JPH0530079B2 - - Google Patents
Info
- Publication number
- JPH0530079B2 JPH0530079B2 JP59164263A JP16426384A JPH0530079B2 JP H0530079 B2 JPH0530079 B2 JP H0530079B2 JP 59164263 A JP59164263 A JP 59164263A JP 16426384 A JP16426384 A JP 16426384A JP H0530079 B2 JPH0530079 B2 JP H0530079B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- power module
- conductor piece
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、インバータ装置などパワー電子回路
の実装方式に係り、特に、半導体パワーモジユー
ルとそれに対する周辺回路部品との間での配線部
分の構成に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a mounting method for a power electronic circuit such as an inverter device, and in particular to a configuration of a wiring portion between a semiconductor power module and its peripheral circuit components. Regarding.
インバータ装置などでは、比較的大きなパワー
を扱う主回路用半導体装置と、それに対する制御
回路など比較的ローパワーの周辺回路部品とが混
在しており、そのため、例えば第２図に示すよう
に、主回路用半導体装置はパワーモジユール８と
して、そしてローパワーの周辺回路部品１７など
はプリント配線板として構成されるのが一般的で
ある。
In inverter devices and the like, main circuit semiconductor devices that handle relatively high power and peripheral circuit components that have relatively low power, such as control circuits, coexist. Generally, the circuit semiconductor device is configured as a power module 8, and the low power peripheral circuit components 17 are configured as a printed wiring board.
なお、第３図はパワーモジユール８の一例を示
したもので、例えば、第２図に示すように２個の
パワートランジスタをを一体にまとめ、６個の端
子１０（第３では１個しか見えていないが、絶縁
用のバリヤＢを隔てて６個存在している）が設け
てあるものである。 Note that FIG. 3 shows an example of the power module 8. For example, as shown in FIG. Although not visible, there are six insulating barriers B separated from each other.
従来、このようなパワーモジユールとプリント
配線板とを備えた機器での、これらパワーモジユ
ールとプリント配線板との間の接続は、例えば第
４図のように渡り配線１３を用いて行なつてい
た。すなわち、プリント配線板３に周辺部品１７
を装着し、端子板１２とパワーモジユール８の端
子１０と間を渡り配線１３で接続するのである。
なお、この第４図において、６は放熱フインで、
このフインにパワーモジユール８を例えば３個取
り付けるようになつている。また、１６はパワー
モジユール８相互間の接続用電線で、比較的大電
流を扱うため、太めの電線となつている。なお、
その他のパワー回路の接続は省略してある。 Conventionally, in a device equipped with such a power module and a printed wiring board, the connection between the power module and the printed wiring board was performed using a crossover wiring 13 as shown in FIG. 4, for example. was. That is, the peripheral components 17 are mounted on the printed wiring board 3.
is attached, and the terminal board 12 and the terminal 10 of the power module 8 are connected by a crossover wiring 13.
In addition, in this FIG. 4, 6 is a heat dissipation fin,
For example, three power modules 8 are attached to this fin. Further, reference numeral 16 denotes an electric wire for connecting between the power modules 8, which is a thick electric wire because it handles a relatively large current. In addition,
Other power circuit connections are omitted.
従つて、このような従来の機器では、パワーモ
ジユール８とプリント配線板３との間の渡り配線
１３が必要になり、作業性や信頼性の面で問題が
多いという欠点があつた。 Therefore, such conventional equipment requires a crossover wiring 13 between the power module 8 and the printed wiring board 3, which has the disadvantage of causing many problems in terms of workability and reliability.
また、保守面でも、分解組立が面倒で、作業に
時間が多く掛るという欠点があつた。 In addition, in terms of maintenance, disassembly and reassembly were troublesome and the work took a lot of time.
本発明の目的は、上記した従来技術の欠点を除
き渡り配線による作業性や信頼性の低下がなく、
しかも保守作業が容易なパワー電子回路装置を提
供するにある。
The purpose of the present invention is to eliminate the drawbacks of the prior art described above and to avoid deterioration in workability and reliability due to crossover wiring.
Furthermore, it is an object of the present invention to provide a power electronic circuit device that is easy to maintain.
この目的を達成するため、本発明は、プリント
配線板に開孔を設けた上で、この開孔内にパワー
モジユールの端子が挿入されてプリント配線板の
一方の面とほぼ平行になるように取付けると共
に、この開孔を横切つてプリント配線板の配線パ
ターンに接続された導体片を設け、この導体片を
パワーモジユールの端子にねじ止めすることによ
り、パワーモジユールとプリント配線板との間の
接続が得られるようにした点を特徴とする。
In order to achieve this object, the present invention provides an arrangement in which a printed wiring board is provided with an opening, and the terminal of the power module is inserted into the opening so that the terminal is approximately parallel to one surface of the printed wiring board. At the same time, by installing a conductor piece across this hole and connected to the wiring pattern of the printed wiring board, and screwing this conductor piece to the terminal of the power module, the power module and the printed wiring board can be connected. It is characterized by the fact that the connection between the two can be obtained.
以下、本発明によるパワー電子回路装置につい
て、図示の実施例により詳細に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS A power electronic circuit device according to the present invention will be explained in detail below with reference to illustrated embodiments.
第１図は本発明の一実施例で、１は導体片、２
はピン部、４は貫通孔、５は取付金具、７は取付
ネジ、９は接触面、１１は開孔、１４は貫通孔、
１５は端子ネジであり、その他は第４図の従来例
と同じである。 FIG. 1 shows an embodiment of the present invention, in which 1 is a conductor piece, 2
is a pin part, 4 is a through hole, 5 is a mounting bracket, 7 is a mounting screw, 9 is a contact surface, 11 is an opening, 14 is a through hole,
15 is a terminal screw, and the other parts are the same as the conventional example shown in FIG.
プリント配線板３には周辺部品１７が装着され
ると共に、パワーモジユール８の上面が通り抜け
られるような開孔１１が設けられている。 A peripheral component 17 is mounted on the printed wiring board 3, and an opening 11 is provided through which the upper surface of the power module 8 can pass.
導体片１はプリント配線板３の貫通孔４に挿入
してその導体パターンにハンダ付ななどで取り付
けられるピン部２と、パワーモジユール８の端子
１０にネジ１５で取り付けるための貫通孔１４を
備え、プリント配線板３の開孔１１を横切つて取
り付けられるようになつている。 The conductor piece 1 has a pin part 2 which can be inserted into a through hole 4 of a printed wiring board 3 and attached to the conductor pattern by soldering or the like, and a through hole 14 which can be attached to a terminal 10 of a power module 8 with a screw 15. It is arranged so that it can be attached across the opening 11 of the printed wiring board 3.
第５図は第１図のＡ−Ａ線からみた断面図で、
この第５図から明らかなように、導体片１の接触
面９はプリント配線板１３の表面と同じ位置にあ
り、従つて端子ネジ１５によつて導体片１を端子
１０に取り付けると、この端子１０の面もプリン
ト配線板３の表面と同じ位置になる。 Figure 5 is a cross-sectional view taken from line A-A in Figure 1.
As is clear from FIG. 5, the contact surface 9 of the conductor piece 1 is at the same position as the surface of the printed wiring board 13, and therefore, when the conductor piece 1 is attached to the terminal 10 with the terminal screw 15, the The surface 10 is also at the same position as the surface of the printed wiring board 3.
導体片１をプリント配線板３の導体パターンに
取り付けるためのピン部２には、図示のようにわ
ん曲が形成されており、ここで可撓性が与えられ
るようになつている。 The pin portion 2 for attaching the conductor piece 1 to the conductor pattern of the printed wiring board 3 is curved as shown in the figure to provide flexibility.
プリント配線板３は取付金具５によつて放熱フ
イン６に取り付けられているが、このとき、この
取付金具５の高さは、パワーモジユール８の端子
１０の接続面とプリント配線板の上面とが同じ線
上にくるような寸法に作られている。 The printed wiring board 3 is attached to the heat dissipation fin 6 by a mounting bracket 5. At this time, the height of the mounting bracket 5 is equal to the connection surface of the terminal 10 of the power module 8 and the top surface of the printed wiring board. The dimensions are so that they are on the same line.
従つて、この実施例によれば、プリント配線板
３を取付金具５で、パワーモジユール８が取り付
けられている放熱フイン６に取り付けてやれば、
パワーモジユール８の端子１０の接続面が導体片
１の接触面９に接するから、端子ネジ１５によつ
てこの導体片１を端子１０に固定させるだけでパ
ワーモジユール８とプリント配線板３との間の接
続やパワーモジユール相互間の接続が得られ、渡
り接続用の配線をなくすことができる。 Therefore, according to this embodiment, if the printed wiring board 3 is attached to the heat dissipation fin 6 to which the power module 8 is attached using the mounting bracket 5,
Since the connection surface of the terminal 10 of the power module 8 is in contact with the contact surface 9 of the conductor piece 1, simply fixing the conductor piece 1 to the terminal 10 with the terminal screw 15 connects the power module 8 and the printed wiring board 3. connections between power modules and between power modules, and wiring for crossover connections can be eliminated.
次に、第６図は導体片１の他の一実施例で、結
合部１ａにより２個の導体片を１個にまとめたも
のである。 Next, FIG. 6 shows another embodiment of the conductor piece 1, in which two conductor pieces are combined into one by a connecting portion 1a.
この第６図の導体片１を用いれば、第４図の端
子間の渡り接続が結合部１ａによつて得られるた
め、第４図の従来例における渡り配線用の電線１
６をなくすことができる。 If the conductor piece 1 shown in FIG. 6 is used, the crossover connection between the terminals shown in FIG. 4 can be obtained by the coupling portion 1a.
6 can be eliminated.
ところで、以上のいずれの実施例においても、
可撓性をもたせるためにわん曲させてあるピン部
２が設けられているため、端子１５により導体片
１を端子１０に取り付けたときにプリント配線板
３に与えられる応力が柔げられ、ピン部２とプリ
ント配線板３との取付部分に損傷を与える虞れが
なく、その他、耐振性の向上も得られるため、高
い信頼性を与えることができる。 By the way, in any of the above embodiments,
Since the pin portion 2 is bent to provide flexibility, the stress applied to the printed wiring board 3 when the conductor piece 1 is attached to the terminal 10 by the terminal 15 is softened, and the pin portion 2 is bent to provide flexibility. There is no risk of damaging the attachment portion between the part 2 and the printed wiring board 3, and in addition, vibration resistance can be improved, so high reliability can be provided.
なお、以上の実施例を表わす図面の第４図及び
第５図では、理解し易くするため、第３図に示し
たパワーモジユール８のバリヤＢは省略してあ
る。 In addition, in FIGS. 4 and 5 of the drawings showing the above embodiment, the barrier B of the power module 8 shown in FIG. 3 is omitted for easy understanding.
以上説明したように、本発明よれば、導体片の
ネジ止めだけでパワーモジユールとプリント配線
板との間の接続が得られるため、従来技術の欠点
を除き、
(1) 電線による配線接続が不要で、良好な作業性
と高い信頼性を与えることができる。
As explained above, according to the present invention, the connection between the power module and the printed wiring board can be obtained simply by screwing the conductor pieces, thereby eliminating the drawbacks of the prior art and eliminating (1) wiring connections using electric wires; It is unnecessary and can provide good workability and high reliability.
(2) 導体片のピン部にわん曲部分を設け、可撓性
を与えてやれば、プリント配線板の取り付け、
取り外しに際して加えられる虞れのある応力を
柔げることができ、かつ耐振性を容易に向上さ
せることができる。(2) If the pin part of the conductor piece is provided with a curved part to give it flexibility, it will be easier to attach the printed wiring board.
The stress that may be applied during removal can be alleviated, and the vibration resistance can be easily improved.
(3) プリント配線板の取り外しに際して配線を外
す必要がないから、保守、点検が容易で、この
面でも良好な作業性が得られる。(3) Since there is no need to remove the wiring when removing the printed wiring board, maintenance and inspection are easy, and good workability can be obtained in this aspect as well.
などの優れた効果を奏するパワー電子回路装置を
容易に提供することができる。It is possible to easily provide a power electronic circuit device that exhibits excellent effects such as the following.
第１図は本発明によるパワー電子回路装置の一
実施例を示す斜視図、第２図は本発明が適用され
る電子回路の一例を示す回路図、第３図は半導体
パワーモジユールの一例を示す斜視図、第４図は
電子回路の実装方式の従来例を示す斜視図、第５
図は第１図の実施例のＡ−Ａ線による断面図、第
６図は導体片の他の一実施例を示す平面図であ
る。
１……導体片、２……ピン部、３……プリント
配線板、４，１４……貫通孔、５……取付金具、
６……放熱フイン、７……ネジ、８……パワーモ
ジユール、９……接触面、１０……端子、１１…
…開孔、１５……端子ネジ、１７……周辺回路部
品。
FIG. 1 is a perspective view showing an embodiment of a power electronic circuit device according to the present invention, FIG. 2 is a circuit diagram showing an example of an electronic circuit to which the present invention is applied, and FIG. 3 is an example of a semiconductor power module. FIG. 4 is a perspective view showing a conventional example of an electronic circuit mounting method, and FIG.
The figure is a sectional view taken along line A--A of the embodiment shown in FIG. 1, and FIG. 6 is a plan view showing another embodiment of the conductor piece. 1... Conductor piece, 2... Pin part, 3... Printed wiring board, 4, 14... Through hole, 5... Mounting bracket,
6...Radiation fin, 7...Screw, 8...Power module, 9...Contact surface, 10...Terminal, 11...
...Opening hole, 15...Terminal screw, 17...Peripheral circuit parts.
Claims (1)
回路部品とからなるパワー電子回路装置におい
て、上記周辺回路部品が装着され一部に開孔部を
有するプリント配線板と、このプリント配線板の
上記開孔部内でプリント配線板の一方の面とほぼ
平行になるようにして上記パワーモジユールの端
子が位置するように上記プリント配線板を保持す
る取付金具と、部品プリント配線板の一方の面上
で上記開孔部を横切つて配線パターンに接続され
た導体片とを設け、この導体片に形成してあるね
じ孔を用い、部品パワーモジユールの端子部に該
導体片をねじ止め結合させることにより、上記パ
ワーモジユールと上記周辺回路部品の間での電気
的な接続が得られるように構成したことを特徴と
するパワー電子回路装置。 ２ 特許請求の範囲第１項において、上記導体片
がわん曲部を備え、このわん曲部を介して上記プ
リント配線板に結合されていることを特徴とする
パワー電子回路装置。 ３ 特許請求の範囲第１項又は第２項において、
上記パワーモジユールがインバータ装置の主回路
用半導体装置であることを特徴とするパワー電子
回路装置。[Scope of Claims] 1. A power electronic circuit device consisting of a power module and peripheral circuit components to be connected to the power module, comprising: a printed wiring board to which the peripheral circuit components are mounted and having an opening in a portion; a mounting bracket for holding the printed wiring board so that the terminals of the power module are positioned substantially parallel to one surface of the printed wiring board within the opening of the printed wiring board; and a component printed wiring board. A conductor piece connected to the wiring pattern is provided across the opening on one side of the conductor piece, and using the screw hole formed in the conductor piece, the conductor piece is connected to the terminal part of the component power module. A power electronic circuit device characterized in that the power module is configured to be electrically connected to the peripheral circuit components by screwing them together. 2. The power electronic circuit device according to claim 1, wherein the conductor piece has a curved portion and is coupled to the printed wiring board via the curved portion. 3 In claim 1 or 2,
A power electronic circuit device, wherein the power module is a semiconductor device for a main circuit of an inverter device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16426384A JPS6142999A (en) | 1984-08-07 | 1984-08-07 | Mounting system of electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16426384A JPS6142999A (en) | 1984-08-07 | 1984-08-07 | Mounting system of electronic circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6142999A JPS6142999A (en) | 1986-03-01 |
| JPH0530079B2 true JPH0530079B2 (en) | 1993-05-07 |
Family
ID=15789763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16426384A Granted JPS6142999A (en) | 1984-08-07 | 1984-08-07 | Mounting system of electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6142999A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855839U (en) * | 1981-10-13 | 1983-04-15 | 三菱電機株式会社 | Electric grinder with dust collector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4853256U (en) * | 1971-10-26 | 1973-07-10 |
-
1984
- 1984-08-07 JP JP16426384A patent/JPS6142999A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855839U (en) * | 1981-10-13 | 1983-04-15 | 三菱電機株式会社 | Electric grinder with dust collector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6142999A (en) | 1986-03-01 |
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