JPH04171130A - Adhering method of plural members - Google Patents

Abstract

PURPOSE:To maintain the first and the second members in a specific condition and to prevent a slippage of position by irradiating ultraviolet rays to an adhesive placed between the first and the second members in the pressure-contact state of the first and the second members with each other, in a pressure-contact process. CONSTITUTION:To the surface to be bonded of the first member 102, an adhesive 80a of an ultraviolet-ray hardening property is applied. Then the first member 102 is placed on a joining force generating means 34. The first and the second members 102 and 104 are unified in respect of the X-axis direction and the Y-axis direction each other, one member 102 of the first and the second members 102 and 104 is moved in the Z-axis direction facing the other member 104, the joining force is generated in the joining force generating means 34, and both members 102 and 104 are pressure-contacted. Under the condition of the first and the second members 102 and 104 being pressure-contacted with each other by the pressure-contact process, the ultraviolet rays from a light source 58 is irradiated to the adhesive 80a placed between the first and the second members 102 and 104.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to a first part of a first member and a second part of a second member while maintaining the relative positional relationship between the first part and the second part of the second member. The present invention relates to a method of adhering two or more members to each other in a state in which two members are brought into close contact with each other using a bonding force generated in the Z-axis direction by a bonding force generating means.

C. Prior Art] In recent years, print heads that eject ink and print on paper using the so-called bubble jet method, which heats the ink to form bubbles, have become advantageous in improving printing accuracy. Therefore, it has been developed and put into practical use.

The assembly device that assembles such a bubble jet print head uses a heater to heat the ink and an ejection port that ejects the foamed ink heated and boiled by the heater toward the paper. , which requires accurate positioning on the micron order. For example, the printing accuracy is approximately 360 dpi (dots pe
To achieve a high accuracy of r 1nch), approximately 4.5
Sixty-four discharge holes must be arranged at equal intervals in a range of 1.5 mm, and the arrangement pitch in this case is as fine as about 70 microns.

Here, the formation of discharge holes at such extremely small intervals can be achieved by, for example, using an ultra-precision processing device such as a laser processing machine to create a predetermined allowable height on the orifice plate attached to the front surface of the top plate member. The discharge hole can be formed with high precision, and by using ultra-precision etching technology when forming the heater, it is also possible to form the heater on the heater board with an acceptable predetermined high precision. It is something that can be formed.

[Problems to be Solved by the Invention] However, in the conventional assembly device, the heater is formed on the heater board as the first member and the orifice plate attached to the front surface of the top plate as the second member. The top plate is placed on the heater board with its axes accurately aligned with the discharge holes. When adhering the two after this positioning, the two are pressed together manually and the adhesive is cured by irradiating the adhesive with ultraviolet rays at the timing when adhesion is to be started.

In this way, because the gluing operation is performed manually,
Both members must be held in a bonded state until the adhesive hardens, and there is a risk that the relative positions of the members may shift during the holding.

In addition, it must be held for a long time, causing great fatigue to workers, and there is a demand for improvements in working conditions. Here, in order to shorten (set) this bonding time, it is possible to use instant adhesive, but when such instant adhesive is used, the adhesive force is exerted immediately after application, so there is no need to It becomes impossible to align the two with the adhesive still interposed, and when the instant adhesive is vaporized, fine powder impurities are mixed into the vaporized gas. There is a risk that these impurities may clog the finely machined discharge ports, and as a result, this instant adhesive cannot be used.

This invention was made in view of the above-mentioned problems, and an object of the invention is to provide a plurality of parts that can maintain the members to be bonded together in a constant state throughout the bonding process and prevent the occurrence of positional deviation. An object of the present invention is to provide a method for bonding members.

Another object of the present invention is to provide a method for bonding multiple members together that can shorten the bonding time without using an instant adhesive.

[Means for Solving the Problems] In order to achieve the above-mentioned object, a method for bonding multiple members according to the present invention includes a method for bonding a plurality of members according to the present invention. Maintaining the positional relationship, move the first and second
A bonding method in which members are adhered to each other in a state in which members are brought into close contact with each other by a bonding force generated in the Z-axis direction by a bonding force generating means, the adhesive method comprising: applying an ultraviolet curable adhesive to the surface of the first member to be bonded; a mounting step of mounting the first member on the bonding force generating means; and a matching step of aligning the first and second parts with each other in the X-axis and y-axis directions. a pressure welding step in which one of the first and second members is moved toward the other in the Z-axis direction, a bonding force is generated in the bonding force generating means, and the two are brought into pressure contact; The present invention is characterized by comprising an ultraviolet irradiation step of irradiating the adhesive interposed between the first and second members with ultraviolet rays while the first and second members are in pressure contact with each other.

In the method for bonding multiple members according to the present invention, the ultraviolet ray irradiation step includes guiding ultraviolet light emitted from an ultraviolet light source spaced from the bonding position to the bonding position via a light guide, and applying the ultraviolet light to the adhesive. It is characterized by irradiating ultraviolet light.

-Also, in the method for bonding multiple members according to the present invention,
At least one of the first and second members is formed to be transparent to ultraviolet rays, and the light guide terminates at the surface of the member that is transparent to ultraviolet rays. It is characterized in that the adhesive is irradiated with ultraviolet rays through a member that is transparent to ultraviolet rays.

[Example] Below, the configuration of a printing head nozzle assembly device 10 to which an example of the method of adhering multiple members according to the present invention is applied will be described.

(Description of the head nozzle 100) First, the schematic configuration of the head nozzle 100 assembled using the adhesive method according to the present invention and the inkjet cartridge 200 equipped with the head nozzle 100 will be described with reference to FIGS. 1 to 3. .

As shown in FIG. 1, this inkjet cartridge 200 is roughly composed of an ink tank 202 and a head nozzle 100. Also, this head nozzle 100
As shown in FIGS. 2 and 3, there is a heater board 102 on which a heater 112 for heating ink is formed, and a partition wall positioned on the heater board 102 to separate a plurality of ink flow paths. A common liquid chamber for distributing ink to each ink flow path and a cylindrical ink receiver for supplying ink to this common liquid chamber are provided with a top plate 1 having an opening 118, etc.
04, and an orifice plate 108 that is integrally attached to the front surface of the top plate 104 and has a plurality of ejection ports 106 corresponding to each ink flow path.

In this embodiment, these ejection ports 106 are arranged at equal intervals over a length of approximately 4.5 mm, and due to this arrangement, the print density of this head nozzle ioo is approximately 360 dpi (dottsp6r 1nch
) with high accuracy.

(Description of the assembly device 10) Below, the assembly device 10 of the head nozzle 100 which is a feature of the present invention, that is, the grooved top plate 104 will be explained.
The configuration and assembly method of the assembly device 10 for assembling the assembly device 10 in an accurately positioned state on the 02 will be described in detail with reference to FIGS. 4 and subsequent figures of the accompanying drawings.

<Description of the overall configuration of the assembly device 10> As shown in FIG. 4, the assembly device 10 includes a surface plate 12 that is accurately positioned horizontally on a base (not shown). On this surface plate 12 is a grooved top plate 104 (hereinafter simply referred to as the top plate) on which an orifice plate 108 is attached in advance, which is one component of the head nozzle 100 assembled by this assembly device 10. The first position adjustment mechanism 14, which allows the position to be adjusted, is fixed to the upper surface of the tip of the base member 208, which is the other component, in an accurately positioned state. A second position adjustment mechanism 16 is provided for adjusting the mounting position of the heater board 102.

The first position adjustment mechanism 14 includes a first X-axis stage 18 that is placed directly on the surface plate 12 and is movable along the X-axis direction (direction perpendicular to the plane of the drawing) with respect to the surface plate 12. , a first two-axis stage 20 placed on the first X-axis stage 18 and movable along the Z-axis direction (vertical direction in the figure) with respect to the first X-axis stage 18; a first y-axis stage 22 placed on the first Z-axis stage 20 and movable along the y-axis direction (left-right direction in the figure) with respect to the first Z-axis stage 20; The base end is placed on this first y-axis stage 22 via a spacer 24, and the above-mentioned top plate 104 is removably attached to the distal end by a mechanism 26. Grooved top plate 10 removed from 26 and placed on heater board 102
4, a first positioning mechanism 27 for positioning with respect to the heater board 102.

The configurations of the attachment device 126 and the first positioning mechanism 27 will be explained in detail later.

On the other hand, the second position adjuster [16 is placed directly on the surface plate 12 in a state adjacent to the first position adjustment mechanism 14 described above, and is moved along the X-axis direction described above with respect to the surface plate 12. A movable second X-axis stage 28; a second stage mounted on the second X-axis stage 28 and movable along the Z-axis direction with respect to the second X-axis stage 28; a Z-axis stage 30, and a stage mounted on the second Z-axis stage 30,
With respect to the second two-axis stage 30, a second y-axis stage 32 that is movable along the y-axis direction described above, and a
The heater board 102 is arranged on the y-axis stage 32 of
A second positioning mechanism 33 fixes the base member 208 to be fixed in an accurately positioned state relative to the second y-axis stage 32, and a top plate 104 is fixed on the heater board 102 in a predetermined manner. and a bonding force generating mechanism 34 for bonding with a bonding force of . The configurations of the second positioning mechanism 33 and the joining force generating mechanism 34 will be explained in detail later.

Here, each axis stage 18, 20, 22; 28.30.
32 are each equipped with a drive motor (not shown), and these drive motors are connected to a corresponding driver 36a.
, 36 b, 36 c.

36d, 36e, and 36f, respectively, are connected to a control unit 38 that manages overall control. These drive motors are controlled by this control unit 38.
In the first position adjustment mechanism 14, the top plate 104 is placed at a predetermined position above the heater board 102;
In the second position adjustment mechanism 16, the heater board 10
2 are positioned at predetermined positions with respect to the surface plate 12, and their respective drives are controlled.

On the other hand, in order to accurately position the top plate 104, this control unit 38 needs to accurately detect the position. The position detection mechanism 40 also needs to accurately detect the position of the heater board 102 in order to accurately position it. 2
Both position detection mechanisms 42 are connected to the control unit 38 via an image processing device 44.

Here, the first position detection mechanism 40 is installed in front of the orifice plate 10g of the grooved top plate 104, which is accurately held at the tip of the mechanism 26, which will be described in detail later. a first objective lens 40a, a first objective lens holder 40b holding the first objective lens 40a, a first epi-illumination fixture 40c, and a first a light source 40d, a first optical system 40e that determines the focusing state, a first lens barrel 40f that houses these optical devices, and a first objective lens 4.
A first ITV camera 40g projects an image of the orifice plate 108 observed through the camera 0a.

Incidentally, the image information of this first ITV camera 40g is
The above-mentioned image processing device 44
sent to. In addition, this first focus determination optical system 40
e is connected to the control unit 38 via a first focus state detector 48. Here, the first position pressure detection mechanism 40 is attached and fixed on the above-mentioned surface plate 12 via a first column (not shown).

Further, the second position detection mechanism 42 described above is arranged above the heater board 102 accurately placed on the second y-axis stage 32 by a second positioning mechanism 33, which will be explained in detail later. A second objective lens 42a, a second objective lens holder 42b holding the second objective lens 42a, a second epi-illuminator 42c, and a second epi-illumination fixture 42c for the second epi-illuminator 42c are provided. 2 light source 42d, a second optical system 42e for determining the focusing state, a second lens barrel 42f for housing these optical devices, and a second objective lens 4.
A second ITV camera 42g displays an image of the heater board 102 observed through the heater board 2a.

Incidentally, the image information of this second ITV camera 42g is
The above-mentioned image processing device 44
sent to. Moreover, this second focus determination optical system 42
e is connected to the control unit 38 via a second focus state detector 52. Here, the second position detection mechanism 42 is attached and fixed on the surface plate 12 described above via a second support column (not shown).

Here, in this embodiment, the position where the optical axis of the first objective lens 40a in the first position detection mechanism 40 and the optical axis of the second objective lens 42a in the second position detection mechanism 42 intersect , an assembly work position α is defined. At this assembly work position α, it is preferable that the two optical axes mentioned above intersect correctly, but even if they are installed separately or do not actually intersect, performing a calibration operation can actually cause problems. It's something that doesn't exist. In reality, it is extremely difficult to align the two optical axes so that they intersect correctly, and as in this example, assuming that they do not intersect, The amount of deviation ΔX is calculated by a calibration operation, and the calculated amount of deviation ΔX is numerically taken into consideration in the position adjustment operation of the first and second position adjustment mechanisms 14.16. In effect, it can be ignored.

On the other hand, in this assembly device 10, the heater board 102 and the top plate 104 are bonded to each other via an ultraviolet curable adhesive after the discharge ports 106 and the corresponding discharge heaters 112 are aligned with each other. In order to prevent the relative positional relationship between the two from changing, in other words, to temporarily fasten the two, a temporary attachment mechanism 54 is provided. This temporary attachment mechanism 5
4, the attachment is located on both sides of the distal end of the mechanism 26, and the respective distal ends are connected to a pair of light guides 56 directed toward the adhesive placement site, and to the proximal ends of both light guides 56;
It is composed of an ultraviolet light source 58 that emits ultraviolet light. - Then, the above-mentioned image processing device 44 calculates that the orifice spray 1= It is configured to calculate the formation position of the discharge port 106 formed in the heater board 108 and the position of the discharge heater 112 disposed on the heater board 102, and send the calculation results to the control unit 38. . Also,
An ITV monitor 64 for checking measurement images, a keyboard 62 for inputting device adjustment programs and data, and a CRT monitor 66 for displaying data are connected to this image processing device 44, and a man-machine interface is established. There is.

Further, the control unit 38 described above calculates data input from the first and second focus state detectors 48, 52 and the image processing device 44 using a predetermined algorithm,
Based on this calculation result, each stage driver 36a to 3
6f, each corresponding axis stage 18, 20,
22, 28° 30.32 as appropriate, and the top plate 104
The relative positions of the discharge ports 106 and the heater boards 102 are adjusted so that the discharge ports 106 and the corresponding discharge heaters 112 are aligned with each other, and after this alignment, the temporary attaching mechanism 54 is activated to turn on the ultraviolet light source 58. It is configured to be activated to perform a control operation to harden the adhesive interposed between the heater board 102 and the top plate 104.

Here, the control unit 38 includes an operation panel 66 for operating the assembly device 10, a keyboard 68 for setting and changing operation programs, and a CRT monitor 70 for displaying data.
A printer 72 for recording data, a data disk 74 for storing data, and a program disk 76 storing operating programs are connected to establish a man-machine interface.

Description of Mounting Mechanism 26 Next, with reference to FIG. 5, the structure of the mounting mechanism 26 to which the top plate 104 is attached will be described in detail.

The mounting mechanism 26 includes a main body 26a that is fixed on the first y-axis stage 22 via a spacer 24. A pair of suction members 26b are provided at the tip of the main body 26a.

26c are attached parallel to each other at a predetermined interval, each projecting forward (along the y-axis direction), and these suction members 26b.

26c are each made of an ultraviolet-transparent material, specifically a transparent plate glass.

Suction holes 26 are provided on the lower surfaces of these suction members 26b and 26c.
d, 26e are open, and these suction holes 26d,
26e is a communication pipe 26f that passes through the corresponding suction members 26b and 26c.

These communication pipes 26f and 26g are selectively connected to a negative pressure generation mechanism and a positive pressure generation mechanism (not shown) via switching valves (not shown), respectively.

When the switching valve is connected to the negative pressure generating mechanism, the top plate 104 is suctioned and held on the lower surface of the suction members 26b and 26c through the suction force generated in the suction holes 26d and 26e. There is. On the other hand, in a state where the switching valve is connected to the positive pressure generation mechanism, these suction holes 26d,
Due to the air ejected (reversely ejected) from the suction member 26e, the top plate 104, which had been suctioned and held by the suction members 26b and 26c, is forcibly moved to the suction member 26b.

It will be pulled downward from 26c.

In this way, while the top plate 104 is being held under suction by the lower surfaces of the pair of suction members 26b and 26c, the opening 118 of the cylindrical ink receptacle is just inserted between the suction members 26b and 26c. In the same position, the orifice plate 10
8 is set in a posture facing forward.

<Description of the first positioning mechanism 27> In addition, this attachment is released from the mechanism 26,
A first positioning mechanism 27 is provided for accurately positioning the top plate 104 that has fallen onto the heater board 102 with respect to the heater board 102.

This first positioning mechanism 27 positions the top plate 104 on the heater board 102 along the X-axis direction, that is, along the arrangement direction so that the corresponding discharge ports 106 and discharge heaters 112 match each other. and an X-axis positioning section 27B that performs positioning along the y-axis direction, that is, so that the rear surface of the orifice plate 108 comes into close contact with the front end surface of the heater board 102.

(Description of the X-axis positioning section 27A) First, in the X-axis positioning section 27A, one suction member 26b, which is on the near side in the figure in this embodiment, is defined as the reference side, and the suction member 26b on the reference side is defined as the reference side. Member 26b is fixed to main body 26a. On the contrary,
The suction member 26c on the other side in the figure is supported so as to be movable along the X-axis direction with respect to the main body 26a. Note that in this X-axis positioning section 27A, the pair of suction members 2
The mutually opposing end surfaces of 6b and 26c, that is, the mutually opposing end surfaces where the cylindrical ink receiver defines the space into which the spout 118 enters are defined as position regulating surfaces, respectively.

Further, the movable side suction member 26c is integrally connected to a rear portion thereof with a continuous member 26h that extends to a midway portion of the main body 26a. On the other hand, a guide shaft 26i extending along the X-axis direction is attached to the main body 26a. The connecting member 26h is supported by the guide shaft 26i via a slide guide 26j so as to be movable along the X-axis direction.

On the other hand, a first drive cylinder (not shown) is mounted on the main body 26a, facing the intermediate portion of the connecting member 26h.
is installed. The piston rod of this first drive cylinder protrudes so as to be driven forward and backward along the X-axis direction, and its tip is connected to the above-mentioned connecting member 26h.

In this way, by reciprocating the corresponding piston rod at high speed by this first driving cylinder, the connecting member 2
The suction member 26c, which is connected to the suction member 26c via 6h, is reciprocated at high speed along the X-axis direction, that is, it is vibrated.

(Description of the X-axis positioning section 27B) Next, as shown in FIG. A pair of engaging pieces 26
m and 26n are provided in parallel with an interval and in a falling state from each other. These engaging pieces 26m and 26n are
They are provided corresponding to the pair of suction members 26b and 26c, respectively, and are arranged so as to be located outside of the corresponding end surfaces for position regulation. In addition, these engaging pieces 26m, 26
n is attached to the inner end portions of the connecting pieces 26p and 26q that extend along the upper edges of the front end faces of the corresponding suction members 26b and 26c to positions further outward than these outer ends. is connected. The outer ends of these connecting pieces 26p and 26q connect to connecting members 26r and 2 that extend along the y-axis direction.
The front end of the 6s is attached.

On the other hand, second drive cylinders 26t extending along the y-axis direction are disposed at both end edges of the main body 26a. Each piston rod 2 of these second drive cylinders 26t
6u protrudes so as to be driven forward and backward along the y-axis direction,
These tips are connected to the rear ends of the aforementioned connecting members 26r and 26s, respectively.

In this way, the second driving cylinder 26t reciprocates the corresponding piston rod 26u at high speed, so that the engaging pieces 26m and 26n connected via the connecting pieces 26p and 26q, respectively, are moved along the y-axis. The top plate 10 is driven back and forth at high speed along the direction, that is, vibrated, so that the orifice plate 108 is brought into close contact with the front end surface of the heater board 102.
Positioning along the y-axis direction of 4 will be performed.

Since the mounting mechanism 26 is configured in this manner, the top plate 104 is suctioned and held by the pair of suction members 26b and 26c.
is moved to a predetermined position above the heater board 102 based on the drive control of the first position adjustment mechanism 14, and by releasing the suction, the top plate 104 is moved to a predetermined position above the heater board 102.
In this fallen position, the top plate 104 is moved upward by the operation of the X-axis positioning section 26A, so that the heater board 1
The position along the y-axis with respect to the heater board 102 is defined by the operation of the X-axis positioning section 26B. Incidentally, the position adjustment operation in the mounting mechanism 26 will be explained in detail later.

<Description of the second positioning mechanism 33> Next, the second positioning mechanism 33 is used to attach the base member 208, to which the heater board 102 is attached in advance, onto the second y-axis stage 32 in an accurately positioned state.
The configuration will be explained with reference to FIGS. 6A to 6C.

Similar to the first positioning mechanism 27 described above, this second positioning mechanism 33 is an X
It includes an axis positioning section 33A, an X-axis positioning section 33B that performs positioning along the y-axis direction, and a Z-axis positioning section 33C that performs positioning along the Z-axis direction.

Here, as is clear from FIG. 6A, the base member 208 to be positioned by the second positioning mechanism 33 includes a rectangular body portion 208a and a portion extending forward from the center of the front end of the body portion 208a. The heater board mounting portion 208b is integrally formed with a protruding upper surface of which the heater board 102 is fixedly mounted.

Note that this heater board 102 is previously attached and fixed to the heater board mounting portion 208b with a predetermined accuracy. Therefore, this heater board 102
By positioning the base member 208 to which the heater board 1 is attached relative to the second y-axis stage 32,
02 will be positioned with respect to the second y-axis stage 32.

Specifically, as shown in FIGS. 6A and 6B, this second positioning mechanism 33 is mounted on the second y-axis stage 32, and the mounting formed in the shape of a side abbreviation is attached to the main body 3.
3a, and a positioning table 33c supported vertically movably via a slide guide 33b on the upright inner surface of the main body 33a.

(Description of the X-axis positioning section 33A) Also, on the positioning base 33c, as shown in FIG. 6A, a pair of X-axis positioning protrusions 33d and 33e protrude upward as the X-axis positioning section 33A. are integrally formed in a state where they are lined up along the y-axis direction. The base member 208 is attached to these X-axis positioning protrusions 33d and 33e.
By abutting one side edge of the main body portion 208a along the y-axis, the position of the base member 208 along the X-axis is uniquely defined, that is, the position of the base member 208 is determined in the X-axis direction.

On the other hand, in this way, these X-axis positioning protrusions 33d, 3
In order to force one side edge of the main body portion 208a of the base member 208 along the y-axis to be in contact with the base member 208, the base member 2 is brought into contact with these X-axis positioning protrusions 33d and 33e.
An X-axis regulating lever 33f is disposed so as to be able to come into contact with the other side edge opposite to the one side edge of 08. The X-axis regulating lever 33f is rotatably supported at its base end around a first support shaft 33g, and is biased to rotate counterclockwise in the figure by a first torsion spring 33h. Is receiving. The abutting end of the X-axis regulating lever 33f is set to abut approximately the center of the other side edge of the base member 208.

(Description of the X-axis positioning section 33B) Also, on this positioning table 33c, the X-axis positioning section 3
3B, one X-axis positioning protrusion 33i protruding upward is integrally formed in close proximity to one X-axis positioning protrusion 33e. By abutting the tip edge along the X-axis of the main body portion 208a of the base member 208 whose position in the X-axis direction is predefined with this X-axis positioning protrusion 33i, the position of the base member 208 along the y-axis is uniquely determined. That is, the y-axis direction is determined.

On the other hand, in order to force the tip edge of the main body portion 208a of the base member 208 along the X-axis to contact the X-axis positioning projection 33i, the base abuts against the X-axis positioning projection 33i. An oval-shaped y-axis regulating lever 3 is provided so as to be able to come into contact with the rear end edge of the member 208 on the opposite side from the front end edge.
3j is installed. This y-axis regulation lever 33j is
The middle part (that is, the bent part forming the L-shape) is connected to the second support shaft 3.
3 so as to be rotatable in the rotational direction, and receives a counterclockwise rotation biasing force from the second torsion spring 331 in the figure. The rear end of the y-axis regulating lever 33j is set to come into contact with a substantially central portion of the rear edge of the base member 208.

Here, when the base member 208 is attached to and detached from the positioning table 33c, the urging force by the X-axis and y-axis regulating levers 33f and 33j must be released. Therefore, in this embodiment, a release mechanism 33D is provided. It is being

This release mechanism 33D includes a release cylinder 33m attached to one side edge of the positioning table 33c, as shown in FIG. 6C.
A piston rod 33n protrudes from the release cylinder 33m so as to move forward and backward along the X-axis direction and passes through the positioning base 33c. The positioning table 33c is taken out through the through holes 33p and 33q, which are formed so as to extend along the axis, in a state slightly protruding from the top surface of the positioning table 33c, and is attached to the X-axis regulating lever 33f and the Y-axis regulating lever 33j, respectively. It is composed of release pins 33r and 33s that can be contacted from the clockwise side.

Here, in this release mechanism 33D, the release cylinder 3
3m is in a non-released state and urges the piston rod 33n to a retracted state. As a result, a pair of release bins 3
3r and 33s are the corresponding X-axis regulation levers 33f, respectively.
and separates from the y-axis regulating lever 33j. In this way, in the non-released state, the X-axis regulating lever 33f and the
The shaft regulating levers 33j are rotated counterclockwise by the biasing forces of the corresponding torsion springs 33h and 33β, respectively, to position and hold the base member 208.

On the other hand, the release cylinder 33m urges the piston rod 33n to protrude in the released state. As a result, the pair of release bins 33r and 33s are respectively
It comes into contact with the shaft regulating lever 33f and the y-axis regulating lever 33j, and rotates them clockwise against the biasing forces of the corresponding torsion springs 33h and 33n. Therefore,
The respective contact ends of the X-axis regulation lever 33f and the y-axis regulation lever 33j are separated from the other side edge and the rear end edge of the base member 208, and in this way, the positioning and holding of the base member 208 is released. It will happen.

(Description of Z-axis positioning part 33C) On the other hand, as shown in FIG. 6B, the above-mentioned Z-axis positioning part 33C protrudes downward from the lower surface of the tip of the base member 208. A pair of first and second protrusions 33t and 33u arranged in parallel along the X-axis direction (FIG. 6B shows
Although only the first protrusion 33t is shown, the positions of the first and second protrusions 33t and 33u are indicated by broken lines in FIG. 6A. ), and a third protrusion 33v that is formed in the center of the upper surface of the rear end of the positioning table 33c and protrudes upward.

Here, the protrusion lengths of these first to third protrusions 33t to 33v are accurately defined in advance so that they are the same. As a result, the first and second protrusions 33t, 33u
comes into contact with the top surface of the positioning table 33c, and the third protrusion 33v comes into contact with the bottom surface of the base member 208.
The position of the base member 208 on the positioning table 33c along the Z-axis direction is accurately defined.

In the embodiment, the base member 208 is placed on the positioning table 3 in order to reliably achieve the above-mentioned contact state.
A suction mechanism 33E that sucks toward 3c is provided. As shown in FIG. 6B, this suction mechanism 33E is disposed on a positioning table 33c, and is designed to connect a ring-shaped suction pad 33w with an open top surface and a suction source (not shown). , and a connecting pipe 33x formed to penetrate inside the positioning table 33c.

Here, the height of the suction pad 33w is set slightly higher than the respective heights of the three projections 33t, 33u, and 33v described above. As a result, the base member 20
8 is placed on the positioning table 33c, the open end of the suction pad 33w is in close contact with the lower surface of the base member 208 all around. Then, by activating a suction source (not shown), this base member 208 is forcibly drawn toward the positioning table 33c, and as a result, the first
A state is forcibly set in which the second protrusions 33t and 33u reliably abut on the upper surface of the positioning table 33c, and the third protrusion 33v reliably abuts on the lower surface of the base member 208. .

By configuring the second positioning mechanism 33 in this way, the base member 208 can be placed on the positioning table 33c.
are precisely positioned along the X-axis direction, y-axis direction, and z-axis direction. As a result, in this embodiment, the top plate 104 is connected to the heater board 102.
When attaching the heater board to the heater board, it is only necessary to define the relative position of the top plate 104 with respect to the heater board 102 via the first positioning mechanism 27.

<Description of the bonding force generation mechanism 34> Next, the top plate 104 is positioned on the heater board 102.
The bonding force generating mechanism 34 that generates bonding force between the two when placed will be described with reference to FIG. 6B.

This bonding force generating mechanism 34 includes a guide shaft 34a attached to the tip of the main body 33a described above so as to be able to move up and down, and the upper end of this guide shaft 34a is fixed to the lower surface of the positioning table 33c. There is. Further, a washer 34b for adjusting the bonding force is screwed onto the upper end of the guide shaft 34a.
By rotating b, the guide shaft 34a of this
The axial position will change.

On the other hand, a coil spring 34c for generating bonding force is wound around the outer periphery of the guide shaft 34a, and the upper end of the coil spring 34c is engaged with the lower surface of the washer 34b, and the lower end is attached to the main body 33a. It is fixed on the top surface. Here, this coil spring 34c is
Supporting the weight of the positioning table 33c and the parts on it, it has shrunk to a certain extent, but by further contracting by a predetermined amount from this initial setting state where it has shrunk to a certain extent, a predetermined elastic repulsive force is generated. This elastic repulsive force is defined as the bonding force.

Since the bonding force generating mechanism 34 is configured in this way, when placing the top plate 104 on the heater board 102,
The top plate 1
04 against the heater board 102, the above-mentioned predetermined bonding force is generated between the top plate 104 and the heater board 102.

Note that this change in bonding force is achieved by rotating the above-mentioned washer 34b and biasing it along the axial direction of the guide shaft 34a, thereby changing the initially set length of the coil spring 34c. .

<Description of Calibration Chart 78> Here, as shown in FIG. 7A, a calibration chart 78 is fixed on the positioning table 33c of the second positioning mechanism 33, which will be used in a calibration operation that will be explained in detail later. ing. This calibration chart 78 is precisely arranged at a position separated by a predetermined distance along the It is formed into a rectangular parallelepiped shape.

In particular, the formation state is such that a first calibration surface 78a is defined from the front end surface of this rectangular parallelepiped-shaped calibration chart 78, and this first calibration surface 78a extends vertically exactly along the X-axis direction. In addition, it is set to extend within the same vertical plane as the front end surface of the heater board 102. Further, a second calibration surface 78b is defined from the upper surface of this rectangular parallelepiped-shaped calibration chart 78, and this second calibration surface 78b extends horizontally exactly along two axial directions, and also extends from the heater board 102. It is set so that it extends in the same horizontal plane as the top surface of. Further, a third calibration surface 78c is defined from the side surface of the rectangular parallelepiped-shaped calibration chart 78 on the side where the heater board 102 is disposed, and this third calibration surface 78c is exactly perpendicular to the y-axis direction. It is set to extend to

Here, a calibration reference point 78d is defined by the intersection of the first to third calibration planes 78a to 78c. As a result, when this calibration chart 78 is photographed by the first position detection mechanism 40, only the first calibration surface 78a is photographed, and this calibration reference point 78d is located on the screen 40A, as shown in FIG. 7B. The image is taken as the intersection of the corners located in the upper right corner of
Furthermore, when photographing is performed using the second position detection mechanism 42, only the second calibration surface 78b is photographed, as shown in FIG. 7C, and this calibration reference point 78d is located at the lower right corner of the screen 42A. It will be photographed as the intersection of the corners.

In addition, in FIG. 7A explaining the calibration chart 78, symbols 80a and 80b indicate the top plate 104 and the heater board 102.
The adhesive used to temporarily attach the and to each other is shown. These adhesives 80a.

80b is formed to have an ultraviolet curing property that hardens when irradiated with ultraviolet rays, and is set to be attached in advance to both ends of the rear edge of the heater board 102, respectively, as shown in the figure. .

(Hereinafter, blank space) (Description of the method for assembling the head nozzle 10 in the assembly apparatus 1o) Below, with reference to FIGS. A method of assembling the head nozzle 10 to which a method of bonding multiple members is applied will be described.

<Schematic procedure of assembly method> First, the schematic procedure of this assembly method will be explained with reference to the flowchart shown in FIG.

First, when an assembly operation is instructed, a variable N indicating the number of assembly operations is set to "1" in step S10. Then, in step S12, each axis stage 18, 20,
Initial setting of the drive motors 22, 28, 30.32 is performed, and subsequently, in step S14, the origin of the drive motors of each axis stage 18° 20.22, 28, 30.32 is found. By executing these steps SL2 and S14, each axis stage 18.20,
22, 28, 30, and 32 can be accurately moved to any prescribed position with respect to the surface plate 12.

After that, in step S16, the amount of deviation between the detection positions of the first and second position detection mechanisms 40.42 is calculated in advance as a calibration amount ΔX (for
8 to calibrate the deviation in the detection positions of the first and second position detection mechanisms 40 and 42. When the calibration operation in step 816 is completed, the variable N is reset to "l" in step S18, and the process proceeds to step S20.

In this step S20, the base member 208 to which the heater board 102 is attached in advance is moved from the supply position to the second position adjustment mechanism 1 via a supply robot (not shown).
6 on the second positioning mechanism 33. Then, in step S22, the supplied base member 208 is accurately positioned.

Here, in this positioning operation, based on the operation of the second positioning mechanism 33 described above, in addition to the operation of positioning the main body 33a in three axial directions, An operation of accurately measuring the amount of deviation (x,) of the discharge heater 112C located in the middle serving as a reference from the assembly work position α with respect to the X-axis direction which is the arrangement direction of these discharge heaters 112a to 112e; In order to measure the amount of deviation based on the image taken by the second ITV camera 42g, in order to accurately focus the image, an accurate position in the Z-axis direction with respect to the assembly work position α on the upper surface of the heater board 102 is determined. This includes a positioning operation.

Following this supply and positioning operation of the heater board 102, in step S24, the top plate 104 is supplied from the storage position to the first positioning mechanism 27 of the first position adjustment mechanism 14 via a supply robot (not shown). Then, in step S26, the supplied top plate 104 is moved to the base member 208, which was previously positioned via the second positioning mechanism 33 in step S22.
Temporarily place it on the heater board 102 above.

In this way, the heater board 102 and the top plate 104 to be assembled are supplied together, and the heater board 1 is positioned.
When the top plate 104 is temporarily placed on 02, step S28
In step S30, in a state where the relative positional relationship between the two along the X-axis direction is accurately defined, an operation of bonding the two is performed. When the bonding operation is completed, in step S32, the assembly as a finished product is discharged to a finished product discharge position via a robot (not shown).

The details of these X-axis positioning operations and bonding operations will be explained later as subroutines.

Then, in step S34, it is determined whether all assembly operations have been completed and all finished product ejection operations have been completed.If it is determined No in this step S34, that is, there is no assembly operation yet. If the operation is not completed and it is determined that the assembly operation is in progress, the process proceeds to step S36, where the variable N is incremented by "1", and in step S38, it is determined whether the variable N has reached a predetermined number. to judge. In this step 338, if it is determined No, that is, if it is determined that the number of assembly executions N is less than a predetermined number of times, specifically, if the number of assembly executions N is less than a predetermined number of times, If it is determined that the calibration amount ΔX is present, it is determined that the reliability of the previously calculated calibration amount ΔX is still maintained. Returning to step S20, the following assembly control procedures are repeatedly executed.

On the other hand, if it is determined YES in step S38, that is, if it is determined that the number of assembly executions N is the predetermined number of times after the earliest calibration operation, the environmental change corresponding to the temperature change Based on this, there is a possibility that the above-mentioned calibration amount ΔX has changed, and it is necessary to execute the calibration operation again and calculate this calibration amount ΔX anew (step S16 described above).
Return to , and repeat the following assembly control procedures.

In other words, if the assembly accuracy is on the order of millimeters,
First, execute the above-mentioned calibration operation, and the obtained calibration amount ΔX,
No problem will occur even if it is used throughout the entire working period of the day, but when assembly accuracy on the order of microns is required, as in this example, the calibration amount due to the temperature change described above may be required. Changes in △X will greatly affect assembly accuracy. On the other hand, in view of the above-mentioned circumstances, it is preferable to perform this calibration operation for each assembly operation. However, if a calibration operation is performed every time an assembly operation is performed in this way, the assembly time will be increased, the assembly efficiency will be reduced, and the cost of the product will be adversely affected. In this way, in order to maintain both assembly accuracy and assembly efficiency, in this embodiment, the calibration operation is set to be re-executed every predetermined number of assembly operations.

Here, after performing the calibration operation in this step S16, the variable N is reset to "1" in step S18, so the number of assemblies in this assembly operation is counted as the -th time again, and In operation, the number of assemblies is incremented by "1".

Furthermore, if it is determined YES in the above-mentioned step S34, that is, if it is determined that all assembly operations have been completed and all finished product ejection operations have been completed, at this point, this assembly Terminate the control procedure.

The individual control procedures outlined in the above-mentioned assembly control procedure will be explained in detail below as subroutines.
In fact, as already mentioned above, in order to achieve high-density printing accuracy of 360 dpi, an orifice plate 108 is used in which a large number of ejection ports 106 are formed at equal intervals over a length of about 4.5 mm. At least 64 discharge ports 1 are arranged on a heater board 102 on which 68 discharge heaters 112 are formed at a similar arrangement pitch.
06 and the discharge heater 112 are assembled in a state that corresponds to each other, and extremely accurate positioning operation and delicate application of joining force are required.

However, in the following explanation of the assembly control procedure, if the 68 discharge ports 106 and the large number of discharge heaters 112 are illustrated and explained as they actually are, the explanation will become unclear and complicated. Therefore, in the following description, as shown in FIG. 9, the orifice plate 108 is formed with five discharge ports 106, specifically, first to fifth discharge ports 106a to 106e. On the heater board 102, there are five discharge heaters 112, specifically, first to fifth discharge heaters 112a to 112.
The explanation will be given in a simplified state, with the shape e being formed.

Detailed Description of Each Subroutine> Various subroutines in the assembly control procedure schematically described with reference to FIG. 8 will be described in detail below.

(Explanation of adhesive application position) First, when the heater board supply operation is started, a supply robot (not shown) grasps and takes out the base member 208 to which the heater board 102 is attached in advance from the pick-up position. , and transported onto an adhesive application jig (not shown).

Then, the predetermined position of the heater board 102 on the base member 208 placed on this adhesive application jig, in detail,
As shown in FIG. 7A, adhesive 80a is applied to both sides of the rear edge of the heater board 102 via an adhesive application mechanism (not shown).
80b is applied respectively.

Note that, as described above, the adhesives 80a and 80b are composed of an ultraviolet curable adhesive that cures, that is, exhibits adhesive strength, by being irradiated with ultraviolet rays. In other words,
At this point of application, these adhesives 80a and 80b do not exhibit any adhesive properties and function only as liquids.

(The heater board 1 of the top plate 104 in step S2g
02) Next, referring to the flowchart shown in FIG. 10 and FIGS. 11A to 13, the top plate 1 in step 828 is
The positioning operation in the X-axis direction on the heater board 102 of No. 04 will be explained.

In the above-described temporary placement operation of the top plate 104, the mounting mechanism 26 is moved to the designed mounting position by driving the first position adjustment mechanism 14, and then this mounting is performed by moving the mounting mechanism 26 to the designed mounting position. This temporary placement operation is performed by dropping the top plate 104 onto the heater board 102 and positioning it in the designed mounting position described above.

Here, as already mentioned above, the arrangement pitch of the discharge ports 106 formed in the orifice plate 108 of the top plate 104 and the discharge heater 112 formed on the heater board 102 is on the order of microns, so In addition to the absolute positioning described above, the relative positioning of the discharge port 106 with respect to the discharge heater 112 is performed so that the discharge heater 112 and the discharge port 106 that correspond to each other are actually within a predetermined positional accuracy. Then, positioning operations must be performed so that they are combined with each other. In addition, these discharge ports 10
6 and discharge heater 112 are set in the X-axis direction, the heater board 102 of this top plate 104
It is specified that the final alignment for is performed only along the X-axis direction through image processing. - First, when this X-axis alignment operation is activated, step 52
At 8A, the top plate 104 is shifted to one side. That is, in this shifting operation, as shown in FIG. 11A, the top plate 1
The cylindrical ink receiver of No. 04 has an opening 118 connected to both suction members 26b.
, 26c, move the movable suction member 26c to the fixed suction member 26b, as shown in FIG. 11B.
The opening 118 of this ink receiver abuts against the fixed suction member 26b. Then, as shown in FIG. 11C, the movable suction member 26c is returned to its original position, and as shown in FIG. By driving the entire unit and moving the top plate 104 to a predetermined position, the shifting operation of the top plate 104 is completed.

When the shifting operation of the top plate 104 is completed, in step 528B, as shown in FIG. 12, the heater is An orifice plate 108 is attached to the front of a top plate 104 temporarily placed on a board 102.
transmits an image of the front side to the first focus state detector 48 . Then, in step S, 28C, this first
In the focus state detector 48 of the second embodiment, the second heater board 102 and the top plate 104 are moved integrally along the y-axis direction so that the focus state is achieved, that is, the focus is brought into focus. The y-axis stage 32 is driven to move.

Here, in this focusing operation, in the positioning operation of the heater board 102 described earlier, the first I
Since the focus of the TV camera 40g is substantially on the front surface of the orifice plate 108, this focusing operation can be completed within an extremely short time, and the front surface of the orifice plate 108 is outside the focusing range. This will surely prevent the focusing operation from becoming impossible.

When the focusing operation is completed in step 528C, the first ITV camera 40g in the first position detection mechanism 40 is fixed to the front side of the top plate 104 temporarily placed on the heater board 102 in step 528D. The front surface of the orifice plate 108 is photographed. The image of the orifice plate 108 taken by the first ITV camera 40g has been focused as described above, so it is a clearly focused image as shown in FIG. ing.

After this, in step 328H, step 328C
The captured image is transmitted to the image processing device 44 via the first signal converter 46, and the process proceeds to step 528F.
Based on the image taken through the first ITv camera 40g, the distance xH from the center of the screen to the center position of the discharge hole 106 that is determined to be closest to the central discharge heater 112C is electrically calculated. Measure. Here, as explained in the positioning operation of the heater board 102 in step S22, the center line of the screen corresponds to the assembly work position α, and this distance x is calculated from the assembly work position α to the center discharge heater. It represents the amount of deviation along the X-axis direction up to the discharge hole 106 that will be combined with 112C.

Discharge port 1 corresponding to the central discharge heater 112C described above
After measuring the amount of deviation XM from the center line of 06, in step 528F, the discharge heater 11 located at the center
2C and the corresponding discharge port 106, it is necessary to move the top plate 104 including the orifice plate 108 in which the discharge port 106 is formed along the X-axis direction. The amount of movement Xa is calculated from the equation shown below.

X7''Xn If it is determined to be YES, that is, if it is determined that the movement amount Xr is smaller than the adjustment standard range C, the control unit 38 controls the heater board 102.
It is determined that the positions in the X-axis direction of each discharge heater 112 and the discharge hole 106 formed in the orifice plate 108 of the top plate 104 match each other, and the control procedure for this X-axis direction positioning operation is ended. and return to the main routine.

On the other hand, if it is determined No in step 528G described above, that is, if it is determined that the movement amount Xa is larger than the adjustment standard range C, the first X-axis drive stage 18 is Then, the top plate 104 is moved by an amount corresponding to this moving amount Xa, and the process returns to step 528D described above.

By positioning the top plate 104 with respect to the heater board 102 in this way, the heater board 102
The discharge heater 112c located in the center of 2 and the top plate 104
The discharge heater 11 in the orifice plate 108 of
The mutual center line with the discharge port 106 closest to 2C is
They will match in the X-axis direction.

In this way, a series of positioning operations between the top plate 104 and the heater board 102 along the X-axis direction are completed, and the control procedure returns to the original main routine.

(The heater board 1 of the top plate 104 in step S30
02) Next, with reference to the flowchart shown in FIG. 14 and FIG. 15, step S3
The operation of adhering the top plate 104 onto the heater board 102 in 0 will be described.

When the positioning operation of the top plate 104 with respect to the heater board 102 in the X-axis direction in step S28 described above is completed, first, in step 530A, the first Z-axis stage 20 in the first position adjustment mechanism 14 is activated, The entire first positioning mechanism 27, and thus the first and second suction members 26b and 26c, are lowered by a predetermined amount along the X-axis direction. These first and second suction members 26
b and 26c will come into contact with the top plate 104 during the descent, and the top plate 104 that has come into contact with it will be connected to the joining force generating mechanism 34 with the heater board 102 integrally below it. It is pushed down against the biasing force of the coil spring 34c.

Here, the predetermined amount of descent of the first Z-axis stage 20 described above is caused by the depression of the top plate 104 and the heater board 102 accompanying this descent, which causes the coil spring 34 to be lowered.
The biasing force generated at c is applied to the top plate 104 and the heater board 10.
2 is set to a value sufficient to act as a predetermined bonding force.

In this way, in a state where a predetermined bonding force is generated between the heater board 102 and the top plate 104, step 330
At B, the ultraviolet light source 58 emits ultraviolet light. The ultraviolet rays are brought to a pair of ultraviolet-transparent suction members 26b, 26c via a pair of light guides 56, and are irradiated onto adhesives 80a, 80b after passing through them.

As a result, since these adhesives 80a and 80b have ultraviolet curing properties, these adhesives 80a.

80b starts to harden, that is, exhibits adhesive properties. That is, the heater board 102 and the top plate 104 are in close contact with each other with a predetermined bonding force, and the adhesives 80a, 80
They will be bonded to each other via b.

As mentioned above, when changing the bonding force in this bonding force generating mechanism 34, rotate the washer 34b,
This is achieved by changing the amount of deformation of the coil spring 34c by moving the guide shaft 34a along the axial direction.

After that, in step 530C, wait for a predetermined time to elapse and wait for the adhesives 80a and 80b to be completely cured, and then in step 530D, the first two-axis stage 20 in the first position adjustment mechanism 14 is Start the
The entire first positioning mechanism 27 is therefore
Raise the suction members 26b and 26c along the two axial directions by the same raising amount U as the above-mentioned lowering scale. As a result, the first and second suction members 26b and 26c
It will rise to a position far above from 4 and wait.

In this way, the series of bonding operation control procedures is completed,
Return to the original main routine.

As detailed above, by carrying out the assembly device 10 of this embodiment and the assembly method in this assembly device 10,
Heater board 102 and top plate 104 which are microfabricated parts
After assembling the discharge heater 112 of the heater board 102 and the discharge port 106 of the top plate 104 with each other accurately with a predetermined precision, without applying excessive force to them and damaging them, This allows them to be glued together.

(Hereinafter, blank space) In particular, in the above-mentioned embodiment, this assembly device lO
This makes it possible to eliminate manual operations from the entire assembly process and achieve fully automatic assembly. As a result,
In the assembly operation of this assembly device 10, the heater board 102 as a first member and the top plate 10 as a second member
4. After aligning the two, specifically, the discharge heater 112C on the heater board 102 and the discharge hole 106 formed in the orifice plate 108 of the top plate 104 are aligned.
After aligning the heater board 102 and the top plate 104 so that they match each other along the X-axis direction, when bonding the heater board 102 and the top plate 104 to each other, an ultraviolet curable adhesive is applied between them in advance, and the heater board 120 The above-mentioned positioning operation is performed with the ultraviolet curable adhesive interposed between the top plate 104 and the top plate 104, and after that, with the two bonded with a predetermined bonding force, ultraviolet rays are applied. By irradiating
The adhesive is cured to bond the two together.

As a result, according to this embodiment, it is unnecessary for the operator to hold the heater board 102 and the top plate 104, and in this way, a positional shift between the two occurs until the adhesive hardens. This will definitely eliminate the risk of this happening.

Further, since the worker is freed from the task of holding the heater board 102 and the top plate 104 for a long time, the fatigue of the worker is reduced and work efficiency can be improved.

[Effects of the Invention] As detailed above, the method for bonding multiple members according to the present invention maintains the relative positional relationship between the first part of the first member and the second part of the second member. , an adhesion method in which a first and a second member are adhered to each other in a state in which the first and second members are brought into close contact with each other by a bonding force generated in the z-axis direction by a bonding force generating means, the adhesive surface of the first member being bonded to an adhesive application step of applying an ultraviolet curable adhesive; a placing step of placing the first member on the bonding force generating means; and a step of placing the first and second parts in the X-axis and y-axis directions. a matching step in which one of the first and second members is moved toward the other in the Z-axis direction, a bonding force is generated in the bonding force generating means, and a pressure welding step in which the two members are brought into pressure contact with each other. and an ultraviolet irradiation step of irradiating the adhesive interposed between the first and second members with ultraviolet rays while the first and second members are in pressure contact with each other in the pressure welding step. It is a feature.

In the method for bonding multiple members according to the present invention, the ultraviolet ray irradiation step includes guiding ultraviolet light emitted from an ultraviolet light source spaced from the bonding position to the bonding position via a light guide, and applying the ultraviolet light to the adhesive. It is characterized by irradiating ultraviolet light.

Further, in the method for adhering multiple members according to the present invention, at least one of the first and second members is formed to have UV transmittance, and the light guide is formed on the surface of the member that has UV transmittance. The ultraviolet ray irradiation step is characterized in that the adhesive is irradiated with ultraviolet rays through this ultraviolet-transparent member.

Therefore, according to the present invention, there is provided a method for bonding multiple members that can maintain the members to be bonded in a constant state throughout the bonding process and prevent the occurrence of misalignment. .

Moreover, according to this invention, even without using instant adhesive,
A method for bonding multiple members that can shorten bonding work time will be provided.

(Hereafter, margin)

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the configuration of an inkjet cartridge that is removably installed in an inkjet recording apparatus in which a head nozzle assembled with an assembly apparatus to which the method of bonding multiple members according to the present invention is applied; Figure 2 is a perspective view showing the configuration of the head nozzle to be assembled with this assembly device; Figure 3 is a top view showing the configuration of a heater board that defines one component of the head nozzle; Figure 4 is a perspective view of this configuration. A diagram schematically showing the configuration of a head nozzle assembly device to which an embodiment of the method for bonding multiple members according to the invention is applied; FIG. A perspective view schematically showing the structure of the mechanism; FIG. 6A is a top view showing the structure of the second positioning mechanism in the second position adjustment mechanism; FIG. 6B is a structure of the joining force generation mechanism together with the second positioning mechanism. Figure 6C is a top view showing the configuration of the release mechanism in the second positioning mechanism; Figure 7A is a perspective view showing how the calibration chart is installed; Figure 7B is the first position detection A diagram showing an image of the calibration chart taken by the first ITV camera in the mechanism; Figure 7C is a diagram showing an image of the calibration chart taken by the second ITV camera in the second position detection mechanism; A flowchart showing a control procedure of an assembly method in which an embodiment of the method for bonding multiple members according to the invention is carried out; FIG. A perspective view showing the board and the top board in a simplified state; FIG. 10 is a flowchart showing the control procedure for positioning the top board with respect to the heater board in the X-axis direction; FIGS. 11A to 11D are Figures showing the steps of the shifting operation in sequence; Figure 12 is a perspective view showing the photographed state of the orifice plate during the X-axis alignment operation of the top plate with respect to the heater board; Figure 13 is the orifice plate photographed with the first ITV camera FIG. 14 is a flowchart showing the bonding operation between the top plate and the heater board; and FIG. 15 is a diagram for explaining the bonding force generation state. In the figure, 10... assembly device, 12... surface plate, 14...
・First position adjustment mechanism, 16... Second position adjustment mechanism, 18... First X-axis stage, 20... First Z-axis stage
Axis stage, 22...first y-axis stage, 24...
・Spacer, 26...Mechanism, 27...First
positioning mechanism, 27A...X-axis positioning section, 27B
...X-axis positioning unit, 28...second X-axis stage, 30...second Z-axis stage, 32...second y-axis
Axis stage, 33... second positioning mechanism, 33A.
...X-axis positioning section, 33B...X-axis positioning section, 3
3C...Z-axis positioning part, 33D...Release mechanism, 3
3E... Suction mechanism, 34-... Bonding force generation mechanism, 36
a;-36b;36c;36d;36e
36 f-...driver, 38...control unit, 40...first position detection mechanism, 42...second position detection mechanism, 44...image processing device, 46...th 1 signal converter, 48...first focus state detector, 5
0... Second signal converter, 52... Second focus state detector, 54... Temporary attachment mechanism, 56... Light guide, 58... Ultraviolet light source, 60... CRT monitor, 6
2...Keyboard, 64...ITV monitor, 66...
...Operation panel, 68...Keyboard, 70...CRT
Monitor, 72... Printer, 74... Data disk, 76... Program disk, 78... Calibration chart, 80 a; 80 b - Adhesive, 100.
... Head nozzle, 102 ... Heater board, 104
... Grooved top plate, 106... Discharge port, 108... Orifice plate, 110... Substrate, 112... Discharge heater, 114... Electrical wiring, 116... Top plate body, 118...The ink receiver is a mouth. Fig. 6A Fig. 6C Mistake 9 Fig. 11B Fig. 11D Fig. l 112 Fig. 13 Fig. j Raku 11 To S Section 14 Fig. 15 rM

Claims (3)

[Claims] (1) While maintaining the relative positional relationship between the first part of the first member and the second part of the second member, the first and second members are
An adhesion method in which the first member is bonded to each other in a state in which they are brought into close contact with each other by a bonding force generated in the z-axis direction by a bonding force generating means, the bonding method comprising applying an ultraviolet curable adhesive to the surface of the first member to be bonded. a step of applying an agent, a placing step of placing the first member on the bonding force generating means, a matching step of making the first and second parts match each other in the x-axis and y-axis directions, and the first member a pressure welding step in which one of the first and second members is moved toward the other in the z-axis direction, and the bonding force is generated in the bonding force generating means to press the two members together; A method for bonding a plurality of members, comprising the step of irradiating ultraviolet rays to the adhesive interposed between the first and second members while the members are in pressure contact with each other. (2) The ultraviolet irradiation step is characterized in that the ultraviolet rays emitted from an ultraviolet light source spaced from the bonding position are guided to the bonding position via a light guide, and the adhesive is irradiated with the ultraviolet rays. The method for adhering multiple members according to item 1. (3) At least one of the first and second members is formed to have ultraviolet transmittance, and the light guide terminates at the surface of the ultraviolet transmittable member, and the ultraviolet irradiation step 3. The method of bonding multiple members according to claim 2, wherein the adhesive is irradiated with ultraviolet rays through the ultraviolet-transparent member.