JPH05342930A - Manufacture of coaxial wire - Google Patents
Manufacture of coaxial wireInfo
- Publication number
- JPH05342930A JPH05342930A JP4151967A JP15196792A JPH05342930A JP H05342930 A JPH05342930 A JP H05342930A JP 4151967 A JP4151967 A JP 4151967A JP 15196792 A JP15196792 A JP 15196792A JP H05342930 A JPH05342930 A JP H05342930A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- copper
- coating
- coaxial wire
- fluororesin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は同軸ワイヤの製造法に関
する。FIELD OF THE INVENTION The present invention relates to a method of manufacturing a coaxial wire.
【０００２】[0002]
【従来の技術】同軸ワイヤは、銅等の金属導線に高周波
特性に優れるフッ素樹脂の被膜を形成し、フッ素樹脂被
膜表面に銅等の遮蔽用の金属被膜を形成したもので、高
密度化、高速化に対応した配線板の配線パタ−ン形成の
ために等で広く使用されている。従来、同軸ワイヤは金
属導線に高周波特性に優れるフッ素樹脂の被膜を形成
し、フッ素樹脂被膜表面を粗化・活性化し、めっき触媒
を付与し、無電解銅めっきにより下地銅めっきを行い、
電気銅めっきの厚付けめっきを行い金属被膜を形成して
製造している。2. Description of the Related Art A coaxial wire is one in which a metal coating such as copper is formed with a coating of fluororesin having excellent high-frequency characteristics, and a metal coating for shielding such as copper is formed on the surface of the fluororesin coating. It is widely used for forming wiring patterns on wiring boards that support higher speeds. Conventionally, the coaxial wire has a fluororesin film excellent in high-frequency characteristics formed on a metal conductor, roughens and activates the fluororesin film surface, adds a plating catalyst, and performs electroless copper plating to perform base copper plating.
It is manufactured by performing thick plating of electrolytic copper plating to form a metal film.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、フッ素
樹脂は化学的に安定でフッ素樹脂に下地用の無電解銅め
っきを、均質に、安定して行うことは容易でなく、その
ためその上に形成される厚付の銅被膜は柔軟性に欠け、
柔軟性に富む銅被膜を有する同軸ワイヤの製造は困難で
あった。従って必要な配線パタ−ンを同軸ワイヤで形成
する配線板の高密度化には自づと制限があった。本発明
は、配線板の高密度化、高速化を可能とする同軸ワイヤ
の製造法を提供するものである。However, the fluororesin is chemically stable, and it is not easy to uniformly and stably perform electroless copper plating for the undercoat on the fluororesin, and therefore the fluororesin is formed thereon. The thick copper coating lacks flexibility,
The manufacture of coaxial wires with a highly flexible copper coating has been difficult. Therefore, there has been a limitation in increasing the density of the wiring board in which the necessary wiring pattern is formed by the coaxial wire. The present invention provides a method for manufacturing a coaxial wire that enables high density and high speed wiring boards.
【０００４】[0004]
【課題を解決するための手段】本発明の同軸ワイヤの製
造法は、金属導線にフッ素樹脂被膜を形成し、フッ素樹
脂被膜表面にスッパタ法で金属薄膜を形成し、さらに電
気めっき法で金属被膜を形成することを特徴とするもの
である。The coaxial wire manufacturing method of the present invention comprises forming a fluororesin coating on a metal conductor, forming a metal thin film on the fluororesin coating surface by the sputtering method, and further electroplating the metal coating. Is formed.
【０００５】図１は、本発明の同軸ワイヤの断面図を示
すもので、１は金属導線、２はフッ素樹脂被膜、３はフ
ッ素樹脂被膜表面にスッパタ法で形成された金属薄膜、
４は電気めっき法で形成された金属被膜である。FIG. 1 is a sectional view of the coaxial wire of the present invention, in which 1 is a metal conductor wire, 2 is a fluororesin coating, 3 is a metal thin film formed on the surface of the fluororesin coating by the sputtering method,
4 is a metal coating formed by the electroplating method.
【０００６】金属導線は、銅、金、銀、アルミニウム等
が使用できるが、銅が最も一般的である。フッ素樹脂と
しては、ポリ四フッ化エチレン、ポリフッ化エチレンプ
ロピレン等が好ましい。Copper, gold, silver, aluminum and the like can be used for the metal conductive wire, but copper is the most common. As the fluororesin, polytetrafluoroethylene, polyfluoroethylene propylene and the like are preferable.
【０００７】フッ素樹脂被膜を形成した金属導線にスッ
パタ法で金属薄膜を形成するには、例えば図２、図３に
示す方法が使用できる。図２はスッパタ装置の要部を示
す斜視図、図３はスッパタ装置の要部を示す断面図であ
り、５はフッ素樹脂被膜を形成した銅ワイヤ、６は銅の
スパッタタ−ゲットである。スパッタタ−ゲット６はリ
ング状の金属銅の板７と同じくリング状のＮ極磁性体８
とＳ極磁性体９とより構成されており、Ｎ極磁性体８と
Ｓ極磁性体９とは所定間隔を開けてリング状の金属銅板
７に取り付けられている。In order to form a metal thin film on the metal conducting wire on which the fluororesin coating is formed by the sputtering method, for example, the method shown in FIGS. 2 and 3 can be used. 2 is a perspective view showing an essential part of the sputter device, FIG. 3 is a sectional view showing an essential part of the sputter device, 5 is a copper wire having a fluororesin film formed thereon, and 6 is a copper sputter target. The sputter target 6 is a ring-shaped N pole magnetic body 8 like the ring-shaped metallic copper plate 7.
And an S-pole magnetic body 9, and the N-pole magnetic body 8 and the S-pole magnetic body 9 are attached to the ring-shaped metal copper plate 7 with a predetermined gap.
【０００８】減圧（例えば５．０×１０-3Ｔｏｒｒ）し
たアルゴン等の不活性ガスの雰囲気中で、フッ素樹脂被
膜を形成した銅ワイヤ５と銅スパッタタ−ゲット６の間
にプラズマ放電を発生させ、リング状の銅スパッタタ−
ゲット６中心部を軸方向に沿ってフッ素樹脂被膜を形成
した銅ワイヤ５を移動させ、フッ素樹脂被膜表面に銅薄
膜を形成する。銅等の金属薄膜の厚みは０．０２〜１μ
mが好ましい。A plasma discharge is generated between the copper wire 5 and the copper sputter target 6 on which the fluororesin coating is formed in an atmosphere of an inert gas such as argon under a reduced pressure (for example, 5.0 × 10 -3 Torr). , Ring-shaped copper sputter
The copper wire 5 having the fluororesin coating formed thereon is moved along the axial direction of the center of the get 6 to form a copper thin film on the surface of the fluororesin coating. The thickness of the metal thin film such as copper is 0.02-1 μ
m is preferred.
【０００９】通常のスッパタ法の平面状スパッタタ−ゲ
ットではタ−ゲットを下、ワイヤをタ−ゲットの上に位
置させてメタライジングするが、ワイヤが金属導線５０
μm、フッ素樹脂被膜厚み５０μmの極細線では強度が小
さく十分な張力を与えることができなく、ワイヤが弛ん
で均質なスパッタ薄膜を形成することができない場合も
あるが、ワイヤをリング状の銅スパッタタ−ゲット６中
心部を軸方向に沿って移動させながらスパッタ薄膜を形
成することにより良質な薄膜を形成することができる。In a conventional sputter target planar sputter target, the target is placed underneath and the wire is placed over the target for metallization.
With an ultrafine wire having a thickness of 50 μm and a fluororesin coating thickness of 50 μm, the strength is small and sufficient tension cannot be applied, and the wire may loosen to form a uniform sputtered thin film. A high quality thin film can be formed by forming a sputtered thin film while moving the center of the get 6 along the axial direction.
【００１０】フッ素樹脂被膜表面に形成された下地めっ
きの銅薄膜を電極として、電気めっきにより銅、アルミ
ニウム、ニッケル等の厚付けの金属被膜を形成する。電
気めっきで銅被膜を形成する場合は、例えばめっき浴は
硫酸銅、ピロりん酸銅溶液等のめっき浴を使用し、室温
で、電流密度１〜３Ａ／dm2の条件で１０〜５０μの銅
被膜を形成する。Using the copper thin film of the base plating formed on the surface of the fluororesin coating as an electrode, a thick metal coating of copper, aluminum, nickel or the like is formed by electroplating. When a copper film is formed by electroplating, for example, a plating bath of copper sulfate, copper pyrophosphate solution or the like is used, and at a room temperature and a current density of 1 to 3 A / dm 2 , copper of 10 to 50 μm is used. Form a film.
【００１１】[0011]
【発明の効果】本発明では、工程が短いので品質の安定
した下地めっきができ、まためっき触媒を必要とせず、
ドライプロセスであるため、均質で、不純物の混入や、
欠陥の少ない薄膜による下地めっきが形成できるので、
厚付けの金属被膜は柔軟性に富むものとなり、本発明の
同軸ワイヤを使用すれば配線板の高密度化が可能とな
る。EFFECTS OF THE INVENTION According to the present invention, since the process is short, it is possible to carry out undercoating with stable quality, and a plating catalyst is not required.
Since it is a dry process, it is homogeneous and does not contain impurities.
Since base plating can be formed with a thin film with few defects,
The thick metal coating is highly flexible, and the coaxial wire of the present invention can be used to increase the density of the wiring board.
【図１】本発明の同軸ワイヤの断面図である。FIG. 1 is a cross-sectional view of a coaxial wire of the present invention.
【図２】本発明の同軸ワイヤの製造で使用されるスッパ
タ装置要部の斜視図である。FIG. 2 is a perspective view of a main part of a spatter device used in manufacturing the coaxial wire of the present invention.
【図３】本発明の同軸ワイヤの製造で使用されるスッパ
タ装置要部の断面図である。FIG. 3 is a sectional view of a main part of a spatter device used in manufacturing the coaxial wire of the present invention.
１．金属導線 ２．フッ素樹脂被膜 ３．フッ素樹脂被膜表面にスッパタ法で形成された金属
薄膜 ４．電気めっき法で形成された金属被膜 ５．フッ素樹脂被膜を形成した銅ワイヤ ６．銅のスパッタタ−ゲット1. Metal conductor 2. Fluororesin coating 3. 3. Metal thin film formed on the surface of fluororesin film by the sputtering method. 4. Metal coating formed by electroplating method Copper wire with fluororesin coating 6. Copper sputter target
Claims (1)
素樹脂被膜表面にスッパタ法で金属薄膜を形成し、さら
に電気めっき法で金属被膜を形成することを特徴とする
同軸ワイヤの製造法。1. A method for producing a coaxial wire, comprising forming a fluororesin film on a metal conductor wire, forming a metal thin film on the fluororesin film surface by a sputtering method, and further forming a metal film by an electroplating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4151967A JPH05342930A (en) | 1992-06-11 | 1992-06-11 | Manufacture of coaxial wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4151967A JPH05342930A (en) | 1992-06-11 | 1992-06-11 | Manufacture of coaxial wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05342930A true JPH05342930A (en) | 1993-12-24 |
Family
ID=15530134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4151967A Pending JPH05342930A (en) | 1992-06-11 | 1992-06-11 | Manufacture of coaxial wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05342930A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006117999A (en) * | 2004-10-21 | 2006-05-11 | Hitachi Cable Ltd | Thin film forming method and thin film forming device |
| JP2007146247A (en) * | 2005-11-29 | 2007-06-14 | Hitachi Cable Ltd | Composite material made from metal and resin, production method therefor and product using the same |
-
1992
- 1992-06-11 JP JP4151967A patent/JPH05342930A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006117999A (en) * | 2004-10-21 | 2006-05-11 | Hitachi Cable Ltd | Thin film forming method and thin film forming device |
| JP2007146247A (en) * | 2005-11-29 | 2007-06-14 | Hitachi Cable Ltd | Composite material made from metal and resin, production method therefor and product using the same |
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