JP2550263B2 - Chip type electronic component package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package used for storing, transporting and mounting chip-type electronic components.

[0002]

2. Description of the Related Art Conventionally, a carrier tape 1 used for housing a chip type electronic component, etc. stores a chip type electronic component 4 in a storage pocket 3 formed by molding as shown in FIG. It is used. As a sealing method, for example, as shown in FIG. 7, a cover tape 5 is attached to a carrier tape 1 by heat using a heater block 9 having a sealing iron. There is a drawback that the cover tape adheres over a wide range due to changes over time, and there has been a strong demand for a chip-type electronic component package that can provide stable peel strength.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been earnestly studied to solve the above-mentioned problems, and as a result, the carrier tape sealing area is formed with a continuous groove having a concave groove on the cover tape from the surface of the cover tape. The inventors have completed the present invention by finding that stable peel strength can be obtained by fitting and sealing an object.

[0004]

DISCLOSURE OF THE INVENTION The present invention is a plastic carrier tape in which storage pockets for storing chip-type electronic components are continuously formed, and the plastic tape is provided in a sealing area of a portion for sealing a cover tape of the carrier tape. The chip-type electronic component package is characterized in that a continuous groove is formed, and a string-like object is fitted into the groove from the surface of the cover tape. As a method of sealing the cover tape in the groove of the carrier tape, after the chip type electronic component is stored in the storage pocket, a string-like object is fitted into the groove of the carrier tape from the surface of the cover tape and sealed to form a package. Further, the package of the present invention is required to have flexibility because the chip-type electronic component is accommodated in the accommodation pocket and is wound in the direction in which the groove is continuously formed, and is made of plastic to give flexibility. In order to give more flexibility, a notch is made in the bottom portion of the groove in the rib portion provided between the storage pockets of the carrier tape and the storage pockets. Since a space, that is, a rib, is formed between the storage pockets, the packaging body can be easily wound even if the chip electronic components are stored while being bent and wound in the direction of the storage pocket.

Hereinafter, a detailed description will be given with reference to the drawings. FIG. 1 is a perspective view showing a package of the present invention, in which a groove 7 continuous with a seal area portion of a carrier tape 1 having a sprocket 2 in which a chip-type electronic component 4 is stored in a storage pocket 3.
And a string-like object 6 is fitted into the groove from the surface of the cover tape 5 and sealed, and the cover tape 5 is partially covered.
It is the state figure which has peeled. Figure 2 shows the sealing method
And a carrier tape 1 having grooves 7 as shown in FIG.
Then, the cover tape 5 is covered with the cord-like material 6 from the surface of the cover tape, and the cord-fitting roll 8 is used to fit and seal the groove 7. As shown in FIG. 3, the shape of the groove 7 is such that the cross-sectional shape is (A) rectangular parallelepiped, (B) tapered,
(C) A circular one is preferable. Since the cover tape does not peel off when the chip-type electronic components are stored, transported, or mounted after being sealed, the thickness of the string-like object is greater than the groove width of 98% and 115% or less. It is necessary that the shape of the object does not deform even after sealing and does not protrude beyond the surface of the carrier. By providing a groove in the seal area of the carrier tape, a space is provided between the storage pockets for storing the chip type electronic components and the storage pockets, that is, the bottom of the ribs, in order to prevent the winding property of the carrier tape from being deteriorated. By making the cuts 10 shown, the flexibility of the carrier tape is secured. With respect to the shape of the cut, it is preferable that the bottom 11 of the groove is cut in a taper shape up to the thickness of the carrier tape sheet with a width of 80% of the size between the pockets for storing the chip type electronic parts,
It is not particularly limited.

[0006]

EXAMPLES The details of the present invention will be described with reference to Examples, but the methods for measuring the strength and the like in the Examples and the measured values are respectively performed by the following methods. (Measurement of Peel Strength of Cover Material) Peel strength was measured at a tensile speed of 300 mm / min and an angle of 180 ° with a peel back fortester manufactured by GPD. (Twist test) A cover material is sealed on each carrier tape, the sample is cut into a length of 250 mm, and both ends of the sample are gripped by 25 mm. The presence or absence of peeling was confirmed at a distance between marked lines of 200 mm. Example 1 24 mm wide, 0.3 mm thick, storage pocket 14 made of hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.)
A carrier tape having a width of 1 mm and a depth of 1.5 mm formed in a carrier tape sealing area of 1 mm square is shown in FIG.
Then, a seal tape having a diameter of 1.0 mm was used and a cover tape made of a polyethylene sheet was used for sealing by the method shown in FIG. Example 2 32 mm wide, 0.3 mm thick, storage pocket 22 made of hard vinyl chloride sheet (Sumilite VSL-3550D manufactured by Sumitomo Bakelite Co., Ltd.)
A carrier tape having a width of 1 mm and a depth of 1.5 mm formed in a carrier tape sealing area of 1 mm square is shown in FIG.
Then, a seal tape having a diameter of 1.0 mm was used and a cover tape made of a polyethylene sheet was used for sealing by the method shown in FIG. <Comparative Example 1> Carrier tape material rigid vinyl chloride sheet (Sumilite VSS13 manufactured by Sumitomo Bakelite Co., Ltd.
05US) Carrier tape with a width of 8 mm, a thickness of 0.2 mm and a storage pocket of 3.2 mm square, and a cover tape with a thickness of 65 μ (Sumilite CSL manufactured by Sumitomo Bakelite Co., Ltd.)
-Z275A) by the method according to FIG. 7 (machine used for sealing: ET-2000N manufactured by Nitto Kogyo) at a temperature of 140
Sealing was performed in an intermittent system at 32 ° C. and 32 mm / sec. Next, the sealed sample was observed for peel strength and torsion test, and the results are shown in Table 1.

[0007] Note: Number of measurements n = 3 It was judged by the twist test and the presence or absence of peeling of the seal state. ○: No abnormality ×: Peeling occurred

[0008]

According to the present invention, the peel strength of the cover tape is stable, it is not necessary to apply an adhesive effect to the cover tape, and the cost of the cover tape can be reduced without adversely affecting the chip-type electronic component. In addition, the sealing technology by heat is not required, and the sealing can be easily performed without the need for complicated mechanical adjustment management.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of a chip-type electronic component package of the present invention.

FIG. 2 is an enlarged vertical sectional view showing an example of a sealing method of the present invention.

FIG. 3 is a sectional view showing an example of the shape of a groove used in the present invention.

FIG. 4 is a laterally enlarged sectional view showing an example of a sealing method of the present invention.

FIG. 5 is a laterally enlarged cross-sectional view of a carrier tape having a notch formed in a groove used in the present invention.

FIG. 6 is a perspective view showing an example of a conventional chip-type electronic component package.

FIG. 7 is a perspective view showing an example of a conventional sealing method.

FIG. 8 is a perspective view showing a carrier tape normal state and a perspective view showing a twisted state of a carrier tape twist test according to the present invention.

Claims (2)

(57) [Claims] 1. A plastic carrier tape in which a storage pocket for storing a chip-type electronic component is continuously formed, wherein a continuous groove is formed in a portion for sealing the carrier tape and a cover tape, and the groove is formed in the groove. A chip-type electronic component package, wherein a string-like material is fitted into the groove from the surface of the cover tape. 2. The chip type electronic component package according to claim 1, wherein the carrier tape storage pocket has a notch in a bottom portion of a groove provided in a rib portion provided between the storage pocket and the storage pocket.