JPH05338683A - Chip type electronic part package - Google Patents

Abstract

PURPOSE:To stabilize the peeling-off strength of a cover tape, by providing a continuous sealing protrusion so as to surrounding containing pockets at the sealing part of a cover tape with a carrier tape and sealing the cover tape on the sealing protrusion. CONSTITUTION:Hexagonal sealing protrusions 6 are provided so as to surround the whole sides of containing pockets 3 on a plastic carrier tape 1. The configuration of the plane of the protrusion 6 is shaped to form X with the cross point at the center of the rib 9, in the sealing area of the rib formed between respective containing pockets 3 and it is provided repeatedly and continuously. The cover tape 5 is heat-sealed on the sealing protrusion 6 by a heater block or the like. In this case, it is preferable to adopt a reversal-recessed form or a flat top mountain-form as the sectional form of the sealing protrusion 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package used for storing, carrying or mounting chip type electronic parts.

[0002]

2. Description of the Related Art Conventionally, a carrier tape used for housing chip-type electronic components or the like stores a chip-type electronic component 4 in a storage pocket 3 formed by molding as shown in FIG. It is used by sealing. The sealing method is, for example, a pressure bonding method using heat by a heater block 8 provided with a sealing iron as shown in FIG. There is a strong demand for a chip-type electronic component packaging body that has a drawback of adhesion and can obtain a stable peel strength.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of earnest research to solve the above-mentioned problems. As a result, a carrier tape is formed on a molding portion in which a convex projection is continuously formed in a sealing area of a sealing portion. The present invention has been completed by finding that stable peel strength can be obtained by sealing the surface of the cover tape with heat.

[0004]

SUMMARY OF THE INVENTION The present invention is a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, and the carrier tape is provided in a sealing area of a portion to be sealed by a cover tape. The chip-type electronic component package is characterized in that a convex sealing protrusion is provided continuously so as to completely surround the storage pocket, and a cover tape is sealed on the sealing protrusion. As a method of sealing the cover tape on the sealing protrusion of the carrier tape, a chip-type electronic component is stored in a storage pocket and then heat sealing is performed from the surface of the cover tape to the sealing protrusion of the carrier tape.

A detailed description will be given below with reference to the drawings. FIG. 1 is a perspective view showing a package of the present invention, which is a package in which a cover tape 5 is sealed on a carrier tape 1 having a sprocket 2 in which a chip-type electronic component 4 is stored in a storage pocket 3, It is a state figure which has peeled off cover tape 5. Further, a convex seal projection 6 is provided in the seal area portion, which is a feature of the present invention. 2 and 3 are a plan view and a cross-sectional view of the carrier tape provided with the sealing projections 6, and as shown in FIG. 1, the convex sealing projections 6 are hexagonal so as to surround the entire circumference of the storage hocket 3. The seal projection 6 in the seal area portion of the rib 9 between the storage pocket 3 and the storage pocket 3 has an X-shape with the center point of the rib 9 as an intersection point. It is provided. Further, the cross-sectional shape of the seal projection 6 is preferably an inverted concave shape shown in FIG. 3, or a mountain-shaped (A) or semicircular (B) shape with a flat upper portion as shown in FIG. The mountain-like shape of A) is preferable. The size of the seal protrusion is more than 0.5 mm and 1.0 mm or less,
The height is preferably more than 0.5 mm and 1.0 mm or less. The sealing method is preferably a method in which the carrier tape 1 is covered with the cover tape 5 as shown in FIG. 5 or 6 and the heater block 8 or the heater roll 7 is used to heat seal from the surface of the cover tape. In the obtained package, since the cover tape does not peel off when the chip electronic components are stored, transported, or mounted after the sealing, the shape of the seal protrusion does not deform even after the sealing and the surface of the carrier tape is not deformed. It needs to be parallel.

[0006]

EXAMPLES The details of the present invention will be described with reference to Examples. The measuring methods of strength and the like in the Examples and the measured values are as follows. (Measurement of Peel Strength of Cover Material) A peel back fortester manufactured by GPD was used to measure the peel strength at a tensile speed of 300 mm / min and an angle of 180 degrees. (Twist test) A cover material is sealed on each carrier tape, the sample is cut into a length of 250 mm, and both ends of the sample are gripped by 25 mm. The presence or absence of peeling was confirmed at the distance between marked lines of 200 mm. << Example 1 >> Hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.) as a material, width 24 mm, thickness 0.3 mm, storage pocket 14
1 mm width for 1 mm square in the seal area of carrier tape
A cover tape was heat-sealed by the method shown in FIG. 5 on a carrier tape having a mountain-shaped sealing projection of FIG. Example 2 A hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.) as a material, width 32 mm, thickness 0.3 mm, storage pocket 22
1 mm width for 1 mm square in the seal area of carrier tape
The cover tape was heat-sealed by the method shown in FIG. 6 on the carrier tape having the mountain-shaped sealing projections of FIG. Comparative Example 1 Hard vinyl chloride sheet (Sumilite VSS1305US made by Sumitomo Bakelite Co., Ltd.) as a material, width 8 mm, thickness 0.2 mm, storage pocket 3.2
65mm thick hippo tape on square mm carrier tape (Sumilite CSL-Z275 manufactured by Sumitomo Bakelite Co., Ltd.
A) is the method according to FIG. 8 (machine used for sealing: ET-2000N manufactured by Nitto Kogyo), temperature 140 ° C. 32 mm
/ Sec The heat sealing was performed in the intermittent method. Next, the sealed sample was observed for peel strength and twist test, and the results are shown in Table 1.

[0007] Note: Number of measurements n = 3 A twist test was performed, and the presence or absence of peeling of the seal state was judged. ○: No abnormality ×: Peeling occurred

[0011]

The package of the present invention is obtained by sealing without the need for complicated mechanical adjustment and complicatedly processed heater blocks, and the peel strength of the cover tape is stabilized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a chip-type electronic component package of the present invention.

FIG. 2 is a plan view of a carrier tape according to the present invention.

FIG. 3 is a sectional view of a carrier tape according to the present invention.

FIG. 4 is an enlarged cross-sectional view showing another example of the shape of the seal projection according to the present invention.

FIG. 5 is an explanatory sectional view showing a sealing method according to the present invention.

FIG. 6 is an explanatory sectional view showing another example of the sealing method according to the present invention.

FIG. 7 is a perspective view showing an example of a conventional chip-type electronic component package.

FIG. 8 is an explanatory sectional view showing an example of a conventional sealing method.

FIG. 9 is a perspective view showing a carrier tape normal state and a perspective view showing a twisted state of a carrier tape twist test according to the present invention.

Claims (1)

[Claims] 1. A plastic carrier tape in which a storage pocket for storing a chip-type electronic component is continuously formed, and the storage pocket is completely surrounded by a portion for sealing the carrier tape and the cover tape. A chip-type electronic component packaging body, comprising a convex seal projection continuously provided on the cover, and a cover tape sealed on the seal projection.