JPH0539662Y2 - - Google Patents

Info

Publication number
JPH0539662Y2
JPH0539662Y2 JP1986023389U JP2338986U JPH0539662Y2 JP H0539662 Y2 JPH0539662 Y2 JP H0539662Y2 JP 1986023389 U JP1986023389 U JP 1986023389U JP 2338986 U JP2338986 U JP 2338986U JP H0539662 Y2 JPH0539662 Y2 JP H0539662Y2
Authority
JP
Japan
Prior art keywords
cooling plate
cooling
refrigerant
ring
flange portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986023389U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62135495U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986023389U priority Critical patent/JPH0539662Y2/ja
Publication of JPS62135495U publication Critical patent/JPS62135495U/ja
Application granted granted Critical
Publication of JPH0539662Y2 publication Critical patent/JPH0539662Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1986023389U 1986-02-20 1986-02-20 Expired - Lifetime JPH0539662Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986023389U JPH0539662Y2 (enExample) 1986-02-20 1986-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986023389U JPH0539662Y2 (enExample) 1986-02-20 1986-02-20

Publications (2)

Publication Number Publication Date
JPS62135495U JPS62135495U (enExample) 1987-08-26
JPH0539662Y2 true JPH0539662Y2 (enExample) 1993-10-07

Family

ID=30821654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986023389U Expired - Lifetime JPH0539662Y2 (enExample) 1986-02-20 1986-02-20

Country Status (1)

Country Link
JP (1) JPH0539662Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068657U (ja) * 1983-10-18 1985-05-15 富士通株式会社 半導体集積回路装置の冷却構造

Also Published As

Publication number Publication date
JPS62135495U (enExample) 1987-08-26

Similar Documents

Publication Publication Date Title
EP4275104B1 (en) Actively cooled heat-dissipation lids for computer processors and processor assemblies
US4791983A (en) Self-aligning liquid-cooling assembly
EP0219674B1 (en) Cooling device for electronic parts
EP0215947B1 (en) Electronic module with self-activated heat pipe
US20080019102A1 (en) Device for increased thermal conductivity between a printed wiring assembly and a chassis
US4712158A (en) Cooling system for electronic circuit components
US6230791B1 (en) Heat transfer cold plate arrangement
EP0297894A2 (en) Thermal package for electronic components
US12150277B2 (en) Hybrid heat sink
US11006548B2 (en) Method and device to provide uniform cooling in rugged environments
JPH0539662Y2 (enExample)
JPH0530394Y2 (enExample)
US20240237309A1 (en) Automotive liquid-cooling cooler structure
CN220986011U (zh) 电源装置、服务器节点以及服务器
JPH07227634A (ja) コールドプレート及びその製造方法
KR102343882B1 (ko) 반도체 공정용 칠러시스템
CN224052568U (zh) 一种risc-v嵌入式分布控制模块
CN218603845U (zh) 一种防腐蚀防盐雾机柜的散热结构
JPH06188345A (ja) 半導体チップの冷却構造
CN223957828U (zh) 液冷散热板
US20230127088A1 (en) Seal for thermal interface material of power electronics modules
JPH02197156A (ja) Ｌｓｉケースの冷却構造
JPH0310704Y2 (enExample)
CN121531555A (zh) 电路模块、电控散热组件以及暖通设备
JPH04336500A (ja) 伝導冷却構造