JPH05320897A - Magnetron sputtering cathode - Google Patents

Abstract

PURPOSE:To provide a magnetron sputtering cathode capable of improving the use efficiency of targets not under limited conditions even but in conditions covering a wide range. CONSTITUTION:In a magnetron sputtering cathode where a central magnet 5 is annularly surrounded with plural annular intermediate magnets 6a, 6b and an annular peripheral magnet 7 in this order to form a magnet device which is arranged in the back of a target 1 and by which the curved magnetic field is formed in a space in the vicinity of the surface of the target 1, the central magnet 5 and the annular peripheral magnet 7 are fixed, and on the other hand, the position variable means is provided only for the annular intermediate magnets 6a, 6b. By this means, the position of the annular intermediate magnets is made variable to make the spacing between the annular intermediate magnets 6a, 6b and the target 1 freely variable.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetron sputter cathode capable of adjusting the magnetic field distribution formed in the space near the surface of a target.

[0002]

2. Description of the Prior Art A conventional magnetron sputter cathode is shown in FIGS. 4 and 5, in which:
The target 1 is attached to the surface of the backing plate 2, and the magnet device 3 is arranged behind the backing plate 2. The magnet device 3 includes a central magnet 5 erected in the center of the fixed yoke 4, two annular intermediate magnets 6a and 6b erected on the fixed yoke 4 so as to surround the periphery of the central magnet 5, and an outer magnet. An annular peripheral magnet 7 is provided upright on the fixed yoke 4 so as to surround the annular intermediate magnet 6b. The central magnet 5, the two annular intermediate magnets 6a and 6b, and the annular peripheral magnet 7 are permanent magnets having a rectangular cross section. 8 is the base and 9
Is a support member that supports the fixed yoke 4 on the base 8.

In such a magnetron sputter cathode, the central magnet 5 and the two annular intermediate magnets 6a, 6 are provided.
A curved magnetic field is formed in the space near the surface of the target 1 by b and the annular peripheral magnet 7, and high-density plasma is generated in the curved magnetic field.
Is sputtered.

[0004]

In the conventional magnetron sputter cathode, the central magnet 5, the two annular intermediate magnets 6a and 6b and the annular peripheral magnet 7 are erected on the fixed yoke 4 as described above, and are not movable. Therefore, before commercializing the magnet device 3, the central magnet 5 and the two annular intermediate magnets 6 are formed.
Unless the arrangements, shapes, and types of the a and 6b and the annular peripheral magnet 7 are determined and the performance of the magnet device 3 is tested, the target 1 can be uniformly eroded and the efficiency of use of the target cannot be improved. Further, even if the optimum magnet device 3 is once determined, the use efficiency of the target varies depending on changes in conditions such as the size of the target, the material of the target, the operating pressure, and the sputtering power. There was a problem that the magnet device 3 was not used only below.

An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a magnetron sputter cathode capable of improving the use efficiency of a target not only under limited conditions but also under a wide range of conditions.

[0006]

In order to achieve the above object, the present invention provides a magnet device in which a circumference of a central magnet is surrounded by a plurality of ring-shaped intermediate magnets and ring-shaped peripheral magnets in a ring shape in a target back portion. In the magnetron sputter cathode which is arranged and forms a curved magnetic field in the space near the surface of the target by the magnet device, while fixing the central magnet and the annular peripheral magnet, the position varying means is provided only in the annular intermediate magnet, The position changing means changes the position of the annular intermediate magnet in the vertical direction, so that the distance between the annular intermediate magnet and the back surface of the target can be changed.

[0007]

According to the present invention, the position of the annular intermediate magnet is changed by the position changing means so that the distance between the annular intermediate magnet and the back surface of the target can be changed freely. Therefore, the magnetic field formed in the space near the surface of the target is changed. The distribution can be adjusted.
Therefore, even if conditions such as the size of the target, the material of the target, the operating pressure, and the sputtering power are changed, it is possible to maintain the stable target use efficiency.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. A magnetron sputter cathode of an embodiment of the present invention is shown in FIGS. 1 and 2, in which target 1 is backing plate 2
The magnet device 3 is mounted on the surface of the backing plate 2 and behind the backing plate 2. The magnet device 3 is
The fixed central yoke 11, the annular peripheral yoke 12 fixedly arranged around the central yoke 11 at a distance from the fixed central yoke 11, and the central yoke 11 and the annular peripheral yoke 12 can pass between these. An annular intermediate yoke 13 located below the yokes 11 and 12, a central magnet 5 standing on the central yoke 11, and an annular intermediate yoke 13 surrounding the central magnet 5 either directly or via an iron spacer 14 Two annular intermediate magnets 6a, 6b, which are erected and have different mounting positions, and an annular peripheral magnet 7 which is erected on an annular peripheral yoke 12 so as to surround the circumference of the outer annular intermediate magnet 6b.
By changing the position of the annular intermediate yoke 13 or changing the height of the iron spacer 14, the two annular intermediate magnets 6a and 6b and the target 1 are provided.
The distance from the back of the is variable. The central magnet 5, the two annular intermediate magnets 6a and 6b, and the annular peripheral magnet 7 are permanent magnets having a rectangular cross section. Reference numeral 8 is a base, 15 is a central support member that supports the central yoke 11 on the base 8, 16 is an intermediate support member that supports the annular intermediate yoke 13 on the base 8, and 17 is a peripheral edge support that supports the annular peripheral yoke 12 on the base 8. It is a member.

In such an embodiment, the position of the annular intermediate yoke 13 is changed, or the iron spacer 1 is used.
The distance between the two annular intermediate magnets 6a and 6b and the back surface of the target 1 is made variable by changing the height of the magnetic field 4, so that the magnetic field distribution formed in the space near the surface of the target 1 can be changed. It can be adjusted as shown by the solid line to the broken line in FIG. Therefore, even if the conditions such as the size of the target 1, the material of the target 1, the operating pressure, and the sputtering power are changed, it is possible to maintain stable use efficiency of the target.

By the way, the annular intermediate yoke 1 of the above embodiment.
3 is supported by a motor-driven vertical movement mechanism instead of being supported by an intermediate support member, and the annular intermediate yoke 13 is moved to change the distance between the two annular intermediate magnets 6a and 6b and the back surface of the target 1. You may set it freely.

[0011]

According to the present invention, the position of the ring-shaped intermediate magnet is changed by the position changing means and the distance between the ring-shaped intermediate magnet and the back surface of the target is made variable, so that it is formed in the space near the surface of the target. The magnetic field distribution can be adjusted. Therefore, even if conditions such as target size, target material, operating pressure, and sputter power change,
Under a wide range of conditions, the efficiency of using the target can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a view seen from the line AA of FIG.

FIG. 3 is a graph showing a magnetic field distribution adjusted according to an embodiment of the present invention.

FIG. 4 is a sectional view of a conventional magnetron sputter cathode.

5 is an arrow view seen from the line BB of FIG.

[Explanation of symbols]

 1 ... Target 2 ... Backing plate 3 ... Magnet device 5 ... Central magnet 6a ... Annular intermediate magnet 6b ··· Annular intermediate magnet 7 ···· Annular peripheral magnet 11 ··· Central yoke 12 ··· Annular peripheral yoke 13 .... Iron spacers

Claims (1)

[Claims] 1. A magnet device, which surrounds a central magnet in a ring shape in the order of a plurality of annular intermediate magnets and annular peripheral magnets, is arranged at the back of a target, and a curved magnetic field is generated in a space near the surface of the target. In the magnetron sputter cathode formed by the apparatus, while fixing the central magnet and the annular peripheral magnet, the position varying means is provided only in the annular intermediate magnet, and the position of the annular intermediate magnet is varied by the position varying means, A magnetron sputter cathode, wherein the distance between the annular intermediate magnet and the back surface of the target is variable.