JPH05340892A - Bonded state inspecting device - Google Patents

Abstract

PURPOSE:To detect the bonded state of an object to be bonded by connecting a high-frequency generating section to a bonding agent discharging nozzle and obtaining a detected value from one electrode connected to the high-frequency generating section by using the bonding agent itself as the other electrode, and then, comparing the detected value with a reference value. CONSTITUTION:An object-to-be-bonded detecting sensor 8 is provided against an applicator nozzle 1 and a bonding controller 6 bonds an object 7 to be bonded by making the nozzle 1 to discharge a bonding agent by conducting a coil 3 and pulling up a needle 2 only during the period in which an object 7 to be bonded passes below the nozzle 1 based on the signal of the sensor 8. A high-frequency oscillation circuit 10 oscillates at a fixed frequency and a power amplifier circuit 11 amplifies power and impresses the amplified power upon the nozzle 1. An electrode 12 is provided on the opposite side of the nozzle 1. A bonding agent detection/output circuit 13 detects whether or not the bonding agent adheres to the object 7 by analyzing a high frequency received from the electrode 12 and outputs discriminated results.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gluing inspection device for detecting whether or not gluing has been performed when gluing is performed using a gluing nozzle.

[0002]

2. Description of the Related Art In a box making machine (suck machine), a collator (collator), etc., gluing is performed using an applicator nozzle in the gluing process. The nozzle is inspecting whether the glue is attached to the gluing target.

As this gluing inspection method, a capacitance type is used in which two electrodes are provided with a glued object sandwiched therebetween and the capacitance between the electrodes changes depending on the presence or absence of the glue. It was being done. Further, an optical method of coloring and detecting the presence or absence of glue by reflected light has been used. As another method, by inserting a carton with glue between the oscillation electrode plate and the receiving electrode plate and transmitting and receiving high frequency waves on both electrode plates, a method of detecting the adhesion of glue is disclosed in JP-A-60-99641. ing.

[0004]

In the case of this electrostatic capacitance method, since two electrodes are provided facing each other with the glued object in between, one of the electrodes faces the glued surface. ing. For this reason, the glue may adhere to the electrode surface, but if the glue adheres to the electrode, the variation in the measured value of the electrostatic capacitance changes greatly and the measurement cannot be performed. In addition, the measured value fluctuates due to humidity, making it difficult to perform stable glue detection. Also, the optical method requires coloring the paste. Further, in the case of the technique of Japanese Patent Laid-Open No. 60-99641, two electrodes are required, and since the object to be glued is passed between the electrodes, it is difficult to reduce the distance between the electrodes and increase the sensitivity.

The present invention has been made in view of the above problems, and it is an object of the present invention to provide a gluing detection device capable of detecting gluing adhesion by using the gluing itself as one electrode.

[0006]

In order to achieve the above object, a glue discharge nozzle, an electrode provided to face the glue discharge nozzle with an object to be glued therebetween, and the electrode or the glue discharge nozzle. A high-frequency generator connected to one side, a high-frequency detector connected to the other side, and a glue detector for comparing the detection value of this high-frequency detector with a reference value to detect the adhesion of glue on the glue object. It is equipped with.

The center of the electrode is displaced from the center of the glue discharge nozzle by a predetermined length on the downstream side in the moving direction of the glued object.

[0008]

[Function] The paste contains a few tens of percent of water and is electrically conductive. When the glue is discharged from the glue discharge nozzle to the gluing target, the glue is continuous from the discharge nozzle to the glue attached to the gluing target. Therefore, when a high frequency voltage is applied to one of the electrodes provided facing the discharge nozzle with the glue discharge nozzle and the object to be glued in between, and the high frequency voltage is detected from the other side, the glue is glued. When the discharge nozzle continues to the object to be glued, the adhesive on the object to be glued serves as an electrode, and high-frequency transmission / reception is performed between the facing electrodes. However, when the glue does not continuously exist between the glue discharge nozzle and the object to be glued, it becomes difficult to transmit and receive high frequency waves between the glue discharge nozzle and the electrode. Therefore, a high frequency is generated from the high frequency generator, the high frequency is detected by the high frequency detector, and if the detected value exceeds the reference value by the glue detector, the glue discharge nozzle and the glued object continue to be glued. Determine that The fact that the paste is continuous means that the paste is being attached to the paste object from the paste discharge nozzle, so that the presence or absence of the paste can be detected. If the distance between the gluing target and the electrode is constant, the higher the adhesive area, the higher the received high frequency, and therefore the amount of the gluing adhered to the gluing target can also be inspected. Further, since the gap between the glue and the electrode facing the paste is small and the attenuation of the received signal with respect to the transmitted signal is small, the S / N is large.

Further, the electrode may be shifted to the downstream side in the moving direction of the object to be glued without making the center of the glue discharge nozzle substantially coincide with the center of the facing electrode. This is because if the glue adheres linearly to the object to be glued without being interrupted by the glue discharge nozzle, high-frequency transmission / reception can be performed between the linear glue adhesion part and the electrode.

The glue itself adhered to the object to be glued serves as one electrode, and the other electrodes are not directly under the nozzle. Therefore, even if the glue is ejected when there is no glue object, the glue does not adhere to other electrodes. Therefore, the adhesive adheres to the electrodes and the received high frequency is intensified accordingly, so that there is no problem such that the amount of adhered adhesive is measured more than it actually is.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of this embodiment.
The applicator nozzle 1 receives the glue supplied from the glue supply device 5 and discharges the glue onto the glued object 7 being transported in the arrow direction. The nozzle is opened and closed by the needle 2, discharging the glue,
Shut off. The needle 2 is pressed by the nozzle by the spring 4 to close the nozzle, but when the coil 3 wound around the needle is energized by the glue controller 6, the needle 2 is pulled up against the pressing force of the spring 4. The glue is discharged from the gap between the needle 2 and the needle. A gluing target object detection sensor 8 for detecting the presence or absence of the gluing target object 7 is provided near the applicator nozzle 1, and the gluing target object 7 moves below the applicator nozzle 1 by a signal from the sensor 8. For a desired time during the passage, the gluing controller 6 energizes the coil 3 and pulls up the needle 2 to discharge the glue from the nozzle to attach the glue to the gluing target 7. In other words, when the gluing controller 6 receives the detection signal from the gluing target detection sensor 8, the gluing controller 6 energizes the coil 3 for a time period determined by the moving speed of the gluing target 7 and the gluing length that is determined to open the nozzle.

The high frequency oscillator circuit 10 has a constant amplitude (for example, 30
V _PP ), oscillates at a constant frequency (for example, 500 kHz),
The output is power-amplified by the power amplifier circuit 11 and applied to the applicator nozzle 1. The electrode 12 is provided so as to face the applicator nozzle 1, and the object 7 to be glued moves between them. The glue detection / output circuit 13 analyzes the high frequency wave received from the electrode 12 to detect whether or not the glue is attached to the gluing target 7, and outputs the result.

FIG. 2 is a diagram showing details of the glue detection / output circuit. The high frequency received by the electrode 12 is amplified by the voltage amplifier circuit 20, and the bandpass filter circuit 21 improves the S / N ratio. The bandpass filter 21 suppresses the influence of radiation noise having another frequency component received by the electrode 12 by matching the center frequency with the transmission frequency, that is, the oscillation frequency of the high frequency oscillation circuit 10, and improves the S / N. .

A detection circuit 22 extracts a signal indicating the presence of glue, and a low pass filter circuit 23 removes high frequency components. The comparison circuit 24 compares the analog signal of the low-pass filter circuit 23 with the reference voltage generated by the reference voltage generation circuit 25. When the reference voltage is exceeded, the signal is set to L level, and the signal that does not exceed the reference voltage is set to H level. To do. The AND gate 26 takes the logical product of the output signal of the comparison circuit 24 and the signal that the gluing controller 6 energizes the coil 3 in FIG. The time delay adjusting circuit 27 is a circuit which ignores a change in the output of the AND gate 26 for a short period of time, and prevents an abnormal signal from being output due to some deviation between the I and J signals. The display circuit 28 indicates that the output of the time delay adjusting circuit 27 is normally glued when the output is at the L level, and displays an error when the output is at the H level. The contact output circuit 29 outputs a signal for operating a contact such as stopping the transfer of the gluing target 7 when the output of the time delay adjusting circuit 27 is at the H level.

FIG. 3 shows a state in which the coil 3 is energized to pull up the needle 2 and the glue 9 is discharged from the nozzle. Figure 4
FIG. 4 is a diagram showing an output waveform of each circuit of FIGS. The operation will be described with reference to these drawings. 4 (a),
(B) and (c) show a state in which the glue 9 is attached to the gluing target 7, and AK shows waveforms corresponding to these (a) to (c).

When the gluing target detection sensor 8 detects the gluing target 7, the gluing controller 6 energizes the coil 3 to pull up the needle 2 and discharges the glue 9 onto the gluing target 7. The high frequency oscillation circuit 10 generates a high frequency of 500 kHz. A shows a high frequency waveform. This high frequency power is amplified by the power amplifier circuit 11, but the waveform B is the same as A. The high frequency power applied to the applicator nozzle 1 propagates the ejected glue, and the glue 9 that adheres to the pasting target 7
It is transmitted toward the electrode 12 from.

The electrode 12 receives the high frequency wave transmitted from the applicator nozzle 1 when the glue 9 is not ejected when the glue is ejected. Since its output is small as shown in C, it is amplified by the voltage amplifier circuit 20 and becomes as shown in D. The band pulse filter circuit 21 increases the S / N. E is a waveform obtained by removing noise from D. The waveform of this E, which is detected by the detection circuit 22, is F. When this F is passed through the low pass filter circuit 23, a waveform like G is obtained. This G is the reference voltage generation circuit
Compared with the reference voltage N generated at 25, when N is higher, Hi is output, and when N is lower, Lo is output. I indicates this. J is Hi when the gluing controller 6 is energized to the coil 3, and Lo when it is not energized. AND gate 26 is the logical product of I and J and is K
Is output as. When J is Hi, it means that the needle 2 is pulled up and the glue 9 is discharged.
When I is Hi, there is no glue 9 on the object 7 to be glued. Therefore, when the logical product of I and J is H, the applicator nozzle 1 is open, but the glue 9 does not come out, indicating an abnormal state. Therefore, the display circuit 28 displays the occurrence of an abnormality, and the contact output circuit 29 outputs a signal for operating the contact such as stopping the movement of the gluing target 7.

FIG. 5 shows the electrode 12 for the applicator nozzle 1.
The figure shows a case in which is arranged on the downstream side in the moving direction of the gluing target 7. Since the high frequency is emitted from the glue 9 which is discharged and adheres to the gluing target 7, it is not necessary that the center of the applicator nozzle 1 and the center of the electrode 12 be substantially coincident with each other. If the electrode 12 is located directly below the applicator nozzle 1, if the test of the nozzle itself is performed without the gluing target 7,
The glue that has fallen at that time rises up on the electrode 12, and if it remains as it is, it will malfunction if the glued object 7 approaches the electrode 12, so it is necessary to clean the glue on the electrode 12. Also,
If the electrode 12 is located directly under the nozzle 1 during maintenance and inspection of the applicator nozzle 1, disassembly and removal work will be hindered. Therefore, it is better to displace them as shown in FIG.

FIG. 6 is a diagram showing a case where the electrode 12 is formed in a ring shape. Instead of shifting the electrode 12 to the downstream side as shown in FIG. 5, the electrode 12 is shaped like a ring so that a part of the electrode 12 exists on the downstream side. In this way, even if it is provided directly below the applicator nozzle 1, there is an advantage that the electrode 12 does not get glued during the test without the glued object 7.

[0020]

As is apparent from the above description, in the present invention, since the glue discharged from the nozzle is used as one electrode, only one electrode is required, and the glue does not adhere to this one electrode. Performance is stable because there is no.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an exemplary embodiment of the present invention.

FIG. 2 is a detailed block diagram of a glue detection / output circuit.

FIG. 3 is a diagram showing a state in which glue is being discharged onto an object to be glued from an applicator nozzle.

FIG. 4 is a diagram showing an output waveform of each circuit shown in FIGS. 1 and 2.

FIG. 5 is a diagram showing a case where the center of the applicator nozzle and the center of the electrode are displaced to the downstream side in the moving direction of the object to be glued.

FIG. 6 is a diagram showing a case where the electrodes have a ring shape.

[Explanation of symbols]

 1 Applicator nozzle 2 Needle 3 Coil 5 Glue supply device 6 Glue controller 7 Glue target 8 Glue target detection sensor 9 Glue 10 High frequency oscillation circuit 12 Electrode 24 Comparison circuit 25 Reference voltage oscillation circuit 26 AND gate

Claims (2)

[Claims] 1. A glue discharge nozzle, an electrode that is provided to face the glue discharge nozzle with an object to be glued therebetween, and a high frequency generator connected to one of the electrode and the glue discharge nozzle. A gluing inspection comprising: a high-frequency detecting section connected to the other side; and a glue detecting section for comparing the detected value of the high-frequency detecting section with a reference value to detect glue adhesion of the glue object. apparatus. 2. The glue inspection apparatus according to claim 1, wherein the center of the electrode is displaced from the center of the glue discharge nozzle by a predetermined length on the downstream side in the moving direction of the glue object. ..