JPH0531272U - Circuit board connection structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a connection structure between substrates that improves workability required for bonding and is compatible with the SMD method. In a connecting structure between two circuit boards joined together via a joining member, a conducting body is provided which electrically connects both boards of the joining member and whose tip is bent in parallel to a joining surface of both boards. A plurality of projecting portions are provided on at least one substrate joining surface of the joining member, a positioning hole through which the projecting portion is inserted is provided on the one circuit board, and the projecting portion is inserted through the positioning hole to form a joining member. That is, the two circuit boards are connected by the conductor.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connection structure between a hybrid IC board and a board such as a print mother board.

[0002]

[Prior art]

 Conventionally, as a connection structure between a hybrid IC board and a printed mother board, as shown in FIG. 3, a male connector plug 32 mounted on the back side of the hybrid IC board 31 and a front side of the mother board 33 are mounted. Female connector plug 34 is provided, and both connectors 32, 34 are fitted to each other to mechanically join and electrically connect the hybrid IC board 31 and the print mother board 33. It was

Further, as another connection structure, as shown in FIG. 4, a joining member 43 sandwiched between the hybrid IC substrate 41 and the print mother substrate 42 is used. The joining member 43 has a plurality of conducting members 45 penetrating the joining member main body 44 and protruding on both surfaces of the joining member 43. The joining member connecting hole 46 formed in the hybrid IC board 41 and the print mother board 42 are formed in the joining member 43. The protrusions 45a and 45b of the conductive member 45 are solder-bonded to the conductive member connection hole 47 formed in (1) to mechanically bond and electrically connect both substrates.

Recently, as a mounting technique for mounting an electronic component on a circuit board, cream solder or the like is applied to a predetermined wiring pattern on the circuit board, and the terminal portion of the electronic component is arranged on the cream solder application portion. A surface mounting method (SMD method) is generally used in which electronic components are mounted on a circuit board and a plurality of electronic components of this type are collectively solder-bonded in a reflow furnace.

[0005]

Problems to be Solved by the Invention In the structure for connecting the substrates 1 and 2 by fitting the male and female connector plugs 32 and 34 described above, they may be separated from each other depending on the fitting force. In many cases, the desired circuit characteristics could not be obtained due to the presence of contact resistance due to the occurrence of contact resistance or insufficient contact, and the production efficiency was greatly reduced.

Further, in a structure in which a plurality of conductive members 45 projecting on both surfaces of the joining member 43 are electrically connected by the connection holes 46 and 47 of the boards 41 and 42, respectively, the circuit boards 41 and 42 are provided. It is necessary to insert the projecting portions 45a and 45b of the conducting member 45 of the joining member 43 into the connection holes 46 and 47, respectively, and the workability is extremely poor, and the joining method is different from the SMD method. Multiple systems are required.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to provide a connection structure between substrates which improves workability required for bonding and is compatible with the SMD method. It is.

[0008]

[Specific means for solving the problem]

 According to the present invention, a joining member, in which a plurality of conductors are fixed to an insulating member so that both ends of the conductor protrude, is placed between circuit boards having circuit wiring on the surface, and the wiring is connected to the circuit wiring of each circuit board. In a circuit board connection structure in which the circuit wirings of both circuit boards are electrically connected by joining both ends of the conductor, the insulating member has a plurality of protrusions on the side facing at least one circuit board. The connection structure of a circuit board is characterized in that the position is regulated by providing the protruding portion through a positioning hole formed in the circuit board.

[0009]

[Action]

 According to the present invention, since the protruding portion of the joining member on the joining surface of the board and the circuit board are fitted to each other, the positioning of the joining member and the board can be surely performed, and the conductor having the bent tip and both the circuit boards are Since the predetermined wiring pattern is joined by cream solder, the connection can be easily and reliably achieved with a simple structure of the connecting member.

[0010]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of a connection structure portion of the present invention, and FIG. 2 is an exploded perspective view.

Reference numeral 1 is a hybrid substrate, 2 is a mother substrate, and 3 is a joining member. The hybrid substrate 1 is made of, for example, a ceramic substrate 11, and a plurality of connection pads 12 for achieving electrical connection are formed at least on the surface in contact with the bonding member 3. In the figure, wiring patterns 13 are formed on both surfaces of the substrate 11, and electronic components 14 such as IC chips and chip components are mounted on the wiring patterns 13. In this case, in order to connect between the wiring patterns 13 on the front surface and the back surface of the substrate, though not shown, via holes penetrating the substrate and conductive films on the end faces of the substrate are formed.

In addition, a plurality of concave or penetrating holes 15 for positioning the joining member 3 are formed on the joining surface of the hybrid substrate 1 with the joining member 3.

The mother substrate 2 is made of, for example, a ceramic substrate 21, and a wiring pattern 23 including a plurality of connection pads 22 for achieving electrical connection and an electronic component 24 are provided on at least a surface in contact with the bonding member 3. Has been formed.

The joining member 3 is composed of a columnar heat-resistant insulating member 31 and a plurality of conductors 32 penetrating the insulating member 31, and a plurality of the above-mentioned plural members are provided on the hybrid substrate 1 side of the insulating member 31. A protrusion 33 for positioning that fits into the hole 15 is formed. Specifically, the insulating member 31 and the protruding portion 33 are integrally molded by a resin molding die shape, and are formed so as to embed a plurality of conductors 32 during molding. The height of the insulating member 31 is at least 10 mm or more so that the electronic components mounted on the joint surface side of the both substrates 1 and 2 do not come into contact with each other. It has a size that can be fitted according to the size. When the plurality of holes 15 are formed so as to penetrate the hybrid substrate 1, the protrusion 33 is set to have the same height as the thickness of the substrate 1.

The conductor 32 is made of, for example, an iron material plated with nickel, is embedded in the insulating material 31, and extends to the bonding surfaces of both substrates, respectively. The leading ends of the extending conductors 32 are bent and formed to be parallel to the joint surface, and serve as contact portions 32a and 32b that are connected to the connection pads 12 and 22 of the substrates 1 and 2.

The pitch and arrangement of the contact portions 32a and 32b are provided corresponding to the pitch and arrangement of the connection pads 12 and 22 of the substrates 1 and 2 to be connected.

Next, the assembly process according to the present invention will be described. First, the hybrid substrate 1 and the mother substrate 2 in which the wiring patterns 13 and 23, the electronic component 14, the plurality of holes 15 and the like are formed are prepared. Next, a cream solder is applied to the connection pads 12 and 22 on the bonding surface side of the hybrid substrate 1 and the bonding surface side of the mother substrate 2. Next, the protrusions 33 of the joint member 3 are fitted into the plurality of holes 15 formed in the hybrid substrate 1 to connect the connection pads 12 of the hybrid substrate 1 and the contact portions 32a of the conductor 32 of the joint member 3 to each other. Contact. Next, the integrated structure of the hybrid substrate 1 and the joining member 3 is placed on the mother substrate 2 so that the connection pad 22 of the mother substrate 2 and the contact portion 32a of the conductor 32 of the joining member 3 are in contact with each other. Finally, the mother substrate 2, the bonding member 3 and the hybrid substrate 1 are heated in a reflow furnace (not shown) capable of heating around 170 to 200 ° C. to heat and melt the above-mentioned cream solder to mechanically bond each other. And achieve electrical connection.

According to the circuit board connection structure achieved by the above assembling process, the joining member 3 and the hybrid board 1 are positioned by the plurality of protrusions 33 and the plurality of holes 15 which are fitted to each other. Therefore, the connection pad 12 on the joint surface of the hybrid substrate 1 and the contact portion 32a of the joint member 3 are surely aligned with each other. In addition, reflow using the contact solder 32a of the joining member 3 and the connecting pad 12 on the joining surface of the hybrid substrate 1 and the contact portion 32b and the connecting pad 22 on the joining surface of the mother substrate 2 using the cream solder. Since it is soldered in a furnace, mechanical and electrical connection can be achieved easily and reliably.

In addition, since the electronic components 14 mounted on the hybrid substrate 1 or the mother substrate 2 can also be solder-joined at the same time when soldering by the reflow furnace, the productivity in forming both circuit boards 1, 2 is improved. Will be improved.

In the above-described embodiment, the connection structure in which the positioning hole 15 and the protrusion 33 of the joint material that fits into the hole 15 are formed only on the hybrid board 1 side has been described. It may be formed on the side, or may be formed on the sides of the substrates 1 and 2 respectively.

[0021]

【effect】

 As described above, according to the present invention, since the protrusion is formed on the board bonding surface of the bonding member and the hole is formed on the circuit board bonding surface, the positioning can be performed and the solder bonding can be performed based on the surface mounting technique. The mechanical connection and electrical connection between the connection pad and the conductor are easily and reliably achieved.

[0022]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a connection structure according to the present invention.

FIG. 2 is an exploded perspective view of the present invention.

FIG. 3 is a cross-sectional view showing a conventional board connection structure.

FIG. 4 is a cross-sectional view showing another conventional connection structure for a substrate.

[Explanation of symbols]

 1 --- Hybrid substrate 2 --- Mother substrate 3 --- Joining member 12,22 ...- Connecting pad 13,23 --- Wiring pattern 14, 24 ··· Electronic parts 15 ··· Positioning hole 31 ··· Insulating member 32 ··· Conductor 33 ··· Positioning protrusion 32a, 32b ... Contact part

Claims (1)

[Scope of utility model registration request] 1. A joining member having a plurality of conductors fixed to an insulating member such that both ends of the conductor are fixed is arranged between circuit boards provided with circuit wiring on the surface thereof, and is connected to the circuit wiring of each circuit board. In a connection structure of a circuit board for electrically connecting circuit wirings of both circuit boards by joining both ends of the conductor, the insulating member has a plurality of protrusions on a surface side facing at least one circuit board. A connection structure for a circuit board, characterized in that the projection is inserted into a positioning hole formed in the circuit board to regulate the position.