JPH05291753A - Manufacture of multilayer printed wiring board - Google Patents

Abstract

PURPOSE:To lessen the dust occurring from the constituent material being fixed by driving a fixture by aligning the constituent material requiring alignment, and laying a prepreg and the constituent material on top of each other. CONSTITUTION:A constituent material 4 requiring alignment is laid on a prepreg, being aligned by the positioning pin 1 of a positioning table 1, and an adhesive tape 6 is stuck to the place in which to drive a fixture 5, and the fixture 5 is driven.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board.

[0002]

2. Description of the Related Art As a method for manufacturing a multilayer printed wiring board,
There is the following method, which is a compromise between the maslamination method and the pin lamination method. Multiple inner layer circuit boards,
Prepreg, copper foil or a single-sided copper-clad laminated plate, the required number of components, holes with the same diameter and pitch at each predetermined position, insert pins into this hole to align each component, In this position, a fixing tool such as a needle is driven to fix each component, the pins are removed, and then heat and pressure are applied to form a multilayer (for example, Japanese Patent Laid-Open Nos. 62-82025 and 62-62). -144937, Japanese Patent Laid-Open No. 1-11
No. 92553). Since this method aligns the components outside the press, the work efficiency is high and the press rotation efficiency is high.

[0003]

However, according to this method, a large amount of dust such as resin powder and glass fiber is generated and scattered during the driving of the fixing tool and before moving to the next step after the driving, resulting in the multilayer printing. Not only did the appearance and surface smoothness of the wiring board deteriorate, but the working environment also deteriorated.
The present invention relates to a method for manufacturing a multilayer printed wiring board in which a prepreg and a constituent material are aligned with each other with respect to a constituent material that requires alignment, a fixing tool is driven in to fix the constituent materials to each other, and then heat and pressure are applied to form a multilayer bond. In the above, it is an object of the present invention to reduce the generation of dust due to driving of the fixture.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a prepreg and a component are overlapped by aligning the components requiring alignment, and a fixing tool is driven to fix the components to each other, followed by heating and pressing. In the method for manufacturing a multilayer printed wiring board, which is laminated in multiple layers, a method for manufacturing a multilayer printed wiring board is characterized in that a fixing tool is driven after dust-proofing is applied to a location where the fixing tool is driven.

As the dustproof treatment method, there are a method of applying an adhesive tape, a method of applying a dustproof paint and the like, but it is preferable to use the adhesive tapes from the viewpoint of work efficiency and material procurement. As the adhesive tape, cellophane tape, polyester film tape and the like are preferable, and either one side or both sides may be used. Also, special adhesive tapes such as polyimide may be used. The place where the dustproof treatment is performed is the place where the fixing tool is driven in at the end of the constituent material. This part is
It is cut off after multi-layer adhesion.

[0006]

The dust generated from the surface of the outermost prepreg of the component, when the fixture is driven, penetrates the prepreg to destroy the adhesion state between the fiber of the base material and the resin, and the resin powder and the glass. It occurs because fibers and the like are easily dropped or separated. Therefore, if dust-proof treatment is applied to the place where the fixing tool is driven, the resin powder and glass fiber are not removed even if they are removed by the driving of the fixing tool, and the resin powder and the glass fiber do not scatter around.

[0007]

Embodiment 1 As shown in FIG. 1, the inner layer circuit board 2 and the prepreg 3 are superposed on the positioning table 1 by aligning the inner layer circuit boards 2 with each other by means of the positioning pins 7 to form the component material 4. did.
The polyester base adhesive tape 6 is attached to the fixing tool driving position of the outermost layer prepreg surface (both upper and lower surfaces) of the constituent material 4, the fixing tool 5 is driven and the positioning table 1 is removed,
It was heated and pressed to obtain a multilayer printed wiring board.

Example 2 As shown in FIG. 2, a polyester base pressure-sensitive adhesive tape was attached to the fixing member on the outermost prepreg surface (both upper and lower surfaces) of the component 4 so as to cover the position and the side face of the fixing member, and the fixing member was driven. Then, a multilayer printed wiring board was obtained in the same manner as in Example 1 below.

Comparative Example A component 4 was formed on a positioning table 1 and a multilayer printed wiring board was obtained in the same manner as in Example 1.

For each of the above examples and comparative examples, the amount of dust generated during the construction work and the subsequent handling was measured. The results are shown in Table 1. As is clear from Table 1,
When the adhesive tape is attached, the amount of dust is reduced both when the fixture is driven and when it is subsequently handled. In particular,
Generation of fine dust can also be prevented by performing dustproof treatment on the side surfaces of the constituent materials.

[0011]

[Table 1]

[0012]

EFFECTS OF THE INVENTION According to the present invention, before the fastener is driven, a resin tape is removed from the base material when the fastener is driven by attaching an adhesive tape or the like to the position where the fastener is inserted to perform dustproof treatment.
It is possible to prevent the generation of secondary dust due to the dust caused by the detachment and the driving of the fixture after the fastener is driven in, the appearance and surface smoothness of the multilayer printed wiring board are not impaired, and the working environment does not deteriorate.

[Brief description of drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention,
(2) is a plan view.

FIG. 2 is a sectional view of Embodiment 2 of the present invention,
(2) is a plan view.

[Explanation of symbols]

 1 Positioning Table 2 Inner Layer Circuit Board 3 Prepreg 4 Components 5 Fixture 6 Polyester Base Adhesive Tape 7 Positioning Pin

Claims (1)

[Claims] 1. A multi-layer printed wiring board in which a prepreg and a component are overlapped with each other in alignment with respect to a component requiring alignment, and a fixing tool is driven to fix the components to each other, followed by heating and pressurizing to make a multilayer adhesion. A method for manufacturing a multilayer printed wiring board, characterized in that, in the manufacturing method, the fixing tool is driven after dust-proofing is applied to a position where the fixing tool is driven.