JPH0536271Y2 - - Google Patents
Info
- Publication number
- JPH0536271Y2 JPH0536271Y2 JP1989129776U JP12977689U JPH0536271Y2 JP H0536271 Y2 JPH0536271 Y2 JP H0536271Y2 JP 1989129776 U JP1989129776 U JP 1989129776U JP 12977689 U JP12977689 U JP 12977689U JP H0536271 Y2 JPH0536271 Y2 JP H0536271Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- air cylinder
- bonding tool
- air
- regulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000002788 crimping Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989129776U JPH0536271Y2 (enrdf_load_stackoverflow) | 1989-11-07 | 1989-11-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989129776U JPH0536271Y2 (enrdf_load_stackoverflow) | 1989-11-07 | 1989-11-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0367435U JPH0367435U (enrdf_load_stackoverflow) | 1991-07-01 |
JPH0536271Y2 true JPH0536271Y2 (enrdf_load_stackoverflow) | 1993-09-14 |
Family
ID=31677382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989129776U Expired - Lifetime JPH0536271Y2 (enrdf_load_stackoverflow) | 1989-11-07 | 1989-11-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0536271Y2 (enrdf_load_stackoverflow) |
-
1989
- 1989-11-07 JP JP1989129776U patent/JPH0536271Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0367435U (enrdf_load_stackoverflow) | 1991-07-01 |
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