JPH05315313A - Leaf-type ultrasonic processing equipment - Google Patents

Abstract

PURPOSE:To conduct the most efficient processing by placing an object to be processed on loops of standing wave generated in processing liquid. CONSTITUTION:A leaf-type ultrasonic processing equipment 10 consists of a processing bath 1 and a liquid surface raising means 2. Processing liquid 3 is made to flow abundantly by being partitioned by bulkheads 1a which are provided in front and at back of the processing bath 1. An ultrasonic transmitter 6 is provided on the bottom of the processing bath 1. Ultrasonic processing can be conducted at the optimum efficiency, if rising up of movable bulkheads 7 is controlled in such way that the height of liquid surface of the processing liquid 3 which has been raised up from an object to be processed has relation with wavelength L of standing wave generated in the processing liquid 3, as the formula of H=L/2 indicates. As a result, processing time can be shortened by obtaining the most efficient processing effects.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-wafer ultrasonic processing apparatus, and more particularly to a single-wafer ultrasonic processing apparatus which is provided with means for raising the level of a processing liquid in the ultrasonic processing apparatus and which can perform the most efficient ultrasonic processing. ..

In recent years, in order to realize high density and high integration of semiconductor devices, in the manufacturing process of semiconductor elements,
Ultra-fine patterning has been performed on large wafers, and the pattern rule is entering the submicron range. Further, in flat displays such as liquid crystal display devices as well, in order to realize a large display capacity and a large screen, in the manufacturing process of surface elements, there is progressing toward fine patterning on a large substrate.

The surface treatment of the substrate, which is carried out in the process of manufacturing the elements of various electronic devices, includes the etching of the surface, the peeling of the surface coating film such as resist, the removal of contaminants adhering to the surface, and the final treatment chemical solution. Every process is an important step, such as replacement with an organic solvent or water to remove it from the substrate, cleaning the substrate surface, and so on. Moreover, in many of these steps, a plurality of steps are continuously performed.

By the way, in such various surface treatments, it is often practiced that the treatment liquid is shaken by ultrasonic waves for efficient treatment. However, the substrates to be treated are continuously moved while being moved one by one. In a processing apparatus, one of the issues is how efficiently ultrasonic processing is performed.

[0005]

2. Description of the Related Art FIG. 4 is an explanatory view of a conventional single-wafer ultrasonic processing apparatus, FIG. 4 (A) is a schematic side view, and FIG. 4 (B) is an explanatory drawing of processing effects of ultrasonic processing. In the figure, 1 is a processing tank, 1a is a partition wall, 1b is an overflow surface, 3 is a processing liquid, 3a is a liquid surface, 3b is an inlet, 3c is an outlet, 4 is a roller conveyor, 5 is an object to be treated, 9a. Is a carry-in port, 9b is a carry-out port, and 10 is a single-wafer ultrasonic processing device.

In FIG. 4 (A), in the conventional single-wafer processing apparatus 10, the processing liquid 3 is fed from an inflow port 3b opened at the bottom of the processing tank 1, and the processing liquid 3 partitions the processing tank 1. The overflow surface 1b of the partition wall 1a overflows to keep the liquid surface 3a constant. And the overflowed processing liquid 3 is the outlet.
It is supposed to be exhaled from 3c.

Various chemicals are used as the treatment liquid 3 depending on the treatment process of the object 5 to be treated. For example, water or a washing liquid for washing the substrate constituting the object 5 to be treated, a developing solution or a stripping solution for the resist, or a substrate. It is an etchant for various films that have been deposited.

The object 5 to be processed is carried on a roller conveyor 4 which is horizontally arranged and driven to rotate. Therefore, the processing tank 1 is provided with a carry-in port 9a and a carry-out port 9b which are opened so as not to hit the object 5 to be processed, and the overflow surface 1b of the partition wall 1a for keeping the liquid level 3a of the processing liquid 3 constant. Also, the height of the workpiece 5 to be conveyed is set so as not to hit it.

The ultrasonic oscillator 6 is arranged at the bottom of the processing tank 1. Then, when the object to be processed 5 rides on the roller conveyor 4 and is carried into the central portion of the processing tank 1 and stopped, the inlet port
The processing liquid 3 fed from 3b overflows from the overflow surface 1b of the partition wall 1a to keep the liquid surface 3a constant. Then, the processing liquid 3 is shaken from below by the ultrasonic oscillator 6, and the object 5 is ultrasonically processed for a predetermined time.

When the ultrasonic treatment is finished, the object 5 to be processed is carried on the roller conveyor 4 and carried out from the carry-out port 9b, and the next object 5 to be processed is carried in from the carry-in port 9a and stopped at the central portion of the processing tank 1. Then, the ultrasonic treatment is sequentially repeated.

In this way, in the single-wafer type single-wafer ultrasonic processing apparatus 10 in which the objects 5 to be processed are carried in one by one, ultrasonically processed and carried out, the partition wall 1a for keeping the liquid surface 3a is carried. The height of the object to be processed 5 is set so as not to hit it. Therefore, when performing ultrasonic treatment, the treatment liquid 3 is discharged from the overflow surface 1b.
When the liquid is overflowed, the height of the liquid surface 3a is raised from the surface of the object to be treated 5 by only a few mm. That is, the object to be processed 5 is not submerged in the processing liquid 3, and the processing is performed in a state where it is almost floating on the liquid surface 3a.

On the other hand, in FIG. 4B, the standing wave 6a in the processing liquid 3 generated by the ultrasonic oscillator is, for example,
Ultrasonic frequency: 25 kHz, sound velocity in liquid: 1,500 m / s
Then, the wavelength L from the node where the amplitude of the standing wave 6a is the minimum (= 0) is L = 30 mm. Therefore, when viewed from the liquid level 3a, the position of the antinode of the standing wave 6a at which the processing liquid 3 vibrates most and thus the processing efficiency is maximum is L / 2 = 15 from the liquid level 3a.
mm.

[0013]

However, in the conventional single-wafer type ultrasonic processing apparatus 10, the object to be processed 5 is placed in the processing tank 1.
Therefore, the overflow surface 1b of the partition wall 1a where the processing liquid 3 overflows cannot be higher than the transport path of the object 5 to be processed. That is, the liquid surface 3a of the processing liquid 3 with respect to the processing object 5 is at a height at which the antinode of the standing wave 6a is located during the ultrasonic processing, that is, in the present example, the processing object 3 is treated with the processing liquid 3a.
It was not possible to position it at a depth of 15 mm from the liquid surface 3a. Therefore, ultrasonic treatment with optimum efficiency could not be performed.

Therefore, it is an object of the present invention to provide a single-wafer type ultrasonic processing apparatus which is provided with a means for raising the level of a processing liquid in the ultrasonic processing apparatus and which can perform the most efficient ultrasonic processing.

[0015]

[Means for Solving the Problems] The above-mentioned problem has a treatment tank and a liquid level raising means, and the treatment tanks are arranged in parallel while overflowing the treatment liquid partitioned by partition walls. An object to be processed that is carried in and out in a single-wafer manner by a conveyor is ultrasonically processed by an ultrasonic oscillator disposed at the bottom, and the liquid level raising means is an ultrasonically processed object. In doing so, the depth from the liquid surface of the treatment liquid to the object to be treated is set to a distance corresponding to 1/2 of the wavelength L of the standing wave generated in the treatment liquid by the ultrasonic oscillator. It is solved by a single-wafer sonicator configured to be one.

[0016]

In the present invention, when the ultrasonic treatment is carried out while the object to be treated is conveyed in a single-wafer manner, the object to be treated is arranged at the position where the ultrasonic treatment is most efficiently performed.

That is, the treatment liquid is shaken most at the antinode where the amplitude of the generated standing wave is maximum, and the depth of the antinode is 1 from the liquid surface of the treatment liquid at the wavelength L of the standing wave. / 2
It has become. Therefore, the object to be processed is positioned at this position.

Therefore, when the object to be processed is transported,
When the ultrasonic treatment is performed by moving the liquid surface so as not to hinder the conveyance, the liquid surface raising means relatively raises the liquid surface of the treatment liquid relative to the object to be treated.

In this way, the object to be treated is ultrasonically treated most efficiently, so that the efficiency of the process should be further improved, especially when a plurality of treatment tanks are connected in series and a series of treatment processes are carried out continuously. You can

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of an essential part of FIG. 1, FIG. 3 is an explanatory view of another embodiment of the present invention during ultrasonic processing of the object to be processed, FIG. 3 (A) is a perspective view of a main part, and FIG. 3 (B) is during ultrasonic processing of the object. Is. In the figure, 1 is a processing tank, 1a is a partition wall, 1b is an overflow surface, 2 is a liquid level raising means, 3 is a processing liquid, 3a is a liquid level, 4 is a roller conveyor, 5 is an object to be processed, 6 is an ultrasonic oscillator. , 6a is a standing wave, 7
Is a movable partition wall, 7a is an overflow hole, 7b is a rack, 7c is a pinion,
8 is a movable roller conveyor, 8a is a cylinder, 8b is a drive gear,
Reference numeral 10 is a single-wafer ultrasonic processing device.

Embodiment 1: In FIGS. 1 and 2, a single-wafer ultrasonic treatment apparatus 10 comprises a treatment tank 1 and a liquid level raising means 2, and a treatment liquid 3
Is partitioned by the partition walls 1a provided before and after the partition wall 1a to overflow. An ultrasonic oscillator 6 is arranged at the bottom of the processing tank 1.

On the other hand, the liquid level raising means 2 is composed of movable partition walls 7 provided in proximity to the partition walls 1a provided at the front and rear of the processing tank 1, respectively. The movable partition 7 is provided with a horizontally long overflow hole 7a in the middle thereof. Further, racks 7b are projectingly provided at both left and right ends, and a pinion 7c which is meshed with the racks 7b and driven to rotate is vertically moved.

When the object 5 to be processed on the roller conveyor 4 is carried into or out of the processing tank 1, the movable partition wall 7 is lowered as shown in FIG. 2 (A). It is in a state. At this time, the object to be treated 5 is overflow hole.
It can pass 7a freely.

On the other hand, when the object 5 to be processed is subjected to ultrasonic treatment, the movable partition 7 is raised after the object 5 is stopped at the center of the processing tank 1. Then, as shown in FIG. 2B, the overflow hole 7a of the movable partition 7 is lifted. Therefore, the position where the processing liquid 3 overflows is increased, and the liquid surface 3a of the processing liquid 3 is raised.

The height H of the liquid surface 3a of the processing liquid 3 raised from the object to be processed 5 has a relationship of H≈L / 2 with respect to the wavelength L of the standing wave generated in the processing liquid 3. If the rise of the movable partition 7 is controlled so as to achieve the above, the ultrasonic treatment can be performed with optimum efficiency.

Embodiment 2 In FIG. 3, the movable roller conveyor 8 provided in the processing tank 1 serves as the liquid level raising means 2. That is, a plurality of roller conveyors arranged in the processing tank 1 are continuously arranged to be integrated, and can be moved up and down by a cylinder 8a, for example.

When the movable roller conveyor 8 moves up, for example, the movable roller conveyor 8 meshes with the drive gear 8b.
The whole is rotated so that the object to be processed 5 can be carried in and out in parallel with the roller conveyor 4.

On the other hand, when the object 5 to be processed is ultrasonically processed, the movable roller conveyor 8 descends and is immersed in the processing liquid 3. And, the degree of lowering of the movable roller conveyor 8,
That is, if the depth of the processing object 5 submerged in the processing solution 3 is controlled, the height H of the liquid surface 3a of the processing solution 3 raised from the processing object 5 as shown in FIG. It is possible to set H≈L / 2 for the wavelength L of the standing wave generated in the treatment liquid 3. Therefore, the ultrasonic treatment can be performed most efficiently.

Thus, when ultrasonically treating the object 5 to be processed, the antinode of the standing wave 6a generated by the ultrasonic oscillator 6 corresponds to the position of the object 5 to be processed. Sonication can be performed.

Although various means can be adopted as the liquid level raising means, according to the present invention, even if the height at which the processing liquid overflows is controlled, the depth at which the object to be processed is submerged in the processing liquid is controlled. However, the same effect can be obtained. Further, such means can be modified in various ways other than those exemplified here.

[0031]

According to the present invention, when performing a single-wafer ultrasonic treatment, the object to be treated is positioned at the antinode of the standing wave generated in the treatment liquid, and the most efficient treatment is achieved. The effect can be obtained and the processing time can be shortened.

As a result, for example, in a flat display manufacturing process, the process efficiency can be improved in the case where a series of processes are continuously performed by appropriately interposing ultrasonic treatment for the glass substrate.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

2A and 2B are enlarged cross-sectional views of the main part of FIG. 1, in which FIG. 2A is the time when the object to be processed is conveyed, and FIG.

3A and 3B are explanatory views of another embodiment of the present invention, in which FIG. 3A is a perspective view of a main part, and FIG.

FIG. 4 is an explanatory view of a conventional single-wafer ultrasonic processing device,
(A) is a schematic side view, (B) is an explanatory view of the processing effect of ultrasonic processing.

[Explanation of symbols]

1 Processing tank 1a Partition wall 1b
Overflow surface 2 Liquid level raising means 3 Treatment liquid 3a Liquid surface 4 Roller conveyor 5 Object to be treated 6 Ultrasonic oscillator 6a Standing wave 7 Movable partition 7a Overflow hole 7b
Rack 7c Pinion 8 Movable roller conveyor 8a Cylinder 8b
Drive gear 10-sheet type ultrasonic processing device

Claims (3)

[Claims] 1. A treatment tank (1) and a liquid level raising means (2) are provided, and the treatment tank (1) is arranged in parallel while overflowing the treatment liquid (3) partitioned by a partition wall (1a). The object to be processed (5), which is carried in and out in a single-wafer manner by the roller conveyor (4) provided, is ultrasonically processed by an ultrasonic oscillator (6) arranged at the bottom, The raising means (2), when the object to be treated (5) is subjected to ultrasonic treatment, the depth from the liquid surface (3a) of the treatment liquid (3) to the object to be treated (5) is 1 / wavelength L of the standing wave (6a) generated in the treatment liquid (3) by the ultrasonic oscillator (6)
A single-wafer ultrasonic processing device, characterized in that the distance is equivalent to 2. 2. The liquid level raising means (2) is the processing tank.
The movable partition wall (7) is provided so as to be vertically movable close to the partition wall (1a) of (1), and has a movable partition wall (7) having an overflow hole (7a) at an intermediate portion thereof. When the object to be processed (5) is carried in and out, the object to be processed (5) descends freely through the overflow hole (7a), and the object to be processed (5) is subjected to ultrasonic treatment. The single-wafer ultrasonic processing apparatus according to claim 1, wherein the overflow hole (7a) rises so as to raise the liquid level (3a) of the treatment liquid (3) when the treatment is performed. 3. The liquid level raising means (2) is a movable roller conveyor (8) which is carried by the object (5) to be processed and is vertically movable in the processing tank (1). ), The movable roller conveyor (8), when the object to be processed (5) is carried in and out, the roller conveyor (4) so that the object to be processed (5) can be loaded. The surface of the treatment liquid (3) rises flush with the surface of the treatment liquid (5) and is lowered so as to raise the liquid surface (3a) of the treatment liquid (3) when the treatment object (5) is ultrasonically treated. Single-wafer ultrasonic processing device.