JPH0536855U - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPH0536855U JPH0536855U JP9091491U JP9091491U JPH0536855U JP H0536855 U JPH0536855 U JP H0536855U JP 9091491 U JP9091491 U JP 9091491U JP 9091491 U JP9091491 U JP 9091491U JP H0536855 U JPH0536855 U JP H0536855U
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor device
- resin
- main body
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 光半導体装置の指向性を広げ、小型化を計る
ことを目的とする。
【構成】 光半導体素子２を搭載する凹状底部を有する
樹脂部本体１にメッキにより電極４，５を形成し、透光
性樹脂６で光半導体素子２を封止した光半導体装置にお
いて、電極を有しない樹脂部本体の側壁を取除いて側面
からも光を授受できるように構成した。
(57) [Summary] (Modified) [Purpose] The purpose is to broaden the directivity of optical semiconductor devices and reduce their size. In an optical semiconductor device in which electrodes 4 and 5 are formed by plating on a resin portion main body 1 having a concave bottom portion on which an optical semiconductor element 2 is mounted and the optical semiconductor element 2 is sealed with a translucent resin 6, the electrodes are The side wall of the resin main body, which is not included, is removed so that light can be transmitted and received from the side surface.
Description
【０００１】[0001]
本考案は光信号と電気信号の変換を行なう光半導体装置に関する。 The present invention relates to an optical semiconductor device for converting an optical signal and an electric signal.
【０００２】[0002]
図３は従来のこの種の光半導体装置の一例の構造を示す斜視図である。 図３において、１は樹脂部本体、２は光半導体素子、３はリード、４はコレク タ電極、５はエミッタ電極、６は透光性樹脂である。 樹脂部本体を凹面とし、メッキによりコレクタ電極４、エミッタ電極５を形成 し、光半導体素子２をコレクタ電極４に搭載し、リード３によって、エミッタ電 極５に接続し、樹脂部本体の凹面内部を透光性樹脂６でモールディングしたもの である。 FIG. 3 is a perspective view showing the structure of an example of a conventional optical semiconductor device of this type. In FIG. 3, 1 is a resin portion main body, 2 is an optical semiconductor element, 3 is a lead, 4 is a collector electrode, 5 is an emitter electrode, and 6 is a translucent resin. The resin body is made concave, the collector electrode 4 and the emitter electrode 5 are formed by plating, the optical semiconductor element 2 is mounted on the collector electrode 4, and the lead 3 is connected to the emitter electrode 5, and the inside of the resin body is made concave. Is molded with a translucent resin 6.
【０００３】[0003]
上記のような従来のこの種の光半導体装置では、光の授受は上面のみにて行わ れるため、使用が制限されることがあり、また、複数個並べて使用する場合に、 側壁の幅がピッチを狭めることになり、必要な数量を基板に取り付けられなくな ることがあった。本考案は上記の問題を解決し、側面からも光を授受することが でき、より狭いピッチで使用できるものを提供することを目的とする。 In the conventional optical semiconductor device of this type as described above, since light is transmitted and received only on the upper surface, use may be limited. It was difficult to attach the required quantity to the board. An object of the present invention is to solve the above-mentioned problems, to provide light which can be transmitted and received from the side, and which can be used at a narrower pitch.
【０００４】[0004]
本考案は上記目的を達成するために、電極を有しない樹脂部本体の側壁を取り 除き、側面からも光を授受できるように構成したものである。 In order to achieve the above object, the present invention is configured such that the side wall of the resin portion main body having no electrode is removed and light can be transmitted and received from the side surface.
【０００５】[0005]
図１は本考案の一実施例を示す斜視図である。図において図３と同一の符号は 同一または相当するものを示す。 図１のように構成すると、光の授受は樹脂部本体１の上面と側壁の存在しない 側面から行うことが可能になり、横に並べて使用する場合、従来の構造のものよ りピッチが狭くなる。 FIG. 1 is a perspective view showing an embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 3 denote the same or corresponding parts. With the configuration shown in FIG. 1, it is possible to transmit and receive light from the upper surface of the resin body 1 and the side surface where there is no side wall, and when used side by side, the pitch is narrower than that of the conventional structure. ..
【０００６】 図２は本考案の他の実施例を示す斜視図である。図において各符号は図１の同 一符号が示すものと同一または相当するものを示す。光を授受できる側面に平行 に搭載された実施例である。FIG. 2 is a perspective view showing another embodiment of the present invention. In the figure, each reference numeral is the same as or equivalent to that shown by the same reference numeral in FIG. This is an embodiment mounted in parallel with the side surface capable of transmitting and receiving light.
【０００７】 従来の透光性樹脂のモールディングは光半導体装置の個々に行なっていたが、 樹脂部本体の側壁を取り除くことにより複数の光半導体素子を連結することがで き、透光性樹脂を一度のモールディングで行なうことが可能となる。 図２には光半導体素子が３個連結した例を示した。複数の光半導体装置を個々 の光半導体装置に分断する方法によって、必要に応じて任意のチャンネル数の光 半導体装置が容易に得られる。Conventionally, the light-transmitting resin is molded individually in the optical semiconductor device. However, by removing the side wall of the resin portion main body, a plurality of light-semiconductor elements can be connected, and the light-transmitting resin is molded. It can be done with a single molding. FIG. 2 shows an example in which three optical semiconductor elements are connected. By a method of dividing a plurality of optical semiconductor devices into individual optical semiconductor devices, an optical semiconductor device having an arbitrary number of channels can be easily obtained as needed.
【０００８】[0008]
以上説明したように、本考案によれば、指向性が広くなり、小型になるととも に、容易に任意のチャンネル数の光半導体装置が得られ、利用性が高くなるとい う効果がある。 As described above, according to the present invention, the directivity is widened, the size is reduced, and an optical semiconductor device having an arbitrary number of channels can be easily obtained, and the utility is improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
【図２】本考案の他の実施例を示す斜視図である。FIG. 2 is a perspective view showing another embodiment of the present invention.
【図３】従来のこの種の光半導体装置の一例の構造を示
す斜視図である。FIG. 3 is a perspective view showing a structure of an example of a conventional optical semiconductor device of this type.
１ 樹脂部本体 ２ 光半導体素子 ３ リード ４ コレクタ電極 ５ エミッタ電極 ６ 透光性樹脂 1 resin part main body 2 optical semiconductor element 3 lead 4 collector electrode 5 emitter electrode 6 translucent resin
Claims (2)
る樹脂部本体にメッキにより電極を形成し、透光性樹脂
で光半導体素子を封止した光半導体装置において、 電極を有しない樹脂部本体の側壁を取り除き、側面から
も光を授受できるように構成したことを特徴とする光半
導体装置。1. An optical semiconductor device in which an electrode is formed by plating on a resin main body having a concave bottom portion on which an optical semiconductor element is mounted and the optical semiconductor element is sealed with a transparent resin, the resin main body having no electrode. The optical semiconductor device is characterized in that the side wall of the is removed and light can be transmitted and received from the side surface.
導体素子を連結したことを特徴とする請求項１の光半導
体装置。2. The optical semiconductor device according to claim 1, wherein a plurality of optical semiconductor elements are connected in parallel to a side surface capable of transmitting and receiving light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9091491U JP2562333Y2 (en) | 1991-10-11 | 1991-10-11 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9091491U JP2562333Y2 (en) | 1991-10-11 | 1991-10-11 | Optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0536855U true JPH0536855U (en) | 1993-05-18 |
| JP2562333Y2 JP2562333Y2 (en) | 1998-02-10 |
Family
ID=14011686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9091491U Expired - Fee Related JP2562333Y2 (en) | 1991-10-11 | 1991-10-11 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2562333Y2 (en) |
-
1991
- 1991-10-11 JP JP9091491U patent/JP2562333Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2562333Y2 (en) | 1998-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |