JPH05327246A - Electronic circuit package - Google Patents

Abstract

PURPOSE:To reduce the impedance of a power supply for an electronic circuit package and suppress the generation of noise due to the connection of live wires. CONSTITUTION:An electronic circuit package includes a power supply connector 3 a ground connector 4 on opposite lengthwise sides of an electronic circuit package 1, and a signal connector 6 for the transfer of a signal on the insertion side. The power supply connector 3 and the ground connector 4 are fitted into a mother board 13 on which a power supply connecting guide rail 11 and a grounding guide rail 12 to be slided are mounted, and power is supplied to the electronic circuit package 1 through these guide rails to operate an electronic circuit 5. With such arrangement, a power supply impedance in the electronic circuit package 1 is prevented from varying depending on its position and also the generation of noise in the electronic circuit package 1 at the time of connection of a live wire is suppressed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit package, and more particularly to an electronic circuit package which can be combined and operated with a mother board.

[0002]

2. Description of the Related Art A conventional electronic circuit package has a structure in which a power supply connector is arranged on a part of the electronic circuit package to supply power, and a connector including a signal terminal and a power supply terminal for connecting to a mother board is arranged. However, it is configured to secure the exchange of signals and power by coupling with a connector arranged on the motherboard side.

[0003]

In this conventional electronic circuit package, in the case where the power supply connector is arranged on a part of the electronic circuit package, the power supply parts are unevenly distributed. There is a problem that the power supply impedance in the circuit package varies depending on the location, and the power supply impedance becomes higher as it is farther from the supply unit, and the power supply impedance becomes weaker to that extent.

Further, in the structure in which the signal terminal and the power source terminal are connected to the mother board by the connector which is integrated, the signal and the power source are simultaneously connected to the mother board. Therefore, the electronic circuit package is connected while the power source is supplied to the mother board ( When the live connection is made, noise is generated during the period from the connection of the power supply to the stabilization of the electronic circuit, causing a malfunction in other normally operating electronic circuit packages through the motherboard. ..

The object of the present invention is to solve the above-mentioned problems,
An object of the present invention is to provide an electronic circuit package in which the vulnerability to noise is significantly strengthened and the occurrence of malfunction of the electronic circuit package during normal operation is significantly suppressed.

[0006]

In the electronic circuit package of the present invention, a power supply connecting portion for connecting a power supply is provided on one of two parallel sides of a printed circuit board on which an electronic circuit is arranged in the longitudinal direction. The other side opposite to the one side is provided with a ground connecting portion for connecting a ground.

In the electronic circuit package of the present invention, the power supply connection portion and the ground connection portion are slid along guide rails attached to the mother board to be coupled to the mother board, and the power source is connected via the guide rails. And a signal can be transmitted and received by being coupled to the motherboard.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an embodiment of the present invention. The embodiment shown in FIG. 1 exemplifies a case where an electronic circuit package is mounted on a mother board, and an electronic circuit package 1, a power circuit connection guide rail 11 and an earth connection guide rail 12 that hold the electronic circuit package 1, Motherboard 13 with these guide rails attached, and motherboard 1
3 and the motherboard side connector 14 attached to 3.

FIG. 2 is a plan view of the electronic circuit package 1 of FIG. 1, and FIG. 3 is a sectional view of the electronic circuit package of FIG.

The electronic circuit package 1 of FIG. 2 has a power supply connecting portion 3 formed on one of the two sides of the printed circuit board 2 in the longitudinal direction. The power supply connecting portion 3 is, as shown in FIG. 2 is connected to the power supply layer 7. Further, a ground connecting portion 4 is formed on the other side facing the power supply connecting portion 3 of the printed circuit board 2, and this ground connecting portion 4 is connected to the ground layer 8 of the printed circuit board 2 as shown in FIG. Has been done.

The electronic circuit 5 is an electronic circuit arranged on the upper surface of the printed board 2, is connected to the power supply layer 7 and the ground layer 8, and is supplied with an operating current according to the operating power supply.

The signal connector 6 is connected to the electronic circuit 5 and exchanges signals with an external motherboard.

Next, supply of an operating current to the electronic circuit package 1 and hot-line connection will be described.

In FIG. 1, a power supply connecting guide rail 1
1 and the ground connection guide rail 12 hold the electronic circuit package 1 by sandwiching the two sides of the power supply connection portion 3 and the ground connection portion 4 of the electronic circuit package 1 and hold the power supply connection guide rail 11 and the ground connection. Guide rail 1
By supplying power from a power supply device (not shown) to FIG. 2, an operating current flows through the power supply connection part 3 and the ground connection part 4, and the electronic circuit 5 operates.

The exchange of signals between the electronic circuit 5 and the external motherboard 13 is ensured by the connection between the signal connector and the motherboard-side signal connector 14 attached to the motherboard 13.

In the case of hot-line connection with such a configuration, the electronic circuit package 1 is slid between the power supply connection guide rail 11 and the ground connection guide rail 12 in the insertion direction L, and the signal connector 6 is inserted. Before the motherboard-side signal connector 14 is connected to the motherboard-side signal connector 14, an operating current flows through the electronic circuit 5, and the operation of the electronic circuit 5 is stabilized.

As a result, the influence of noise on other electronic circuit packages is significantly suppressed, and it is possible to secure a reduction in power source impedance over the entire area within the electronic circuit package itself.

[0018]

As described above, according to the present invention, the power source connecting portion for connecting the power source and the ground connecting portion for connecting the ground to the power source connecting portion are provided on the two sides in the longitudinal direction of the electronic circuit package. By ensuring the signal transmission / reception to / from the motherboard via the connector, the power supply impedance can be suppressed low over the entire area of the electronic circuit package, and it is effective against noise.

In the case of hot-line connection, an operating current is supplied at the stage of inserting the electronic circuit package, and the signal is connected to the outside after the electronic circuit is stabilized. Therefore, noise is generated in other electronic circuit packages. It also has the effect that it can be suppressed.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a plan view of the electronic circuit package 1 of FIG.

FIG. 3 is a sectional view taken along arrow A in FIG.

[Explanation of symbols]

 1 Electronic Circuit Package 2 Printed Circuit Board 3 Power Connection Section 4 Ground Connection Section 5 Electronic Circuit 6 Signal Connector 7 Power Layer 8 Ground Layer 11 Power Supply Guide Rail 12 Ground Connection Guide Rail 13 Motherboard 14 Motherboard Side Signal Connector

Claims (2)

[Claims] 1. A power supply connecting portion for connecting a power supply is provided on one of two parallel sides in a longitudinal direction of a printed circuit board on which an electronic circuit is arranged, and a ground is connected to the other side opposite to the one side. An electronic circuit package, which is provided with a grounding connection portion. 2. The power supply connection part and the ground connection part slide along guide rails attached to a mother board to be coupled to the mother board, and are supplied with power via the guide rails. The electronic circuit package according to claim 1, wherein a signal can be transmitted and received by being coupled with a mother board.