JPH0533553B2 - - Google Patents
Info
- Publication number
- JPH0533553B2 JPH0533553B2 JP60020293A JP2029385A JPH0533553B2 JP H0533553 B2 JPH0533553 B2 JP H0533553B2 JP 60020293 A JP60020293 A JP 60020293A JP 2029385 A JP2029385 A JP 2029385A JP H0533553 B2 JPH0533553 B2 JP H0533553B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- common electrode
- thermal head
- glass film
- undercoat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000605 extraction Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 230000004927 fusion Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000003763 resistance to breakage Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Description
【発明の詳細な説明】
(a) 技術分野
この発明は、基板上に導体膜および抵抗膜のペ
ーストをパターン形成して高温焼成することによ
り作成される厚膜サーマルヘツドに関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to a thick film thermal head made by patterning a paste of a conductive film and a resistive film on a substrate and firing the pattern at high temperature.
(b) 従来技術
従来の厚膜サーマルヘツドは、第３図および第
４図に示すように、セラミツク基板１上の一端辺
部に帯状のアンダーコートガラス膜２を形成し、
この上から導体膜３を櫛歯状にパターン形成し、
さらに、導体膜３の櫛歯状が互い違いに合わさつ
た部分の上に細長い発熱抵抗体膜４を形成し、最
後に、この上全面を覆うようにオーバーコートガ
ラス膜５を形成することにより構成されている。
ところが、従来のサーマルヘツドは、導体膜３の
共通電極部６がベタ塗りの帯状に形成されていた
ので、この部分でアンダーコートガラス膜２とオ
ーバーコートガラス膜５との密着が悪くなり、導
体膜３との膨張係数の相違からストレスを受け破
壊し易い構造になつていた。このため、導体膜３
の共通電極部６と発熱抵抗体膜４との間の距離δ1
をできるだけ離す必要があつた。従つて、従来の
サーマルヘツドは、素子が大型化する傾向にある
とともに、共通電極６の幅W1を広くすることが
困難となり、共通電極部６のインピーダンスが高
くなり大きな電流を流すことができず。例えば多
数の発熱ドツトを同時に通電した際に、共通電極
部６での電圧降下により、発熱体に対する通電量
が変動し、その結果、印刷品位が低下する、とい
うう欠点を有していた。(b) Prior Art As shown in FIGS. 3 and 4, a conventional thick-film thermal head includes a band-shaped undercoat glass film 2 formed on one edge of a ceramic substrate 1.
A conductor film 3 is formed into a comb-like pattern from above,
Furthermore, an elongated heating resistor film 4 is formed on the portion where the comb-like shapes of the conductor film 3 are alternately joined together, and finally, an overcoat glass film 5 is formed so as to cover the entire surface thereof. ing.
However, in the conventional thermal head, the common electrode part 6 of the conductor film 3 was formed in the shape of a solid band, so the adhesion between the undercoat glass film 2 and the overcoat glass film 5 deteriorated in this part, and the conductor Due to the difference in expansion coefficient from the membrane 3, the structure was susceptible to stress and was easily destroyed. For this reason, the conductor film 3
The distance δ 1 between the common electrode part 6 and the heating resistor film 4
It was necessary to keep them as far away as possible. Therefore, in conventional thermal heads, the elements tend to become larger and it becomes difficult to increase the width W1 of the common electrode 6, which increases the impedance of the common electrode section 6 and makes it difficult to pass a large current. figure. For example, when a large number of heating dots are energized at the same time, the amount of current applied to the heating element fluctuates due to a voltage drop at the common electrode portion 6, resulting in a disadvantage in that printing quality deteriorates.
(c) 発明の目的
この発明は、このような事情に鑑みなされたも
のであつて、アンダーコートガラス膜とオーバー
コートガラス膜との密着性を高め、ストレスによ
る破壊に対する耐性を高めた厚膜サーマルヘツド
を提供することを目的とする。(c) Purpose of the Invention The present invention was made in view of the above circumstances, and provides a thick film thermal film that improves the adhesion between the undercoat glass film and the overcoat glass film and increases resistance to breakage due to stress. The purpose is to provide a head.
(d) 発明の構成および効果
この発明は、共通電極とこの共通電極から延び
る複数の引出電極および複数の個別電極からなる
導体膜と、前記複数の引出電極と複数の個別電極
の上部に設置された発熱抵抗膜とを、基板上のア
ンダーコートガラス膜上に設け、前記導体膜と前
記発熱抵抗体膜を含む前記アンダーコートガラス
膜の上部に保護用のオーバーコートガラス膜を配
設した厚膜サーマルヘツドにおいて、前記共通電
極の膜面に表裏に貫通する多数の孔を形成すると
ともに、前記多数の孔を通して前記アンダーコー
トガラス膜と前記オーバーコートガラス膜間を融
合させたことを特徴とする。(d) Structure and Effects of the Invention The present invention provides a conductor film consisting of a common electrode, a plurality of extraction electrodes extending from the common electrode, and a plurality of individual electrodes, and a conductor film installed above the plurality of extraction electrodes and the plurality of individual electrodes. a heating resistor film provided on an undercoat glass film on a substrate, and a protective overcoat glass film disposed on top of the undercoat glass film including the conductor film and the heating resistor film. The thermal head is characterized in that a large number of holes are formed through the film surface of the common electrode from front to back, and the undercoat glass film and the overcoat glass film are fused through the large number of holes.
この発明の厚膜サーマルヘツドを上記のように
構成すると、幅の広い共通電極を形成しても、そ
の共通電極の膜面の表裏に貫通する多数の孔を通
して上下のガラス膜が融合するので、アンダーコ
ートガラス膜とオーバーコートガラス膜との密着
が良くなりストレスによる破壊を生じるおそれが
なくなる。このため、導体膜の幅を広くして共通
電極のインピーダンスを充分低下させることがで
き、電圧降下による前記問題を解消することがで
きる。また、共通電極をストレス源としての発熱
体から遠ざける必要がなくなり、素子の小型化に
貢献することができる。 When the thick film thermal head of the present invention is constructed as described above, even if a wide common electrode is formed, the upper and lower glass films are fused through the many holes penetrating the front and back sides of the common electrode's film surface. Adhesion between the undercoat glass film and the overcoat glass film is improved, and there is no risk of breakage due to stress. Therefore, the impedance of the common electrode can be sufficiently lowered by increasing the width of the conductor film, and the above-mentioned problem caused by voltage drop can be solved. Furthermore, it is no longer necessary to move the common electrode away from the heating element as a stress source, which contributes to miniaturization of the device.
(e) 実施例
第１図は、この発明の実施例である厚膜サーマ
ルヘツドの部分平面図、第２図は、同厚膜サーマ
ルヘツドの第１図Ａ−Ａ線における部分断面図で
ある。(e) Embodiment FIG. 1 is a partial plan view of a thick film thermal head which is an embodiment of the present invention, and FIG. 2 is a partial sectional view of the same thick film thermal head taken along line A-A in FIG. .
この実施例の厚膜サーマルヘツドは、導体膜３
の共通電極部６に多数の孔７を形成することによ
り構成される。この導体膜３は、アンダーコート
ガラス膜２とオーバーコートガラス膜５との間に
配設されている。アンダーコートガラス膜２は、
セラミツク基板１上の一端辺部に、断面が厚さ
15μm程度の蒲鉾形となるような帯状に形成され
ている。導体膜３は、この上に、櫛の歯状が向か
い合わせにアンダーコートガラス膜２の中央頂部
で互い違いに一定の間隔を開けて重なり合うよう
に3μm程度の厚さでパターン形成され、向かい合
う一方の櫛の歯状の導体膜３は、基部を共通電極
６に接続した引出電極として形成され、他方の櫛
の歯状の導体膜３は個別電極として形成され、基
部がそれぞれ図外の駆動用ICに接続されている。
発熱抵抗体膜４は、導体膜３の櫛の歯状の先端が
互いに違いに合わさつた部分の上の、アンダーコ
ートガラス膜２の中央頂部に沿つて細長く形成さ
れている。オーバーコートガラス膜５は、この上
全面を覆うようにして10μm程度の厚さに形成さ
れ、発熱抵抗体膜４や導体膜３を保護している。
孔７は、この導体膜３の共通電極６に表裏に貫通
するように多数形成された、直径数μm〜１mm程
度の抜き孔である。 The thick film thermal head of this embodiment has a conductor film 3
It is constructed by forming a large number of holes 7 in the common electrode section 6 of the. This conductor film 3 is disposed between the undercoat glass film 2 and the overcoat glass film 5. The undercoat glass film 2 is
At one end of the ceramic substrate 1, a cross section with a thickness of
It is formed into a belt-like shape with a diameter of about 15 μm. The conductor film 3 is patterned with a thickness of about 3 μm so that the comb teeth face each other and are alternately overlapped at the center top of the undercoat glass film 2 at a constant interval. The comb-tooth-shaped conductor film 3 is formed as an extraction electrode whose base is connected to the common electrode 6, and the other comb-tooth-shaped conductor film 3 is formed as an individual electrode, with the base connected to a drive IC (not shown). It is connected to the.
The heat generating resistor film 4 is formed in a long and narrow manner along the central top of the undercoat glass film 2 above the portions where the comb-like tips of the conductor film 3 meet at different angles. An overcoat glass film 5 is formed to a thickness of about 10 μm to cover the entire surface, and protects the heating resistor film 4 and the conductor film 3.
The holes 7 are punch holes having a diameter of about several μm to 1 mm, which are formed in large numbers so as to penetrate the common electrode 6 of the conductor film 3 from the front to the back.
上記のよううに構成されたこの実施例の厚膜サ
ーマルヘツドは、高温焼成時に導体膜３の共通電
極６の孔７を通して上下のガラス膜が融合するの
で、アンダーコートガラス膜２とオーバーコート
ガラス膜５との密着が良くなり、発熱抵抗体膜４
の発熱によるストレスに対して破壊等のおそれが
なくなる。このため、素子の信頼性が向上するば
かりでなく、発熱抵抗体膜４と導体膜３との間の
距離δ2を近づけることができるので、厚膜サーマ
ルヘツドの小型化を推進することができる。ま
た、共通電極部６の幅W2を広くすることができ
るので、発熱抵抗体アレイに供給する電流容量を
増加することが可能となり、同時印字ドツト数を
多くすることができ、厚膜サーマルヘツドの印刷
速度の高速化に貢献することができる。 In the thick film thermal head of this embodiment configured as described above, the upper and lower glass films are fused through the hole 7 of the common electrode 6 of the conductor film 3 during high-temperature firing, so that the undercoat glass film 2 and the overcoat glass film 5, the heat-generating resistor film 4
There is no risk of destruction due to stress caused by heat generation. Therefore, not only the reliability of the element is improved, but also the distance δ 2 between the heat generating resistor film 4 and the conductor film 3 can be reduced, so that the miniaturization of the thick film thermal head can be promoted. . Furthermore, since the width W2 of the common electrode section 6 can be increased, it is possible to increase the current capacity supplied to the heating resistor array, and the number of simultaneous printing dots can be increased. This can contribute to faster printing speeds.
第１図は、この発明の実施例である厚膜サーマ
ルヘツドの部分平面図、第２図は、同厚膜サーマ
ルヘツドの第１図Ａ−Ａ線における部分断面図、
第３図は、従来の厚膜サーマルヘツドの部分平面
図、第４図は、同厚膜サーマルヘツドの第３図Ｂ
−Ｂ線における部分断面図である。
１…セラミツク基板（基板）、２…アンダーコ
ートガラス膜、３…導体膜、５…オーバーコート
ガラス膜、７…孔。
FIG. 1 is a partial plan view of a thick film thermal head according to an embodiment of the present invention, and FIG. 2 is a partial sectional view of the same thick film thermal head taken along line A-A in FIG.
Figure 3 is a partial plan view of a conventional thick film thermal head, and Figure 4 is Figure 3B of the same thick film thermal head.
- It is a partial sectional view taken on the B line. DESCRIPTION OF SYMBOLS 1... Ceramic substrate (substrate), 2... Undercoat glass film, 3... Conductor film, 5... Overcoat glass film, 7... Hole.
Claims (1)
出電極および複数の個別電極からなる導体膜と、
前記複数の引出電極と複数の個別電極の上部に設
置された発熱抵抗膜とを、基板上のアンダーコー
トガラス膜上に設け、前記導体膜と前記発熱抵抗
体膜を含む前記アンダーコートガラス膜の上部に
保護用のオーバーコートガラス膜を配設した厚膜
サーマルヘツドにおいて、前記共通電極の膜面に
表裏に貫通する多数の孔を形成するとともに、前
記多数の孔を通して前記アンダーコートガラス膜
と前記オーバーコートガラス膜間を融合させたこ
とを特徴とする厚膜サーマルヘツド。1. A conductor film consisting of a common electrode, a plurality of extraction electrodes extending from the common electrode, and a plurality of individual electrodes;
The plurality of extraction electrodes and the heating resistor film installed on the top of the plurality of individual electrodes are provided on the undercoat glass film on the substrate, and the undercoat glass film including the conductor film and the heating resistor film is provided on the undercoat glass film on the substrate. In a thick film thermal head having a protective overcoat glass film disposed on the upper part, a large number of holes are formed in the film surface of the common electrode, penetrating from the front to the back, and the undercoat glass film and the A thick film thermal head characterized by fusion of overcoat glass films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020293A JPS61179591A (en) | 1985-02-04 | 1985-02-04 | Thick film element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020293A JPS61179591A (en) | 1985-02-04 | 1985-02-04 | Thick film element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61179591A JPS61179591A (en) | 1986-08-12 |
| JPH0533553B2 true JPH0533553B2 (en) | 1993-05-19 |
Family
ID=12023114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60020293A Granted JPS61179591A (en) | 1985-02-04 | 1985-02-04 | Thick film element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61179591A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002002005A (en) * | 2000-06-19 | 2002-01-08 | Rohm Co Ltd | Thick film type thermal printing head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138984A (en) * | 1980-03-31 | 1981-10-29 | Nitto Electric Ind Co | Circuit board with electric resistance layer |
-
1985
- 1985-02-04 JP JP60020293A patent/JPS61179591A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138984A (en) * | 1980-03-31 | 1981-10-29 | Nitto Electric Ind Co | Circuit board with electric resistance layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61179591A (en) | 1986-08-12 |
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