JPH0533153U - Continuous surface treatment equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] A continuous installation type in which a processing chamber of a processing device such as a spray etching device where corrosive vapor is generated and a processing chamber of another processing device communicate with each other through a communication chamber. In the surface treatment apparatus, the vapor is prevented from leaking to the outside of the processing chamber regardless of the balance of exhaust pressure between the processing chambers. [Structure] An opening portion 52 communicating with the atmosphere is formed on the peripheral wall surfaces of communication chambers 24, 26 which connect the etching treatment chamber 18, the development treatment chamber 16 and the film stripping treatment chamber 20, respectively. The outside air flows into the communication chamber through the opening so that the outside air flows into the etching processing chamber.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 This invention includes a processing apparatus, such as a spray etching apparatus, in which a corrosive fluid is used as a surface treatment agent and the vapor of the corrosive fluid is mixed in the atmosphere of the processing chamber, and the processing is performed separately from the etching apparatus. Equipment related to surface treatment equipment such as development equipment and film peeling equipment, which are connected in series with a communication chamber interposed.This continuous surface treatment equipment is used when manufacturing liquid crystal display devices and printed circuit boards. To be done.

[0002]

[Prior Art]

 Liquid crystal display devices and printed circuit boards are manufactured using the photo-etching method. During the series of manufacturing processes, during the etching process, a mixed solution of ferric chloride aqueous solution and hydrochloric acid or a mixed solution of hydrochloric acid and nitric acid is used. Such a corrosive liquid is used, and the corrosive liquid is sprayed from a spray pipe onto the surface of a plate material to be processed which is horizontally conveyed in the processing chamber by a conveying roller or the like to perform spray etching. Therefore, inside the etching chamber, part of the corrosive liquid sprayed from the spray pipe is vaporized and its vapor is generated. Since this vapor has strong corrosiveness, the atmospheric gas in the processing chamber is forcibly exhausted so that it does not flow out of the processing chamber through the opening (pass line opening) through which the plate to be processed passes. And I always try to keep the pressure in the room negative.

As a method for preventing corrosive vapor generated inside the etching chamber from leaking out through the pass line opening, for example, Japanese Utility Model Publication No. 59-19727 discloses a spray chamber (processing chamber). ), The shielded chambers are arranged in a straight line in front of and behind the shielded chambers, and passages for the plate to be processed are provided in the shielded chambers before and after the shielded chamber to circulate a shielding liquid such as water between the front and rear shielding chambers and the storage tank. The amount of shielding liquid that is greater than the amount that flows out from the passage for the plate material to be processed is supplied to the room so that the liquid surface is positioned above the passage for the plate material to be processed, and both ends of the top plate of the spray chamber are supplied. A technique is disclosed in which a shielding plate that hangs down from the front and rear shielding chambers is configured to be immersed in the liquid to prevent the outflow of vapor generated in the spray chamber.

[0004]

[Problems to be solved by the device]

 By the way, another processing chamber, that is, a development processing chamber or a film removal processing chamber is installed adjacent to the etching processing chamber, and these adjacent processing chambers are connected to each other through a communication chamber. The continuous type surface treatment apparatus in which the transport mechanism such as the transport rollers is arranged in a straight line in the communication chamber has the following problems. In other words, not only in the etching processing room but also in the development processing room and the film removal processing room, the atmospheric gas in the processing room is forcedly exhausted, so that each room is always kept at a negative pressure, while the communication room is , The processing chambers adjacent to each other are connected to each other in a state of being almost airtight. In this case, the negative pressure in the etching processing chamber is usually set to be higher than the negative pressures in the other processing chambers. Therefore, as long as the system is operating normally, air will not flow into the etching chamber and corrosive vapor will not leak out of the chamber through the pass line opening. However, the exhaust pressure of each processing chamber fluctuates due to some cause such as malfunction of the exhaust fan, the pressure of the air knife installed inside each processing chamber is changed, or it is installed in the etching processing chamber. When the opening / closing lid is opened and the exhaust pressure balance between the processing chambers is disturbed, the negative pressure in the development processing chamber or film peeling processing chamber is larger than that even if the etching processing chamber maintains a negative pressure state. Become. As a result, the atmospheric gas in the etching processing chamber is pulled toward the other processing chamber, and vapor leakage easily occurs from the etching processing chamber through the pass line opening. If vapor leaks from the etching chamber for a short period of time, the corrosive liquid used for etching is extremely corrosive, and the leaked vapor easily corrodes the SUS parts of the developing device and film peeling device. There is a big problem that it will be done.

Here, according to the method disclosed in Japanese Utility Model Publication No. 59-19727, it is possible to prevent vapor leakage from the etching processing chamber. However, in that case, there is a concern that the plate material surface may be contaminated by the contact of the plate material to be treated with the shielding liquid, and the configuration of the apparatus becomes complicated.

The present invention has been made in view of the above circumstances, and a simple surface treatment apparatus of a type in which a plurality of processing chambers and a communication chamber communicating between adjacent processing chambers are provided in series. With such a configuration, it is a technical object to always prevent the vapor from leaking out from the processing chamber of an apparatus that uses a corrosive fluid, such as an etching apparatus.

[0007]

[Means for Solving the Problems]

 This invention has at least two processing chambers adjacent to each other, each of which is provided with a transporting means for transporting a plate material to be processed and is connected to a forced exhausting means for forcibly exhausting an atmospheric gas. At least one of the processing chambers is provided with corrosive fluid supply means for supplying a corrosive fluid to the surface of the plate material to be processed which is conveyed in the horizontal direction by the transfer means. Has a transport means for transporting the plate material to be processed in the horizontal direction, and a connecting chamber that surrounds the transport means and that has a communication chamber that communicates the two treatment chambers is arranged in a line in both treatment chambers. In the processing apparatus, an opening communicating with the atmosphere is formed on the peripheral wall surface of the communication chamber.

In the surface treatment apparatus having the above-described structure, since the opening communicating with the atmosphere is formed on the peripheral wall surface of the communication chamber, the treatment chamber using the corrosive fluid, for example, the spray etching treatment chamber is exhausted by the forced exhaust means. As long as the negative pressure is maintained by the atmospheric pressure, the outside air always flows into the communication chamber through the opening due to the atmospheric pressure difference between the negative pressure and the atmospheric pressure, and the outside air is etched from the communication chamber through the pass line opening. Atmosphere gas in the etching chamber does not flow out of the chamber regardless of the balance of exhaust pressure between the chamber and the other chambers.

A lid member is attached to the opening of the communication chamber, and the cover member covers the opening at a predetermined distance, so that unwanted matter may fall into the communication chamber through the opening. You should try to prevent this. Further, a filter may be provided at the opening of the communication chamber to prevent dust and the like from flowing from the atmosphere into the processing chamber through the communication chamber.

[0010]

【Example】

 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic longitudinal sectional view showing a schematic configuration of a continuous surface treatment apparatus according to an embodiment of the present invention. This device is, for example, a part of a printed circuit board manufacturing line, and is composed of a developing machine 10, a spray etching machine 12, and a film peeling (resist film peeling) machine 14. The three processing chambers, that is, the development processing chamber 16, the etching processing chamber 18 and the film stripping processing chamber 20, and the four communication chambers, that is, the development processing chamber 16 and the processing chamber (not shown) in the preceding stage thereof. , A contact room 24 for communicating the developing processing chamber 16 with the etching processing chamber 18, a contact room 26 for communicating the etching processing chamber 18 with the film stripping processing chamber 20, and a film stripping processing chamber 20. A communication chamber 28 that connects the processing chamber and a processing chamber (not shown) in the subsequent stage is connected in a straight line.

Inside each of the processing chambers 16, 18, 20 and each of the communication chambers 22, 24, 26, 28, transport mechanisms 30 to 42 composed of transport rollers are respectively arranged, so that the transport is linear in a straight line as a whole. The road is formed. In addition, each processing chamber 16, 18, 20 is connected to an exhaust fan (not shown) so as to compulsorily exhaust the atmospheric gas inside each processing chamber 16, 18, 20. Has been Further, the etching chamber 18 is provided with a spray pipe 44 for ejecting an etching liquid (corrosion liquid) onto the surface of the plate material 50 to be processed, which is horizontally transferred by the transfer mechanism 32. Further, in the development processing chamber 16 and the film removal processing chamber 20, spray pipes 46 and 48 for ejecting a developing solution and a stripping solution to the surface of the plate material 50 to be processed which are transported by the respective transport mechanisms 30 and 34 are provided. Has been.

Openings 52 are formed on the upper wall surfaces of the communication chambers 22, 24, 26, 28, respectively, so that the interiors of the communication chambers 22, 24, 26, 28 communicate with the atmosphere. . The opening may be formed not on the upper wall surface but on the side wall surface, or may be formed on the side wall surface together with the upper wall surface. A lid member 54 is attached to the opening 52 of the communication chamber in order to prevent unnecessary objects from dropping through the opening 52. The lid member 54 is arranged at a predetermined distance from the opening surface of the opening 52, covers the opening surface, and forms an air passage between the lid member 54 and the opening surface. Further, a filter may be arranged in the opening 52 of the communication chamber to prevent dust and the like from flowing into the communication chambers 22 to 28.

When the continuous surface treatment apparatus having the above-described structure is operated, the inside of each processing chamber 16, 18, 20 is forcibly exhausted to a negative pressure, and the negative pressure and the atmospheric pressure. Due to the difference, outside air flows into each of the communication chambers 22, 24, 26, 28 through each opening 52, and the outside air flows from each of the communication chambers 22, 24, 26, 28 through the pass line opening into each processing chamber. It will flow into 16, 18, and 20. In this case, the negative pressures in the processing chambers 16, 18 and 20 are different, and in particular, due to the negative pressure in the etching processing chamber 18 due to some reason, the negative pressure in the development processing chamber 16 or the film stripping processing chamber 20 is reduced. However, since the contact chamber 24 or the contact chamber 26 communicating with the atmosphere is interposed between the etching processing chamber 18 and the development processing chamber 16 or the film stripping processing chamber 20, Atmospheric gas in the etching processing chamber 18 is not pulled toward the development processing chamber 16 or the film removal processing chamber 20 by the action of the negative pressure inside the development processing chamber 16 or the film removal processing chamber 20. Therefore, the vapor of the corrosive liquid sprayed and sprayed from the spray pipe 44 in the etching processing chamber 18 leaks out of the etching processing chamber 18 and corrodes the SUS parts of the developing device 10 and the film stripping device 14. That doesn't happen. Moreover, although an opening for monitoring or maintenance is usually formed on the upper surface or the side surface of the etching processing chamber 18, even if the opening / closing lid attached to such an opening is opened, the same reason is used. The atmosphere gas in the etching processing chamber 18 does not flow into the development processing chamber 16 or the film stripping processing chamber 20 through this opening.

The above description has been made by taking as an example a developing machine-spray etching machine-film stripping machine continuous type surface treatment apparatus which forms a part of a printed circuit board manufacturing line, but the present invention is accompanied by processing. The present invention can be widely applied to a continuous surface treatment apparatus including a treatment apparatus that generates corrosive vapor.

Further, in the above embodiment, in the development processing chamber 16, the etching processing chamber 18 and the film stripping processing chamber 20, the developing solution, the etching solution and the film stripping solution are respectively supplied from the spray pipes 46, 44 and 48 to the plate material 50 to be processed. However, instead of such a spray pipe, each treatment liquid may be allowed to flow down onto the surface of the plate material 50 to be treated by its own weight through the guide means. Further, in the etching processing chamber 18, instead of spraying the corrosive liquid through the spray pipe 44, an opening communicating with the supply source of the corrosive gas is formed, and the corrosive gas is discharged through the opening. It is also possible to supply it to the plate material 50 to be processed.

[0017]

[Effect of the device]

 Since the present invention is constructed and operates as described above, according to the present invention, a processing apparatus, such as a spray etching apparatus, in which corrosive vapor is generated during the processing is included, and the processing chamber of the processing apparatus is included. In a continuous surface processing apparatus having a structure in which a communication chamber and a processing chamber of another processing apparatus are communicated with each other through a communication chamber, regardless of the exhaust pressure balance between the processing chambers, an etching apparatus, etc. Leakage of corrosive vapor from the processing chamber can be effectively prevented at all times, the structure of the device is simple, and there is no risk of any problems with the plate material to be processed.

[Brief description of drawings]

FIG. 1 is a schematic vertical sectional view showing a schematic configuration of a continuous installation type surface treatment apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 16 Development chamber 18 Etching chamber 20 Stripping chamber 22, 24, 26, 28 Contact chamber 30-42 Transport mechanism 44 Corrosion liquid spray pipe 46, 48 Spray pipe 50 Treated plate 52 Opening 54 Lid member

Claims (3)

[Scope of utility model registration request] 1. An atmosphere gas, comprising: a transportation means for horizontally transporting a plate material to be processed, and a corrosive fluid supply means for supplying a corrosive fluid to a surface of the plate material to be processed horizontally transported by the transportation means. A first processing chamber, which is connected to a forced exhaust means for forcibly exhausting the sheet, a conveying means that is adjacent to the first processing chamber and horizontally conveys the plate material to be treated, and a horizontal direction by the conveying means. A second processing chamber provided with a processing fluid supply means for supplying a processing fluid to the surface of the plate material to be conveyed and communicatively connected to a forced exhaust means for forcibly exhausting atmospheric gas, and both of these processing chambers. In the continuous surface treatment apparatus, which has a conveying means for horizontally conveying the plate material to be processed between the chambers, and which is continuously provided with a communication chamber that surrounds the conveying means and connects the two processing chambers to each other, Contact An opening communicating with the atmosphere is formed on the peripheral wall surface of the chamber, and the outside air flowing into the communication chamber through the opening is allowed to flow into each of the first and second processing chambers. Fixed surface treatment equipment. 2. The opening member of the communication chamber is provided with a lid member for covering the opening member at a predetermined distance, and an air passage is provided between the lid member and the peripheral edge of the opening member. Continuous surface treatment equipment. 3. The continuous surface treatment apparatus according to claim 1, wherein a filter is arranged at the opening of the communication chamber.