JPH05326351A - Semiconductor manufacturing jig and manufacutre of semiconductor element - Google Patents

Abstract

PURPOSE:To prevent crack of a silicon wafer occurring at the time of alloying of the wafer and a reinforcing plate, contamination of a semiconductor element and to improve operability. CONSTITUTION:A reinforcing plate 2 and a wafer 3 are positioned and fixed by using a jig 8 having a recess 81 for fixing the plate 2 and a positioning member 5 mounted in the jig 8 to position the wafer 3. Thus, crack of the wafer is eliminated, and contamination of a semiconductor element with mineral oil is obviated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing jig and a semiconductor element manufacturing method, and more particularly to a pressure contact type semiconductor manufacturing jig and a semiconductor element manufacturing method using the same.

[0002]

2. Description of the Related Art In a structure such as a power semiconductor element, it is necessary to reinforce a silicon wafer and take out an electrode. Therefore, an aluminum deposition film is used as a brazing material on one surface of the silicon wafer and one surface of a reinforcing plate made of molybdenum. A method is used in which they are formed, then both surfaces are superposed and heated to about 700 ° C. in a vacuum to alloy them.

FIG. 2 shows a sectional view of a conventional semiconductor manufacturing jig. In FIG. 2, reference numeral 1 is a positioning fixing jig coated with carbon, and 2 is a reinforcing plate made of molybdenum (Mo), and an Al vapor deposition layer 4a is formed on one surface of the reinforcing plate. 3 is a silicon wafer, and an Al vapor deposition layer 4b is formed on the surface facing the reinforcing plate 2.

In the above structure, the reinforcing plate 2 made of Mo is used.
Is designed to be larger than the diameter of the silicon wafer 3. This is because the extra brazing material (Al in this case) that flows out during alloy formation adheres to the inner wall surface of the jig and the silicon is removed when the alloy is taken out. The purpose is to prevent the wafer 3 from being chipped. Therefore, in order to obtain the coaxiality between the silicon wafer 3 and the reinforcing plate 2 made of Mo, the recess 61 is provided on the inner wall surface of the positioning and fixing jig. The depth of the recess 61 must be shallower than the thickness of the silicon wafer 3 in order to bring the reinforcing plate 2 and the silicon wafer 3 into close contact with each other to form an alloy.
Further, a step portion 62 for aligning the reinforcing plate 2 is formed on the inner wall surface of the fixing jig 6, and a convex portion 63 having a diameter slightly smaller than the diameter of the reinforcing plate 2 is formed below the jig. There is. The convex portion 63 is for pressing the reinforcing plate 2 from above another jig having the same configuration when forming the alloy. Reference numeral 64 is a groove formed in the processing step of forming the recess 61, which prevents the edge of the recess 61 from being tapered.

Hereinafter, the order of assembling the alloy using the above positioning and fixing jig will be described. First, a carbon coating member is used, and a concave portion 61 for fixing the silicon wafer 3 therein, a step portion 62 for aligning the reinforcing plate 2 and a convex portion for closely adhering the reinforcing plate 2 to the outside are formed. A positioning and fixing jig 6 including 63 is prepared. Then, the silicon wafer 3 on which the Al vapor deposition layer 4b is formed is placed in the recess 61 of the jig 6 with the Al vapor deposition layer 4b facing upward.

Next, the reinforcing plate 2 having the Al vapor deposition layer 4b formed thereon.
Is placed in the step portion 62 of the jig 6 with the Al vapor deposition layer 4b facing down, and both Al vapor deposition layers 6a and 6b are overlapped. Next, in order to bring the reinforcing plate 2 and the silicon wafer 3 into close contact with each other, the convex portion of another positioning and fixing jig (not shown) is mounted on the reinforcing plate 2, and the assembly is performed in the same manner. Are heated in an overlapping state to melt the Al vapor-deposited layers 4a and 4b between both members to alloy them.

However, the silicon wafer 3 is subjected to the diffusion process, A
l When the Al vapor deposition layer is warped in a concave shape with the Al vapor deposition layer upward by more than the thickness in the vapor deposition step, the silicon wafer 3 rides on the stepped portion 62 and positioning cannot be performed, and when the reinforcing plate 2 is set and pressed in this state, the silicon wafer 3 may be broken.

As a solution to such a problem, the alloy jig assembling method of FIG. 3 has been proposed. In the figure, reference numeral 1 indicates a concave portion 1 for fixing a reinforcing plate 2 therein, which is formed by using a member coated with carbon.
1 is a positioning and fixing jig that has a convex portion 12 for applying a pressing force to another jig at the time of assembly on the lower side of the outside.

The order of assembling the alloy using the positioning and fixing jig shown in FIG. 3 will be described below. The fixing jig 1 having the above-described structure is prepared, and the reinforcing plate 2 having the Al vapor deposition layer 4a formed therein is placed in the recess 11 with the Al vapor deposition layer 4a facing upward. Next, in order to align the silicon wafer 3 and the reinforcing plate 2, a mineral oil film 7 is formed on the Al vapor deposition layer 4a, and the Al vapor deposition layer 4b is placed downward so that the silicon wafer 3 is coaxial with the reinforcing plate 2. Is adhered to the surface through the mineral oil film 7. Next, in order to bring the reinforcing plate 2 and the silicon wafer 3 into close contact with each other, a convex portion of another fixing jig (not shown) is mounted on the silicon wafer 3 and the same assembly is performed thereafter to stack a plurality of fixing jigs. It heats in the state and alloys.

However, in such an alloy jig assembling method, a deviation between the reinforcing plate 2 and the silicon wafer 3 is likely to occur, and the semiconductor element is contaminated by the mineral oil film 7, resulting in poor workability. was there.

[0011]

The conventional semiconductor manufacturing jig and semiconductor element manufacturing method are configured as described above. In the assembly method using the alloy jig shown in FIG. 2, a thin silicon wafer is used. In this case, there is a problem in that the silicon wafer is warped to cause a positional deviation, the silicon wafer rides on the stepped portion of the jig and enters between the reinforcing plate 2 and the silicon wafer to be broken. Further, in the assembling method using the alloy jig shown in FIG. 3, since the silicon wafer and the reinforcing plate are fixed by the mineral oil film, the deviation is weak and the semiconductor element is contaminated by the mineral oil film, and the workability is also improved. There was a problem that it was bad.

The present invention has been made in order to solve the above-mentioned problems, and obtains the coaxiality between the silicon wafer and the reinforcing plate, prevents the semiconductor element from being contaminated by the mineral oil film, and has good workability. An object of the present invention is to obtain a semiconductor manufacturing jig and a semiconductor element manufacturing method that can be improved.

[0013]

A semiconductor manufacturing jig according to the present invention is mounted on a jig main body having a recess for fixing a reinforcing plate therein and a reinforcing plate fixed to the jig main body. The reinforcing plate and the wafer are positioned by using a positioning member having an opening for mounting the wafer on the reinforcing plate and positioning the wafer.

Further, in the method for manufacturing a semiconductor element according to the present invention, a reinforcing plate having a brazing material deposited thereon is arranged in a concave portion inside a jig body having a convex portion on the outside and a ring-shaped positioning member having a step portion. After mounting the wafer on which the brazing material has been vapor-deposited in the opening of the ring-shaped positioning member, the convex portion below the outside of another jig body having the same configuration as the jig body is An alloy is formed by stacking and closely adhering on a wafer.

[0015]

According to the present invention, conventionally, the reinforcing plate and the wafer are fixed by a single positioning and fixing jig.
Since the reinforcing plate is fixed in the recess of the fixing jig main body, and the position of the wafer with respect to the reinforcing plate is determined by the positioning member attached to the reinforcing plate, even if the wafer is warped more than its thickness, it will be formed during alloy formation. The coaxiality can be obtained without damaging the wafer, and the problem of contamination of the semiconductor element with mineral oil is eliminated.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor manufacturing jig and a semiconductor element manufacturing method according to an embodiment of the present invention will be described below with reference to FIG. In FIG. 1, the same reference numerals as those in FIGS. 2 and 3 denote the same or corresponding portions, and 5 is a positioning member having a coating of carbon, which has an opening 51 slightly smaller than the wafer 3 and is located below the opening 52. A step portion 52 is formed on the peripheral surface. Reference numeral 8 denotes a positioning fixing jig (jig body) coated with carbon, in which a concave portion 81 for fixing the reinforcing plate 2 and a step portion 82 for mounting the positioning member 5 are provided. Further, a convex portion 83 for pressing and closely adhering a silicon wafer set on another jig at the time of alloy formation is provided below the outside. The depth of the recess 81 is shallower than the thickness of the reinforcing plate 2, and the height of the stepped portion 82 is lower than the thickness of the reinforcing plate 2 on which the Al vapor deposition 4a is formed. Ingredient 8
It is designed in such a range that a gap is maintained without coming into contact with the (stepped portion 82).

Next, the order of assembling the alloy using the jig shown in FIG. 1 will be described. The reinforcing plate 2 on which the Al vapor deposition layer 4a is formed is placed in the recess 81 of the fixing jig 8 with the Al vapor deposition layer 4a facing upward, and the positioning member 5 having the step portion 52 that comes into contact with the upper surface of the wafer is provided.

Next, the silicon wafer 3 is placed in the opening 51 of the positioning member 5 with the Al vapor deposition layer 4b facing down, and is overlaid on the Al vapor deposition layer 4a on the reinforcing plate 2 side. At this time, the thickness of the opening portion 51 of the positioning member 5 into which the silicon wafer 3 is inserted is not restricted by the thickness of the silicon wafer 3, so that a sufficient margin may be given to the thickness of the silicon wafer 3.

Next, in order to bring the silicon wafer 3 into close contact with the reinforcing plate 2, the convex portion 83a of the other jig 8a is mounted on the silicon wafer 3 and stacked on top of it, and heated in a vacuum to be alloyed. I do.

As described above, according to this embodiment, the jig body 8
Since the reinforcing plate 2 is fixed by the concave portion 81 of the wafer 3 and the wafer 3 is placed in the opening 51 of the positioning member 5 mounted on the reinforcing plate 2, the wafer 3 and the reinforcing plate 2 are positioned. Even if 3 is relatively warped, it is possible to obtain a precise coaxiality with the reinforcing plate 2 without damaging the wafer, and since mineral oil is not used, there is no concern that the semiconductor element is contaminated.

[0021]

As described above, according to the present invention, the reinforcing plate and the wafer are fixed using separate members,
Since the reinforcing plate is fixed and then the wafer is mounted and fixed, even if a warp more than the thickness of the wafer occurs, the wafer can be alloyed without cracking of the wafer and contamination of semiconductor elements, and workability is improved. There is an effect that can be.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a semiconductor manufacturing jig according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a conventional semiconductor manufacturing jig.

FIG. 3 is a configuration diagram of another conventional semiconductor manufacturing jig.

[Explanation of reference numerals] 1 fixing jig main body 2 reinforcing plate 3 silicon wafer 4a Al vapor deposition layer 4b Al vapor deposition layer 5 positioning member 51 opening 52 step difference 6 positioning fixing jig 7 mineral oil film 8 fixing jig main body 8a other Jig main body 81 Recessed portion 82 Stepped portion 83 Convex portion 83a Convex portion of other jig main body

Claims (2)

[Claims] 1. A semiconductor manufacturing jig used in the step of alloying a wafer having a semiconductor element and a reinforcing plate with a brazing material, wherein the jig has a recess for fixing the reinforcing plate therein. Using the main body and a positioning member mounted on the reinforcing plate fixed to the jig main body and having an opening for mounting the wafer on the reinforcing plate and positioning the wafer, the reinforcing plate and the wafer are separated. A semiconductor manufacturing jig characterized by performing positioning. 2. A method of manufacturing a semiconductor element, which comprises a step of alloying a wafer having a semiconductor element and a reinforcing plate with a brazing material, wherein a brazing material is provided to a concave portion inside a jig main body having a convex portion at a lower portion outside thereof. A step of disposing a reinforcing plate having vapor deposited thereon, a step of mounting a ring-shaped positioning member having a step portion on the reinforcing plate, and a wafer having a brazing material deposited thereon being placed in the opening of the ring-shaped positioning member. A method of manufacturing a semiconductor device, comprising: a step; and a step of superimposing an outer lower convex portion of another jig main body having the same configuration as the jig main body on the wafer and closely adhering the convex portion, thereby alloying.