JPH05342576A - Production and apparatus for production of high-density magnetic recording medium - Google Patents

Abstract

PURPOSE:To enable the formation of thin films on base bodies of plural sizes and to increase the output of the magnetic recording medium by providing the existing sheet static confronting type thin film forming device with a holder which can form the thin films not only on the base bodies to be originally handled by the device but also on the base bodies smaller than these base bodies as well. CONSTITUTION:The holder 10 to be used for the sheet static confronting type thin film forming device is constituted of a disk 11 having the same size as the size of the disk substrates to be ordinarily handled and is constituted of the disk 11 having the same size as the size of the sizes of the plural substrates existing on the periphery. The disk is provided with plural substrate holding holes 12 existing on the periphery and a shaft holding hole 13 existing at the center. The holder is constituted in such a manner and the ordinary substrates are inserted into the holding holes 12. The thin films are then formed on the surfaces of these substrates. The separately prepd. holder of a smaller size is used if the size of the substrate to be inserted into the holding holes 12 is smaller than the size of the ordinary substrates. The holding holes 12 are provided with radial parts 15 corresponding to the substrates of the ordinary size and radial parts 14 for reducing the radius so as to deal with the substrates of the small size in order to make the holes 12 adaptable even to the substrates of the small size. The mounting of even the substrates having the different diameters is thus possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a high-density magnetic recording medium, and more particularly to a magnetic disk device used as a storage device in a computer, in which a magnetic recording layer is a thin magnetic film. The present invention relates to a manufacturing method and a manufacturing apparatus suitable for a disc.

[0002]

2. Description of the Related Art Hitherto, a high-density magnetic recording medium, for example, a sputter disk in a magnetic disk apparatus, is formed by using a carrier type in-line film forming apparatus in which a disk substrate made of a plurality of non-magnetic materials is incorporated in a pallet. Has been done. However, the disk obtained by the transfer type in-line film forming apparatus causes a fluctuation in the holding force in the circumferential direction of the disk substrate, which is considered to be caused by the transfer anisotropy, and causes a fluctuation in the head output when assembled as a magnetic disk apparatus. Therefore, there is a limit as a film forming apparatus for a magnetic disk apparatus, which is becoming the mainstream in downsizing that enables a high density magnetic recording by reducing the diameter of the disk.

A single-wafer-facing static thin film forming apparatus, in which each disk substrate is loaded from a cassette one by one to perform film formation, can perform film formation without such a problem. This film forming apparatus includes a main chamber, an inlet load lock and an outlet load lock arranged above the main chamber, and a load lock between these main locks, as disclosed in Japanese Patent Publication No. 3-45455. A plurality of processing stations located above the main chamber and located in each of the load lock and processing station to raise the substrate from the main chamber into the processing station and into the load lock, as well as the load lock and processing station. A vertical transfer mechanism for lowering the substrate into the main chamber and a horizontal transfer mechanism for transferring the substrate between these vertical transfer mechanisms inside the main chamber. When a substrate such as a disk substrate of a magnetic disk device is loaded into the entrance load lock from the outside, the vertical transport mechanism lowers the substrate into the main chamber and transfers it to the horizontal transport mechanism inside the main chamber. Vertically conveys to the vertical transfer mechanism at the bottom of each processing station, and these vertical transfer mechanisms raise to each of the processing stations, hold during processing and then lower, and then the vertical transfer mechanism of the last processing station. When the processed substrate is passed to the horizontal transport mechanism, the horizontal transport mechanism transports the substrate to the vertical transport mechanism below the exit load lock, and this vertical transport mechanism raises the substrate into the exit load lock, The substrate is carried out through the load lock.

[0004]

However, in the single-wafer-facing stationary type thin film forming apparatus, the size of the substrate on which the film can be formed is specified for each apparatus, that is, it is dedicated, and the size of each substrate is different. Since a device is required, new installation or expansion of the device is required according to the above-mentioned needs. Further, since the thin film is formed while transporting the substrates one by one to each of the load lock and the processing station, it takes a long time to form the film and the production amount is limited.

An object of the present invention is to enable thin film formation on a substrate such as a disk substrate over a plurality of sizes in such a single-wafer stationary opposed thin film forming apparatus, and to increase the production amount per unit time. To do so.

[0006]

In order to achieve the above object, a method of manufacturing a high-density magnetic recording medium according to the present invention comprises forming a thin film magnetic recording layer on each substrate while transporting the substrates one by one. A method of manufacturing a high-density magnetic recording medium by using a single-wafer stationary opposed thin film forming apparatus, wherein a plurality of substrates having a size related to the substrate and exposing a thin film forming region are formed. Prepare a holder with a holding mechanism, attach a small-sized substrate to each of the holding mechanisms of this holder, put the holder in place of the substrate normally handled by the single-wafer stationary opposed thin film forming apparatus, and place it on the holder. Is characterized in that a thin film is formed on the small-sized substrate.

The high-density magnetic recording medium manufacturing apparatus of the present invention comprises a sheet-fed stationary opposed thin film forming apparatus for forming a magnetic recording layer made of a thin film on each substrate while transporting the substrates one by one. The thin film forming apparatus is characterized by comprising a holder having a size and a shape related to a substrate to be handled and having a mechanism for exposing a thin film forming region and holding a plurality of substrates having a smaller size.

[0008]

The film formation is carried out by mounting a small-sized substrate on the holding mechanism in the holder and inserting the holder into the single-wafer stationary opposed thin film forming apparatus. Since the holder has the same size and shape as the substrate that the single-wafer stationary opposed thin-film forming apparatus originally handles, the single-wafer stationary opposed thin-film forming apparatus is formed on the exposed surface of the small-sized substrate on the holder like the substrate. Do the membrane.

When the substrate that is originally used by the single-wafer stationary thin film forming apparatus is a disk of a magnetic disk device, the holder holding mechanism exposes the surface of the disk substrate on which the magnetic recording layer is formed and exposes the periphery of the disk substrate. It is configured as a circular hole having a groove for holding on the inner peripheral surface. If the single-wafer stationary opposed thin film forming apparatus handles a 5.25-inch disk substrate and the holder has a diameter of 5.25 inches, eight holding holes for a 1-inch diameter disk substrate are formed. It can be installed in one holder, and a single-wafer stationary opposed thin film forming apparatus can be used in 6.5.
Handles an inch-sized disk substrate and the holder has a diameter of 6.
With 5 inches, one holder can be provided with six holding holes for a 1.8-inch disk substrate or four holding holes for a 2.5-inch disk substrate. Therefore, the production amount in the single-wafer stationary opposed thin film forming apparatus is at least four times as large. It is preferable to use the apparatus described in Japanese Patent Laid-Open No. 3-45455 as the single-wafer stationary opposed thin film forming apparatus, but a similar apparatus having another configuration may be used.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a method and an apparatus for manufacturing a high density magnetic recording medium of the present invention will be described below with reference to the drawings.

In the following description, the magnetic recording medium is a disk of a magnetic disk device used as a storage device of a computer. A method of manufacturing a high density magnetic recording medium according to the present invention has a size related to a substrate which is originally used by a single-wafer stationary opposed thin film forming apparatus, in this case, a size related to a disk substrate, and a disk substrate of this original size. Prepare a holder that has a mechanism to hold multiple disk substrates of a smaller size by exposing the thin film formation area, attach a small-sized disk substrate to each of the holding mechanisms of this holder, and replace it with this holder. It is put into a single-wafer stationary opposed thin film forming apparatus to form a thin film on each small size disk substrate.

FIG. 1 shows a holder used in this single-wafer stationary opposed thin film forming apparatus. The holder 10 is
A plurality of small-sized disk substrates each having a disk 11 having the same diameter and related size as the disk substrate handled in the single-wafer stationary opposed thin film forming apparatus and having a size smaller than the normal-sized disk substrate. A hole 12 is provided to expose and hold a region where w is a thin-film magnetic recording layer to the outside.

The holder 10 includes a disk 11 having a diameter of 6.5 inches when the above-mentioned single-wafer stationary opposed thin film forming apparatus is configured to handle a 6.5-inch disk substrate, for example. In addition, a hole for mounting the holder on the shaft of the cassette of the single-wafer stationary opposed thin film forming apparatus, for example, a hole 13 having an inner diameter of 40 mm is provided at the center of the disc.

The holding hole 12 is provided in a region formed between the peripheral edge of the disk 11 forming the holder and the central hole 13. When the disk substrate w mounted on the holder is, for example, a disk substrate having a diameter of 1.8 inches, the six holding holes 12 are regions sandwiched between the outer circumference and the inner circumference of the disc 11. In addition, they are provided at an angle of 60 ° with respect to the center of the disk 11. Each holding hole 12 is composed of a portion 14 associated with the radius of the disk substrate w and a portion 15 having a radius larger than the radius, as best shown in FIG. The inner peripheral surfaces of these holding holes 12 have a substantially v-shaped cross section, as shown in FIG. At the tip of this v-shaped portion, as shown in FIG.
As shown in FIG. 7, a shape 17 related to the cross-sectional shape of the peripheral edge of the disk substrate w is formed. When mounting the disc substrate w on this holder, the disc substrate w is held in the holding hole 1
The groove 1 located inside the 2 and in the part 14 in the holding hole
6 by fitting the peripheral edge of the disk substrate w. When the disc substrate w is mounted in the holding hole, the holder 10 is exposed in a state where the surface of the disc substrate w is exposed, leaving a region where a part of the peripheral edge is held in the groove 16 in the portion 13 of the holding hole. Held in.

FIGS. 5 and 6 show a sheet-fed stationary opposed thin film forming apparatus. This thin film forming apparatus 20 is
-45455, a standard cassette c for loading a 6.5-inch disk substrate w.
A main chamber 22, an entrance load lock 23, an exit load lock 24, a plurality of processing stations 25 to 28, a vertical transfer mechanism 29 for loading and unloading a disk substrate w to and from a standard cassette c, each load lock and each. Disk substrate w at processing station
Vertical transport mechanisms 31 to 36 for loading and unloading, a horizontal transport mechanism 37 for transporting the disk substrate w between the inlet load lock and the vertical transport mechanism for the processing station in line with this, the exit load lock 24 and one line for this. It is equipped with a horizontal transport mechanism 38 for transporting the disk substrate w between the vertical transport mechanisms and a rotary transport mechanism 39 for transporting the disk substrate w between the vertical transport mechanisms to the processing station.

The conveyor 21 comprises, for example, a chain conveyor and is arranged at one end of the main chamber 22.
The cassette c is intermittently moved corresponding to the interval between the disk substrates w loaded therein. The vertical transport mechanism 29 is arranged below the conveyor 21 and is intermittently stopped.
The disk substrate w is raised from the cassette c located at 1 to the position related to the entrance load lock 23. The vertical transfer mechanism 30 is also arranged under the conveyor 21 and lowers the disk substrate w from the position related to the exit lock to the cassette c on the conveyor 21. The vertical transfer mechanism itself has a support 41 for holding the disk substrate w and an elevator 42 such as a pneumatic cylinder for raising and lowering it.
The same groove as the groove 16 in the holder 10 is provided in the support.

The main chamber 22 comprises a vacuum container having a rectangular parallelepiped shape, for example. The inlet load lock 23 is located at one end of the main chamber 22 and is arranged above it, and the outlet load lock 24 is arranged above the main chamber 22 so as to face the inlet load lock 23. The inlet load lock 23 is a member fixed to the main chamber 22, a position forming an enclosed space with this member, and the conveyor 2
It is composed of a member 43 which rotates between itself and the upper position of the cassette c in FIG. The outlet load lock 24 also rotates between a member fixed to the main chamber 22 and a position forming a closed space with this member and a position above another cassette c on the conveyor 21.
It consists of The vertical transfer mechanism 31 is located under the entrance load lock 23 and is incorporated in the main chamber 22 to lower the disk substrate w from the entrance load lock 23 into the main chamber 22. The vertical transport mechanism 32 is located below the exit load lock 24 and is located in the main chamber 22.
The disk substrate w is lifted from the inside of the main chamber 22 to the entrance load lock 23. Similar to the vertical transfer mechanisms 29 and 30 for the conveyor 21, these vertical transfer mechanisms are provided with a support for holding the disk substrate w and an elevator for moving the support.

The processing stations 25, 26 are arranged in line with the inlet load lock 23, and the processing stations 27, 28 are arranged in line with the outlet load lock 24 above the main chamber 22. The vertical transfer mechanisms 33 to 36 are located under the respective processing stations 25 to 28 and are located in the main chamber 22.
The disk substrate w is raised and lowered between these processing stations and the inside of the main chamber 22. Similar to the vertical transfer mechanisms 29 to 32, these vertical transfer mechanisms also include a support for holding the disk substrate w and an elevator for moving the support.

The horizontal transfer mechanism 37 includes the entrance load lock 2
Vertical processing mechanism 3 from 3 to adjacent processing station 2
6, the disk substrate w is transferred to the vertical transfer mechanism 33, and the disk substrate w is provided between the vertical transfer mechanism 33 of the processing station 26 and the vertical transfer mechanism 34 of the processing station 27.
For carrying the disk substrate w between the vertical carrying mechanism 34 and the rotary carrying mechanism 39 of the processing station 27, and is incorporated in the main chamber 22. The other horizontal transport mechanism 38 is
Transfer of the disk substrate w between the rotary transfer mechanism 39 and the vertical transfer mechanism 35 of the processing station 28, the vertical transfer mechanism 35 of the processing station 28, and the processing station 27.
Of the disk substrate w between the vertical transfer mechanism 36 of the processing station 27 and the vertical transfer mechanism 32 of the exit load lock 24, and the main chamber 22. Built into the. Regarding the conveyance, the horizontal conveyance mechanism 38 will be described. The rod 47 is brought closer to the support of the vertical conveyance mechanism, the disk substrate is placed on the pin of the rod 47, and the crank arms 45 and 46 move the rod 47 upward, horizontally, and downward. After the disk substrate is placed on the support of the adjacent vertical transport mechanism, the rod 47 is separated from the support. Horizontal transportation in the horizontal transportation mechanism 37 is performed in the same manner. The rotary transport mechanism 39 is for transporting the disk substrates w one by one from the horizontal transport mechanism 37 to the horizontal transport mechanism 28. The rotary transport mechanism 39 is located between the end portions of these horizontal transport mechanisms and is located inside the main chamber 22. It has been incorporated.
The transportation is performed by rotating supports 51 and 52 for holding the disk substrate around the shaft 48 and sequentially moving the supports to the respective ends of the horizontal transport mechanisms 37 and 28.

In this single-wafer stationary opposed type thin film forming apparatus, the conveyor 21 has an unprocessed disk substrate w in the cassette c.
The cassette c is intermittently moved at every interval. Every time the cassette c stops, the member 43 of the entrance load lock 23 rotates on the cassette c placed on the conveyor 21, and the vertical transport mechanism 29 moves the disk substrate w in the cassette to the member 4
3 and the member 43 holds the disc substrate w. When the member 43 is closed, the vertical transport mechanism 31 holds the disk substrate w and descends into the vacuum chamber 22.
When it descends, the horizontal transfer mechanism 37 operates and the rod 47 transfers the disk substrate w to the vertical transfer mechanism 33 of the adjacent processing station 25. When the transfer is performed, the support of the vertical transfer mechanism 33 rises, and the disk substrate w is loaded inside the processing station 25. When the processing is over, the vertical transfer mechanism 33 lowers the disk substrate, and the horizontal transfer mechanism 37 moves the vertical transfer mechanism 3 of the next processing station 26.
The disk substrate w is transported to 8. Each time the processing in this processing station is completed, the horizontal transfer mechanism 38 transfers the disk substrate w to the support of the rotary transfer mechanism 39, and the rotary transfer mechanism 39 moves the disk substrate w to another horizontal transfer mechanism 38. The horizontal transport mechanism 38 sequentially transports the disk substrate w to the vertical transport mechanism 35 and the vertical transport mechanism 36, and sequentially transports the disk substrate w to the processing stations 27 and 28 related to the vertical transport mechanisms 35 and 36, respectively.
Take in and out. When the processing in the processing station 28 is over, the horizontal transfer mechanism 38 transfers the disk substrate w to the vertical transfer mechanism 32 of the exit load lock 24, and the vertical transfer mechanism 32 transfers the disk substrate w to the exit load lock 2.
4, the member 44 holds the disk substrate W. When held, the member 44 rotates on the conveyor 21. By this time, the last disk substrate has been sent out from the cassette c, and the exit load lock 24 in the empty state.
Is conveyed by the conveyor 21 to a position related to. When the member 44 is located on the empty cassette, another vertical transport mechanism 30 at the bottom of the conveyor 21 supports and lowers the disk substrate w from the member 44, so that the processed disk substrate is empty cassette c ′. To load. Transfer of the disk substrate from the cassette c to the first processing station 33, transfer of the disk substrate between the processing stations, transfer of the disk substrate between the horizontal transfer mechanisms, and transfer of the disk substrate from the final processing station 36 to the cassette c ′. Are carried out in the same working time, and the disc substrates are processed one after another.

When forming a thin film on the disc substrate held by the holder 10, the holder 10 is loaded with a 1.8-inch disc substrate w in advance by a loader, loaded into the standard cassette c, and placed on the conveyor 21. When the cassette c is transported to the inlet load lock 23, the single-wafer stationary opposed thin film forming apparatus has the same size and outer shape of the holder 10 as the 6.5-inch disk substrate processed in this apparatus. Like the 0.5 inch disk substrate, the holder 10 in the cassette c is transferred to the inside of the main chamber via the inlet load lock, and then sequentially transferred to the processing stations 25 to 28 to be mounted on the holder 10. An underlayer, a magnetic recording layer, and a protective layer are sequentially formed on the exposed surface of each of the 1.8-inch disk substrates w, and then,
The processed holder 10 is carried out to the cassette c ′ on the conveyor 21 via the exit load lock 24, and the six film-formed 1.8 inch disks are transferred to each holder 1
Obtained from 0 holder.

A specific example will be described. The single-wafer stationary opposed type thin film forming apparatus has a structure as described above and is made by Varian Associates, Inc. of the United States of America capable of processing a disk substrate having a diameter of 6.5 inches. The holder is a holder having an outer diameter of 6.5 inches as shown in FIG. The disk substrate w on which a thin film is formed has an outer diameter of 1.8 inches and an inner diameter of 1
It is made of 2 mm thick Al-Mg alloy plated with Ni-P. Six of the 1.8-inch disk substrates are mounted in each holding hole 12 in the holder, and the holders mounted with the disk substrates are housed in the cassette of the above-mentioned single-wafer stationary opposed type thin film forming apparatus, and each of the processing stations A nonmagnetic Cr underlayer is formed on the surface of the disk substrate mounted on the holder by Co-6 at% C on the surface of the underlayer.
A magnetic recording layer made of an r-4 at% Ta alloy was formed, and then a protective layer made of carbon was formed on the surface of the magnetic recording layer. Even if the discharge gas pressure in this film forming apparatus was lowered, The fluctuation of the reproduction output can be reduced to a negligible level without an electrical correction circuit, and a strong holding force of 13000e or more was obtained. Further, the resulting disk substrate w was kept in a constant temperature and constant humidity environment of a temperature of 40 ° C. and a humidity of 80% RH for one week, and the missing error was measured. As a result, no increase in the error was recognized and the corrosion resistance was excellent. On the other hand, a disc substrate having the same holding power and the same layer structure as the specific example was produced by a transfer type in-line sputtering device, and after a week in a constant temperature and humidity environment of a temperature of 40 ° C and a humidity of 80% RH, a missing error occurred. Was measured, and the number of errors increased to 128 or more per surface.

In the method for manufacturing a high density magnetic recording medium of the present invention, a magnetic recording medium having stable magnetic characteristics and excellent corrosion resistance can thus be obtained by the single-wafer stationary opposed thin film forming apparatus. By combining the obtained disk with a dual head having an inductive head for writing and an MR head for reading only in one element, the disk is less expensive and has a smaller volume per volume than a conventional magnetic disk apparatus using only an inductive head. In addition to obtaining a high-density magnetic storage device, it is possible to produce a small size disk that cannot be produced by a conventional thin film forming apparatus of this kind, and moreover, this disk can be produced in large quantities. The throughput of the leaf stationary facing thin film forming apparatus is, for example, 90 holders or more per hour, and 360 per hour production number
It is also possible to set the number of sheets to 420 or more.

Returning to FIG. 1, the holder 10 is provided with a detection hole 17. The detection hole has a form of a through hole provided in a region where the holding hole 12 is provided as an opening partially provided in a part of the central hole as shown in the figure. Such a detection hole is used when the unprocessed disk substrate w is mounted on the holder 10 by the loader, or when the thin film-formed disk substrate w is unloaded from the holding hole 12 by the unloader and loaded into the cassette c or the like. The direction of the holder can be recognized by the loader and the unloader. That is, the holding hole 12
Consists of a portion 14 of the disc substrate w which is associated with the radius of the disc substrate w and a portion 15 having a radius larger than said radius, and the disc substrate w is formed only from the opening formed by the portion 15.
In order to mount or dismount the groove 16 in the portion 14, it is necessary to match the loading or unloading direction of the loader and unloader with those of the holder 10 in advance. By detecting, the loader and the unloader can recognize the current direction of the holder, and the loading and unloading of the disk substrate according to the direction of the holder 10 can be performed. Further, such a detection hole is provided with an optical sensor so that the light beam is located in a region which does not correspond to the central hole of the disk substrate and passes through the detection hole 17 of the holder. By incorporating the disk substrate and the holder of the size to be handled in a mixed manner, the disk substrate and the holder can be distinguished from each other by mounting the unprocessed disk substrate in the holding hole 12 by incorporating the disk substrate and the holder into the carrying path. Alternatively, the disk substrate w having a thin film formed on the cassette can be loaded by the loader and the unloader, and if necessary, the processing conditions can be changed and other controls at the processing station for each of these disk substrates. It can be done.

FIG. 7 shows another structure of the holder. The holder 110 has an outer diameter of 6.5 inches, similar to the holder described with reference to FIGS. 1 to 4.
However, the holding holes 112 are four holding holes 112 having an outer diameter of 65 mm, and the holding holes 112 are the peripheral edge of the disk 111 of the holder and the center hole 11.
It is provided in a region sandwiched by 3 so that four 2.5 inch disk substrates can be mounted in each of the holding holes. Each holding hole 112 is shown as a circle, but similar to the embodiment described in connection with FIGS. 1 to 4, a portion 115 having a radius of 65 mm of the disk substrate.
And a portion 114 having a radius larger than this radius, and further, the peripheral surface of the portion 115 has a substantially v-shaped cross section, and the peripheral edge of the 2.5-inch disk substrate to be mounted. A groove having a shape related to the cross-sectional shape is formed at the tip of the v-shaped portion.

This holder also has 2.
A 5-inch disk substrate is mounted, and the film is stored in a cassette corresponding to the 6.5-inch outer diameter disk substrate in the above-mentioned single-wafer stationary opposed thin-film forming apparatus, and film formation is performed in the same manner as the 6.5-inch disk substrate. Thus, four 2.5 inch disk substrates can be obtained from each holder 110.

FIG. 8 shows a holder for a single-wafer stationary opposed type thin film forming apparatus which handles a 5.25 inch disk substrate. This holder 210 has an outer diameter of 6.5 inches similarly to the holder described with reference to FIGS. 1 to 4, but eight holding holes 212 are provided at the peripheral edge of the disk 211 of the holder and the central hole 213. It is provided in a region sandwiched between the holding holes 212 so that a 1-inch disk substrate can be mounted in each of the holding holes 212. Each holding hole 21
2 is shown as a circle, but similar to the embodiment described in connection with FIGS. 1 to 4, the radius 25.
It is composed of a portion 214 having a diameter of 4 mm and a portion 216 having a radius larger than this radius, and the cross-section of the peripheral surface forming the portion 215 is substantially v-shaped and is mounted 1
A groove having a shape related to the cross-sectional shape of the peripheral edge of the inch disk substrate is formed at the tip of the v-shaped portion.

This holder also has a 1-inch disk substrate mounted in each of the holding holes 212, and is housed in a standard cassette for a 5.25-inch disk substrate in a single-wafer stationary opposed thin film forming apparatus, and has a diameter of 5.25 inches. By forming a film in the same manner as the disk substrate of (1), eight 1-inch disk substrates can be obtained from each holder.

[0029]

As described above, the present invention can form a thin film on a small-sized substrate by using the conventional single-wafer stationary opposed thin film forming apparatus, and can be produced with high efficiency. ..

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a holder used in a method and apparatus for manufacturing a high density magnetic recording medium of the present invention.

FIG. 2 is an enlarged cross-sectional view of a hole for holding a base body in the holder shown in FIG.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an enlarged view of portion B in FIG.

FIG. 5 is a plan view of a single-wafer stationary opposing thin film forming apparatus.

FIG. 6 is a front view in which a part of the single-wafer stationary opposed thin film forming apparatus is cut away.

FIG. 7 is a front view showing another embodiment of a holder used in the method and apparatus for manufacturing a high density magnetic recording medium of the present invention.

FIG. 8 is a front view showing still another embodiment of a holder used in the method and apparatus for manufacturing a high density magnetic recording medium of the present invention.

[Explanation of reference numerals] 10, 110, 210 ... Holders 12, 112, 212 ... Holding mechanism w ... Small size substrate

 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Takayuki Kishikawa 2880 Kunizu, Odawara-shi, Kanagawa Hitachi Ltd. Odawara factory (72) Inventor Atsushi Takagaki 2880 Kunizu, Odawara, Kanagawa Hitachi Ltd. Odawara Inside the factory (72) Inventor Keigo Iechika 2880 Kozu, Odawara City, Kanagawa Stock Company Hitachi Ltd. Odawara Factory

Claims (3)

[Claims] 1. A method for producing a high-density magnetic recording medium using a sheet-fed stationary opposed thin film forming apparatus for forming a magnetic recording layer made of a thin film on each substrate while transporting the substrates one by one. , A holder having a mechanism for holding a plurality of substrates having a smaller size by exposing the thin film formation region, and mounting a small-sized substrate on each of the holding mechanisms of the holder. A method for manufacturing a high-density magnetic recording medium, characterized in that the holder is placed in a leaf stationary opposed thin film forming apparatus in place of a substrate which is normally used, and a thin film is formed on a small-sized substrate on the holder. 2. A sheet-fed stationary opposed type thin film forming apparatus for forming a magnetic recording layer made of a thin film on each of the substrates while conveying the substrates one by one, and a size and shape related to the substrates handled in the thin film forming apparatus. And a holder provided with a mechanism for holding a plurality of substrates having a smaller size by exposing a thin film forming region, and a manufacturing apparatus for a high density magnetic recording medium. 3. A single-wafer stationary opposed thin film forming apparatus is provided with a main chamber, an entrance load lock and an exit load lock arranged on the upper part of the main chamber, and an upper part of the main chamber located between these load locks. A plurality of processing stations are arranged and arranged in each of the load lock and the processing station to raise the substrate from the main chamber into the processing station and the load lock, and
It has a vertical transfer mechanism for lowering the substrate from the load lock and the processing station into the main chamber, and a horizontal transfer mechanism for transferring the substrate between these vertical transfer mechanisms in the main chamber.
A disk configured to process a disk-like substrate having a diameter in the range of inches to 6.5 inches, the holder exposing the thin film forming area and having a diameter in the range of 1 inch to 2.5 inches and a shape of the disk. The manufacturing apparatus according to claim 2, further comprising a mechanism for holding the substrate.