JPH05297336A - Method and device for cleaning substrate - Google Patents

Abstract

PURPOSE:To securely and efficiently remove contaminants on the surface of a long flexible substrate which is used as the substrate of a liquid crystal display panel, etc., and has an electrode on at least one surface. CONSTITUTION:The long flexible substrate K is rolled to form a feed roll 11 and the substrate K is sent from the feed roll 11; while the substrate is wound around a take-up roll 17, brush cleaning B is continuously carried out fro one end side to the other end side of the substrate K and then ultrasonic cleaning C is continuously performed from one side to the other end side of the substrate K.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning a long substrate having an electrode on at least one surface and having flexibility, particularly a long substrate for a liquid crystal display panel used for electronic devices and the like. Regarding the device.

[0002]

2. Description of the Related Art Conventionally, as a substrate of an electronic device, a rigid and single-wafer substrate such as a silicon substrate for a semiconductor, a printed substrate or a glass substrate for a liquid crystal display panel has been generally used. However, in recent years, in particular for liquid crystal display panels, flexible plastic substrates have begun to be used due to the demand for lighter weight and larger screens. A liquid crystal display panel is constructed by sandwiching a liquid crystal composition between these substrates, and at this time, the surface of the substrate is washed with a solution for the purpose of improving wettability.

The above-mentioned plastic substrate is generally washed with a solution like the conventional plastic film. This method is also called a wet cleaning method in distinction from a dry method, and is a method using the chemical cleaning power of a liquid. The types of liquids include pure water, organic solvents, surfactants, and chemical cleaners such as acids and alkalis, and solution cleaning is performed by using one kind or a combination of two or more kinds. Furthermore, in order to increase the cleaning power, it is common to combine a physical cleaning method such as brush scrubbing, jet spray or ultrasonic wave. Specifically, a method has been proposed in which a substrate is immersed in a neutral detergent or methyl alcohol, and then ultrasonically cleaned in deionized water (JP-A-1-196020).

However, the above-mentioned Japanese Laid-Open Patent Publication No. 1-19602.
The cleaning method described in Japanese Patent No. 0 is a method in which a single-wafer substrate is immersed in a cleaning tank filled with a cleaning solution for cleaning, and an extremely large cleaning tank and a large amount of cleaning solution are required for cleaning a long plastic substrate. It becomes necessary and efficient cleaning cannot be performed. Further, it is almost impossible to uniformly wash a continuous body of a very long plastic substrate. further,
When cleaning the substrate of a liquid crystal display panel, the cleaning level is insufficient, and the wettability of the substrate is reduced by the organic matter remaining on the surface, and when the organic matter remains nonuniformly, the liquid crystal composition is repelled onto the substrate. It causes the problem of being burned. In addition, a cleaning apparatus using a plurality of cleaning tanks can continuously perform cleaning, but the apparatus is a horizontal type and is large, which places restrictions on the installation location. Further, in the water washing, it is not possible to effectively remove the organic substances attached to the surface even if ultrasonic waves are applied or brushing is used together.

On the other hand, the dry cleaning method includes an ultraviolet ozone cleaning method and a plasma cleaning method which are mainly used in the semiconductor field, and is used for cleaning a rigid substrate. Recently, the ultraviolet ozone cleaning method has also been used for cleaning glass substrates for liquid crystal panels.

According to this ultraviolet ozone cleaning method, although it is possible to remove organic substances, if dust or the like adheres to the substrate, the ultraviolet light is blocked by the dust or the like to form a shadow. There is a drawback that a reliable cleaning effect cannot be obtained, for example, cleaning cannot be performed.

The present invention has been made in view of the above problems, and has contaminants on the surface of a flexible long substrate having an electrode on at least one surface used as a substrate of a liquid crystal display panel or the like. An object of the present invention is to provide a method of cleaning a substrate and a cleaning apparatus for the same, which can reliably and efficiently remove the substrate.

[0008]

In order to achieve the above object, a method of cleaning a substrate according to the present invention comprises a flexible long substrate having an electrode on at least one surface and wound in a roll. To form a feeding roll, and while the substrate is fed from this feeding roll and wound on the winding roll, the cleaning treatment is continuously brush-cleaned from one end side to the other end side of the substrate, and then ultrasonic cleaning is performed on the substrate. Is continuously performed from one end side to the other end side. In this case, ultraviolet cleaning is preferably performed after ultrasonic cleaning.

Further, in the substrate cleaning apparatus of the present invention, a flexible long substrate having an electrode on at least one surface is fed from a delivery roll, passed through a cleaning processing region, and wound onto a winding roll for recovery. A substrate transfer mechanism, a brush cleaning device that is installed in the cleaning processing region and brushes the substrate surface to remove solid dirt on the substrate surface, and a cleaning liquid that is installed behind the brush cleaning device in the cleaning processing region. An ultrasonic cleaning device is provided for immersing the substrate therein to generate ultrasonic vibration and remove dirt.

That is, according to the above substrate cleaning method,
The substrate is unwound from a payout roll formed by winding a long flexible substrate, and a cleaning process is performed while the substrate is taken up by a take-up roll, so that one end of the long substrate is continuously transferred to the other end. The cleaning process can be performed under the conditions. In addition, by combining brush cleaning and ultrasonic cleaning, the foreign matter that has eroded in the ultrasonic cleaning can be separated by the contact force of the brush, and the foreign matter that has entered the fine holes that cannot be removed by the ultrasonic cleaning is ultrasonically cleaned. By performing washing in the washing solution with the above method, it is possible to perform a high degree of washing which has not been achieved by the conventional technique. Furthermore, by performing ultrasonic cleaning after performing ultrasonic cleaning, organic substances on the substrate surface can be removed to a higher degree. Therefore, even with a continuum of very long plastic substrates,
Uniform and good cleaning can be performed efficiently, and a uniformly and completely cleaned flexible substrate can be efficiently and stably obtained.

Further, according to the above substrate cleaning apparatus, the substrate is transferred from the delivery roll by the substrate transfer mechanism, passed through the cleaning processing region, and wound on the winding roll to be collected, while brush cleaning is performed in the cleaning processing region. By removing foreign matter that has invaded the substrate with the equipment and removing foreign matter that has entered the fine holes that cannot be removed with the next brush with the ultrasonic cleaning equipment, it has been uniformly and completely cleaned according to the above cleaning method. A flexible substrate can be obtained efficiently and stably. Furthermore, by performing ultraviolet cleaning with an ultraviolet cleaning device after ultrasonic cleaning, organic substances on the substrate surface can be removed to a higher degree.

The present invention will be described in more detail below. The substrate, which is the object to be cleaned of the present invention, is a long substrate having an electrode on at least one surface and having flexibility, and specifically, an electrode is formed on the surface of a plastic substrate. Examples of the plastic substrate include crystalline polymers such as uniaxially or biaxially stretched polyethylene terephthalate, amorphous polymers such as polyarylate, polysulfone, polyethersulfone and polycarbonate, polyolefins such as polyethylene and polypropylene, and polyamides such as nylon. Any material may be used as long as it is flexible and has flexibility. Further, as the electrodes formed on these plastic substrates for driving the liquid crystal and the like, any material having conductivity can be used, for example, formed by vapor deposition, ion beam vapor deposition, sputtering or the like. Indium oxide, ITO made of indium oxide and tin oxide, metal vapor deposition of aluminum, nickel, copper or the like, or a laminated film is preferably used.

According to the method of cleaning a substrate of the present invention, while the long flexible substrate is wound, the substrate is unwound from the unwinding roll, passed through the washing treatment area, and wound on the winding roll. After the brush cleaning in the cleaning area, ultrasonic cleaning is performed.

In this case, in the brush cleaning, the surface of the substrate is scrubbed with a brush while spraying pure water, ultrapure water or suitable cleaning water on the substrate. At this time, the substrate is rinsed with pure water, ultrapure water or cleaning water, and at the same time, the brush is rinsed. Here, there is no limitation on the material, diameter, and length of the brush, as long as it does not damage the substrate itself, and it is appropriately selected and set. Further, the shape of the brush is not particularly limited, and may be an appropriate shape such as a roller shape or a brush shape.

Here, although not particularly limited,
Prior to the brush cleaning, it is preferable that the surface of the substrate is subjected to a charge removal treatment and washed with water, and thereby it is preferable to remove foreign matters such as electrostatically adhered fine particles. Also,
After the brush cleaning, it is preferable to spray pure water or ultrapure water on the substrate to rinse it.

In the ultrasonic cleaning performed after the brush cleaning, a cleaning liquid such as pure water or ultrapure water is contained in the cleaning tank, and the substrate is immersed in this cleaning liquid to generate ultrasonic vibrations in the cleaning liquid. At this time, the cavitation effect caused by the ultrasonic vibration in the liquid is utilized to efficiently remove the stain on the substrate. This cavitation action has the effect of promoting the cleaning power of the cleaning liquid and physically removing the deposits on the substrate surface. Ultrasonic vibration can be generated by an ultrasonic vibrator installed at the bottom or side of the cleaning tank. Types of ultrasonic vibrator include ferrite type, barium titanate type, zirco titanate type, nickel type, etc. Can be used. The output of this oscillator varies depending on the size of the cleaning tank, but usually 20 kW or less is used, and 3 W / cm ² or less per unit area of the diaphragm can be used, preferably 0.3 to 1 W / Cm ² is suitable. As the frequency of ultrasonic vibration, a frequency of 100 kHz or less is mainly used, and a range of 20 to 50 kHz is preferably used. In this case, it is also effective to modulate the frequency within this range depending on the type of substrate, the degree of contamination, and the like. Note that it is also possible to use a high frequency of 800 kHz or higher and utilize impact due to vibration acceleration for cleaning without using the cavitation effect.

Conditions for carrying out this ultrasonic cleaning include temperature, time, type of cleaning liquid, output of ultrasonic waves and the like, and there are no particular restrictions and they can be set as appropriate, but if the temperature is too high. In order to cause the deformation of the substrate and the attenuation of the cavitation force, the glass transition temperature of the substrate or less is preferable, and specifically, it is preferably about 40 to 70 ° C.

When the substrate is cleaned by this ultrasonic cleaning method, it is preferable to rinse the substrate with pure water or ultrapure water after cleaning to wash away the stain remaining by the ultrasonic cleaning and the stain reattached. In this case, this rinsing step may be performed by storing the rinsing liquid in the rinsing tank and immersing the substrate in the rinsing tank, or by spraying pure water or ultrapure water from the nozzle.

After rinsing, it is preferable to dry and carry it to the ultraviolet cleaning step described later. In this case, it is preferable to dry the substrate by blowing clean air or nitrogen gas onto the substrate with an air knife or the like to blow off water droplets and then heat-drying with a hot air drying device or the like. The drying temperature is preferably below the glass transition temperature of the plastic substrate material.

In the method for cleaning a substrate of the present invention, the brush cleaning and the ultrasonic cleaning are sequentially performed while the substrate is fed from the pay-out roll and wound on the winding roll to be collected. By further performing ultraviolet cleaning, a more advanced cleaning process can be performed.

In this ultraviolet cleaning, the substrate surface is irradiated with ultraviolet rays in an atmosphere containing oxygen or ozone to remove organic contaminants attached to the substrate surface. Here, as the ultraviolet ray generation source in the ultraviolet ray cleaning, a low-pressure mercury lamp that efficiently generates ultraviolet rays having a main wavelength of 184.9 nm and 253.7 nm is preferably used. The output of this ultraviolet lamp is preferably such that the ultraviolet irradiation intensity is as high as possible, although it depends on the size of the lamp. The ultraviolet irradiation intensity under the cleaning conditions is 3 mW / cm ²
Above, particularly, the output adjustment of the ultraviolet lamp and the distance between the lamp and the substrate (ultraviolet irradiation distance) are adjusted so as to be 20 mW / cm ² or more.

The ozone concentration is preferably changed according to the amount of organic substances on the surface of the substrate, particularly 10 ppm.
It is preferable that the concentration range is from 10% to 10%. In this case, a concentration of around 100 ppm can be achieved by irradiation with ultraviolet rays in the air without using an ozone generator. In this concentration range, since the ultraviolet irradiation distance and the concentration are inversely proportional, the ozone concentration can be adjusted by the ultraviolet irradiation distance. Further concentration adjustment is based on the output control of the ozone generator.

When the substrate temperature is as high as possible, the decomposition rate of organic substances can be increased. However, the substrate is deformed above the glass transition temperature of the substrate, and the decomposition of the substrate itself is promoted as the temperature rises. Therefore, it is desirable to control the temperature below the glass transition temperature of the substrate.
Although it is mainly performed by adjusting the output of the heater, it can also be performed by the ultraviolet irradiation distance and the irradiation time. If the ultraviolet irradiation time (cleaning time) is too long, the temperature rises and decomposition proceeds from the back surface of the substrate, so that the electrode surface of the substrate is likely to be recontaminated. Further, there is a possibility that the electrode itself may deteriorate to cause a resistance change. Therefore, the washing time is preferably short, and preferably 30 minutes or less. Furthermore, the ultraviolet irradiation intensity, the ozone concentration, and the substrate temperature change depending on the ultraviolet irradiation distance, and the cleaning effect tends to decrease as the distance increases, so that the ultraviolet irradiation distance is preferably short. Usually adjusted to 100 mm or less, preferably 10
-30 mm is suitable.

After the ultrasonic cleaning and drying, or after the ultraviolet cleaning, the cleaned substrate is wound up from the cleaning area and collected by a winding roll. At this time, the substrate is wound on a winding roll. It is preferable to perform static elimination treatment before collecting.

[0025]

EXAMPLES Next, examples of the present invention will be described in more detail with respect to the substrate cleaning method and substrate cleaning apparatus of the present invention. [First Embodiment] FIG. 1 shows a substrate cleaning apparatus according to an embodiment of the present invention. This cleaning apparatus is a substrate delivery / winding chamber A, a brush cleaning chamber B, an ultrasonic cleaning chamber C and a drying chamber. A cleaning processing area including a chamber D and a cleaning device control panel E are provided.

In the substrate feeding / winding chamber A, a feeding roll 11 and a winding roll 17 formed by winding a substrate K are used.
And the substrate K is delivered from the feeding roll 11 to the cleaning processing area through the substrate inlet 15 and is discharged from the cleaning processing area through the substrate outlet 45.
Is collected on a winding roll 17. Here, reference numerals 12 and 13 in the figure denote protective film take-up rolls for peeling and collecting the protective films attached to the front surface and the back surface of the substrate K, respectively. Note that 91
Reference numerals a and 91b are guide rolls, and 14 and 16 are static eliminating devices.

In the brush cleaning chamber B, a nylon material (diameter of 100 μm, length 3) which rotates in the direction opposite to the traveling direction of the substrate K is used.
0 mm) roller-shaped cleaning brushes 22, 22 are provided. Then, the guide rolls 91c and 91d
Causes the substrate K to move from bottom to top along the vertical direction,
It passes between these cleaning brushes 22 and 22, is conveyed to the ultrasonic cleaning chamber C described later through the substrate insertion port 25, returns to the brush cleaning chamber B through the substrate insertion port 25 again, and is guided by the guide roll 91i. Substrate exit (drying room entrance)
It is designed to be transported from 27 to the drying chamber D. In front of and behind the cleaning brushes 22, 22, and in front of the substrate outlet (drying chamber inlet) 27, cleaning water injection nozzles 21, 23, 26 for injecting cleaning water such as pure water or ultrapure water onto the substrates are provided. It is arranged on both sides of K. Reference numeral 24 is a cleaning waste liquid discharge port, and reference numeral 92a is a cleaning waste liquid discharge pipe.

The ultrasonic cleaning chamber C is provided with an ultrasonic cleaning tank 30 consisting of an inner tank 31 and an outer tank 32, and the substrate K introduced from the brush cleaning chamber B is guided by a guide roll 91.
It is immersed in the cleaning liquid in the inner tank 31 by e and 91f, pulled up from the inner tank 31 by the guide rolls 91g and 91h, and returned to the brush cleaning chamber B through the substrate insertion port 25 again by the guide roll 91i. ing. In the figure, 33 is a cleaning liquid introducing pipe for supplying the cleaning liquid to the inner bath 31, 34 is a cleaning waste liquid discharge port for discharging the overflowing cleaning liquid to the outer bath 32, and 92b is a cleaning waste liquid discharge pipe.

In the drying chamber D, air nozzles 41a,
41b and the hot air blowing nozzles 42a and 42b are the substrate K.
Of the nozzles 41a, 41 from the drying chamber inlet (brush cleaning chamber outlet) 27 by the guide rolls 91j, 91k, 91l.
The substrate exit 45 (entrance of the substrate feeding and winding chamber) 45 is passed through b, 42a and 42b. Incidentally, 43 is an exhaust port, and 44 is an exhaust pipe.

The cleaning device control board E controls the rotation speed of the feeding roll 11, the winding roll 17, and the cleaning brush 22, the injection of liquid or air from each nozzle and the adjustment of the amount thereof, and the ultrasonic cleaning tank 30 Controls the generation of sound waves.

This substrate cleaning apparatus performs a cleaning process on a plastic substrate with an electrode according to the above-described substrate cleaning method of the present invention. When cleaning the substrate, the take-up roll 1 is driven by driving the winding roll 17.
The substrate K is sent from 1 to the brush cleaning chamber B. At this time,
The protective films on the front and back of the substrate K are peeled off by the protective film take-up rolls 12 and 13, and then the front and back of the substrate K are neutralized by the static eliminator 14 to easily remove foreign matter such as electrostatically adhering particles in the downstream process, Substrate entrance 15
And is sent out to the brush cleaning chamber B through.

Next, the substrate K is brush-cleaned while moving upward in the brush cleaning chamber B. In the brush cleaning chamber B, first, pure water is sprayed from the cleaning water jet nozzle 21 onto the substrate K to preliminarily remove foreign substances adhering to the surface, and then both brushes 22 and 22 scrub clean both sides of the substrate. At this time, the ultrapure water is discharged from the cleaning water jet nozzles 23, 23 onto the substrate K.
And brushes 22 and 22 to rinse the substrate and simultaneously clean the brushes. Then, the substrate is transferred from the substrate insertion port 25 to the ultrasonic cleaning chamber C. Here, the cleaning water such as ultrapure water sprayed from the cleaning water spray nozzles 21 and 23 flows from the upper part to the lower part of the substrate K moving upward, and from the cleaning waste liquid discharge port 24 to the outside of the system through the discharge pipe 92a. Is discharged.

The substrate K introduced into the ultrasonic cleaning chamber C passes through the cleaning liquid contained in the inner tank 31 of the ultrasonic cleaning tank 30 to be ultrasonically cleaned, and then passes through the substrate insertion port 25 again. It is returned to the brush cleaning chamber, rinsed with pure water or ultrapure water from the cleaning water jet nozzle, and the substrate outlet (drying chamber inlet) 2
7 is conveyed to the drying chamber D. At this time, the cleaning liquid is constantly supplied to the inner tank 31 of the ultrasonic cleaning tank 30 from the cleaning liquid supply pipe 33, and the overflowed cleaning liquid is discharged from the cleaning waste liquid discharge port 34 to the outside of the system through the discharge pipe 92b.

The substrate K introduced into the drying chamber D is removed by blowing off the water droplets of pure water or ultrapure water adhering to the surface of the substrate K by the pressure of the jet gas of the air nozzles 41a and 41b, and the hot air blowing nozzle. After the clean hot air is blown from 42a and 42b to be dried, it is conveyed from the substrate outlet 45 to the substrate feeding / winding chamber A, where it is discharged by the static eliminator 16 to be discharged and collected by the winding roll 17. Here, as the nozzles of the air nozzles 41a and 41b and the hot air blowing nozzles 42a and 42b, nozzles of various shapes such as a slit shape and a hole shape can be used. In addition to the hot air drying, a drying method using heat radiation from an electric heater or the like is preferably adopted for the heat drying.

The processing time and cleaning efficiency of the above-mentioned brush cleaning, ultrasonic cleaning, and drying processing are controlled by the feeding and winding speed of the substrate. Further, each process can be centrally controlled by the cleaning device control panel, and the cleaning work can be performed extremely efficiently.

[Second Embodiment] FIG. 2 shows a substrate cleaning apparatus according to another embodiment of the present invention. This cleaning apparatus has an ultraviolet ray between a drying chamber D and a substrate feeding / winding chamber A. A cleaning room F is provided. Since the other structure is the same as that of the first embodiment, the same reference numerals are given and the description thereof is omitted.

An ultraviolet lamp 5 is provided in the ultraviolet cleaning chamber F.
1a, 51b, 52a, 52b are arranged at a predetermined distance from each other, and the substrate K from the substrate inlet (drying chamber outlet) 55 is guided by the guide rolls 91k, 91l to the ultraviolet lamps 51a, 51b, 52a, 52b. After passing through the space, the substrate is discharged from the substrate outlet 45 into the substrate feeding and winding chamber A. In addition, 53 is an exhaust port and 54 is an exhaust pipe.

The substrate K introduced into the ultraviolet cleaning chamber F passes between the ultraviolet lamps 51a, 51b, 52a and 52b, and the organic substances attached to the electrodes on the substrate surface are removed by the ultraviolet rays and the ozone generated by the ultraviolet rays. , Discharged from the substrate outlet 45 into the substrate feeding and winding chamber A, and the static eliminator 1
The electricity is removed at 6, and the roll 17 is wound up and collected. The ultraviolet lamp illuminates the substrate electrode side. In this case, clean air is always supplied to the ultraviolet cleaning chamber F through the air filter 93, and decomposed gas, unreacted ozone and the like are discharged from the exhaust port 53 to the outside of the system through the exhaust pipe 54. It is also possible to introduce ozone generated by an ozone generator or the like into the ultraviolet cleaning chamber F from the outside to enhance the cleaning power.

As described above, according to the method and apparatus for cleaning a substrate of the above-described embodiment, the substrate is unwound from the unrolling roll formed by winding the long flexible substrate, and while it is wound on the winding roll. By performing the cleaning process, the cleaning process can be continuously performed from one end to the other end of the long substrate under the same condition. Moreover, by combining brush cleaning and ultrasonic cleaning, foreign matter that has been eroded into the substrate that cannot be removed by ultrasonic cleaning or the like is removed by the contact force of the brush,
The foreign matter that cannot be removed by the brush and that has entered the fine pores can be washed out into the cleaning liquid by ultrasonic cleaning, and it is possible to perform high-level cleaning that has not been achieved by conventional techniques. Furthermore, by performing ultrasonic cleaning after performing ultrasonic cleaning, organic substances on the substrate surface can be removed to a higher degree. Therefore, even with a very long continuous plastic substrate, uniform and good cleaning can be efficiently performed, and a uniformly and completely cleaned flexible substrate can be efficiently and stably obtained. it can.

The substrate cleaning method and the substrate cleaning apparatus of the present invention are not limited to the above-described embodiments, and for example, the shapes of the nozzles and the cleaning brush can be changed as appropriate, and other configurations are possible. Also, various modifications may be made without departing from the gist of the present invention. Further, the substrate cleaning method and the substrate cleaning apparatus of the present invention is preferably adopted when cleaning the substrate of the liquid crystal display, but in addition, for cleaning various electronic substrates such as touch panels and electroluminescence. It can be preferably used.

[0041]

As explained above, according to the method and apparatus for cleaning a substrate of the present invention, even a very long continuous plastic substrate can be uniformly and efficiently cleaned. Thus, a flexible substrate that has been uniformly and completely cleaned can be efficiently and stably obtained.

[Brief description of drawings]

FIG. 1 is a schematic view showing a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a substrate cleaning apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 11 ... Delivery roll 17 ... Winding roll 91a to 91l ... Guide roll 21, 23, 26 ... Wash water jet nozzle 30 ... Ultrasonic washing tank 41a, 41b ... Air nozzle 42a, 42b ... Hot air jet nozzle 51a, 51b, 52a, 52b ... Ultraviolet lamp A ... Substrate feeding / winding room B ... Brush cleaning room C ... Ultrasonic cleaning room D ... Drying room E ... Cleaning room control panel F ... Ultraviolet cleaning room B, C, D, F ... Cleaning processing area

Claims (4)

[Claims] 1. A flexible long substrate having an electrode on at least one surface is wound into a roll to form a pay-out roll, and the substrate is sent from the pay-out roll and taken up by a take-up roll. In addition, after the cleaning treatment is continuously brush-cleaned from one end side to the other end side of the substrate, ultrasonic cleaning is continuously performed from one end side to the other end side of the substrate. .. 2. The method for cleaning a substrate according to claim 1, wherein ultraviolet cleaning is performed after ultrasonic cleaning. 3. A substrate transfer mechanism which has an electrode on at least one surface and which is flexible and is sent out from a delivery roll, passes through a cleaning processing region, and is wound and collected by a winding roll. A brush cleaning device that is installed in the processing area and brushes the substrate surface to remove solid dirt on the substrate surface, and a brush cleaning device that is installed in the cleaning processing area behind the brush cleaning device.
An apparatus for cleaning a substrate, comprising: an ultrasonic cleaning device for immersing a substrate in a cleaning liquid and generating ultrasonic vibration to remove dirt. 4. The ultraviolet cleaning device according to claim 3, further comprising, behind the ultrasonic cleaning device in the cleaning processing region, an ultraviolet cleaning device for irradiating the substrate with ultraviolet rays in an atmosphere containing oxygen or ozone to remove organic substances on the surface of the substrate. Substrate cleaning equipment.