JPH05293438A - Adhesive coating method - Google Patents

Abstract

PURPOSE:To keep the coating position of an adhesive constant by placing a member to be bonded on the coating jig arranged at a standby position to feed the same up to the coating position and stopping the member to be bonded at the coating position to coat the predetermined position thereof with the adhesive. CONSTITUTION:In coating a heater board 102 being a member to be bonded with an adhesive 80, at first, the heater board 102 is placed on the coating jig 402 arranged at a standby position and the coating jig 402 is transferred from the standby position to the coating position of an adhesive coating station 400 by a reciprocally moving mechanism 404. Then, the coating jig 402 is stopped at the coating position by a stopper pin 414 to be positioned by positioning pins 416a, 416b and the adhesive 80 is applied to the predetermined position of the heater board 102 on the coating jig 402 stopped at the coating position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive application method for applying an adhesive onto a member to be adhered.

[0002]

2. Description of the Related Art In recent years, when ink is ejected to print on a paper, a printing head for heating the ink to form bubbles, which is a so-called bubble jet method, is advantageous in improving printing accuracy. Therefore, it has been developed and put into practical use. In an assembling apparatus for assembling such a bubble jet type printing head, a heater for heating the ink and an ejection port for ejecting the foamed ink heated and boiled by the heater toward the paper, It must be accurately positioned on the order of microns. For example, the printing accuracy is about 360 dpi (dotts per
In order to achieve high precision of inch), 64 discharge holes must be arranged at equal intervals in a range of about 4.5 mm.
The arrangement pitch at this time is as fine as about 70 microns.

Here, the formation of the discharge holes at such an extremely small interval is allowed in the orifice plate attached to the front surface of the top plate member by using an ultra-precision processing device such as a laser processing machine. It is possible to form the discharge holes with a predetermined high precision, and when forming the heater, by using ultra-precision etching technology, similarly, it is possible to form a discharge hole on the heater board with a predetermined high precision. , A heater can be formed.

[0004]

Here, in the conventional assembling apparatus, the heater on the heater board and the discharge hole formed on the orifice plate are accurately aligned with their axes. Although the top plate is bonded on top, when applying the adhesive on the heater board,
While visually observing the heater board with a magnifying glass, the x mark attached to the application target position is targeted, and the tip of the ejection needle of the dispenser is applied to this to supply the adhesive.

However, in the prior art, since the worker manually and the adhesive application work relying on the visual inspection in this way, the tip of the ejection needle is displaced and comes into contact with the wiring pattern near the target mark. There is a risk that it will be soiled. In particular, when the wire bonding near the target mark is touched, this wire may be cut. Further, since the dispenser is manually operated, there is a problem that the application position and the application amount of the adhesive are not constant. In particular, if the adhesive application position or application amount is unbalanced, the adhesive state may change due to the difference in shrinkage amount when the adhesive is solidified. Further, when the adhesive is applied near the ink flow path on the top plate, the adhesive may penetrate into the ink flow path and block the ink ejection port (nozzle hole). The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an adhesive coating method capable of maintaining a constant coating position of the adhesive.

[0006]

In order to achieve the above-mentioned object, an adhesive applying method according to the present invention is an adhesive applying method of applying an adhesive onto a member to be adhered, wherein the member to be adhered is on standby. A placement step of placing the coating jig on the coating jig at a position, a transport step of transporting the coating jig from a standby position to a coating position, and a positioning step of stopping and positioning the coating jig at the coating position, It is characterized by comprising an applying step of applying an adhesive to a predetermined position of a member to be adhered on an applying jig stopped at the applying position.

Further, in the adhesive applying method according to the present invention, in the applying step, the adhesive is applied to the tip of at least one transfer element at an adhesive transfer station defined at a position apart from the applying position. And an adhering sub-step of moving the transfer member from a transfer position to a coating position, and bringing the transfer member into contact with a predetermined position of the adhered member from above so that the adhesive adhered to the tip is moved to the predetermined position. And a transfer sub-process for transferring.

[0008]

EXAMPLES The construction of an example of the adhesive coating method according to the present invention will be described below. (Description of Ink Jet Cartridge 200 and Head Nozzle 100) First, an ink jet cartridge 20 equipped with a head nozzle 100 assembled by an assembling apparatus 10 to which the adhesive application method according to the present invention is applied.
A schematic configuration of 0 will be described with reference to FIGS.

This ink jet cartridge 200
As shown in FIG. 1, it is generally configured by an ink tank 202 and a head nozzle 100. Further, the head nozzle 100 includes a heater board 102 having a heater 112 for heating ink, as shown in FIGS.
Positioned on the heater board 102, a partition for partitioning a plurality of ink flow paths, a common liquid chamber for distributing ink to each ink flow path, and a cylindrical shape for supplying ink to the common liquid chamber The top plate 104 having the ink receiving ports 118 and the like, and the orifice plate 108 integrally attached to the front surface of the top plate 104 and having a plurality of ejection ports 106 corresponding to the respective ink flow paths. In addition, in this one embodiment, these discharge ports 1
Nos. 06 are arranged at equal intervals over a length of about 4.5 mm, and due to the arrangement of these intervals, the print density of the head nozzle 100 is as high as about 360 dpi (dotts per inch).

(Description of Assembly Device 10) The assembly device 10 for the head nozzle 100, which is a feature of the present invention, that is, the assembly for assembling the grooved top plate 104 on the heater board 102 in a correctly positioned state is described below. The configuration of the device 10 and the assembling method will be described in detail with reference to FIG.

<Description of Overall Structure of Assembly Device 10> As shown in FIG. 4, this assembly device 10 has a surface plate 12 whose mounting posture is accurately positioned in a horizontal state on a base (not shown).
Is equipped with. The assembling device 10 is mounted on the surface plate 12.
The grooved top plate 104 (hereinafter simply referred to as a top plate), to which the orifice plate 108 is attached in advance, which is one of the components of the head nozzle 100 assembled in step 1, is stipulated so that its attachment position is adjustable. Position adjusting mechanism 14 and the other component, the heater board 102 fixed in advance to the upper surface of the front end of the base member 208 in a state of being accurately positioned. 2 position adjusting mechanism 16 is provided.

The first position adjusting mechanism 14 includes a surface plate 12
A first x-axis stage 18 that is directly placed on the first surface and is movable along the x-axis direction (a direction perpendicular to the paper surface) with respect to the surface plate 12, and is placed on the first x-axis stage 18. The first z-axis stage 20 is movable along the z-axis direction (vertical direction in the drawing) with respect to the first x-axis stage 18, and is mounted on the first z-axis stage 20. , A first y-axis stage 22 movable along the y-axis direction (left and right direction in the drawing) with respect to the first z-axis stage 20, and a spacer 24 on the first y-axis stage 22. A base end portion is placed via the mounting mechanism 26, and the top plate 104 is detachably attached to the front end portion, and the mounting mechanism 2
6 and a first positioning mechanism 27 for performing positioning of the grooved top plate 104 placed on the heater board 102 with respect to the heater board 102. The configurations of the attachment mechanism 26 and the first positioning mechanism 27 will be described later in detail.

On the other hand, the second position adjusting mechanism 16 includes the surface plate 1
A second x-axis stage 28, which is directly mounted on the second unit adjacent to the first position adjusting mechanism 14 and is movable in the x-axis direction with respect to the surface plate 12; Two
Mounted on the x-axis stage 28 of the second and movable along the z-axis direction described above with respect to the second x-axis stage 28.
Z-axis stage 30 and a second y-axis stage 32 mounted on the second z-axis stage 30 and movable along the y-axis direction described above with respect to the second z-axis stage 30.
And a base member 208 disposed on the second y-axis stage 32 and to which the heater board 102 is attached and fixed.
A second positioning mechanism 33 that fixes the second y-axis stage 32 in a state of being accurately positioned with respect to the second y-axis stage 32,
It is composed of a joining force generating mechanism 34 for joining the top plate 104 to the heater board 102 with a predetermined joining force. The second positioning mechanism 33 and the joining force generating mechanism 34
The configurations of and will be described later in detail.

Here, each axis stage 18, 20, 22;
Although not shown, 28, 30, and 32 are each provided with a drive motor, and these drive motors correspond to the corresponding drivers 36a, 36b, 36c, 36d, 36e, 36f.
Are connected to a control unit 38 which controls the overall control. Under the control of the control unit 38, these drive motors are driven by the first position adjusting mechanism 14
In the above, the top plate 104 is placed at a predetermined position above the heater board 102, and the second position adjusting mechanism 16
In the above, the heater boards 102 are driven and controlled so that they are respectively positioned so as to come to a predetermined position with respect to the surface plate 12.

On the other hand, the control unit 38 is provided on the top plate 10.
Although it is necessary to accurately detect the position of the top plate 4 in order to accurately position it, the first position detection mechanism 40 that accurately detects the position of the top plate 104 based on the image of the top plate 104.
However, it is necessary to accurately detect the position of the heater board 102 in order to accurately position the heater board 102. However, a second position detection mechanism that accurately detects the position of the heater board 102 based on an image captured by the heater board 102. 42 are both connected to the control unit 38 via the image processing device 44.

Here, the first position detecting mechanism 40 is
The first objective lens 40a and the first objective lens 40a are arranged in front of the orifice plate 108 of the grooved top plate 104 which is accurately gripped at the tip thereof by the mounting mechanism 26 which will be described later in detail. First holding lens 40a
Objective lens holder 40b and first epi-illumination device 40
c and the first light source 4 for this first epi-illuminator 40c
0d, a first optical system 40e that determines the in-focus state, a first lens barrel 40f that houses these optical devices, and an image of the orifice plate 108 observed through the first objective lens 40a. It is composed of a first ITV camera 40g which is projected.

The image information of the first ITV camera 40g is sent to the above-mentioned image processing device 44 via the first signal converter 46. The first focus determination optical system 40e is connected to the control unit 38 via the first focus state detector 48. Here, the first position detection mechanism 40 is attached / fixed to the above-described surface plate 12 via a first support post (not shown).

The second position detecting mechanism 42 described above is also used.
Is disposed above the heater board 102 accurately placed on the second y-axis stage 32 by the second positioning mechanism 33, which will be described in detail later, and includes the second objective lens 42a and The second objective lens holder 42b that holds the second objective lens 42a, the second epi-illumination device 42c, the second light source 42d for the second epi-illumination device 42c, and the focus state are determined. Second optical system 42e
And a second lens barrel 42f for housing these optical devices,
The second ITV camera 42g projects an image of the heater board 102 observed through the second objective lens 42a.

The image information of the second ITV camera 42g is sent to the above-mentioned image processing device 44 via the second signal converter 50. The second focusing optical system 42e is connected to the control unit 38 via the second focusing state detector 52. Here, the second position detecting mechanism 42 is attached / fixed to the above-described surface plate 12 via a second support (not shown).

Here, in this embodiment, the optical axis of the first objective lens 40a in the first position detecting mechanism 40 and the optical axis of the second objective lens 42a in the second position detecting mechanism 42 are set. The assembly work position α is defined at the intersection of the positions. At this assembly work position α,
It is preferable that the two optical axes described above intersect correctly, but even if they do not actually intersect, there is practically no problem by executing the calibration operation described later.
Actually, it is extremely difficult to perform an operation for aligning the two optical axes so as to correctly intersect the two optical axes, and it is premised that they do not intersect as in this embodiment. The deviation amount Δx is calculated by the calibration operation, and the calculated deviation amount Δx is numerically taken into consideration in the position adjusting operation in the first and second position adjusting mechanisms 14 and 16 to obtain the deviation amount Δx substantially. You can ignore it. The calibration operation for calculating the deviation amount Δx will be described in detail later.

On the other hand, the assembling apparatus 10 has a discharge port 106.
The heater board 102 and the top plate 104 after the corresponding discharge heaters 112 are matched with each other are adhered to each other via an ultraviolet curable adhesive so that the relative positional relationship between the two does not change. Therefore, in other words, the temporary attachment mechanism 54 is provided to temporarily fix the two. The temporary attachment mechanism 54 is located on both sides of the tip end portion of the attachment mechanism 26, and each tip end is connected to the pair of light guides 56 directed to the adhesive placement site and the base end portions of both light guides 56. And an ultraviolet light source 58 that emits ultraviolet light.

Then, the image processing device 44 described above uses the orifice plate based on the image information obtained from the first and second ITV cameras 40g and 42g through the first and second signal converters 46 and 50. The formation position of the ejection port 106 formed in 108 and the arrangement position of the ejection heater 112 arranged on the heater board 102 are calculated, and the calculation result is sent to the control unit 38. . Further, the image processing device 44 includes an ITV monitor 64 for confirming a measurement image, a keyboard 62 for inputting a device adjustment program and data, and a CRT monitor 6 for displaying data.
6 is connected, and the man-machine interface is established.

The above-mentioned control unit 38 has the first
And the second focus state detectors 48 and 52, and the data input from the image processing device 44 is calculated by a predetermined algorithm, and based on the calculation result, via the respective stage drivers 36a to 36f, The corresponding axis stages 18, 20, 22, 28, 30, 32 are appropriately drive-controlled to adjust the relative positions of the top plate 104 and the heater board 102 so that the ejection openings 106 and the corresponding ejection heaters 112 are mutually arranged. To match and after this match,
The temporary attachment mechanism 54 is activated, the ultraviolet light source 58 is activated, and a control operation for curing the adhesive agent interposed between the heater board 102 and the top plate 104 is executed.

The control unit 38 has an operation panel 66 for operating the assembling apparatus 10, a keyboard 68 for setting / changing an operation program, a CRT monitor 70 for displaying data, and a printer for recording data. 72, a data disk 74 for storing data, and a program disk 76 in which an operation program is stored are connected, and a man-machine interface is established.

<Description of Attachment Mechanism 26> Next, referring to FIG. 5, the attachment mechanism 2 to which the top plate 104 is attached.
The configuration of No. 6 will be described in detail. This attachment mechanism 26
Is a spacer 24 on the first y-axis stage 22 described above.
The main body 26a is attached and fixed via the.
A pair of suction members 26b,
26c are attached in parallel with each other, with a predetermined gap therebetween, and projecting forward (along the y-axis direction). The suction members 26b and 26c are made of an ultraviolet-transparent material, specifically, Are formed of transparent plate glass.

Suction holes 26d and 26e are opened on the lower surfaces of the suction members 26b and 26c, respectively, and the suction holes 26d and 26e correspond to the suction members 26b and 2, respectively.
The communication pipes 26f and 26g penetrating through the inside of 6c are respectively defined from the end openings of the communication pipes 26f and 26g.
It is selectively connected to a negative pressure generating mechanism and a positive pressure generating mechanism (not shown) via respective switching valves (not shown).

Then, when the switching valve is connected to the negative pressure generating mechanism, the top plate 104 is moved to the suction members 26b and 26 through the suction force generated in the suction holes 26d and 26e.
It is designed to be suction-held on the lower surface of c. On the other hand, in the state where the switching valve is connected to the positive pressure generating mechanism, the air ejected (reverse ejected) from these suction holes 26d and 26e sucks and holds the suction members 26b and 26c. The plate 104 is forcibly pressed by the suction members 26b, 2
It will be pulled downward from 6c.

As described above, the pair of suction members 26b, 2
In the state where the top plate 104 is suction-held on the lower surface of 6c, the cylindrical ink receiving port 118 of the top plate 104 is just the suction member 26.
The attitude between the b and 26c is set, and the orientation plate 108 is set to the front.

<Description of First Positioning Mechanism 27> Also,
The heater board 1 of the top plate 104 released from here and dropped on the heater board 102 is attached to the attachment mechanism 26.
A first positioning mechanism 27 for accurately positioning the position with respect to 02 is provided.

The first positioning mechanism 27 is used for the top plate 10.
4 along the x-axis direction on the heater board 102, that is, the x-axis positioning portion 27A for positioning along the array direction so that the ejection port 106 and the ejection heater 112 corresponding to each other are aligned, and the y-axis. Along the direction, that is, the rear surface of the orifice plate 108 is the heater board 102.
And a y-axis positioning portion 27B for positioning so as to be in close contact with the front end face of the.

<< Explanation of x-axis positioning portion 27A >> First, x
In the shaft positioning portion 27A, on the other hand, in this embodiment, the first suction member 26b on the far side in the drawing is defined as the reference side, and the suction member 26b on the reference side is defined.
Are fixed to the main body 26a. On the other hand, the second suction member 26c on the front side in the drawing has the main body 26a.
On the other hand, it is movably supported along the x-axis direction. In the x-axis positioning portion 27A, the end surfaces of the pair of suction members 26b and 26c facing each other, that is,
The end faces that face each other and define the space in which the cylindrical ink receiving port 118 is inserted are defined as the position regulating faces.

The movable suction member 26c has a continuous member 2 extending to the middle of the main body 26a at the rear portion thereof.
6h are integrally connected. On the other hand, a guide shaft 26i extending along the x-axis direction is attached to the main body 26a. Then, the connecting member 26h is attached to the guide shaft 26i via the slide guide 26j.
It is movably supported along the x-axis direction.

On the other hand, a first drive cylinder (not shown) is mounted on the main body 26a so as to face the intermediate portion of the connecting member 26h. The piston rod of the first drive cylinder protrudes so as to be driven back and forth along the x-axis direction, and the tip of this protrudes from the connecting member 26h described above.
It is connected to the. In this way, the first driving cylinder reciprocally drives the corresponding piston rod at high speed to thereby cause the suction member 2 to be connected continuously via the connecting member 26h.
6c is reciprocally driven at high speed along the x-axis direction, that is, vibrated.

<< Explanation of y-axis positioning section 27B >> Next, y
As shown in FIG. 5, the shaft positioning portion 27B includes a pair of engaging pieces 26m and 26n that can be engaged with the front surface of the orifice plate 108 of the top plate 104 placed on the heater board 102.
Are provided parallel to each other with a gap between them in a state where they stand down from each other. These engaging pieces 26m, 26n are provided corresponding to the pair of suction members 26b, 26c, respectively, and are arranged so as to be located outside the corresponding end faces for position regulation. In addition, these engagement pieces 26m and 26n extend along the upper edges of the front end surfaces of the corresponding suction members 26b and 26c, respectively, of the connection pieces 26p and 26q that extend further outward than their outer ends. The respective upper ends are connected to the respective end portions. The outer ends of these connecting pieces 26p and 26q are y
The front ends of the connecting members 26r and 26s extending along the axial direction are attached.

On the other hand, second drive cylinders 26t extending along the y-axis direction are provided at both ends of the main body 26a. The respective piston rods 26u of the second drive cylinders 26t project so as to be driven back and forth along the y-axis direction, and the tips thereof are connected to the above-mentioned connecting members 26r, 26r.
They are connected to the rear ends of 26s, respectively.

In this way, this second drive cylinder 2
By 6t reciprocatingly driving the corresponding piston rod 26u at high speed, the engaging pieces 26m, 26n connected via the connecting pieces 26p, 26q are reciprocally driven at high speed along the y-axis direction, that is, vibration. As a result, the top plate 104 is positioned along the y-axis direction so that the orifice plate 108 comes into close contact with the front end surface of the heater board 102.

Since the mounting mechanism 26 is configured as described above, the top plate 104 sucked and held by the pair of suction members 26b and 26c reaches the first position adjusting mechanism 14 above the heater board 102. When the suction is released, the top plate 104 drops onto the heater board 102, and at the dropped position,
The position of the top plate 104 along the x axis with respect to the heater board 102 is defined by the operation of the x axis positioning portion 26A.
Further, the operation of the y-axis positioning portion 26B defines the position along the y-axis with respect to the heater board 102. The position adjusting operation of the mounting mechanism 26 will be described later in detail.

<Description of Second Positioning Mechanism 33> Next,
Base member 2 to which heater board 102 is attached in advance
A configuration of the second positioning mechanism 33 for mounting the 08 on the second y-axis stage 32 in a correctly positioned state will be described with reference to FIGS. 6 to 8.

Similar to the first positioning mechanism 27 described above, the second positioning mechanism 33 positions the x-axis positioning portion 33A for positioning the base member 208 on the second y-axis stage 32 along the x-axis direction. And a y-axis positioning portion 33B for positioning along the y-axis direction,
Further, a z-axis positioning portion 33C along the z-axis direction is provided.

The base member 208 to be positioned by the second positioning mechanism 33 is shown in FIG.
As is clear from the above, a rectangular main body portion 208a and a heater board mounting portion 208b that projects forward from the center of the front end of the main body portion 208a and has the heater board 102 mounted and fixed to the upper surface thereof are integrally formed. ing.

The heater board 102 is previously attached and fixed to the heater board attaching portion 208b with a predetermined accuracy. Therefore, the base member 208 to which the heater board 102 is attached is
By positioning with respect to the y-axis stage 32, the heater board 102 is positioned with respect to the second y-axis stage 32.

This second positioning mechanism 33 will be described in detail with reference to the second y-axis stage 32 as shown in FIGS. 6 and 7.
A mounting main body 33a mounted on the upper side and formed in a substantially L-shape on the side surface, and a positioning base 33c movably supported on a raised inner side surface of the main body 33a via a slide guide 33b. ..

<Explanation of x-axis positioning portion 33A> As shown in FIG. 6, a pair of x-axis positioning projections 33d, which project upward, are provided on the positioning table 33c as the x-axis positioning portion 33A. , 33e are integrally formed in a state of being arranged along the y-axis direction. The main body portion 2 of the base member 208 is attached to the x-axis positioning protrusions 33d and 33e.
The position of the base member 208 along the x-axis is uniquely defined by abutting one side edge of the 08a along the y-axis,
That is, the x-axis direction is positioned.

On the other hand, as described above, the main body portion 208 of the base member 208 is attached to the x-axis positioning protrusions 33d and 33e.
In order to forcibly contact the one side edge of the a along the y-axis, the one side edge of the base member 208 abutting against the x-axis positioning projections 33d and 33e is abutted against the other side edge. An x-axis regulating lever 33f is arranged so that it is possible. The x-axis restricting lever 33f has its base end pivotally supported about the first supporting shaft 33g so as to be rotatable, and is rotated counterclockwise in the figure by the first torsion spring 33h. Is receiving. The tip of the x-axis regulating lever 33f, which is the abutting end, is set to abut the substantially central portion of the other side edge of the base member 208.

<Explanation of y-axis positioning portion 33B> Further, on the positioning table 33c, as the y-axis positioning portion 33B, one y-axis positioning projection 3 protruding upward is provided.
3i is integrally formed in a state of being close to one x-axis positioning protrusion 33e. This y-axis positioning protrusion 3
3i has a base member 208 whose position in the x-axis direction is defined in advance.
By contacting the tip edge of the main body portion 208a along the x-axis, the position of the base member 208 along the y-axis is uniquely defined, that is, the y-axis direction is positioned.

On the other hand, in order to force the state in which the tip edge of the main body portion 208a of the base member 208 along the x-axis is in contact with the y-axis positioning projection 33i, the y-axis positioning projection 33i is attached to the y-axis positioning projection 33i. A substantially L-shaped y-axis restricting lever 33j is provided so as to be able to abut on a rear end edge of the base member 208 on the opposite side of the abutting end edge. The y-axis restricting lever 33j is pivotally supported at an intermediate portion (that is, a bent portion forming an L-shape) so as to be rotatable around the second support shaft 33k, and
The second torsion spring 33l receives a rotational urging force counterclockwise in the figure. The rear end, which is the contact end of the y-axis regulating lever 33j, is set so as to contact the substantially central portion of the rear end edge of the base member 208.

Here, the positioning table 3 of the base member 208
When attaching / detaching to / from 3c, the x-axis and y-axis regulating lever 33
The biasing force of f and 33j must be released.
Therefore, in this embodiment, the release mechanism 33D is provided. As shown in FIG. 8, the release mechanism 33D includes a release cylinder 33m attached to one side edge of the positioning base 33c, and a release cylinder 33m which projects from the release cylinder 33m so as to be movable back and forth along the x-axis direction. Piston rod 33n penetrating and this piston rod 33
a pair of penetrating holes 33p standing upright in the n direction, and formed in the positioning table 33c so as to extend along the x-axis direction,
33q, respectively, and release pins 33r and 33s that are taken out in a state of slightly protruding from the upper surface of the positioning base 33c and that can come into contact with the x-axis regulating lever 33f and the y-axis regulating lever 33j from the clockwise side, respectively. Has been done.

In the releasing mechanism 33D, the releasing cylinder 33m is in the non-releasing state and the piston rod 3
It is urging to pull in 3n. As a result, the pair of release pins 33r and 33s are separated from the corresponding x-axis regulating lever 33f and y-axis regulating lever 33j, respectively.
Thus, in the non-released state, the x-axis regulating lever 33f and the y-axis regulating lever 33j are rotated counterclockwise by the urging forces of the corresponding torsion springs 33h and 33l, respectively, and the base member is rotated. Position and hold 208.

On the other hand, the releasing cylinder 33m biases the piston rod 33n in the protruding state in the released state. As a result, the pair of release pins 33r and 33s abut the corresponding x-axis regulating lever 33f and y-axis regulating lever 33j, respectively, and make them correspond to the corresponding torsion springs 33.
It is rotated in the clockwise direction against the biasing force of h and 33l. Therefore, the abutting ends of the x-axis restricting lever 33f and the y-axis restricting lever 33j are separated from the other side edge and the rear end edge of the base member 208, respectively, thus positioning and holding the base member 208. Will be released.

<Explanation of the z-axis positioning portion 33C> On the other hand, the z-axis positioning portion 33C described above, as shown in FIG. 7, has the x-axis positioning portion 33C in a state of projecting downward to the lower surface of the tip portion of the base member 208. A pair of first and second protrusions 33t and 33u arranged in parallel along the direction (only the first protrusion 33t is shown in FIG. 7, but in FIG. 6, the first and second protrusions 33t are not shown). , 33u are shown in broken lines.)
And a third protrusion 33 formed in a state of protruding upward at the center of the upper surface of the rear end of the positioning table 33c.
v is formed.

Here, the first to third protrusions 33t
The protrusion lengths of up to 33 v are accurately specified in advance so as to be the same as each other. As a result, the first and second protrusions 3
Since 3t and 33u abut on the upper surface of the positioning table 33c and the third protrusion 33v abuts on the lower surface of the base member 208, the position of the base member 208 on the positioning table 33c in the z-axis direction can be accurately determined. It will be prescribed.

In this embodiment, a suction mechanism 33E for sucking the base member 208 toward the positioning table 33c is provided in order to surely achieve the above-mentioned contact state. As shown in FIG. 7, the suction mechanism 33E is a ring-shaped suction pad 33w provided on the positioning table 33c and having an upper surface opened, and the suction pad 33w.
To connect a suction source (not shown) to the positioning table 33c.
The connecting pipe 33x is formed so as to penetrate the inside.

Here, the height of the suction pad 33w is set slightly higher than the height of each of the three protrusions 33t, 33u, 33v described above. As a result, the base member 2
With the 08 mounted on the positioning table 33c, the open edge of the suction pad 33w is in close contact with the lower surface of the base member 208 over the entire circumference. Then, when a suction source (not shown) is activated, the base member 208 is forcibly attracted toward the positioning table 33c, and as a result, the first and second protrusions 33t and 33u are securely attached to the upper surface of the positioning table 33c. The state in which the third protrusion 33v abuts on the lower surface of the base member 208 is forcibly set.

By thus constructing the second positioning mechanism 33, the base member 208 on the positioning table 33c can be accurately positioned along the x-axis direction, the y-axis direction, and the z-axis direction. Will be positioned in. As a result, in this embodiment, when the top plate 104 is attached to the heater board 102, only the relative position of the top plate 104 with respect to the heater board 102 should be defined via the first positioning mechanism 27. It will be good.

<Description of Bonding Force Generating Mechanism 34> Next, when the top plate 104 is positioned and placed on the heater board 102, a bonding force generating mechanism 34 for generating a bonding force between the two is produced.
Will be described with reference to FIG. 7.

The joining force generating mechanism 34 is provided with a guide shaft 34a attached to the tip of the above-mentioned main body 33a so as to vertically pass therethrough, and the upper end of the guide shaft 34a is attached to the lower surface of the positioning table 33c. It is fixed. A washer 34b for adjusting the joining force is screwed onto the upper end of the guide shaft 34a. By rotating the washer 34b, the axial position of the washer 34b with respect to the guide shaft 34a is changed. .

On the other hand, a coil spring 34c for generating a joining force is wound around the outer periphery of the guide shaft 34a. The upper end of the coil spring 34c is locked to the lower surface of the washer 34b, and the lower end is Body 33a
Is locked to the upper surface of. Here, the coil spring 34c bears the weight of the positioning table 33c and the parts mounted on the positioning table 33c, and contracts to a certain extent. An elastic repulsive force is generated, and this elastic repulsive force is defined as the joining force.

Since the joining force generating mechanism 34 is constructed as described above, when the top plate 104 is placed on the heater board 102, the positioning table 33c on which the heater board 102 is positioned and placed is as described above. By pressing the top plate 104 against the heater board 102 so as to descend by a fixed amount, the above-mentioned predetermined joining force is generated between the top plate 104 and the heater board 102. .. In addition, the change of the joining force is performed by the above-mentioned Washer 34.
This is achieved by rotating b and biasing it along the axial direction of the guide shaft 34a to change the initially set length of the coil spring 34c.

<Explanation of Calibration Chart 78> Here, as shown in FIG. 9, on the positioning table 33c of the above-mentioned second positioning mechanism 33, there is a calibration chart 78 used in a calibration operation which will be described in detail later. It is fixed.
The calibration chart 78 has a base member 208 accurately positioned at a predetermined position by the second positioning mechanism 33.
It is accurately arranged at a position separated from the upper heater board 102 by a predetermined distance along the x-axis, and is formed in a rectangular parallelepiped shape.

In particular, the formation state is such that the first calibration surface 78a is defined from the front end surface of the rectangular parallelepiped calibration chart 78, and the first calibration surface 78a is accurately perpendicular to the x-axis direction. It is set to extend and extend in the same vertical plane as the front end face of the heater board 102.
Further, a second calibration surface 78b is defined from the upper surface of the rectangular parallelepiped calibration chart 78, and the second calibration surface 78b is defined.
Are set to extend exactly horizontally along the z-axis direction and to extend in the same horizontal plane as the upper surface of the heater board 102. Furthermore, a third calibration surface 78c is defined from the side surface of the rectangular parallelepiped calibration chart 78 on the side where the heater board 102 is disposed. The third calibration surface 78c is defined.
c is set to extend vertically exactly along the y-axis direction.

Here, the first to third calibration surfaces 78a to 7
A calibration reference point 78d is defined by the intersection of 8c. As a result, when the calibration chart 78 is photographed by the first position detecting mechanism 40, only the first calibration surface 78a is photographed and the calibration reference point 78 is photographed, as shown in FIG.
d is photographed as an intersection of the corners located in the upper right portion of the screen 40A, and when photographed by the second position detecting mechanism 42, only the second calibration surface 78b is taken as shown in FIG. This calibration reference point 78d is captured as an intersection of the corners located in the lower right part of the screen 42A.

In FIG. 9 illustrating the calibration chart 78, reference numerals 80a and 80b denote adhesives for temporarily attaching the top plate 104 and the heater board 102 to each other. These adhesives 80a and 80b are formed so as to have an ultraviolet curability that is cured by being irradiated with ultraviolet rays, and as shown in the figure, they are preliminarily attached to both ends of the rear end edge of the heater board 102, respectively. Is set.

(Head nozzle 10 in assembly device 10)
Description of assembly method 0) Hereinafter, referring to FIG.
The control unit 3 in the assembling apparatus 10 having the above-mentioned configuration
A method of assembling the head nozzle 100 under the control of No. 8 will be described in detail.

<Schematic Procedure of Assembling Method> First, the schematic procedure of the assembling method will be described with reference to the flow chart shown in FIG. First, when the assembling operation is instructed, the variable N indicating the number of assembling is set to "1" in step S10. Then, in step S12, the initialization of the drive motors of the respective axis stages 18, 20, 22, 28, 30, 32 is executed, and subsequently in step S14, the respective axis stages 18, 20, 22, 28, 30, 32 are executed.
Perform home search for the drive motor of. These steps S
12 and step S14, the respective axis stages 18, 20, 22, 28, 30, 32 are moved to the surface plate 12
It will be possible to move accurately to any position specified for.

After that, in step S16, the above-mentioned calibration chart 78 is used for calculating in advance the deviation amount between the detection positions of the first and second position detecting mechanisms 40 and 42 as the calibration amount Δx. The calibration operation is performed to calibrate the deviation between the detection positions of the first and second position detecting mechanisms 40 and 42. The calibration operation constitutes one of the features of the present invention, and will be described in detail later as a subroutine. When the calibration operation in step S16 is completed, the variable N is reset to "1" in step S18, and the process proceeds to step S20.

In this step S20, an adhesive is applied to a predetermined position on the heater board 102 through a supply robot (not shown) on the base member 208 to which the heater board 102 is attached in advance, and a second position from the supply position is set. It is supplied onto the second positioning mechanism 33 of the position adjusting mechanism 16. Then, in the subsequent step S22, the supplied base member 208 is accurately positioned.

In this positioning operation, the main body 3 is operated based on the operation of the second positioning mechanism 33 described above.
The discharge heaters 112a to 112a on the heater board 102 are operated together with the operation of performing positioning in the three axis directions with respect to 3a.
The discharge heater 1 located in the center of the reference 2e.
The operation of accurately measuring the deviation amount (x _h ) of the 12c from the assembly work position α in the x-axis direction which is the arrangement direction of these discharge heaters 112a to 112e, and this deviation amount measurement is the second operation. Since it is performed based on the image photographed by the ITV camera 42g, in order to accurately focus the image, an accurate alignment operation in the z-axis direction with respect to the assembly work position α on the upper surface of the heater board 102 is included.

The supply operation and the positioning operation of the base member 208, that is, the heater board 102 will be described in detail later as a subroutine. Subsequent to the supply and the positioning operation of the heater board 102, in step S24, the top plate 104 is moved from the storage position to the first position of the first position adjusting mechanism 14 via a supply robot (not shown).
To the positioning mechanism 27. Then, in the subsequent step S26, the supplied top plate 104 is temporarily placed on the heater board 102 on the base member 208 which has been positioned in advance via the second positioning mechanism 33 in step S22. The supply operation and the temporary placement operation of the top plate 104 will be described later as subroutines.

The heater board 1 to be assembled in this way
02 and the top plate 104 are both supplied, and the top plate 104 is temporarily placed on the positioned heater board 102, in step S28, the relative positional relationship along the x-axis direction is accurately defined, In step S30, the bonding operation (temporary bonding operation) between the two is performed. Then, when this bonding operation is completed, in step S31, the top plate 104 is inserted via the fixing spring member 122 described above.
The fixing operation for firmly fixing the heater to the heater board 102 is executed. After that, in step S32, a discharging operation of discharging the assembly as a finished product to the finished product discharging position via a robot not shown is executed. This x
The details of the axial alignment operation, the bonding operation, the fixing operation, and the discharging operation will be described later as subroutines.

Then, in step S34, it is judged whether or not all the assembling operations have been completed and all the finished product discharging operations have been completed.
If it is judged to be O, that is, if it is judged that the assembling operation is not completed yet and the assembling operation is being performed, the process proceeds to step S36, where the variable N is incremented by "1", and at step S38. , It is determined whether the variable N has reached a predetermined number. In this step S38, N
When it is determined to be O, that is, when the assembly execution number N is determined to be less than the predetermined number of times, specifically, it is determined to be less than the predetermined number of times after executing the earliest calibration operation. In this case, it is determined that the reliability of the previously calculated calibration amount Δx is still maintained. Therefore, in order to execute the assembly operation without newly executing the calibration operation, the process returns to step S20 described above, The following assembly control procedure is repeatedly executed.

On the other hand, if YES in step S38, that is, if it is determined that the number N of assembly executions is the predetermined number of times since the earliest calibration operation was executed, it is judged that the temperature change has occurred. Based on environmental changes, the above-mentioned calibration amount Δ
There is a possibility that x has changed, the calibration operation is executed again, and in order to newly calculate this calibration amount Δx, the process returns to step S16 described above, and the assembly control procedure thereafter is repeatedly executed.

That is, when the assembling accuracy is on the order of millimeters, no problem will occur even if the above-described calibration operation is first performed and the obtained calibration amount Δx is used throughout the entire working period of one day. As in the case of this embodiment, when the assembly accuracy is required to have a micron order, the change in the calibration amount Δx due to the temperature change described above greatly affects the assembly accuracy. On the other hand, in view of the above-mentioned circumstances, it is preferable to execute this calibration operation every one assembly operation. However, if the calibration operation is performed for each single assembly operation as described above, the assembly time becomes long, the assembly efficiency is reduced, and the product cost is adversely affected. In this way, in order to maintain both the assembly system and the assembly efficiency, in this embodiment, the calibration operation is set to be re-executed after every predetermined assembly operation.

Here, after the calibration operation is executed in step S16, the variable N is reset to "1" in step S18. Therefore, the number of times of assembling in this assembling operation is counted again as the first time and continues. In the assembling operation, the number of times of assembling is incremented by "1". In addition, the above-mentioned step S34
If it is determined to be YES, that is, if it is determined that all assembling operations have been completed and all finished product discharging operations have been completed, this assembly control procedure is completed at this point.

The individual control procedures outlined in the above-mentioned assembly control procedure will be described in detail below as subroutines, but in reality, as already described above, 360 dp
In order to achieve high-density printing accuracy of i, a top plate 104 integrally provided with an orifice plate 108 in which a large number of ejection openings 106 are formed at equal intervals in a length of about 4.5 mm.
At least 64 discharge ports 106 and discharge heaters 112 are mounted on the heater board 102 on which 68 discharge heaters 112 are formed at a similar arrangement pitch in a corresponding state. An extremely accurate positioning operation and a delicate joining force addition operation are required.

However, in the following description of the assembly control procedure, if 68 discharge ports 106 and a large number of discharge heaters 112 are to be illustrated and described as they are, it will be rather unclear and the description will be omitted. Since it becomes complicated, in the following description, the orientation plate 108 will be used.
As shown in FIG. 13, five discharge ports 106, specifically, first to fifth discharge ports 106 a to 106 e are formed, and five discharge ports 106 are formed on the heater board 102. The heater 112, specifically, the one in which the first to fifth ejection heaters 112a to 112e are formed, will be described in a simplified state.

<Detailed Description of Each Subroutine>
Various subroutines in the assembly control procedure that has been schematically described with reference to FIG. 12 will be described in detail.

<< Explanation of Calibration Operation in Step S16 >> First, FIGS. 14 and 15 and FIG. 10 shown above.
The control procedure of the calibration operation in step S16 described above will now be described with reference to FIG. That is, as shown as a flow chart in FIG. 14, when this calibration operation is started, the second position adjusting mechanism 1 is started in step S16A.
The second x-axis stage 28 of No. 6 is driven, and as shown in FIG.
The first and second position detecting mechanisms 40, 42 are moved until they coincide with the assembly work position α defined by the intersection of the optical axes of the respective objective lenses 40a, 42a.

Then, in step S16B, the first
The calibration chart 78 is photographed from the front by using the first ITV camera 40g of the position detection mechanism 40. Also,
In step S16C, the calibration chart 78 is photographed from above by using the second ITV camera 42g of the second position detection mechanism 42. As a result, the image photographed using the first ITV camera 40g is as shown in FIG. 11 described above, and the image photographed using the second ITV camera 42g is as shown in FIG. 12 described above. Projected.
Therefore, in step S16D, step S16B
The image photographed in step S16E is transmitted to the image processing device 44 via the first signal converter 46, and in step S16E,
The image photographed in step S16C is transmitted to the image processing device 44 via the second signal converter 50.

Then, in step S16F, the first
Based on the image taken through the ITV camera 40g of
The distance x ₁ from the left end of the screen to the calibration reference point 78d is electrically measured, and in step S16G, the distance x ₂ from the left end of the screen to the calibration reference point 78d based on the image taken through the second ITV camera 42g. Is measured electrically. Thereafter, in step S16h, calculates the x ₁ -x _2, the results, define the above-mentioned shift amount (calibration amount) [Delta] x and.

Then, in step S16I, the deviation amount Δx as the calculation result is stored in the memory and the data disk 78 in the control unit 38, and in step S1.
At 6J, the second x-axis stage is moved so that the positioning table 33c on which the calibration chart 78 is placed is returned to the supply position where the base member 208 to which the heater board 102 is previously fixed is supplied. 28 is controlled. In this way, a series of calibration operations is completed and the original main routine is returned to.

In this calibration operation, the first and second ITV cameras 40g and 42g photograph the same calibration reference point 78d of the calibration chart 78, and the left end of the screen up to the same calibration reference point 78d. Since the distances x ₁ and x ₂ from the first objective lens 4 and the second objective lens 4 are determined by Δx defined as the difference between these distances x ₁ and x _2.
The shift amounts of the optical axes of 0a and 42a are obtained.

<< Description of Heater Board Supply Operation in Step S20 >> Next, with reference to the flow charts shown in FIGS. 16 and 17 and FIGS. 18 and 19, the control of the heater board supply operation in step S20 described above is performed. The procedure is explained. The heater board 102 has a predetermined accuracy in advance, as already described many times.
The heater board mounting portion 208b of No. 8 is positioned and fixed. Therefore, supplying the heater board 102 means supplying the base member 208 onto the second positioning mechanism 33.

First, when the heater board supply operation is started, in step S20A, a supply robot (not shown) is operated to grasp and take out the base member 208 to which the heater board 102 is attached in advance from the storage position.
It is conveyed onto the adhesive application jig 402 that is waiting at the standby position in the adhesive application station 400 shown in FIG.
Here, referring to FIG. 18, the adhesive application station 4
The configuration of 00 will be described.

The adhesive coating station 400 is provided with a reciprocating mechanism 404 that reciprocates the adhesive coating jig 402 in one direction between the standby position and the coating position. This reciprocating mechanism 404 is composed of an adhesive application jig 402.
Pair of guide members 406a, 406 for sliding guide
b, a pair of endless belts 408a and 408b that travel so that the upper portions thereof slide on the upper surfaces of the respective guide members 406a and 406b, and both endless belts 408.
The front portions of the a and 408b are wound, and corresponding endless belts 408a and
It is provided with drive pulleys 410a and 410b for driving the 8b to travel.

Since the reciprocating mechanism 404 is configured as described above, the adhesive application jig 402 is reciprocated between the standby position and the application position according to the rotational driving direction of the drive pulleys 410a and 410b. Will be done. The arrival sensor 4 is provided on the side wall of the one guide member 406a in order to detect that the adhesive application jig 402 has arrived at the application position.
12 are provided. The arrival sensor 412 is composed of a proximity sensor.

On the other hand, in order to stop the adhesive application jig 402 at the application position, both endless belts 408a, 40
A stopper pin 414 is fixed between 8b.
When the adhesive applying jig 402 comes into contact with the stopper pin 414, the adhesive applying jig 402 is substantially stopped at the applying position. Further, below the adhesive application jig 402 stopped at this application position, the adhesive application jig 40 is separated from each other along the above-mentioned one direction.
A pair of positioning pins 416a and 416b for accurately positioning 2 at the coating position are provided so as to be vertically movable. Here, the positioning pins 416a and 416b are inserted into the adhesive application jig 402 from below, respectively, so that the positioning holes 418a and 418b for accurately controlling the application position are penetrated in the thickness direction. It is formed in the opened state. That is, in the adhesive application jig 402 which is substantially stopped at the application position by contacting the stopper pin 414 described above, both positioning pins 416a and 416b are inserted into the positioning holes 418a and 418b from below, respectively. It will be stopped in the state of being accurately positioned at the coating position.

Here, a plurality of mounting pins 420 for immovably mounting the base member 208 are planted on the adhesive application jig 402. These mounting pins 420
Are arranged so that at least one is located on each side of the base member 208. Specifically, the base member 2
No. 08 is mounted on the adhesive application jig 402 so that the front end to which the heater board 102 is fixed is positioned forward with respect to the transport direction from the standby position to the application position,
In other words, the base member 208 is reciprocated along the y-axis direction. Then, two mounting pins 420 are arranged so as to abut on one side of the base member 208 along one guide member 406a.

Incidentally, the side of the adhesive application jig 402 brought to the application position is brought into contact with the other side of the base member 208 placed on the adhesive application jig 402, and this is set to one side. A press-contact mechanism 422 is provided for press-contacting the two mounting pins 420 provided correspondingly. This press contact mechanism 422
Is a drive cylinder 424 fixed on the other guide member 406b, a piston rod 426 attached to the drive cylinder 424 so that the piston rod 426 can move forward and backward, and a tip end of the piston rod 426 is pivotally attached to the base member 20.
The pressure member 428 is composed of a spring member rotatably and reciprocally supported between a press-contact position laterally pressed against the other side of 8 and a separated position separated from the other side.

Since the press contact mechanism 422 is constructed in this manner, the drive cylinder 424 is moved to the piston rod 42 while the adhesive application jig 402 is positioned at the application position.
By pushing and driving 6, the pressing member 428 is rotated from the separated position to the pressure contact position, and is pressed by the pressing member 428, so that the base member 208 presses the two mounting pins 420 on one side thereof. Then, the base member 208 is adhered to the adhesive application jig 402 without rattling.
Will be placed in.

On the other hand, this adhesive application station 400
Is adjacent to the reciprocating mechanism 404 described above, and is a transfer corresponding to the above-mentioned coating position along the other direction orthogonal to the above-mentioned one direction (that is, the reciprocating movement direction between the standby position and the coating position). An adhesive transfer mechanism 430 that is movable between the position and the attachment position is provided. Here, the adhesion position is defined as a position for adhering a predetermined amount of adhesive to the tips (lower ends) of the pair of transfer elements 432 provided in the adhesive transfer mechanism 430. The adhesive attached to the tip of the transfer element 432 is transferred to a predetermined position on the upper surface of the heater board 102 fixed to the base member 208 placed on the adhesive application jig 402 brought to the application position. It is defined as the position for doing.

Specifically, the adhesive transfer mechanism 430 is
A pair of upper and lower guide rods 434 extending along the other direction described above, a transfer main body 436 reciprocating along the other direction by the guide rods 434, and the transfer main body 4
A mounting stay 438 fixed to the front of the unit 36 and having a U-shape on the side surface, a pair of left and right upper and lower guide rods 440 attached to the mounting stay 438, and an elevating unit supported by the upper and lower guide rods 440 so as to be vertically movable. The block 442 and the mounting block 444 integrally mounted on the front surface of the elevating block 442 and to which the above-described pair of transfer elements 432 are mounted.

The transfer elements 432 are attached to the lower surface of the attachment block 444 in a state of standing down. The distance between the two transfer elements 432 is set so that the adhesive application position 80a on the heater board 102,
The distance is set to 80b. Further, although not shown, the transfer body 436 and the elevating block 442 are configured to be driven and driven by a drive mechanism in a state along the other direction and the up and down direction, respectively.

Here, with the adhesive transfer mechanism 430 stopped at the adhering position, an adhesive container 446 containing a liquid adhesive 80 is disposed below the attachment block 444. .. Although not shown, the adhesive container 446 is provided with a liquid level holding mechanism that holds the liquid level of the adhesive contained therein constant. As described above, the adhesive 80 is composed of an ultraviolet curable adhesive that is cured by irradiation of ultraviolet rays, that is, exhibits an adhesive force. In other words, in this housed state, the adhesive 80 does not exhibit any adhesiveness and functions only as a liquid.

As described above, the adhesive application station 400
Since it is configured, as described above, step S20
In A, when the base member 208 is conveyed onto the adhesive application jig 402 at the standby position, the subsequent step S
In 20B, the reciprocating mechanism 404 is activated, the drive pulleys 410a and 410b are rotationally driven, and the adhesive application jig 402 is conveyed from the standby position to the application position in accordance with the running of the endless belts 408a and 408b. It As a result, the conveyed adhesive application jig 402 contacts the stopper pin 414 and stops at the approximate application position.

Then, in step S20C, the arrival sensor 412 is awaited to be turned on, and this step S2
When it is determined that the arrival sensor 412 is turned on at 0C, a pair of positioning pins 41 are set at step S20D.
6a and 416b are lifted, and the adhesive application jig 402
The corresponding positioning holes 418a and 418b are inserted from below. Then, in step S20E, the driving of the reciprocating mechanism 404 is stopped. In this way, the adhesive application jig 402 is accurately positioned here while stopped at the application position.

Then, in step S20F, the pressure contact mechanism 422 is activated to push out the pressing member 428 to drive the base member 208 to one side. In this way
The base member 208 is placed on the adhesive application jig 402 without rattling. And step S
At 20G, a deviation completion signal is output and step S
Wait for the output of the coating completion signal at 20H.

On the other hand, in parallel with the activation of the reciprocating mechanism 404 in step S20A described above, step S20 is performed.
I is executed. In this step S20I, the adhesive transfer mechanism 430 is activated, the elevating block 442 is lowered, and the tips (lower ends) of the pair of transfer elements 432 are moved by a predetermined amount into the adhesive contained in the adhesive container 446. Immersed. Here, the height of the liquid surface is always constant by the liquid surface holding mechanism described above. Therefore, the pair of transfer elements 43
The amount of adhesive that adheres to the tip of No. 2 is always constant.

After this, in step S20J, the elevating block 442 is raised, and in step S20K.
At, the transfer body 436 is moved from the attachment position to the transfer position. After that, in step S20L, the fact that the transfer main body 436 is brought into the transfer position is detected by this detection operation, and subsequently, in step S20M, the above-mentioned biasing is performed. Wait for completion signal output. When it is detected that the deviation completion signal is output, in step S20N, the elevating block 442 is lowered to push down the transfer element 432 having the adhesive at the tip (lower end) thereof, and stop at the coating position. The tip (bottom end) of the transfer element 432 is brought into contact with a predetermined portion on the heater board 102, and the adhesive adhered thereto is transferred onto the heater board 102. In this manner, the adhesives 80a and 80b are accurately positioned at predetermined positions on the heater board 102, and
The transfer amount is applied in a state where the transfer amount is accurately specified.

After that, in step S20P, the elevating block 442 is raised, and in step S20Q, a coating completion signal is output. And step S20
At R, the transfer main body 436 is moved back to the attachment position from the transfer position, and the control procedure in the adhesive transfer mechanism 430 ends.

On the other hand, in the reciprocating mechanism 404 described above, the state of waiting for the output of the coating completion signal in step S20H described above is canceled by the output of the coating completion signal in step S20Q described above, and the positioning is performed in step S20S. The pins 416a and 416b are pulled down,
The adhesive application jig 402 is made movable. And
In step S20T, the pressure contact state by the pressure contact mechanism 422 is released, and in step S20U, the drive pulleys 410a and 410b rotate in the opposite directions, and the adhesive application jig 402 is moved back from the application position to the standby position.

Thereafter, in step S20V, the heater board 102 coated with the adhesive 80a, 80b.
The base member 208 to which is attached is gripped by the supply robot, and in step S20W, the base member 208 is conveyed onto the second positioning mechanism 33 via this supply robot, and in step S20X, the base member 208 by the conveyance robot. Then, the base member 208 is placed on the second positioning mechanism 33. still,
As shown in FIG. 18, the standby position of the second positioning mechanism 33 is defined by the position shown in the drawing, which is separated from the above-described assembly work position α by a predetermined distance along the x-axis direction. In this way, the heater board supply operation involving a series of adhesive application operations is ended, and the control procedure returns to the original main routine.

<< Explanation of Positioning Operation of Heater Board in Step S22 >> Next, referring to the flow chart shown in FIG. 20, FIG. 21, and FIGS. 7 to 9 described above,
The positioning operation of the heater board 102 in step S22 will be described.

First, the second positioning mechanism 33 for positioning the heater board 102 is placed in the standby state before the heater board 102 is conveyed.
Since the release mechanism 33D shown in FIG. 9 is activated and the release cylinder 33m is driven so as to push out the corresponding piston rod 33n, the release pins 33r and 33s on this piston rod 33n are respectively connected to the x-axis regulating levers 33f and y. The shaft restricting levers 33j are engaged with each other and are moved to a position where they are largely separated from the base member 208, that is, a separated position.

When the positioning operation is started in the state where the second positioning mechanism 33 is set in the standby state in this way, in step S22A, the driving of the release cylinder 33m is released. As a result, the corresponding piston rod 33n moves so as to be drawn inward by the urging force of the built-in return spring (not shown). Therefore,
Release pins 33r and 33s on the piston rod 33n
Are x-axis regulating lever 33f and y-axis regulating lever 33j, respectively.
Will be separated from.

In this way, the base member 208 is x
Since the shaft restricting lever 33f is biased to rotate counterclockwise by the biasing force of the first torsion spring 33h,
A pair of x-axis positioning protrusions 33d, which are pushed along the x-axis direction from the separated position to form the x-axis positioning portion 33A,
33e, the position in the x-axis direction is defined. On the other hand, the base member 208 is pushed from the separated position along the y-axis direction by the y-axis restricting lever 33j being biased by the biasing force of the second torsion spring 33l in the counterclockwise direction so as to be pushed out along the y-axis direction. It comes into contact with the y-axis positioning protrusion 33i that constitutes the shaft positioning portion 33B, and the position in the y-axis direction is defined. That is, by releasing the driving force of the release cylinder 33m, the base member 208 is accurately positioned along the x-axis and y-axis directions.

After the step S22A is executed in this way, the driving of the suction mechanism 33E is started in the step S22B. Along with this start, a suction source (not shown) is activated, and the suction force from this suction source acts on the suction pad 33w via the connecting pipe 33x, and as a result, the base member 208 is attracted downward and the z-axis. Positioning part 33
The first and second protrusions 33t and 33u forming C reliably contact the upper surface of the positioning 33c, and the third protrusion 33v surely contacts the lower surface of the base member 208. That is, by driving the suction mechanism 33E, the base member 208 is accurately positioned at the position along the z-axis direction.

In this way, the base member 208 is accurately positioned in the three axial directions with respect to the main body 33a by the positioning operation of the second positioning mechanism 33. In addition, the base member 208 moves the second positioning mechanism 3 by the operation of the suction mechanism 33E.
3 to the position accurately positioned by the main body 33a
Even if is moved, it will be surely retained.

When this step S22B is completed, next, in step S22C, the second position adjusting mechanism 1
6 is activated to move the base member 208 positioned and held by the second position detection mechanism 33 from its standby position to the assembly work position α. Then, in step S22D, the base member 20 brought to this assembly work position α is
The image on the upper surface of the heater board 102 on the No. 8 is transmitted to the second focus state detector 52 via the second optical system 42e for focus determination.

Then, in step S22E, the second focus state detector 52 detects z from the focus position.
The axial focus shift amount Δz, that is, this in-focus position is the designed setting position in the z-axis direction.
2 Amount of focus deviation Δ in the z-axis direction at the assembly work position α
z is measured, and the measured focus shift amount Δz is transmitted to the control unit 38 in step S22F. After that, in step S22G, the control unit 38
Internally, the movement amount Z ₂ of the second z-axis stage 30 is calculated based on the focus shift amount Δz, and in step S22H, the second z-axis stage 30 is moved based on the calculated movement amount Z _2. By driving, the position in the z-axis direction at the assembly work position α on the upper surface of the heater board 102 is accurately defined.

Next, in step S22I, the upper surface of the heater board 102 is photographed by the second ITV camera 42g of the second position detecting mechanism 42, and in step S22J, the photographed image information is converted into the second signal. Converter 50
And is transmitted to the image processing device 44 via the. FIG. 21 shows an image of the heater board taken by the second ITV camera 42g. In the image projected by the second ITV camera 42g, since the position in the z-axis direction at the assembly work position α on the upper surface of the heater board 102 is accurately defined in the steps S22D to S22H, the image is focused. The image is clear and accurate.

Here, as shown in FIG. 21, the discharge heaters 112a to 112e are formed in advance on the heater board 102 with a predetermined forming accuracy, and the second positioning mechanism 33 described above performs a predetermined positioning operation. If it is being executed, the ejection heater 112c located in the middle will be shown in the image. As long as the discharge heater 112c located at the center is projected, the following assembling operation is set to be possible.

Therefore, in step S22K, it is judged whether or not the discharge heater 112c located at the center is projected, and if it is judged that it is not projected in step S22K, the following assembling operation is not performed. Since it becomes possible, in step S22L, an alarm is issued and the control procedure thereafter is terminated. On the other hand, in step S22K, the discharge heater 112 located in the middle is
If it is determined that c is projected, the process proceeds to step S22M, where the assembly work position α of the discharge heater 112c is
The amount of displacement x _h along the x-axis direction from is measured. Incidentally, for the measurement of the deviation amount x _h along the x-axis direction, when the discharge heater 112c located at the center is shifted on the right side of the screen to the center line, denoted by the sign (+), it is shifted to the left In this case, it is set so that the symbol (-) is attached.

Here, in this embodiment, as a means for distinguishing the middle discharge heater 112c among the five discharge heaters 112a to 112e from other discharge heaters 112c, as shown in FIGS. An identification mark 82 is drawn at a position adjacent to the discharge heater 112c. That is,
In the above-described step S22K, when the identification mark 82 is recognized in the image, it is determined that the ejection heater 112c located in the middle is projected, and when the identification mark 82 cannot be recognized. Is set so as to judge that the discharge heater 112c is not projected.

The amount of displacement x _h along the above-mentioned x-axis direction
Is defined as the distance from the center position of the image to the center position of the middle discharge heater 112c, and the center position of this image and the assembly work position α are set so as to match in advance. After the displacement amount x _h in the x-axis direction is measured in this way, this displacement amount x _h is measured in step S22N.
It transmits the _h to the control Yunitsuto 38, in step S22O, stores the shift amount x _h in the memory of the control Yunitsuto 38.

Thereafter, in step S22P, the first
First optical system 40e for focus determination of the position detection mechanism 40
The image of the front end face of the heater board 102 on the base member 208 brought to the assembling work position α is transmitted to the first focus state detector 48 via. Then, in step S22Q, the first focus state detector 48 moves the heater board 102 along the y-axis direction so that the focus state is achieved, that is, the focus state is adjusted. The second y-axis stage 32 is driven to move. And
When the focusing operation ends in step S22Q,
In step S22R, the second y-axis stage 32 is further moved and driven by the thickness t ₁ of the orifice plate 108 described above so that the second y-axis stage 32 is further moved from the in-focus position.

As described above, the heater board 102 in the y-axis direction is previously formed by the thickness t ₁ of the orifice plate 108.
The top plate 104 is assembled on the heater board 102 by offsetting the position of the front end surface of the heater board 102, and the orifice plate 108 fixed in advance to the front end surface of the top plate 104 is closely attached to the front end surface of the heater board 102. In this state, the focus of the first position detecting mechanism 40 on the surface of the orifice plate 108 is
Accurate match is achieved without executing any focus detection operation. In this way, the series of heater boards 102
The positioning operation of is ended and the control procedure returns to the original main routine.

<< Explanation of Supplying Operation of Top Plate 104 at Step S24 >> Next, the flow chart shown in FIG.
The supply operation of the top plate 104 in step S24 will be described with reference to FIG. 19 described above.

First, when the supply operation of the top plate 104 is activated, the top plate 104 is conveyed from the storage position to the attachment mechanism 26 at the standby position via a supply robot (not shown) in step S24A. Specifically, it is conveyed from below such that the cylindrical ink receiving port 118 of the top plate 104 is inserted into the gap defined between the pair of suction members 26b and 26c constituting the attachment mechanism 26. Then, in step S24B, the first positioning mechanism 2
7 to drive the second suction member 26c on the movable side so as to approach the first suction member 26b on the fixed side, and as shown in FIG. The ink receiving port 1 is provided between the first and second suction members 26b and 26c.
Make sure that 18 is clamped with a weak force. In this way
The ink receiving port 118 comes into light contact with the inner side surface defined as the reference surface of the first suction member 26b on the fixed side. As a result, the ink receiving port 118, and thus the top plate 1
The position of 04 in the x-axis direction with respect to the mounting mechanism 26 is accurately defined.

Since the force for pinching the ink receiving port 118 is set to be weak as described above, the deformation of the ink receiving port 118 due to the pinching force can be almost ignored, and the ink is not held in this pinching state. Receptacle 1
It is not possible to hold the top plate 104 by gripping 18. After that, the top plate body 116 of the top plate 104, which is positioned in the x-axis direction in step S24B, passes through the suction holes 26d and 26e formed on the lower surfaces of the first and second suction members 26b and 26c, respectively. As a result, they are sucked and held on the lower surfaces of the first and second suction members 26b and 26c. In this way, the series of supply operations of the top plate 104 is completed, and the control procedure returns to the original main routine.

<< Explanation of Temporary Placement Operation of Top Plate 104 in Step S26 >> Next, referring to the flow chart shown in FIG. 23, the temporary placement operation of the top plate 104 on the heater board 102 in Step S26 will be described. .. Here, as already described, since the top plate 104 and the heater board 102 are both actually microfabricated parts, they may be damaged when an excessive force is applied. For this reason, prior to the x-axis direction alignment operation of step S28, the temporary placement operation of the top plate 104 on the heater board 102 is executed.

First, when the temporary placing operation is started, as shown in step S26A, the first position adjusting mechanism 14 is driven to maintain a sufficient gap between the top plate 104 and the heater board 102. , The top plate 104 is moved directly above the heater board 102. After that, in step S26B, the top plate 104 is moved downward along the z-axis direction, and the top plate 10 is moved.
The gap between 4 and the heater board 102 is reduced. Then, in step S26C, the top plate 104 is attached to the heater board 1.
02 drop it on.

In this state, the top plate 104 is placed on the heater board 102 in a state where its placement position is not precisely defined. Therefore, in step S26D, the engagement pieces 26m and 26n of the first positioning mechanism 27 are moved to move the orifice plate 108 to the heater board 1.
The front end face of 02 is applied. Furthermore, step S26
In E, as a preparation for the x-axis direction alignment operation, the thickness calibration operation of the top plate 104 is performed, and the positional relationship between the top plate 104 and the suction members 26b and 26c in the first positioning mechanism 27 is set to an optimum state. To do. In this way, the series of temporary placement operations of the top plate 104 on the heater board 102 are completed, and the control procedure returns to the original main routine.

<< Description of Positioning Operation of the Top Plate 104 in the x-Axis Direction with the Heater Board 102 in Step S28 >> Next, referring to the flow chart shown in FIG. 24 and FIGS. 25 to 30, the ceiling in step S28 will be described. Board 10
The positioning operation in the x-axis direction with respect to the heater board 102 of No. 4 will be described.

In the above-described temporary placing operation of the top plate 104, the mounting mechanism 26 is driven to move to the designed mounting position by the first position adjusting mechanism 14, and then the top plate is moved from the mounting mechanism 26. 104 to the heater board 102
This temporary placing operation is executed by dropping the sheet up and positioning it at the above-mentioned designed mounting position. Here, as already described above, the arrangement pitch of the discharge ports 106 formed on the orifice plate 108 of the top plate 104 and the discharge heaters 112 formed on the heater board 102 is on the order of micron, so that the design Not only the above absolute alignment but also the relative alignment of the discharge port 106 with respect to the discharge heater 112 is performed so that the discharge heater 112 and the discharge port 106, which correspond to each other, are actually positioned within a predetermined positional accuracy. Then, the positioning operation must be performed so that they are combined with each other. In addition, these discharge ports 10
6 and the discharge heater 112 are arranged in the x-axis direction, the heater board 102 of the top plate 104 is arranged.
The final alignment with respect to is defined to be performed via image processing only along the x-axis direction.

First, when the x-axis aligning operation is started, the top plate 104 is offset in step S28A. That is, in this one-sided movement, as shown in FIG. 25, from the state where the cylindrical ink receiving port 118 of the top plate 104 is located between the suction members 26b and 26c, as shown in FIG.
As shown in, the movable suction member 26c is moved toward the fixed suction member 26b, and the ink receiving port 118 is abutted against the fixed suction member 26b. And FIG. 27
28, the movable suction member 26c is returned to its original position, and as shown in FIG. 28, both suction members 26b and 26c are moved integrally, that is, the attachment mechanism 26 is moved in the x-axis direction as a whole. Then, by moving the top plate 104 to a predetermined position, the offset operation of the top plate 104 is completed.

When the shifting operation of the top plate 104 is completed,
Next, in step S28B, as shown in FIG.
First optical system 4 for focusing determination of the first position detection mechanism 40
The orifice plate 1 mounted in front of the top plate 104 temporarily placed on the heater board 102 via 0e.
The front image of 08 is transmitted to the first focus state detector 48. Then, in step S28C, the heater board 102 and the top plate 104 are integrated along the y-axis so that the first focus state detector 48 achieves the focus state, that is, the focus state is achieved. Second to move
The y-axis stage 32 is driven to move.

Here, in this focusing operation, step S of the positioning operation of the heater board 102 described above is performed.
22P to S22R, the first IT has already been
Since the focus of the V camera 40g is substantially aligned with the front surface of the orientation plate 108, this focusing operation is completed within a very short time, and the front surface of the orientation plate 108 is out of the focusing range. It will be surely prevented that the focusing operation becomes impossible.

When the focusing operation is completed in step S28C, the first operation is performed in step S28D.
First ITV camera 40g in the position detection mechanism 40 of
Then, the front surface of the orifice plate 108 fixed to the front surface side of the top plate 104 temporarily placed on the heater board 102 is photographed. Since the image of the orientation plate 108 taken by the first ITV camera 40g has been subjected to the focusing operation as described above, as shown in FIG. 30, it becomes a clear image in which the focus is accurately achieved. There is.

Thereafter, in step S28E, the image photographed in step S28C is converted into the first signal converter 4
6 to the image processing device 44, and step S28
In F, the ejection hole 10 that is determined to be closest to the above-described central ejection heater 112c from the center of the screen based on the image taken through the first ITV camera 40g.
The distance x _H to the center position of 6 is measured electrically. Here, as described in the positioning operation of the heater board 102 in step S22, the center line of the screen is
This distance x _H corresponds to the assembly work position α, and represents the amount of deviation along the x-axis direction from the assembly work position α to the discharge hole 106 to be combined with the central discharge heater 112c.

When the displacement amount x _H from the center line of the ejection port 106 corresponding to the above-mentioned central ejection heater 112c has been measured, in step S28G, the central ejection heater 112c and the corresponding ejection port 112h. The top plate 104 including the orifice plate 108 in which the ejection port 106 is formed in order to accurately match the upper and lower sides with the top plate 104.
, The amount of movement x required to move along the x-axis direction
_T is calculated from the following arithmetic expression. x _T = x _h −x _H + Δx

Next, in step S28H, it is determined whether or not this movement amount x _T is smaller than the adjustment standard range C for the x-direction alignment stored in advance on the data disk. When it is determined YES in step S28H, that is, when the movement amount x _T is determined to be smaller than the adjustment standard range C, the control unit 38 causes the discharge heaters 112 of the heater board 102 and the top plate 104. Of the discharge hole 106 formed in the orifice plate 108 of
It is judged that the positions in the x-axis direction match each other, and this x
The control procedure of the axial alignment operation is ended, and the process returns to the main routine.

On the other hand, if it is determined NO in step S28H described above, that is, if the movement amount x _T is greater than the adjustment standard range C, in step S28I, the first x-axis drive is performed. The stage 18 is driven to move the top plate 104 by an amount corresponding to this moving amount x _T. As a result, the ink receiving port 118 that is offset to the end surface of the first suction member 26b on the fixed side is pushed by the first suction member 26b and moves by the above-described movement amount x _T. Then, the process returns to step S28D described above.

By thus positioning the top plate 104 with respect to the heater board 102, the discharge heater 112c located at the center of the heater board 102 is positioned.
And in the orifice plate 108 of the top plate 104,
The respective center lines of the ejection port 106 closest to the ejection heater 112c coincide with each other in the x-axis direction. In this way, a series of alignment operations of the top plate 104 and the heater board 102 along the x-axis direction are completed, and the control procedure returns to the original main routine.

In particular, in this embodiment, when the top plate 104 is aligned with the heater board 102 in the x-axis direction, the ink receiving port 118 of the top plate 104 is pushed by the end surface of the first suction member 26b. As a result,
The top plate 104 moves in the x-axis direction. Here, the orifice plate 108 integrally attached to the top plate 104 is pressed against the front end surface of the heater board 102 in the above-described step S26D. Therefore, when the top plate 104 moves in the x-axis direction, the contact state between the orifice plate 108 and the heater board 102 acts as friction resistance.

If it is assumed that only this frictional resistance acts unilaterally, then when the top plate 104 moves in the x-axis direction, the ink receiving port 118 is moved to the first suction member 26b.
When is pressed, the top plate 104 does not move straight along the x-axis direction, but makes an irregular rotational-like motion with the orifice plate 108 as a fulcrum, and the alignment cannot be accurately achieved. .. However, in this embodiment, the adhesives 80a, 80 having an appropriate viscosity are provided on the side opposite to the side where the orifice plate 108 is provided.
Since b is applied, this also acts as a frictional resistance. As a result, when the top plate 104 moves in the x-axis direction, both frictional forces are balanced, and the alignment operation in the x-axis direction is achieved in a stable state.

<< Description of Adhesion Operation (Temporary Adhesion Operation) of Top Plate 104 to Heater Board 102 in Step S30 >> Next, referring to FIGS. 32 and 32, the top plate 104 in step S30. The adhering operation (temporary adhering operation) on the heater board 102 will be described.

The top plate 10 in step S28 described above.
Positioning in the x-axis direction with respect to the heater board 102 of No. 4
When the operation is completed, first, in step S30A,
The first z-axis stage 2 in the first position adjusting mechanism 14
0 to activate the entire first positioning mechanism 27
The first and second suction members 26b and 26c by a predetermined amount D
_F Only down along the z-axis. This first and second
The suction members 26b and 26c of the
As shown in Fig. 32, the contact is made.
The heated top plate 104 is below the heater board 102.
In the state in which the
Push downward against the urging force of the coil spring 34c.
Will be lowered.

Here, the first z-axis stage 20 described above is used.
The predetermined descending amount D _{F at} is the top 10 accompanying this descending.
4 and the pressing force of the heater board 102, the biasing force generated in the coil spring 34c is set to a value sufficient to act as a predetermined joining force between the top plate 104 and the heater board 102.

As described above, the heater board 102 and the top plate 1
In a state where a predetermined joining force is generated between the UV light source and the light source 04, the UV light source 58 emits UV light in step S30B. This ultraviolet ray is introduced to the pair of suction members 26b, 26c that are transparent to ultraviolet rays through the pair of light guides 56, and the adhesive 80a, 8a in the state where they are transmitted therethrough.
0b is irradiated. As a result, these adhesives 80a, 8
Since 0b has ultraviolet curability, these adhesives 8
0a and 80b start curing, that is, exhibit adhesiveness. That is, the heater board 102 and the top plate 104 are
The adhesive 80 is adhered to each other with a predetermined joining force.
They will be bonded to each other via a and 80b.

As described above, this joining force generating mechanism 3
When changing the joining force in No. 4, washer 34b
Is achieved by rotating and moving the guide shaft 34a along the axial direction of the guide shaft 34a to change the deformation amount of the coil spring 34c.

Thereafter, in step S30C, a predetermined time is waited for and the adhesives 80a, 80b are completely cured. Then, in step S30D, the first z of the first position adjusting mechanism 14 is restored again. Axis stage 20
To activate the entire first positioning mechanism 27,
The first and second suction members 26b, 26c are raised along the z-axis direction by the same amount of rise U _F as the amount of fall D _F described above. As a result, the first and second suction members 26b, 26c
Will rise until it is located above the top plate 104 and stand by. In this way, a series of control procedures for the bonding operation are terminated, and the original main routine is restored.

<< Description of Fixing Operation of Top Plate 104 at Step S31 >> Next, referring to FIGS. 33 to 35,
The fixing operation of the top plate 104 in step S31 will be described.

As shown in FIG. 33, the fixing spring member 122 used for firmly fixing the top plate 104 to the heater board 102 is brought into pressure contact with the upper surface of the top plate body 116 and urges this downward. Spring body 112a for moving, and leg portions 112 that respectively stand down from both sides of the spring body 112a.
b, 112c and the locking claws 112d, 112e bent inwardly from the lower ends of the legs 112b, 112c.
And a pressure contact piece 112f bent downward from the front end edge of the spring body 112a (that is, the edge close to the orifice plate 108). Here, the top plate body 116 is provided at a substantially central portion of the spring body 112a.
An opening 112g through which the ink receiving port 118 projectingly provided is inserted.

On the other hand, the left and right leg portions 112b and 112c of the fixing spring member 122 described above are inserted into the base member 208 just in the state of being adjacent to the left and right side edges of the heater board 102 fixed thereto. Mounting holes 208
c and 208d are formed so as to penetrate in the thickness direction. Here, the respective mounting holes 208c, 208d correspond to the locking claws 112d, 11 of the corresponding leg portions 112b, 112c.
2e is set to a size large enough to be inserted. In addition, the connecting distances of the two mounting holes 208c and 208d (that is, the distance between the edges that are close to each other) are such that the leg portions 112b and 112c of the spring member 112 in the natural state.
It is set slightly shorter than the distance between them. As a result, by pushing out both legs 112b and 112c,
The locking claws 112d and 112e inserted into the corresponding mounting holes 208c and 208d are attached to the mounting holes 208c and 2c.
Both legs 112b, 1 while passing through 08d downward.
When the expanded state of 12c is released, the claws 112d and 112e are displaced inward relative to each other, and the locking claws 112d and 112e are locked to the lower surface of the base member 208, as shown in FIG.

Here, the lengths of both leg portions 112b and 112c are such that the spring main body 112a is the top plate main body 1 with the locking claws 112d and 112e locked to the lower surface of the base member 208.
It is set so as to have a length sufficient to press the upper surface of 16 and press it downward. Also, the spring body 112a
Is pressed against the upper surface of the top plate body 116, the spring body 1
The pressure contact piece 112f formed on the front end edge of 12a presses the front end of the top plate body 116 particularly strongly. As a result, as already described with reference to FIG. 4, the heater board 1
02, the area where the heater 112 is provided at the front end portion and the ink flow path portion defined at the front end portion of the top plate 104 are strongly adhered to each other, and ink leakage is effectively prevented. Become.

In particular, in this one embodiment, the adhesive 8
The fourth area D, which is the area where 0a and 80b are arranged, is set far away from the first area, which is the area where the heater is arranged. Therefore, the applied adhesive 80a, 80b is applied to the heater area. It is possible to reliably prevent the above-mentioned adhesiveness from being impaired by invading.

When the fixing operation is started, the fixing spring member 112 is not shown in the state where the top plate 104 is temporarily attached to the heater board 102 via the adhesives 80a and 80b as described above. A mounting hole 208 that is gripped by the robot hand and has both leg portions 112b and 112c corresponding thereto.
It is spread so that it can be inserted into the c and 208d from above. After this, the legs 112b, 112 of the spring member 112 are
c is inserted into the corresponding mounting holes 208c and 208d from above, and as shown in FIG.
18 is lowered so as to pass through the opening 112g. Then, when the locking claws 112d and 112e formed at the lower ends of the two leg portions 112b and 112c project further downward from the lower surface of the base member 208, the lowering operation of the spring member 112 is stopped, and the two leg portions 112b and 112c are stopped. By releasing the spread state, the spring member 112 is locked to the base member 208 in a state where the top plate 104 is firmly pressed and fixed to the heater board 102. In this way, the top plate 1
After the fixing operation of 04, the robot hand (not shown) releases the grip of the spring member 112 and returns to the initial position.

<< Explanation of Assembly Discharging Operation in Step S32 >> Next, the discharging operation of the finished product in step S32 will be described with reference to the flow chart shown in FIG. In step S30 described above, the heater board 102 and the top plate 104, which are aligned with each other, are bonded (temporarily bonded) to each other via the adhesives 80a and 80b.
In step S31, the assembly as a finished product is formed with the top plate 104 firmly fixed to the heater board 102 via the spring member 112. When the assembly is finally formed in this way, the discharging operation of the assembly is started.

When this discharging operation is started, first, in step S32A, switching control is performed so that the switching valve (not shown) in the first positioning mechanism 27 is connected to the positive pressure generating mechanism. As a result, compressed air is ejected (reverse ejection) from the pair of suction holes 26d and 26e, and the assembly of the top plate 104 and the heater board 102 as a finished product is pressed downward. After this, step S32
At B, the first z-axis stage 20 is activated again,
The mounting mechanism 26, and thus the first positioning mechanism 27 as a whole, is raised so that the ink receiving port 118 mounted on the upper surface of the top plate 104 comes out downward between the suction members 26b and 26c. In this way, the first positioning mechanism 27 becomes freely movable in the horizontal plane.

Thereafter, in step S32C, the switching valve is controlled to switch to the atmosphere open position, and the reverse injection operation is stopped.
Further, in step S32D, the second z-axis stage 30 of the second position adjusting mechanism 16 is activated to lower the entire second positioning mechanism 33. And step S3
In 2E, the first position adjustment mechanism 14 is activated to return the entire attachment mechanism 26 from the assembly work position α to the standby position.

On the other hand, in step S32F, the release mechanism 33D of the second positioning mechanism 33 is activated to release the clamped state of the base member 208 in the x-axis and y-axis directions, and in step S32G, the suction mechanism 33E is driven. To stop the holding state of the base member 208 in the z-axis direction. In this way, the second positioning mechanism 33 extends to the base member 208, and thus the heater board 104 and the top plate 102 mounted on the base member 208.
However, it becomes removable. After this, step S3
At 2H, the second position adjusting mechanism 16 is activated to return the entire second positioning mechanism 33 from the assembly work position to the standby position. And finally, step S32I
In step 2, the base member 208 in the assembly is gripped via the supply robot (not shown), the finished product is taken out from the second positioning mechanism 33, and is transported to the finished product storage station (not shown). In this way, a series of discharge operations of finished products is completed, and the control procedure returns to the original main routine.

As described in detail above, by performing the assembling apparatus 10 of this embodiment and the assembling method in the assembling apparatus 10, the heater board 102 and the top plate 104, which are finely machined parts, are excessively provided on them. The ejection heater 112 of the heater board 102 and the ejection port 106 of the top plate 104 can be accurately and precisely combined with each other and bonded to each other without being damaged by applying an assembling force. become. It goes without saying that the present invention is not limited to the configuration of the above-described embodiment and can be variously modified without departing from the scope of the present invention.

[0153]

As described in detail above, the method of applying an adhesive according to the present invention is an adhesive application method of applying an adhesive onto a member to be adhered, wherein the member to be adhered is in a standby position. Placement step of placing on the tool, conveying step of conveying the coating jig from the standby position to the coating position, positioning step of stopping and positioning the coating jig at the coating position, and stopping at the coating position And a coating step of coating an adhesive on a predetermined position of the adhered member on the coating jig.

Further, in the adhesive applying method according to the present invention, in the applying step, the adhesive is applied to the tip of at least one transfer element at an adhesive transfer station defined at a position apart from the applying position. And an adhering sub-step of moving the transfer member from a transfer position to a coating position, and bringing the transfer member into contact with a predetermined position of the adhered member from above so that the adhesive adhered to the tip is moved to the predetermined position. And a transfer sub-process for transferring. Therefore, according to the present invention, there is provided an adhesive application method capable of holding the adhesive application position at a constant level.

[Brief description of drawings]

FIG. 1 is a perspective view showing a structure of an ink jet cartridge which is detachably attached to an ink jet recording apparatus incorporating a head nozzle assembled by an assembly method to which an adhesive applying method according to the present invention is applied. is there.

FIG. 2 is a perspective view showing a configuration of a head nozzle shown in FIG.

FIG. 3 is a top view showing the configuration of the main part of the heater board that defines one of the constituent features of the head nozzle.

FIG. 4 is a diagram schematically showing an assembling apparatus to which the configuration of an embodiment of the adhesive applying method according to the present invention is applied.

FIG. 5 is a perspective view schematically showing the configurations of an attachment mechanism and a first positioning mechanism in the first position adjusting mechanism.

FIG. 6 is a top view showing a configuration of a second positioning mechanism in the second position adjusting mechanism.

FIG. 7 is a side sectional view showing a configuration of a joining force generating mechanism together with a second positioning mechanism.

FIG. 8 is a top view showing the configuration of a release mechanism in the second positioning mechanism.

FIG. 9 is a perspective view showing an attached state of a calibration chart.

FIG. 10 is a diagram showing an image of a calibration chart photographed by a first ITV camera in the first position detecting mechanism.

FIG. 11 is a diagram showing an image of a calibration chart taken by a second ITV camera in the second position detecting mechanism.

FIG. 12 is a flow chart showing a control procedure of an embodiment of an assembling method according to the present invention.

FIG. 13 is a perspective view showing, in a simplified state, a heater board and a top plate that form a head nozzle, in order to clarify the description of the assembly method.

FIG. 14 is a flow chart showing a control procedure of a calibration operation as a subroutine.

FIG. 15 is a perspective view showing a state during a calibration operation.

[FIG. 16]

FIG. 17 is a flow chart showing, as a subroutine, a control procedure of a heater board supply operation involving the adhesive application method which is a feature of the present invention.

FIG. 18 is a perspective view schematically showing the configuration of an adhesive application station.

FIG. 19 is a standby position of the first and second positioning mechanisms,
It is a perspective view which shows an assembly work position.

FIG. 20 is a flow chart showing a control procedure of a positioning operation of the heater board as a subroutine.

FIG. 21 is a diagram showing an image of a heater board taken by a second ITV camera.

FIG. 22 is a flow chart showing a control procedure of a top plate supply operation as a subroutine.

FIG. 23 is a flowchart showing a control procedure of a temporary table top placing operation as a subroutine.

FIG. 24 is a flow chart showing a control procedure of an alignment operation of the top plate with respect to the heater board in the x-axis direction.

FIG. 25:

FIG. 26:

FIG. 27:

FIG. 28 is a diagram sequentially showing the procedure of the one-sided movement of the top plate.

FIG. 29 is a perspective view showing a photographing state of the orifice plate in the x-axis alignment operation with respect to the heater board of the top plate.

FIG. 30 is a diagram showing an image of an ejection port of an orifice plate taken by a first ITV camera.

FIG. 31 is a flow chart showing the bonding operation between the top plate and the heater board.

FIG. 32 is a diagram for explaining a joining force generation state.

FIG. 33 is a perspective view showing a state in which the top plate is fixed to the heater board.

FIG. 34:

FIG. 35 is a side sectional view and a front sectional view showing a state in which the top plate is fixed to the heater board via a spring member.

FIG. 36 is a flow chart showing the discharging operation of the assembly as a finished product.

[Explanation of symbols]

 10 assembly device, 26 attachment mechanism, 27 first positioning mechanism, 33 second positioning mechanism, 34 joining force generating mechanism, 38 control unit, 44 image processing device, 100 head nozzle, 102 heater board, 104 grooved top plate, 106 discharge port, 108 orifice plate, 112 discharge heater, 200 ink jet cartridge, 202 ink tank, 208 base member, 400 adhesive application station, 402 adhesive application jig, 404 reciprocating movement mechanism, 412 arrival sensor, 414 stopper pin 416a; 416b locating pin, 418a; 418b locating hole, 420 mounting pin, 422 pressure contact mechanism, 430 adhesive transfer mechanism, 432 transfer element, 446 adhesive container.

Front page continuation (72) Inventor Go Orikasa 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (2)

[Claims] 1. A method of applying an adhesive onto a member to be adhered, comprising: a placing step of placing the member to be adhered on an application jig at a standby position; and a step of placing the application jig at a standby position. To a coating position, a positioning step of stopping and positioning the coating jig at the coating position, and an adhesive agent at a predetermined position of the adhered member on the coating jig stopped at the coating position. A method for applying an adhesive, comprising: an applying step of applying. 2. An applying sub-step of applying an adhesive to the tip of at least one transfer element at an adhesive transfer station defined at a position distant from the application position; It includes a moving step of moving from a transfer position to a coating position, and a transfer sub-step of bringing the transfer element into contact with a predetermined position of the adherend member from above and transferring the adhesive attached to the tip to the predetermined position. The adhesive application method according to claim 1, wherein: