JPH05340993A - Burn-in jig - Google Patents

Abstract

PURPOSE:To realize the direct burn-in of a semiconductor device on a transfer tray by integrating a contactor, a pattern wiring, pad parts, and a tray cover having locking function with the transfer tray. CONSTITUTION:A cover is aligned exactly with a tray 11 upon insertion of positioning rods 7 on the tray cover 8 into aligning holes 9 of the transfer tray 11 on which semiconductor devices 10 are arranged while being positioned. When they are integrated through a lock mechanism 6, contactors 5 at retaining section 4 come into contact with the terminals of semiconductor devices 10 being arranged thus allowing burn-in. This burn-in jig obviates the necessity of transferring/rearranging work of semiconductor devices to semiconductor device sockets on a burn-in board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for burn-in of semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor device is burned in, semiconductor devices aligned on a semiconductor device carrying tray are picked up individually or in plural at the same time, and the semiconductor devices are aligned and mounted in advance on a burn-in board. The semiconductor device, insert the semiconductor device, make the terminals of the semiconductor device and the terminals of this semiconductor device socket contact and make them electrically conductive, and then insert the burn-in board into the burn-in device. I was doing a burn-in.

[0003]

However, in the method described above, the terminals of the semiconductor device and the contacts of the semiconductor device socket are brought into contact with each other in the socket for the semiconductor device aligned and mounted on the burn-in board, and the electrical contact is made. The semiconductor device is placed in a semiconductor device socket on the burn-in board, and the burn-in board is placed in the burn-in tank to perform burn-in. To the semiconductor device socket on the burn-in board,
That is, steps such as picking up from the semiconductor device transport tray, transport, positioning, and insertion are required. Further, after the burn-in is completed, it is necessary to pull out from the semiconductor device socket on the burn-in board and refill the semiconductor device transport tray. As described above, the process is complicated, and an automatic machine is required to perform these operations, and the automatic machine becomes expensive due to the complicated process.
There was a problem such as.

Since the present invention excludes the steps such as the transfer operation and the refilling operation described above, it provides an excellent jig which can directly burn-in a semiconductor device to be burned in on a semiconductor device carrying tray. The purpose is to

[0005]

A burn-in jig for a semiconductor device according to the present invention holds a semiconductor device aligned in a tray for carrying a semiconductor device, and a contact which is electrically conductive with a terminal of the semiconductor device. A semiconductor serving as a burn-in board having a pattern wiring for supplying a power supply voltage and an input voltage to the semiconductor device, a pad portion contacting a connector in the burn-in tank, and a lock function for integrating with a semiconductor device transport tray The device transport tray lid is integrated with the semiconductor device transport tray to enable burn-in.

[0006]

According to the present invention, the working efficiency can be improved, and moreover, it can be easily placed on the automation line.

[0007]

1 is an exploded perspective view showing an embodiment of a burn-in jig for a semiconductor device according to the present invention, and FIG. 2 is a view showing the semiconductor device carrying tray shown in FIG. Indicates the state. In the figure, 1 is a printed circuit board provided with a connector pad portion 2 and a pattern wiring 3 for supplying a power supply voltage and an input voltage to a semiconductor device, 4
Is a holding plate provided with a contactor 5 that comes into contact with the terminals of the semiconductor device, 6 is a locking mechanism, 7 is a positioning rod, and 8 is the above-mentioned printed board 1, retaining plate 4, locking mechanism 6 and positioning rod 7, The contact 5 has a tray lid for transporting a semiconductor device, which also serves as a burn-in board for electrically connecting to the pattern wiring 3 of the printed board 1, 9 is a positioning hole into which the positioning rod 7 of the tray lid 8 is inserted, and 10 is a positioning hole. A semiconductor device 11 which is aligned and aligned is a tray for carrying a semiconductor device, which is provided with this alignment hole and which supports the semiconductor device 10 by aligning and aligning it.

With this structure, when the positioning rod 7 of the tray lid 8 is inserted into the alignment hole 9 of the semiconductor device carrying tray 11 in which the semiconductor devices 10 are aligned and aligned, the semiconductor device carrying tray 11 is The tray lid 8 fits snugly. Then, as shown in FIG. 2, when the lock mechanism 6 locks and integrates the contacts, the contacts 5 of the pressing portion 4 come into contact with the terminals of the aligned semiconductor devices 10 and become electrically conductive. Then, the burn-in can be performed while the tray lid 8 and the semiconductor device transport tray 11 remain integrated.

Therefore, it is possible to eliminate the conventional work such as transfer and refill to the semiconductor device socket on the burn-in board.

[0010]

As described in detail above, according to the burn-in jig for a semiconductor device according to the present invention, the semiconductor device and the semiconductor device transport tray sent from the process before the burn-in are left as they are. Burn-in can be performed and sent to the next process as it is, so work efficiency is good, and the semiconductor device transport tray can be delivered before and after the burn-in process, facilitating the construction of an automated line. Has the effect of.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a burn-in jig for a semiconductor device according to the present invention.

FIG. 2 is a perspective view showing a state in which the tray lid of FIG. 1 and a semiconductor device transport tray are integrated.

[Explanation of symbols]

 1 Printed Circuit Board 6 Lock Mechanism 7 Positioning Rod 8 Tray Lid 10 Semiconductor Device 11 Semiconductor Device Transport Tray

Claims (1)

[Claims] 1. A semiconductor device carrying tray is positioned and aligned with a semiconductor device carrying tray lid which also serves as a burn-in board, and the semiconductor device carrying tray is pressed to be integrated with the semiconductor device carrying tray. A burn-in jig for a semiconductor device characterized by being performed.