JPH05291792A - Parts fitting method - Google Patents

Parts fitting method

Info

Publication number
JPH05291792A
JPH05291792A JP4083961A JP8396192A JPH05291792A JP H05291792 A JPH05291792 A JP H05291792A JP 4083961 A JP4083961 A JP 4083961A JP 8396192 A JP8396192 A JP 8396192A JP H05291792 A JPH05291792 A JP H05291792A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
parts
small
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4083961A
Other languages
Japanese (ja)
Other versions
JP3005360B2 (en
Inventor
Hidefumi Hijiya
秀文 泥谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP4083961A priority Critical patent/JP3005360B2/en
Publication of JPH05291792A publication Critical patent/JPH05291792A/en
Application granted granted Critical
Publication of JP3005360B2 publication Critical patent/JP3005360B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To reduce traveling distance of a parts fitting device by fitting first parts consecutively according to an arrangement order of a plurality of small printed circuit board patterns, at the same time tracing the arrangement order of the small printed circuit board pattern inversely, and repeating forward and backward orders alternatively. CONSTITUTION:First parts are consecutively fitted from a first small printed circuit board pattern A to a last small printed circuit board pattern D according to the arrangement order of small printed circuit board patterns A, B, C, and D. Then, second parts are fitted from the last small printed circuit board pattern D to the first small circuit board pattern A by tracing the arrangement order of the small printed circuit board patterns A, B, C, and D inversely. Then, third parts are fitted from the small printed circuit board pattern A to the small printed circuit board pattern D again. In the same manner, parts are fitted alternately and repeatedly in forward and backward directions, thus fitting all parts and hence reducing traveling distances of a parts fitting nozzle and a printed circuit board supporting device.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器に使用する回
路基板であって、部品装着後複数個の小基板に分割され
るタイプのもの、すなわち多面取り基板に部品を装着す
る方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for electronic equipment, which is of a type that is divided into a plurality of small boards after mounting the parts, that is, a method for mounting the parts on a multi-sided board.

【0002】[0002]

【従来の技術】1枚の基板に複数個の小基板パタ−ンを
作り、部品装着後、これを分割して複数の小基板を得る
ことは、現に広く行われている。文献に現れた例として
は、特開昭64−47100号公報、特開平1−103
709号公報、特開平1−105600号公報、特開平
1−212498号公報等に記載されたものがある。
2. Description of the Related Art It is now widely practiced to make a plurality of small board patterns on one board, mount the components, and then divide the board to obtain a plurality of small boards. Examples appearing in the literature include Japanese Patent Laid-Open Nos. 64-47100 and 1-103.
709, JP-A-1-105600, and JP-A 1-212498.

【0003】[0003]

【発明が解決しようとする課題】多面取り基板に部品を
装着するに際し、装着順序の組立てに二通りの手法があ
る。その一は特定の小基板パタ−ンに作業を集中し、こ
の小基板パタ−ンにすべての部品を装着し終わった後、
次の小基板パタ−ンに対する部品装着を開始する手法で
あり、これをパタ−ンリピ−ト方式と称する。その二
は、特定種類の部品をすべての小基板パタ−ンに装着し
て行き、それが終わったら次の種類の部品を再びすべて
の小基板パタ−ンに装着して行く手法であり、これをス
テップアンドリピ−ト方式と称する。基板設計、部品配
置、部品装着装置の特性等に応じ、より能率の上がる方
式を採用することになるが、ここでは、ステップアンド
リピ−ト方式による部品装着の模様を、図6に基づき説
明する。図において、A、B、C、Dは多面取り基板に
「田」の字形に配置された小基板パタ−ンである。小基
板パタ−ンA、B、C、Dは同一規格のもので、同じ位
置に同じ種類の部品が装着される。1、2、3は部品の
装着位置を示す。これまでのやり方は、A、B、C、D
の順序で各小基板パタ−ン内の位置1に部品を装着し、
その後再びAに戻り、位置2への部品を開始する。位置
2への部品装着をパタ−ンDまで終了した後、再びAに
戻って位置3への部品装着を開始する、というものであ
った。ところがこのやり方では、作業エンド位置から次
の作業のスタ−ト位置までの距離が長く、作業タクト短
縮の障害になっていた。
There are two methods for assembling the mounting sequence when mounting the components on the multi-chamber substrate. One is to concentrate the work on a specific small board pattern, and after mounting all the parts on this small board pattern,
This is a method of starting the component mounting to the next small board pattern, which is called a pattern repeat method. The second is a method of mounting parts of a specific type on all small board patterns, and then mounting parts of the next type on all small board patterns again. Is called a step and repeat system. A more efficient method will be adopted according to the board design, the component arrangement, the characteristics of the component mounting apparatus, etc. Here, the pattern of component mounting by the step-and-repeat method will be described with reference to FIG. . In the figure, A, B, C, and D are small board patterns arranged in a "T" shape on the multi-chambered board. The small board patterns A, B, C and D have the same standard, and the same type of components are mounted at the same position. Reference numerals 1, 2, and 3 indicate component mounting positions. The conventional method is A, B, C, D
Place the component in position 1 in each small board pattern in the order of,
After that, the process returns to A again, and the component to the position 2 is started. After the component mounting at the position 2 is completed up to the pattern D, the process returns to A and the component mounting at the position 3 is started. However, with this method, the distance from the work end position to the start position for the next work is long, which is an obstacle to shortening the work tact.

【0004】[0004]

【課題を解決するための手段】本発明では、第1の部品
を、最初の小基板パタ−ンから最後の小基板パタ−ンま
で、小基板パタ−ンの配列順序に従いつつ順次装着する
と共に、第2の部品については、最後の小基板パタ−ン
から装着を開始して最初の小基板パタ−ンまで、小基板
パタ−ンの配列順序を逆にたどり、以下同様にして正順
と逆順を交互に繰り返しつつ部品を装着する。
According to the present invention, the first component is sequentially mounted from the first small board pattern to the last small board pattern in accordance with the arrangement order of the small board patterns. As for the second part, the mounting order is started from the last small board pattern to the first small board pattern, the arrangement order of the small board patterns is reversed, and the same order is obtained. Parts are mounted while alternately repeating the reverse order.

【0005】[0005]

【作用】次のステップの装着作業を、同じ小基板パタ−
ンの中で開始するため、部品装着ノズルないし基板支持
装置の移動距離が短くなり、作業タクトを短縮できる。
[Function] The same small board pattern can be used for the mounting work of the next step.
Since it is started in the process, the moving distance of the component mounting nozzle or the substrate supporting device is shortened, and the working tact can be shortened.

【0006】[0006]

【実施例】図に基づき一実施例を説明する。図2の部品
装着装置10は、構成要素を図3のようにレイアウトし
ている。図3において、12は吸着装置、14は部品供
給装置、16は供給側基板搬送装置、18は収納側基板
搬送装置、20は基板位置決め装置である。基板位置決
め装置20はXYテ−ブルを主体に構成されるものであ
り、供給側基板搬送装置16から基板(多面取り基板)
22を受け取り、この基板22の部品装着個所を作業地
点に順次位置決めする。所要の部品をすべて装着した
後、基板位置決め装置20は収納側基板搬送装置18に
基板22を引き渡す。
Embodiment An embodiment will be described with reference to the drawings. The component mounting apparatus 10 of FIG. 2 has its components laid out as shown in FIG. In FIG. 3, reference numeral 12 is a suction device, 14 is a component supply device, 16 is a supply-side substrate transfer device, 18 is a storage-side substrate transfer device, and 20 is a substrate positioning device. The substrate positioning device 20 is mainly composed of an XY table, and is connected to the substrate (multi-chamber substrate) from the supply-side substrate transfer device 16
22 is received, and the component mounting locations of the substrate 22 are sequentially positioned at the work points. After mounting all the required components, the board positioning device 20 delivers the board 22 to the storage-side board transfer device 18.

【0007】部品供給装置14は、直線移動する可動支
持台24の上に複数個の部品供給ユニット26を並べた
ものである。部品供給の方式は、テ−プ、マガジン、バ
ルクホッパ等が現今多く採用されているが、そのいずれ
であっても良い。吸着装置12は、ロ−タリ−インデッ
クステ−ブルの周縁に複数個の装着ヘッドを設けたもの
であるが、この構成は周知なので詳細な説明は略す。
The component supply device 14 is formed by arranging a plurality of component supply units 26 on a movable support 24 that moves linearly. Tapes, magazines, bulk hoppers, etc. are currently widely used as the parts supply system, but any of them may be used. The suction device 12 is provided with a plurality of mounting heads on the peripheral edge of the rotary index table, but since this configuration is well known, detailed description thereof will be omitted.

【0008】図4に部品装着装置10の制御系統を示
す。30は演算処理部32とメモリ34により構成され
る制御部である。制御部30には、吸着装置12、部品
供給装置14、供給側基板搬送装置16、収納側基板搬
送装置18、基板位置決め装置20の他、部品位置規正
装置36、デ−タ入力部38、キ−ボ−ド40が入出力
インタ−フェ−ス42を介して接続されている。
FIG. 4 shows a control system of the component mounting apparatus 10. Reference numeral 30 is a control unit including an arithmetic processing unit 32 and a memory 34. The control unit 30 includes a suction device 12, a component supply device 14, a supply-side substrate transfer device 16, a storage-side substrate transfer device 18, a substrate positioning device 20, a component position regulating device 36, a data input unit 38, and a key. A board 40 is connected via an input / output interface 42.

【0009】多面取り基板22に対する部品装着順序は
次のようになる。図1に示すように、小基板パタ−ン
A、B、C、Dの順序で、まず位置1に第1の部品を装
着する。次に位置2に第2の部品を装着するのである
が、今度は小基板パタ−ンDから装着を開始し、今の順
序を逆にたどって、小基板パタ−ンAでこのステップの
作業を終える。続いて位置3に第3の部品を装着するに
あたっては、再び小基板パタ−ンから作業を開始し、小
基板パタ−ンDで作業を終える。このように正順と逆順
の部品装着を交互に繰り返しつつ、すべての部品を装着
する。
The order of mounting components on the multi-sided board 22 is as follows. As shown in FIG. 1, in the order of small board patterns A, B, C and D, the first component is first mounted at the position 1. Next, the second component is mounted at position 2. This time, the mounting is started from small board pattern D, the order is reversed, and the work of this step is carried out with small board pattern A. To finish. Subsequently, when mounting the third component at the position 3, the work is started again from the small board pattern, and the work is finished with the small board pattern D. In this way, all the components are mounted while alternately repeating the normal and reverse component mounting.

【0010】[0010]

【発明の効果】本発明によれば、同一小基板パタ−ン内
での移動を多く、それに比例して小基板パタ−ンの境界
を飛び越す回数を少なくでき、作業時間の短縮に効果が
ある。
According to the present invention, there are many movements within the same small board pattern, and the number of times of jumping over the boundaries of the small board patterns can be reduced in proportion thereto, which is effective in shortening the working time. .

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による部品装着手順を示す多面取り基板
の上面図である。
FIG. 1 is a top view of a multi-panel board showing a component mounting procedure according to the present invention.

【図2】部品装着装置の斜視図である。FIG. 2 is a perspective view of a component mounting device.

【図3】部品装着装置の構成要素のレイアウトを示す図
である。
FIG. 3 is a diagram showing a layout of components of the component mounting apparatus.

【図4】部品装着装置の制御系統を示すブロック図であ
る。
FIG. 4 is a block diagram showing a control system of the component mounting apparatus.

【図5】装着順序決定のフロ−チャ−トである。FIG. 5 is a flowchart for determining a mounting order.

【図6】本発明によらない部品装着手順を示す多面取り
基板の上面図である。
FIG. 6 is a top view of a multi-sided board showing a component mounting procedure according to the present invention.

【符号の説明】[Explanation of symbols]

22 多面取り基板 A 小基板パタ−ン B 小基板パタ−ン C 小基板パタ−ン D 小基板パタ−ン 22 Multi-Chamfering Board A Small Board Pattern B Small Board Pattern C Small Board Pattern D Small Board Pattern

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 部品装着後分割され、複数個の小基板と
なる多面取り基板に、ステップアンドリピ−ト方式で部
品を装着するものにおいて、 第1の部品を、最初の小基板パタ−ンから最後の小基板
パタ−ンまで、小基板パタ−ンの配列順序に従いつつ順
次装着すると共に、第2の部品については、最後の小基
板パタ−ンから装着を開始して最初の小基板パタ−ンま
で、小基板パタ−ンの配列順序を逆にたどり、以下同様
にして正順と逆順を交互に繰り返しつつ部品を装着して
行くことを特徴とする部品装着方法。
1. A method for mounting a component on a multi-chambered substrate, which is divided into a plurality of small substrates after component mounting by a step-and-repeat method, wherein the first component is the first small substrate pattern. From the last small board pattern to the last small board pattern in order according to the arrangement order of the small board patterns, and for the second component, the mounting starts from the last small board pattern to the first small board pattern. The component mounting method is characterized in that the sequence of arranging the small board patterns is reversed until the same time, and the components are mounted while alternately repeating the forward order and the reverse order in the same manner.
JP4083961A 1992-04-06 1992-04-06 Component mounting method Expired - Lifetime JP3005360B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4083961A JP3005360B2 (en) 1992-04-06 1992-04-06 Component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4083961A JP3005360B2 (en) 1992-04-06 1992-04-06 Component mounting method

Publications (2)

Publication Number Publication Date
JPH05291792A true JPH05291792A (en) 1993-11-05
JP3005360B2 JP3005360B2 (en) 2000-01-31

Family

ID=13817161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4083961A Expired - Lifetime JP3005360B2 (en) 1992-04-06 1992-04-06 Component mounting method

Country Status (1)

Country Link
JP (1) JP3005360B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101632055B1 (en) * 2014-05-13 2016-06-20 박지은 Chinese education system and method

Also Published As

Publication number Publication date
JP3005360B2 (en) 2000-01-31

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