JPH05326342A - Manufacture of solid electrolytic capacitor - Google Patents

Manufacture of solid electrolytic capacitor

Info

Publication number
JPH05326342A
JPH05326342A JP14856792A JP14856792A JPH05326342A JP H05326342 A JPH05326342 A JP H05326342A JP 14856792 A JP14856792 A JP 14856792A JP 14856792 A JP14856792 A JP 14856792A JP H05326342 A JPH05326342 A JP H05326342A
Authority
JP
Japan
Prior art keywords
anode
lead frame
side terminal
capacitor element
solid electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14856792A
Other languages
Japanese (ja)
Other versions
JP3191411B2 (en
Inventor
Kazuyuki Komata
和幸 小俣
Minoru Miyazaki
実 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP14856792A priority Critical patent/JP3191411B2/en
Publication of JPH05326342A publication Critical patent/JPH05326342A/en
Application granted granted Critical
Publication of JP3191411B2 publication Critical patent/JP3191411B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To provide a method for manufacturing a solid electrolytic capacitor in which a product is reduced in size by using a foil and is increased in capacitance. CONSTITUTION:An anode foil 6 is mounted at a lead frame 2 for forming an anode side terminal 12 or a conductor piece 4 mounted at the frame 2. A solid electrolyte layer 16 and a conductive layer 18 are generated on a surface of the foil 6 to form a capacitor element 20, an anode side terminal 22 is connected to the element 20, and resin-sealed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電解質に有機導電ポリ
マー等の固体電解質を用いた固体電解コンデンサの製造
方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a solid electrolytic capacitor using a solid electrolyte such as an organic conductive polymer as an electrolyte.

【0002】[0002]

【従来の技術】従来、固体電解コンデンサは、陽極側に
ブロック状の陽極体を用いて、その表面にコンデンサ素
子として必要な処理を施した後、陽極側端子及び陰極側
端子を引き出し、その上に樹脂封止を施している。この
ような陽極体を用いた固体電解コンデンサでは、陽極体
によって外観形状が定まり、外観精度を高めることがで
きるとともに、固体電解コンデンサを堅牢化できる利点
がある。
2. Description of the Related Art Conventionally, a solid electrolytic capacitor has a block-shaped anode body on the anode side, which is subjected to necessary treatment as a capacitor element on its surface, and then an anode side terminal and a cathode side terminal are drawn out, Is resin-sealed. In the solid electrolytic capacitor using such an anode body, the appearance shape is determined by the anode body, the appearance accuracy can be improved, and the solid electrolytic capacitor can be made robust.

【0003】[0003]

【発明が解決しようとする課題】ところが、この固体電
解コンデンサでは、陽極体がブロック体である故に、表
面積の拡大には限界があり、極度なエッチング処理を施
しても、大幅な容量増加を期待することができない。し
かも、陽極体の大きさが固体電解コンデンサの小型化を
妨げる要因になる。また、陽極体の形態から、処理途上
の搬送や一括的な処理を行い難く、製品の均一化を図り
難いという欠点もある。
However, in this solid electrolytic capacitor, since the anode body is a block body, there is a limit to the expansion of the surface area, and a large increase in capacity is expected even if subjected to extreme etching treatment. Can not do it. Moreover, the size of the anode body becomes a factor that hinders the miniaturization of the solid electrolytic capacitor. In addition, there is a drawback in that it is difficult to carry out a process in the middle of processing or to collectively process the products because of the form of the anode body, and it is difficult to make the products uniform.

【0004】これに対し、箔は表面積の拡大が容易であ
り、単位面積当たりの容量増加に寄与するものの、その
柔軟性のため、箔表面に生成した固体電解質層が破損す
るおそれがあった。
On the other hand, although the foil can easily increase the surface area and contributes to the increase in the capacity per unit area, its flexibility may damage the solid electrolyte layer formed on the foil surface.

【0005】そこで、本発明は、箔を用いて製品の小型
化とともに、容量増加を図った固体電解コンデンサの製
造方法を提供することを目的とする。
Therefore, an object of the present invention is to provide a method of manufacturing a solid electrolytic capacitor which uses a foil to reduce the size of a product and increase the capacity.

【0006】[0006]

【課題を解決するための手段】即ち、本発明の固体電解
コンデンサの製造方法は、陽極側端子(12)を成すリ
ードフレーム(2)又はリードフレームに取り付けた導
体片(4)に陽極箔(6)を取り付け、この陽極箔の表
面に電解質層(固体電解質層16)及び導電層(18)
を生成してコンデンサ素子(20)を形成し、このコン
デンサ素子に陰極側端子(22)を接続した後、樹脂封
止を施すことを特徴とする。
That is, according to the method for producing a solid electrolytic capacitor of the present invention, an anode foil (2) is formed on a lead frame (2) forming an anode side terminal (12) or a conductor piece (4) attached to the lead frame. 6) is attached, and an electrolyte layer (solid electrolyte layer 16) and a conductive layer (18) are attached to the surface of this anode foil.
Is formed to form a capacitor element (20), the cathode side terminal (22) is connected to this capacitor element, and then resin sealing is performed.

【0007】[0007]

【作用】リードフレームと陽極箔との組み合わせによ
り、リードフレーム上でコンデンサ素子としての処理及
び封止を一括的に処理することを内容としている。ま
た、リードフレームは、導体材料で形成されるので、そ
れ自体を陽極側端子として利用できる。
The combination of the lead frame and the anode foil is to collectively perform the processing as the capacitor element and the sealing on the lead frame. Further, since the lead frame is made of a conductive material, it can be used as an anode side terminal itself.

【0008】そこで、本発明では、リードフレーム又は
リードフレームに取り付けた導体片に連続した陽極箔を
跨がって取り付ける。この場合、陽極箔とリードフレー
ムは電気的に接続され、陽極箔にはリードフレーム上で
コンデンサ素子として必要な処理、即ち、電解質層及び
及び導電層を生成することができる。各コンデンサ素子
には、リードフレーム上で陰極側端子を接続した後、樹
脂封止を施す。そして、リードフレームから陽極側端子
とともにコンデンサ素子を分離させて製品としての固体
電解コンデンサが形成される。
Therefore, in the present invention, the continuous anode foil is attached to the lead frame or the conductor piece attached to the lead frame so as to straddle it. In this case, the anode foil and the lead frame are electrically connected to each other, and the anode foil can be provided with a treatment necessary as a capacitor element on the lead frame, that is, an electrolyte layer and a conductive layer. Each capacitor element is resin-sealed after the cathode side terminal is connected on the lead frame. Then, the solid electrolytic capacitor as a product is formed by separating the capacitor element from the lead frame together with the anode side terminal.

【0009】[0009]

【実施例】以下、本発明を図面に示した実施例を参照し
て詳細に説明する。
The present invention will be described in detail below with reference to the embodiments shown in the drawings.

【0010】[0010]

【実施例】図1は、本発明の固体電解コンデンサの製造
方法の一実施例を示している。図1の(A)は、リード
フレーム2に対する導体片4及び陽極箔6の取付け工程
を示し、図1の(B)は製品としての固体電解コンデン
サの断面を示している。
FIG. 1 shows an embodiment of the method for manufacturing a solid electrolytic capacitor of the present invention. FIG. 1A shows a process of attaching the conductor piece 4 and the anode foil 6 to the lead frame 2, and FIG. 1B shows a cross section of a solid electrolytic capacitor as a product.

【0011】リードフレーム2は、アルミニウム等の導
体材料板を打抜き加工したものであり、連続した帯状部
8に位置決め孔10とともに、得るべきコンデンサ素子
の単位である複数の陽極側端子12が一定の間隔で形成
されている。このリードフレーム2の各陽極側端子12
の端部に導体片4を取り付ける。この導体片4は、アル
ミニウム等の導体材料で形成されており、各陽極側端子
12に対して溶接等の接続手段で電気的に接続するとと
もに、強固に機械的に固着する。この導体片4は、従来
の陽極体と機能的に異なっており、陽極箔6の補強部材
となるものである。即ち、従来の陽極体の堅牢化ととも
に軟弱な陽極箔6を導体片4の機械的な強度で補強する
ものである。各導体片4の表裏面側に折り返して陽極箔
6が取り付けられ、この陽極箔6の接続も、超音波溶接
等の溶着手段や接着剤を用いての接着手段で行なう。陽
極箔6には、アルミニウム箔等の皮膜形成金属箔を用い
る。
The lead frame 2 is formed by punching out a conductor material plate such as aluminum, and has a plurality of anode-side terminals 12 which are units of a capacitor element to be obtained, along with a positioning hole 10 in a continuous strip portion 8. It is formed at intervals. Each anode side terminal 12 of this lead frame 2
Attach the conductor piece 4 to the end of the. The conductor piece 4 is formed of a conductor material such as aluminum, and is electrically connected to each anode terminal 12 by a connecting means such as welding and is firmly and mechanically fixed. This conductor piece 4 is functionally different from the conventional anode body and serves as a reinforcing member for the anode foil 6. That is, the conventional anode body is made solid and the soft anode foil 6 is reinforced by the mechanical strength of the conductor piece 4. The anode foil 6 is attached by folding back the front and back sides of each conductor piece 4, and the anode foil 6 is also connected by welding means such as ultrasonic welding or adhesion means using an adhesive. For the anode foil 6, a film-forming metal foil such as an aluminum foil is used.

【0012】この陽極箔6の表面には、図2の(A)に
示すように、エッチング処理の後、化成処理によって誘
電体酸化皮膜14を形成し、その上に気相重合、化学重
合又は電解重合によってポリピロール等のポリマー層か
ら成る固体電解質層16を形成し、その上に導電ペース
ト等の塗布によって導電層18を形成する。陽極箔6は
各陽極側端子12に跨がって設置されているので、陽極
側端子12の幅に合わせて切断する。この場合、リード
フレーム2には位置決め孔10が形成されているので、
この位置決め孔10を基準にして陽極箔6を切断するこ
とができる。この結果、陽極側端子12を単位とする複
数のコンデンサ素子20がリードフレーム2の陽極側端
子12上に形成される。
As shown in FIG. 2 (A), a dielectric oxide film 14 is formed on the surface of the anode foil 6 by an etching treatment and then a chemical conversion treatment, and vapor-phase polymerization, chemical polymerization or A solid electrolyte layer 16 made of a polymer layer such as polypyrrole is formed by electrolytic polymerization, and a conductive layer 18 is formed thereon by applying a conductive paste or the like. Since the anode foil 6 is installed so as to straddle each anode-side terminal 12, it is cut in accordance with the width of the anode-side terminal 12. In this case, since the lead frame 2 has the positioning hole 10 formed therein,
The anode foil 6 can be cut based on the positioning holes 10. As a result, a plurality of capacitor elements 20 including the anode side terminal 12 as a unit are formed on the anode side terminal 12 of the lead frame 2.

【0013】また、各コンデンサ素子20の導電層18
の上面には、陽極側端子12に対応する位置に陰極側端
子22を導電性接着剤24を以て接続する。
The conductive layer 18 of each capacitor element 20
The cathode side terminal 22 is connected to the upper surface of the above with a conductive adhesive 24 at a position corresponding to the anode side terminal 12.

【0014】そして、図2の(B)に示すように、各コ
ンデンサ素子20に、リードフレーム2上で封止樹脂2
6を以て個別に樹脂封止を行なう。この場合、樹脂封止
はコンデンサ素子20を中心に行うが、外部端子の形成
のため、封止範囲は、陽極側端子12及び陰極側端子2
2が封止樹脂26の外部に十分な長さで引き出されるよ
うに設定する。
Then, as shown in FIG. 2B, each of the capacitor elements 20 is provided with a sealing resin 2 on the lead frame 2.
Resin sealing is individually performed using 6. In this case, the resin encapsulation is performed mainly on the capacitor element 20, but because the external terminals are formed, the encapsulation range is the anode side terminal 12 and the cathode side terminal 2.
2 is set so as to be drawn to the outside of the sealing resin 26 with a sufficient length.

【0015】この樹脂封止の後、リードフレーム2から
コンデンサ素子20を切断する。この場合、コンデンサ
素子20側には、外部端子として必要な長さに陽極側端
子12を残して陽極側端子12とともにコンデンサ素子
20をリードフレーム2から切り取る。リードフレーム
2には位置決め孔10が形成されているので、この位置
決め孔10を基準にしてコンデンサ素子20を切り離す
ことができる。また、封止樹脂26は、成形型等を用い
て直方体に成形できるので、図2の(B)に示すよう
に、陽極側端子12及び陰極側端子22は、封止樹脂2
6で形成されている外装体の表面に折り曲げてフォーミ
ング加工を施し、外部端子を形成する。
After this resin sealing, the capacitor element 20 is cut from the lead frame 2. In this case, the capacitor element 20 is cut off from the lead frame 2 together with the anode side terminal 12 while leaving the anode side terminal 12 in a length required as an external terminal on the side of the capacitor element 20. Since the lead frame 2 has the positioning hole 10, the capacitor element 20 can be separated based on the positioning hole 10. Further, since the sealing resin 26 can be molded into a rectangular parallelepiped by using a molding die or the like, as shown in FIG. 2B, the anode side terminal 12 and the cathode side terminal 22 are the sealing resin 2
The surface of the exterior body formed in 6 is bent and subjected to a forming process to form an external terminal.

【0016】このような製造方法によれば、リードフレ
ーム2上で陽極箔6の取付け、コンデンサ素子20の形
成、封止樹脂26による封止処理を一括的に行なうこと
ができ、しかも、製造途上の製品搬送をリードフレーム
2を単位として搬送できるので、均一性が高く、陽極箔
6による高容量化を図った固体電解コンデンサを製造で
き、生産能率の向上を図ることができる。
According to such a manufacturing method, the attachment of the anode foil 6, the formation of the capacitor element 20, and the sealing process with the sealing resin 26 can be collectively performed on the lead frame 2, and the manufacturing process is still in progress. Since the product can be transported by the lead frame 2 as a unit, it is possible to manufacture a solid electrolytic capacitor having high uniformity and high capacity by the anode foil 6, and it is possible to improve the production efficiency.

【0017】そして、前記実施例の導体片4は省略して
もよく、図3の(A)に示すように、リードフレーム2
に前記実施例の導体片4及び陽極側端子12を兼用さ
せ、その上に陽極箔6を折り返して接続してコンデンサ
素子20を形成してもよい。このようにすれば、図3の
(B)に示すように、導体片4の省略によって固体電解
コンデンサの構造を単純化できる。
The conductor piece 4 of the above embodiment may be omitted, and as shown in FIG.
Alternatively, the capacitor element 20 may be formed by using the conductor piece 4 and the anode-side terminal 12 of the above-mentioned embodiment also as the anode piece and folding back and connecting the anode foil 6 thereon. In this way, as shown in FIG. 3B, the structure of the solid electrolytic capacitor can be simplified by omitting the conductor piece 4.

【0018】また、リードフレーム2をアルミニウム等
で形成した場合には、その表面に選択的に半田付け可能
な金属層として例えば、半田層28をめっき処理で形成
してもよい。この場合、陰極側端子22には、同様の半
田層30を形成したものを用いる。なお、このめっき処
理は、リードフレーム2又は陰極側端子22の基材上に
予め施すようにしてもよい。
When the lead frame 2 is made of aluminum or the like, a solder layer 28 may be formed on the surface of the lead frame 2 as a metal layer that can be selectively soldered by plating. In this case, the cathode-side terminal 22 having the same solder layer 30 formed thereon is used. The plating treatment may be performed in advance on the base material of the lead frame 2 or the cathode side terminal 22.

【0019】また、前記実施例では、陽極箔6を所定の
幅に切断した後、コンデンサ素子20毎に樹脂封止を行
なったが、陽極箔6を所定の幅に切断した後、図4の
(A)に示すように、各コンデンサ素子20を一括的に
モールド金型32、34のキャビティ36内に設置して
封止樹脂26を以て樹脂封止を施してもよい。
In the above embodiment, the anode foil 6 was cut into a predetermined width and then the capacitor element 20 was resin-sealed. However, after the anode foil 6 was cut into a predetermined width, as shown in FIG. As shown in (A), each capacitor element 20 may be collectively installed in the cavity 36 of the molding dies 32 and 34 and resin-sealed with the sealing resin 26.

【0020】そして、図4の(B)に示すように、封止
樹脂26を以て連鎖状を成すコンデンサ素子20を封止
樹脂26の部分で切断するとともに、リードフレーム2
から陽極側端子12を切断し、陽極側端子12及び陰極
側端子22をフォーミング加工するようにしても、前記
実施例と同様の固体電解コンデンサを得ることができ
る。
Then, as shown in FIG. 4 (B), the capacitor element 20 forming a chain with the sealing resin 26 is cut at the portion of the sealing resin 26, and the lead frame 2 is formed.
Even if the anode side terminal 12 is cut from the above and the anode side terminal 12 and the cathode side terminal 22 are subjected to forming processing, the solid electrolytic capacitor similar to the above-mentioned embodiment can be obtained.

【0021】[0021]

【発明の効果】以上説明したように、本発明によれば、
リードフレーム又はリードフレームに取り付けた導体片
に折り返して陽極箔を取り付け、その陽極箔上にコンデ
ンサ素子を形成し、それを樹脂封止した後、切断して固
体電解コンデンサを得るようにしたので、陽極箔を用い
たことによる容量増加とともに各コンデンサ素子の処理
をリードフレーム上で一括的に行なうことができ、製品
の均一化とともに生産途上の搬送処理を容易化でき、生
産能率を高めることができる。
As described above, according to the present invention,
Since it was folded back to the lead frame or the conductor piece attached to the lead frame and the anode foil was attached, a capacitor element was formed on the anode foil, and after sealing it with resin, it was cut to obtain a solid electrolytic capacitor. With the increase in capacity due to the use of the anode foil, the processing of each capacitor element can be performed collectively on the lead frame, the product can be made uniform and the transportation processing during production can be facilitated, and the production efficiency can be improved. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の固体電解コンデンサの製造方法の一実
施例における導体片及び陽極箔を取り付けたリードフレ
ームを示す斜視図及び製品としての固体電解コンデンサ
の縦断面図である。
FIG. 1 is a perspective view showing a lead frame to which a conductor piece and an anode foil are attached in an embodiment of a method for manufacturing a solid electrolytic capacitor of the present invention, and a vertical sectional view of a solid electrolytic capacitor as a product.

【図2】リードフレーム上のコンデンサ素子を示す断面
図及びリードフレーム上のコンデンサ素子の樹脂封止を
示す部分断面図である。
FIG. 2 is a sectional view showing a capacitor element on a lead frame and a partial sectional view showing resin sealing of the capacitor element on the lead frame.

【図3】他のコンデンサ素子の断面図及び他のコンデン
サ素子を用いた固体電解コンデンサの縦断面図である。
FIG. 3 is a sectional view of another capacitor element and a vertical sectional view of a solid electrolytic capacitor using the other capacitor element.

【図4】コンデンサ素子のモールド型を用いた樹脂封止
を示す断面図及びリードフレーム上のコンデンサ素子の
樹脂封止を示す部分断面図である。
4A and 4B are a sectional view showing resin sealing using a mold of a capacitor element and a partial sectional view showing resin sealing of a capacitor element on a lead frame.

【符号の説明】[Explanation of symbols]

2 リードフレーム 4 導体片 6 陽極箔 12 陽極側端子 16 固体電解質層 18 導電層 20 コンデンサ素子 22 陰極側端子 2 Lead frame 4 Conductor piece 6 Anode foil 12 Anode side terminal 16 Solid electrolyte layer 18 Conductive layer 20 Capacitor element 22 Cathode side terminal

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 陽極側端子を成すリードフレーム又はリ
ードフレームに取り付けた導体片に陽極箔を取り付け、
この陽極箔の表面に電解質層及び導電層を生成してコン
デンサ素子を形成し、このコンデンサ素子に陰極側端子
を接続した後、樹脂封止を施すことを特徴とする固体電
解コンデンサの製造方法。
1. An anode foil is attached to a lead frame or a conductor piece attached to the lead frame, which constitutes the anode side terminal,
A method for producing a solid electrolytic capacitor, which comprises forming an electrolyte layer and a conductive layer on the surface of this anode foil to form a capacitor element, connecting a cathode side terminal to this capacitor element, and then sealing with a resin.
JP14856792A 1992-05-15 1992-05-15 Method for manufacturing solid electrolytic capacitor Expired - Lifetime JP3191411B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14856792A JP3191411B2 (en) 1992-05-15 1992-05-15 Method for manufacturing solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14856792A JP3191411B2 (en) 1992-05-15 1992-05-15 Method for manufacturing solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JPH05326342A true JPH05326342A (en) 1993-12-10
JP3191411B2 JP3191411B2 (en) 2001-07-23

Family

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Family Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG84567A1 (en) * 1999-02-17 2001-11-20 Matsushita Electric Ind Co Ltd Method of manufacturing solid electrolytic capacitor, and apparatus of manufacturing the same
JP2007281237A (en) * 2006-04-07 2007-10-25 Nichicon Corp Method for manufacturing solid electrolytic capacitor
JP2011114201A (en) * 2009-11-27 2011-06-09 Sanyo Electric Co Ltd Method of manufacturing electrolytic capacitor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG84567A1 (en) * 1999-02-17 2001-11-20 Matsushita Electric Ind Co Ltd Method of manufacturing solid electrolytic capacitor, and apparatus of manufacturing the same
JP2007281237A (en) * 2006-04-07 2007-10-25 Nichicon Corp Method for manufacturing solid electrolytic capacitor
JP2011114201A (en) * 2009-11-27 2011-06-09 Sanyo Electric Co Ltd Method of manufacturing electrolytic capacitor

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JP3191411B2 (en) 2001-07-23

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