JPH05342304A - Printed board cad system - Google Patents

Printed board cad system

Info

Publication number
JPH05342304A
JPH05342304A JP4149078A JP14907892A JPH05342304A JP H05342304 A JPH05342304 A JP H05342304A JP 4149078 A JP4149078 A JP 4149078A JP 14907892 A JP14907892 A JP 14907892A JP H05342304 A JPH05342304 A JP H05342304A
Authority
JP
Japan
Prior art keywords
printed board
wiring
wiring density
grids
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4149078A
Other languages
Japanese (ja)
Other versions
JP2906830B2 (en
Inventor
Keiji Nagano
圭治 長野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4149078A priority Critical patent/JP2906830B2/en
Publication of JPH05342304A publication Critical patent/JPH05342304A/en
Application granted granted Critical
Publication of JP2906830B2 publication Critical patent/JP2906830B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0005Apparatus or processes for manufacturing printed circuits for designing circuits by computer

Abstract

PURPOSE:To design a printed board in a short time by correctly recognizing the wiring density in each area of a wiring pattern on the printed board. CONSTITUTION:A step B for temporary wiring, a step F where the printed board is divided into plural areas, a step G where lattices are vertically and horizontally arranged in each of divided areas at intervals corresponding to an allowable wiring density, a step H where the number of lattices scattered in each of divided areas is counted, a step I where the number of lattices included in the wiring in each of divided areas is counted, and a step J where the number of lattices counted in the step I is divided by that counted in the step H to calculate the wiring density are provided besides steps A to D where parts are arranged on the printed board based on wiring density forecast of rat's nest information, and the wiring density in each area is displayed in a step L, thus making the degree of congestion of wiring easy to understand.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント板に搭載され
る部品の配置および配線の設計を行なうプリント板CA
D(Computor Aided Designの略
称)システムに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board CA for designing the layout and wiring of components mounted on the printed circuit board.
The present invention relates to a D (Computer Aided Design) system.

【0002】[0002]

【従来の技術】図2(a)及び(b)は従来のプリント
板CADシステムの一例を説明するためのフローチャー
ト及びディスプレイ上に描画されるプリント板の一部を
示す図である。従来、この種のプリント板CADシステ
ムは、例えば、図2(a)にで示すフローチャートの基
に行なわれるものがある。
2. Description of the Related Art FIGS. 2A and 2B are a flowchart for explaining an example of a conventional printed board CAD system and a part of a printed board drawn on a display. Conventionally, a printed board CAD system of this type is, for example, performed based on the flowchart shown in FIG.

【0003】このプリント板CADシステムは、まず、
図2(a)に示すステップAで、プリント板及びプリン
ト板に搭載される部品のの外形寸法並びに配線すべき端
子に関する情報を入力する。次に、ステップBで、プリ
ント板上に部品を配置する。次に、ステップCで、ラッ
トネストと呼ばれるネット情報を基にし、各部品の接続
端子同志を結び、図2(b)に示すように、ディスプレ
イ上に描画する。次に、次に、ステップDで、ラットネ
スト2で示される配線情報を基に配線密度が適宜になる
ように部品の配置を修正する。次に、ステップEで、配
置設定が決められた各部品における接続端子間の布線を
行ない完了していた。
The printed board CAD system is as follows.
In step A shown in FIG. 2A, information regarding the external dimensions of the printed board and the components mounted on the printed board and the terminals to be wired is input. Next, in step B, the parts are arranged on the printed board. Next, in step C, based on the net information called rat nest, the connection terminals of each component are connected and drawn on the display as shown in FIG. 2B. Next, in step D, the placement of the components is corrected so that the wiring density becomes appropriate based on the wiring information indicated by the rat nest 2. Next, in step E, the wiring between the connection terminals of each component whose layout setting has been determined has been completed.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、従来の
プリント板CADシステムでは、ラットネスト情報によ
る配線密度を予測して配線設計を行なうものの、例え
ば、図2(b)に示すように、部品1a、1b、1cの
端子a同志を結ぶラットネスト4と端子bを結ぶラット
ネスト2とが別の情報にもかかわらず、ディスプレイ上
では重なり正確な配線密度が予測出来ないという事態を
生ずる。このため、しばしば、領域によっては許容され
る配線密度を越えることがある。このような配線密度が
越える領域を捜し修正するにしても多大な工数を浪費す
るといった問題がある。
However, in the conventional printed board CAD system, although the wiring density is predicted by the rat nest information to perform the wiring design, for example, as shown in FIG. Although the rat nest 4 connecting the terminals a of 1b and 1c and the rat nest 2 connecting the terminals b are different information, the rat nest 4 overlaps on the display and an accurate wiring density cannot be predicted. For this reason, in some areas, the allowable wiring density is often exceeded. There is a problem that a great number of man-hours are wasted even if the area where the wiring density exceeds is searched and corrected.

【0005】本発明の目的は、このような問題を解消す
るために各領域の配線密度を正確に把握し、より短時間
に設計出来るプリント板CADシステムを提供すること
である。
SUMMARY OF THE INVENTION An object of the present invention is to provide a printed board CAD system capable of accurately grasping the wiring density of each region and designing in a shorter time in order to solve such a problem.

【0006】[0006]

【課題を解決するための手段】本発明の第1のプリント
板CADシステムは、プリント板及び配置される部品の
外形寸法と結線すべき端子の情報を少なくとも入力する
ステップと、これら情報に基ずき前記部品を前記プリン
ト板に配置する部品配置ステップと、前記端子同志を結
ぶ配線を行なう布線ステップと、前記プリント板を複数
の領域に分割する分割ステップと、この分割される領域
に格子を所定の間隔で縦横に並べ配置する格子配置ステ
ップと、分割された前記領域内に点在する格子数を計数
する第1の計数ステップと、分割された前記領域内の配
線内に含まれる格子数を計数する第2の計数ステップ
と、この第2の計数ステップの格子数を前記第1の計数
ステップの格子数で除して配線密度を算出するステップ
とを含んで構成される。
According to a first printed board CAD system of the present invention, at least the step of inputting the external dimensions of the printed board and the components to be arranged and the information of terminals to be connected, and based on these information. A step of arranging the parts on the printed board, a step of wiring for connecting the terminals to each other, a step of dividing the printed board into a plurality of areas, and a grid in the divided areas. A grid arranging step of arranging vertically and horizontally at a predetermined interval, a first counting step of counting the number of grids scattered in the divided area, and a number of grids included in the wiring in the divided area And a step of calculating the wiring density by dividing the number of grids in the second counting step by the number of grids in the first counting step. .

【0007】また、第2のプリント板CADシステム
は、第1のプリント板CADシステムに加えて、算出さ
れる前記配線密度を表示するステップを表示する表示ス
テップを含んで構成される。さらに、この表示ステップ
が配線密度の大小を色の対比で表示することを特徴とし
ている。
In addition to the first printed board CAD system, the second printed board CAD system includes a display step for displaying the calculated wiring density. Further, this display step is characterized in that the size of the wiring density is displayed by comparing the colors.

【0008】[0008]

【実施例】次に本発明について図面を参照して説明す
る。
The present invention will be described below with reference to the drawings.

【0009】図1(a)及び(b)は本発明のプリント
板CADシステムの一例を説明するためのフローチャー
ト及びプリント板の一部を示す部分平面図である。この
プリント板CADシステムは、従来のラットネスト情報
による配線密度を予測するステップに加えて具体的に配
線密度を求めるステップを付加させたことである。さら
に、この配線密度を容易に解るようにディスプレイ上に
表示出来るようにしたことである。
1A and 1B are a partial plan view showing a flowchart and a part of the printed board for explaining an example of the printed board CAD system of the present invention. This printed board CAD system has a step of specifically determining the wiring density in addition to the conventional step of predicting the wiring density based on rat nest information. Furthermore, the wiring density can be displayed on the display so that the wiring density can be easily understood.

【0010】まず、従来例で伸べたように、図1(a)
に示すステップAからDまでラットネスト情報で配線密
度を予測しながら、ステップEで配線の仮の布線設計を
する。次に、ステップFで、プリント板における領域を
許容される配線密度が異なる領域毎に、あるいは許容配
線密度が同じであれば、任意の大きさの領域に分割す
る。次に、ステップGで、図1(b)に示すように、プ
リント板のそれぞれの領域に許容配線密度に応じた間隔
で格子4を縦横に並べ配置する。次に、ステップHで、
一領域内にある格子4の数を計数する。例えば、図1
(b)では両面にそれぞれ36個あると仮定する。次
に、ステップIで、配線内にある格子4の数を計数す
る。この格子数を例えば部品搭載面では18個とし、裏
面側では18個とする。(スルーホール5の周囲を含む
領域の格子数8個も加算されている。)次に、ステップ
Jにより、領域内の格子数で配線内の格子数を除算し
て、この領域での配線密度を算出する。すなわち、ここ
では、プリント板の裏表の領域に含まれる格子数72個
で配線内の全格子数34個を除して、34/72=0.
472となり、約47パーセントという配線密度が算出
される。このように次々と分割された領域毎に配線密度
を算出し、ステップKでプリント板の全領域の配線密度
を算出し終ったところで、ステップLでディスプレイ上
に各領域毎に配線密度を表示する。
First, as shown in the conventional example, as shown in FIG.
While the wiring density is predicted from the rat nest information in steps A to D shown in (1), a temporary wiring wiring design is performed in step E. Next, in step F, the area on the printed board is divided into areas having different allowable wiring densities or, if the allowable wiring densities are the same, into areas of arbitrary size. Next, in step G, as shown in FIG. 1B, the grids 4 are arranged vertically and horizontally in each region of the printed board at intervals according to the allowable wiring density. Then in step H,
The number of grids 4 in one area is counted. For example, in FIG.
In (b), it is assumed that there are 36 on each side. Next, in step I, the number of lattices 4 in the wiring is counted. The number of grids is, for example, 18 on the component mounting surface and 18 on the back surface side. (The number of grids in the area including the periphery of the through hole 5 is also 8 added.) Next, in step J, the number of grids in the wiring is divided by the number of grids in the area to obtain the wiring density in this area. To calculate. That is, here, the total number of grids in the wiring, 34, is divided by 72, which is included in the front and back areas of the printed board, to obtain 34/72 = 0.
472, and a wiring density of about 47% is calculated. In this way, the wiring density is calculated for each of the divided areas, and when the wiring density of the entire area of the printed board is calculated in step K, the wiring density is displayed for each area on the display in step L. .

【0011】ここで、配線密度を表示する際に、配線密
度が一目瞭然となるように、例えば、単一色であれば、
配線密度が高くなる領域程彩度を濃くし、許容配線密度
を越えたところをは赤色など別の色で区分すると良い。
また、他の例として、明度の異なる色で区別しても良い
し、要は、色の対比で配線密度の高低を表示することで
ある。
Here, when displaying the wiring density, for example, if the wiring density is a single color, the wiring density becomes clear.
It is advisable to increase the saturation in the region where the wiring density is high, and to divide the areas where the wiring density exceeds the allowable wiring density with another color such as red.
Further, as another example, it is possible to distinguish by colors having different lightness, and the point is to display the high and low of the wiring density by contrasting the colors.

【0012】このように各領域毎に配線密度を杷枠でき
ることから、実配線に際しての修正がより簡単に出来、
短時間で設計出来るという利点がある。
As described above, since the wiring density can be framed for each area, the correction at the time of actual wiring can be made easier,
It has the advantage that it can be designed in a short time.

【0013】[0013]

【発明の効果】以上説明したように本発明は、領域毎に
所定の間隔で縦横に並べて格子を配置するステップと、
この格子が点在する個数を計数し、領域内の配線が占め
る面積を求め、領域毎の配線密度を算出し表示すること
によって、無駄な工数を費いやすことなくより短時間で
設計出来るプリント板CADシステムが得られるという
効果がある。
As described above, according to the present invention, the steps of arranging the grids in a row and column at a predetermined interval for each area,
A printed board that can be designed in a shorter time without wasting man-hours by counting the number of scattered grids, calculating the area occupied by wiring in the area, and calculating and displaying the wiring density for each area There is an effect that a CAD system can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のプリント板CADシステムの一例を説
明するためのフローチャート及びプリント板の一部を示
す部分平面図である。
FIG. 1 is a partial plan view showing a flowchart and a part of a printed board for explaining an example of a printed board CAD system of the present invention.

【図2】従来のプリント板CADシステムの一例を説明
するためのフローチャート及びディスプレイ上に描画さ
れるプリント板の一部を示す図である。
FIG. 2 is a diagram illustrating a flowchart for explaining an example of a conventional printed board CAD system and a part of a printed board drawn on a display.

【符号の説明】[Explanation of symbols]

1a,1b,1c 部品 2 ラットネスト 3 端子 4 格子 5 スルーホール 1a, 1b, 1c parts 2 rat nest 3 terminal 4 lattice 5 through hole

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 プリント板及び配置される部品の外形寸
法と結線すべき端子の情報を少なくとも入力するステッ
プと、これら情報に基ずき前記部品を前記プリント板に
配置する部品配置ステップと、前記端子同志を結ぶ配線
を行なう布線ステップと、前記プリント板を複数の領域
に分割する分割ステップと、この分割される領域に格子
を所定の間隔で縦横に並べ配置する格子配置ステップ
と、分割された前記領域内に点在する格子数を計数する
第1の計数ステップと、分割された前記領域内の配線内
に含まれる格子数を計数する第2の計数ステップと、こ
の第2の計数ステップの格子数を前記第1の計数ステッ
プの格子数で除して配線密度を算出するステップとを含
むことを特徴とするプリント板CADシステム。
1. A step of inputting at least information about a printed board and external dimensions of a part to be placed and terminals to be connected, a step of placing the part on the printed board based on the information, A wiring step of connecting the terminals to each other, a dividing step of dividing the printed board into a plurality of areas, and a grid arranging step of arranging grids vertically and horizontally at predetermined intervals in the divided areas are divided. A first counting step of counting the number of grids scattered in the area, a second counting step of counting the number of grids included in the wiring in the divided area, and a second counting step. And dividing the number of grids of the grid by the number of grids in the first counting step to calculate the wiring density.
【請求項2】 算出される前記配線密度を表示するステ
ップを表示する表示ステップを含むことを特徴とする請
求項1記載のプリント板CADシステム。
2. The printed board CAD system according to claim 1, further comprising a display step of displaying a step of displaying the calculated wiring density.
【請求項3】 前記表示ステップが配線密度の大小を色
の対比で表示することを特徴とする請求項2記載のプリ
ント板CADシステム。
3. The printed board CAD system according to claim 2, wherein the display step displays the magnitude of the wiring density by color comparison.
JP4149078A 1992-06-09 1992-06-09 Printed board CAD system Expired - Fee Related JP2906830B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4149078A JP2906830B2 (en) 1992-06-09 1992-06-09 Printed board CAD system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4149078A JP2906830B2 (en) 1992-06-09 1992-06-09 Printed board CAD system

Publications (2)

Publication Number Publication Date
JPH05342304A true JPH05342304A (en) 1993-12-24
JP2906830B2 JP2906830B2 (en) 1999-06-21

Family

ID=15467215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4149078A Expired - Fee Related JP2906830B2 (en) 1992-06-09 1992-06-09 Printed board CAD system

Country Status (1)

Country Link
JP (1) JP2906830B2 (en)

Also Published As

Publication number Publication date
JP2906830B2 (en) 1999-06-21

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