JP2684949B2 - Glue inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sizing inspection apparatus for detecting whether sizing is performed when sizing is performed by a sizing discharge nozzle.

[0002]

2. Description of the Related Art In a box making machine (sack machine), a collating machine (collator), and the like, gluing is performed using an applicator nozzle in a gluing process. Inspection is performed to determine whether glue is attached to the gluing target object by the nozzle.

[0003] As this gluing inspection method, there is used a capacitance type which is provided with two electrodes sandwiching a glued object and detects a change in capacitance between the electrodes depending on the presence or absence of glue. Had been. Further, an optical method has been used in which the paste is colored and the presence or absence of the paste is detected by reflected light. As another method, by inserting a carton with glue between the transmitting electrode plate and the receiving electrode plate and transmitting and receiving high frequency with both electrode plates,
A method for detecting the adhesion of glue is disclosed in JP-A-60-99641.

[0004]

In the case of this electrostatic capacitance system, two electrodes are provided opposite to each other with a glued object interposed therebetween, and one of the electrodes faces the glued surface. ing. For this reason, the adhesive may adhere to the electrode surface facing the adhesive surface, but if the adhesive adheres to the electrode, the variation in the measured value of the electrostatic capacitance changes significantly and measurement cannot be performed. In addition, the measured value fluctuated due to humidity, and it was difficult to perform stable glue detection. In addition, the optical method required coloring the paste. Further, in the case of the technique disclosed in Japanese Patent Laid-Open No. Sho 60-99641, two electrodes are required, and since the object to be glued is passed between the electrodes, the gap between the electrodes is made small and the sensitivity of glue adhesion detection is increased. Difficult to do.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has as its object to provide a glue detecting device capable of detecting glue adhesion using the glue itself as one electrode.

[0006]

[Means for Solving the Problems] To achieve the above object, a glue discharge nozzle and a glue discharge target nozzle that moves relative to the glue discharge nozzle on the same side as the glue discharge nozzle, An electrode provided to face the glue to be ejected, a high-frequency generator connected to one of the electrode and the glue ejection nozzle, a high-frequency detector connected to the other, and a detection value of the high-frequency detector It is provided with a glue detection unit that detects the glue adhesion of the glued object as compared with a reference value.

The glue discharge nozzle is provided on the same side as the glue discharge nozzle with respect to the glue object to be moved with respect to the glue discharge nozzle, facing the glue discharged onto the glue object. Electrode, a high-frequency generator connected to one of the electrode and the glue discharge nozzle, a high-frequency detector connected to the other, and a detection value of the high-frequency detector is compared with a reference value to apply the glue. It is provided with a glue detection unit for detecting the glue adhesion of the object.

[0008]

[Function] The glue contains a few tens of percent of water and exhibits conductivity. When the glue is discharged from the glue discharge nozzle to the object to be glued, the glue discharge nozzle and the discharged glue are continuous. Therefore, if a high frequency voltage is applied to one of the glue discharge nozzle and an electrode provided opposite to the glue discharged from the glue discharge nozzle and the high frequency voltage is detected from the other, the glue is discharged. When the adhesive is ejected from the adhesive ejection nozzle, the ejected adhesive serves as an electrode and high-frequency transmission / reception is performed with the opposing electrode. However, when the glue is not ejected from the glue ejection nozzle, it becomes difficult to transmit and receive high frequency waves between the glue ejection nozzle and the electrode.
Therefore, a high frequency is generated from the high frequency generator, the high frequency is detected by the high frequency detector, and if the detected value exceeds the reference value, the glue is judged to have been discharged from the glue discharge nozzle. The fact that the glue is ejected means that the glue is being attached to the object to be glued from the glue ejection nozzle, so that the presence or absence of the glue can be detected. Further, the gap between the glue discharged from the glue discharge nozzle and the electrode facing the glue is small, and the attenuation of the reception signal with respect to the transmission signal is small, so that the S / N ratio is large.

When the glue is discharged from the glue discharge nozzle to the glued object, the glue continues from the glue discharge nozzle to the glue attached to the glued object. Therefore, if a high frequency voltage is applied to one of the glue discharge nozzle and an electrode provided to face the glue discharged on the glued object and the high frequency voltage is detected from the other, the glue Is continuous from the glue discharge nozzle to the object to be glued, the glue on the object to be glued serves as an electrode, and high-frequency transmission / reception is performed between the opposing electrodes. However, when the glue does not continuously exist between the glue discharge nozzle and the gluing target, high-frequency transmission and reception between the glue discharge nozzle and the electrode becomes difficult. Therefore, a high frequency is generated from the high frequency generator, the high frequency is detected by the high frequency detector, and if the detected value exceeds the reference value by the glue detector, the glue discharge nozzle and the glue target are continuously glued. It is determined that there is. The fact that the glue is continuous means that the glue is being attached to the gluing target from the glue discharge nozzle, so that the presence or absence of gluing can be detected. If the gap between the glue target and the electrode is constant, the received high frequency increases as the glue adhesion area increases, so that the amount of glue that has adhered to the glue target can also be inspected. Further, since the gap between the glue attached on the object to be glued and the electrode facing the glue is small and the attenuation of the received signal with respect to the transmitted signal is small, the S / N ratio is large.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of this embodiment.
The metallic applicator nozzle 31 receives the adhesive 36 supplied from the adhesive supply device 33, and discharges the adhesive 36 to the adhesive object 35 moving in the arrow direction. The gluing controller 34 controls the gluing and stopping of the applicator nozzle 31 to continuously or intermittently attach the gluing 36 to the gluing target 35. An electrode unit 39 is provided at the nozzle tip 32 of the applicator nozzle 31.

The high frequency oscillation circuit 37 has a constant amplitude (for example,
It oscillates at a constant frequency (for example, 500 kHz) at 30 V _PP ), the output thereof is power-amplified by the power amplifier circuit 38, and is applied to the applicator nozzle 31. The electrode unit 39 is the glue 3 discharged from the nozzle tip 32 of the applicator nozzle 31.
A high frequency wave is received from 6 or the glue 36 attached on the glued object 35. The glue detection / output circuit 40 is an electrode unit 39.
By analyzing the high frequency received by the adhesive 36
It is detected whether or not it is attached to No. 5, and this result is output. Even if the signal is transmitted from the electrode and received by the metallic nozzle,
Good.

There are two types of electrode units 39, a vertical electrode type that receives a high frequency from the glue 36 discharged from the nozzle tip 32 and a horizontal electrode type that receives a high frequency from the glue 36 attached to the pasting target 35. FIG. 2 shows a configuration diagram of a vertical electrode type electrode unit 39, in which electrodes 41 are arranged parallel to the ejection direction of the applicator nozzle 31. The electrode 41 is shielded by a conductor 43 and the inside thereof is filled with an insulating material 44. The conductor 43 is grounded. As a result, the high frequency emitted from the glue 36 discharged from the nozzle tip 32 is mainly input to the electrode 41.

FIG. 3 is a block diagram of a horizontal electrode type electrode unit 39, in which electrodes 41 are arranged in parallel with the object 35 to be glued. The electrode 41 is shielded by a conductor 43 and is filled with an insulating material 44. The conductor 43 is grounded.
As a result, the glue 3 attached to the glue object 35 is attached to the electrode 41.
The high frequency transmitted from 6 is mainly input.

The vertical electrode type electrode unit 39 can detect if the glue 36 is ejected from the nozzle tip 32, so that it can be detected whether the glue length is short or long. It has not been confirmed how the object 35 adheres. On the other hand, the horizontal electrode type electrode unit 39 cannot receive the high frequency unless the glue 36 is continuous from the nozzle tip 32 to the electrode 41. Therefore, in order to detect intermittent gluing, it is necessary to set the continuous length to a certain length or more. Therefore, it is necessary to use it according to each feature. The electrode unit 39
Is integrally formed with the applicator nozzle 31, the electrode unit 39 is also moved by moving the applicator nozzle 31 when the gluing position is changed. No need to adjust.

FIG. 4 is a diagram showing details of the glue detecting / outputting circuit 40. The high frequency received by the electrode unit 39 is amplified by the voltage amplifying circuit 50, and the direct current component is cut off by the coupling circuit 51 to extract only the alternating current component. The coupling circuit 51 connects capacitors in series and outputs only changed signals. The detection circuit 52 takes out a signal indicating the presence of glue, and the low-pass filter circuit 53 removes high-frequency components. The comparison circuit 55 is a low pass filter circuit 53.
The analog signal of is compared with the reference voltage generated by the reference voltage generation circuit 54. When the reference voltage is exceeded, the signal is set to H level, and the signal that does not exceed the reference voltage is set to L level. That is, the H level indicates that the gluing is performed, and the L level indicates that the gluing is not performed.

The display circuit 56 shows the output of the comparison circuit 55, and displays whether or not gluing has been performed. The determination condition setting circuit 57 sets the gluing condition designated by the gluing controller 34. That is, it is set whether to paste the glue continuously or intermittently at a predetermined pitch. The determination circuit 58 determines the output of the comparison circuit 55 based on this gluing condition, and outputs an abnormal signal if the gluing condition is not met. This abnormal signal is reset by the signal from the comparison circuit 55 indicating that the gluing has been performed. The display circuit 59 displays the abnormality signal of the determination circuit 58, and the output circuit 60 outputs the abnormality signal to a device that operates such as stopping the movement of the pasting target 35 based on the abnormality signal.

FIG. 5 shows the adhesive 36 from the applicator nozzle 31.
1 and FIG. 4 in the case of intermittently discharging the ink at a constant speed and intermittently gluing it to the gluing target 35 sent at a constant speed.
3 is a diagram showing output waveforms of each circuit of FIG. Electrode unit 39
Uses the vertical electrode type electrode unit 39 shown in FIG. The operation will be described with reference to these drawings. (A) of FIG.
Indicates a state in which the glue 36 is attached to the gluing target object 35, and A to
J indicates a waveform corresponding to this (a).

As the electrode unit 39, the vertical electrode type electrode unit 39 shown in FIG. 2 is used to detect the discharge state of the glue 36 from the nozzle tip 32, and the glue is detected from the detected value and the moving speed of the glued object 35. It is possible to detect the attachment length of the glue 36 on the attachment target 35, or the length without the attachment. The gluing controller 34 is set to intermittently paste at a predetermined pitch, and the determination condition setting circuit 57 is set to generate an abnormal signal when the gluing length or time is interrupted by Lk or more. Since the gluing object 35 is sent at a constant speed, the length can be obtained by measuring the time as Lk.

When gluing is started by the gluing controller 34, the gluing object 35 is moved to the applicator nozzle 3 at the same time.
It is sent under 1 at a constant speed. High frequency oscillation circuit 3
7 generates a high frequency of 500 kHz. A shows a high frequency waveform. This high frequency power is amplified by the power amplifier circuit 38, but the waveform A remains unchanged. The high frequency power applied to the applicator nozzle 31 is transmitted from the ejected glue 36 toward the electrode 41.

The electrode 41 receives the high frequency wave emitted from the discharged glue 36. Its output is B, and this is voltage-amplified to C. Since a direct current component is added to this C due to the influence of temperature, etc., in order to extract only the alternating current component showing the change, the output is passed through a coupling circuit 51 having a circuit in which a capacitor is connected in series. As shown in. A waveform obtained by half-wave detecting this D by the detection circuit 52 is E. When this E is passed through the low-pass filter circuit 53, the high frequency component is removed and a waveform like F is obtained.
The comparison circuit 55 compares this F with the reference voltage G generated by the reference voltage generation circuit 54, and if F is higher than Hi, F
When is lower, it is output as Lo. I indicates this, which is displayed on the display circuit 56.

The determination circuit 58 monitors the length of time I becomes Lo or the time Lk, and when it exceeds Lk, it outputs an abnormal signal as indicated by J. This abnormal signal is reset by a signal indicating adhesion of glue. J is displayed on the display circuit 59 and is output from the output circuit 60. The determination circuit 58 uses a timer when measuring Lk as time, and when measuring it as length, an encoder is provided on the rotary shaft of the roller that conveys the pasting target 35, and the number of pulses of this encoder is counted.

FIG. 6 is a diagram showing the output waveform of each circuit of FIGS. 1 and 4 in the case where the gluing target 35 sent at a constant speed is continuously glued. As the electrode unit 39, the horizontal electrode type electrode unit 39 shown in FIG. 3 is used. The electrode 41 receives the high frequency transmitted from the glue 36 attached to the glued object 35. 6A shows a state in which the glue 36 is attached to the pasting target object 35, and A to J show waveforms corresponding to this (a).

The gluing controller 34 is set to paste continuously, and the judgment condition setting circuit 57 is set to generate an abnormal signal when the gluing length or time is interrupted by Lk or more. This abnormal signal is reset by a signal indicating adhesion of glue. The description of the waveforms A to J is almost the same as in the case of FIG.

In the above embodiment, the glue 35 is applied to the glue object 35.
The case where the abnormality is displayed when the length does not reach the predetermined length has been described. However, a sensor for detecting a predetermined position of the gluing target 35 is provided, and the applicator nozzle 31 and the gluing target are attached so that the gluing is performed at this position. Determine the relative position with the object 35,
It is also possible to detect whether or not glue has been applied to this position.

[0025]

As is apparent from the above description, in the present invention, since the glue discharged from the nozzle is used as one electrode, only one electrode is required, and this one electrode is used for the glued object. Since it is provided on the same side as the nozzle, the gap between this one electrode and the glue that forms the electrode is reduced
It is possible to increase the noise ratio and improve the gluing detection accuracy.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of the present invention.

FIG. 2 is a detailed view of a vertical electrode type electrode unit.

FIG. 3 is a detailed view of a horizontal electrode type electrode unit.

FIG. 4 is a detailed block diagram of a glue detection / output circuit.

FIG. 5 is a diagram showing output waveforms of the circuits shown in FIGS. 1 and 4 during intermittent gluing.

6 is a diagram showing an output waveform of each circuit shown in FIGS. 1 and 4 during continuous gluing.

[Explanation of symbols]

 31 Applicator Nozzle 32 Nozzle Tip 33 Glue Supply Device 34 Glue Controller 35 Glue Target 36 Glue 37 High Frequency Oscillation Circuit 38 Power Amplification Circuit 39 Electrode Unit 40 Glue Detection / Output Circuit

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hironobu Yoshikawa 2951 Ishikawa-cho, Hachioji-shi, Tokyo 4 Nireco Co., Ltd. (56) References Patent 2626415 (JP, B2)

Claims (2)

(57) [Claims] 1. A glue discharge nozzle and a glue discharge target provided on the same side as the glue discharge nozzle, which faces the glue discharged from the glue discharge nozzle. An electrode, a high-frequency generator connected to one of the electrode and the glue discharge nozzle, a high-frequency detector connected to the other, and a detection value of the high-frequency detector compared with a reference value to determine the object to be glued. And a glue detection unit for detecting the glue adhesion of the glue. 2. A glue discharge nozzle and a glue discharging nozzle provided on the same side as the glue discharging nozzle with respect to the glue moving target moving with respect to the glue discharging nozzle. Electrode, a high-frequency generator connected to one of the electrode and the glue discharge nozzle, a high-frequency detector connected to the other, and a detection value of the high-frequency detector is compared with a reference value to apply the glue. A gluing inspection device, comprising: a gluing detection unit for detecting gluing of an object.