まで排気された真空室7に送られる。つ
いでゲートバルブ6を閉じ、被処理体1は処理さ
れる。
After the vacuum load lock chamber 5 reaches a predetermined degree of vacuum, the gate valve 6 is opened and the object to be processed 1 is sent to the vacuum chamber 7 which has already been evacuated to a predetermined degree of vacuum. Then, the gate valve 6 is closed and the object 1 to be processed is processed.

実施例ではシヤワ8は被処理体1の上下に設け
たが、被処理体1の形状によつては上下左右に設
ける必要がある。
In the embodiment, the showers 8 are provided above and below the object 1 to be processed, but depending on the shape of the object 1 to be processed, it may be necessary to provide them at the top, bottom, left and right.

第2図はその例を示す搬送ベルト3の側断面図
である。
FIG. 2 is a side sectional view of the conveyor belt 3 showing an example of this.

〔考案の効果〕[Effect of idea]

以上説明したように本考案によれば、排気時間
は短縮され、搬送ベルトを内蔵した窒素室を設け
た従来例のように装置は大型化されず、乾燥気体
の消費量は少なくてすむ。
As explained above, according to the present invention, the exhaust time is shortened, the apparatus does not need to be enlarged unlike the conventional example in which a nitrogen chamber with a built-in conveyor belt is provided, and the amount of drying gas consumed can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による被処理体の乾燥方法を説
明する装置の断面図、第2図は搬送ベルトおよび
シヤワの側断面図、第3図は従来例による被処理
体の乾燥方法を説明する装置の断面図である。 図において、1は被処理体、2は窒素室、3は
搬送ベルト、4,6はゲートバルブ、5は真空ロ
ードロツク室、7は真空室、8はシヤワを示す。
Fig. 1 is a sectional view of an apparatus for explaining a method of drying objects to be processed according to the present invention, Fig. 2 is a side sectional view of a conveyor belt and a shower, and Fig. 3 is an illustration of a conventional method for drying objects to be processed. FIG. 2 is a cross-sectional view of the device. In the figure, 1 is an object to be processed, 2 is a nitrogen chamber, 3 is a conveyor belt, 4 and 6 are gate valves, 5 is a vacuum load lock chamber, 7 is a vacuum chamber, and 8 is a shower.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空処理室と、該真空処理室にゲートバルブを
介して結合されたロードロツク室と、該ロードロ
ツク室へ大気中から被処理体を搬入するための搬
送装置と、該被処理体を該ロードロツク室へ搬送
する直前で該被処理体に乾燥ガスを吹きつけるノ
ズル群を有するシヤワとを具備することを特徴と
する真空処理装置。
A vacuum processing chamber, a loadlock chamber coupled to the vacuum processing chamber via a gate valve, a transfer device for transporting the object to be processed from the atmosphere into the loadlock chamber, and a transfer device for transporting the object to be processed into the loadlock chamber. 1. A vacuum processing apparatus comprising: a shower having a nozzle group for spraying dry gas onto the object to be processed immediately before transporting the object.
JP11444884U 1984-07-27 1984-07-27 Vacuum processing equipment Granted JPS6130233U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11444884U JPS6130233U (en) 1984-07-27 1984-07-27 Vacuum processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11444884U JPS6130233U (en) 1984-07-27 1984-07-27 Vacuum processing equipment

Publications (2)

Publication Number Publication Date
JPS6130233U JPS6130233U (en) 1986-02-24
JPH0541546Y2 true JPH0541546Y2 (en) 1993-10-20

Family

ID=30673466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11444884U Granted JPS6130233U (en) 1984-07-27 1984-07-27 Vacuum processing equipment

Country Status (1)

Country Link
JP (1) JPS6130233U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6384238B2 (en) * 2014-09-29 2018-09-05 日立金属株式会社 Dryer and magnet piece drying method using the same

Also Published As

Publication number Publication date
JPS6130233U (en) 1986-02-24

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