JPH05291349A - Flexible base for packaging semiconductor chip and mold for resin sealing semiconductor which is packaged on it - Google Patents

Abstract

PURPOSE:To provide a flexible base for packaging a semiconductor chip which can prevent burr from being generated when resin sealing and a mold which is used for resin sealing the semiconductor which is packaged on the above base. CONSTITUTION:For preventing burr from being generated when resin sealing an IC chip which is mounted to a flexible tape such as a TAB tape, a step part 24 which is lower than the thickness of a film 34 is formed at a part which is in contact with a lead group out of edges along a cavity 14b of a lower mold 4. Then, when the TAB tape is pressed and held by upper and lower molds so that the step is engaged to the edge of the film when an IC chip 32 is sealed by resin, a film strikes through between the leads since the film is generally softer than a lead 36, thus reducing clearance between the leads.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for resin-sealing a flexible base material such as a TAB tape used for mounting a semiconductor chip such as a microprocessor and a semiconductor chip mounted on the flexible base material. It is about molds.

[0002]

2. Description of the Related Art TAB (Tape Automated Bonding) technology is one of the IC chip mounting technologies. It enables the formation of leads with a narrower number of pins than other mounting technologies, and it is a face-up high-speed automatic bonding. There is a feature that can be done. For this reason, the TAB technology has been particularly attracting attention in recent years. Figure 11 shows a typical TAB that is normally used.
FIG. 12 is a schematic plan view of the tape, and FIG. 12 is a schematic cross-sectional view taken along the line D-D of FIG. 11 showing a state where the TAB tape shown in FIG. 11 is sandwiched between resin molding dies.

The TAB tape shown in FIG. 11 has an IC chip 132 and a film carrier in which leads 136 are formed on a film 134. The IC chip 132 is joined to the leads 136 via bumps (not shown). The film 134 has a device hole 133 in which the IC chip 132 is placed, and two types of punching parts 14
2, 144 are formed. Lead group 136a-1
36d is pulled out in four directions of up, down, left and right as shown in FIG. Further, the portion surrounded by the alternate long and short dash line in FIG. 11 is a resin-molded region, and the portion of the resin-sealed tape is supported by the supporting portion 146.

By the way, a transfer molding method is mainly used to seal the IC chip 132 with a resin in order to protect the IC chip 132. As shown in FIG. 12, the transfer mold method uses an upper mold 102 and a lower mold 10.
A resin injection chamber 1 for the upper mold 102 and the lower mold 104, in which a TAB tape on which an IC chip 132 is mounted is sandwiched by a resin molding mold composed of
It is a method of pouring into 14 and solidifying. According to this method
If the speed of injecting the molten resin into the resin molding die is low, there is an advantage that a product of a certain quality can be mass-produced without impairing the characteristics of IC chips and the like.

[0005]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
When a lead formed on a flexible tape such as a tape is sandwiched between resin molding dies, a gap is formed between the leads because the lead has a thickness. Generally, the resin can enter the 50-micron gap if it is present. Therefore, when the resin is injected into the resin-molding die, the amount of the resin varies depending on the thickness of the leads, but the resin also flows between the leads to cause resin burr between the leads. For this reason, when punching out the resin-sealed TAB tape, there is a problem that the lead is deformed or cut due to the burr.

On the other hand, in the method described in Japanese Patent Laid-Open No. 01-183837, the package die is TAB.
By pressing the tape from above and below and forcibly deforming the tape by the pressing force, the gap between the lead and the tape is filled and the resin leakage is prevented. Usually, the resin leakage is stopped by this method, but due to the pressing force of the mold applied to fill the gap between the lead and the tape, the lead may be deformed and the conductivity may be deteriorated.

There is also a device in which the shape of the lead wire is devised to prevent resin leakage, as in US Pat. No. 3,689,991 and US Pat. No. 5,031,022. However,
In these cases, in the portion where the lead wire is not drawn out (the same as the support portion 146 in FIG. 11), a gap is formed between the upper mold and the film by the thickness of the lead, and therefore the resin protrudes from this portion. There is a problem that burr may occur.

The present invention has been made based on the above circumstances, and a flexible base material for mounting a semiconductor chip capable of preventing the occurrence of burrs when resin sealing is performed, and this flexible base material. It is an object of the present invention to provide a mold for use in resin sealing of a semiconductor mounted on.

[0009]

In order to achieve the above object, a flexible base material for mounting a semiconductor chip according to the present invention is made of a flexible synthetic resin and is used for mounting the semiconductor chip. A substrate provided with a mounting portion; a group of conductive leads formed on the surface of the substrate; the group of leads is a mounting portion for mounting the semiconductor chip and is electrically connected to the outside of the semiconductor chip. A plurality of leads formed from a position facing the connection point to a predetermined position of the flexible substrate; and the leads in the surface region of the substrate where the lead group is not formed. It is configured to include a protrusion formed to have a thickness substantially equal to the thickness of the lead of the group. The substrate is made of polyimide. Further, the protrusions are made of polyimide. Further, each lead wire of the lead group is configured to include gold plating. Further, a resin leakage preventing means for preventing resin leakage when the semiconductor chip is sealed with resin is further provided at a predetermined position of the lead group. Further, the resin leakage preventing means is made of polyimide. The lead group extends in four directions from a mounting position on the surface of the substrate for mounting the semiconductor chip. The protrusions are formed on three of the four lead groups formed by the lead groups and the substrate, which are not drawn out. Also, a plurality of the above-mentioned substrates are continuously formed at a predetermined interval and formed into a tape shape. The tape-shaped substrate further has sprocket holes on both sides thereof.

Further, in order to achieve the above object, the TAB tape according to the present invention is made of a flexible synthetic resin and has a mounting position for mounting semiconductor chips at predetermined intervals; A group of conductive leads formed in a desired length from a position facing the electrical contact with the outside of the semiconductor chip at the placement position described above;
In the portion of the surface of the substrate where the lead group is not drawn out, a projection portion having a thickness substantially equal to the thickness of the lead of the lead group is included. The substrate is made of polyimide. Further, the protrusion is made of polyimide. Each lead of the lead group is configured to include gold plating. Further, a resin leakage preventing means for preventing resin leakage when the semiconductor chip is sealed with resin is further provided at a predetermined position of the lead group. Further, the resin leakage preventing means is made of polyimide. The lead group extends in four directions from a mounting position on the surface of the substrate for mounting the semiconductor chip. The protrusions are formed on three of the four lead groups formed by the lead groups and the substrate, which are not drawn out.
The substrate further has sprocket holes on both sides thereof.

Further, in order to achieve the above object, the TAB tape according to the present invention is composed of a flexible polyimide resin, and has a mounting position for mounting a semiconductor chip at a predetermined interval. The substrate is further provided with sprocket holes on both sides thereof; the substrate is formed in a desired length from a position facing the electrical contact with the outside of the semiconductor chip in the above-mentioned mounting position of the substrate, and is made of gold as a main component and conductive. A lead group having a lead resin, and a protrusion made of a polyimide resin having a thickness substantially equal to the thickness of the lead of the lead group on the surface of the substrate where the lead group is not drawn out. I am configuring.

Further, in order to achieve the above object, a semiconductor chip is placed at a predetermined position on a flexible base material having a plurality of conductive leads formed on the surface according to the present invention and resin-sealed. Of the upper die is in contact with the surface of the flexible base material; and is in contact with the back surface of the flexible base material, and is in contact with the lead at the edge of the container into which the resin is injected. It is configured to include a lower mold in which a stepped portion having a height slightly smaller than the thickness of the flexible base material is formed in the portion. Further, a convex portion having a height substantially equal to the thickness of the lead is formed at a portion which is an edge portion of the container into which the resin of the upper mold is poured and which does not contact the lead.

Further, in order to achieve the above object, the semiconductor chip is mounted at a predetermined position on a flexible base material having a plurality of conductive leads formed on the surface according to the present invention and resin-sealed. The mold is in contact with the surface of the flexible base material, and is a convex portion having a height approximately equal to the thickness of the lead at the end edge portion of the container into which the resin is injected and the lead does not contact. And a lower mold that contacts the back surface of the flexible substrate.

[0014]

According to the present invention, with the above-mentioned structure, a flexible base material and a TAB tape for mounting a semiconductor chip capable of preventing the generation of burrs when resin-sealing is performed, and the flexible base material and the TAB tape. It is possible to provide a mold used for resin-sealing the semiconductor mounted on.

Flexible substrate and TA according to the present invention
With the above-described structure, the B tape has a projecting portion formed on the surface of the tape on which the lead group is not pulled out, so that the lead group can be resin-sealed even when a conventional mold is used. It is possible to bring the mold surface into close contact with the surface of the tape where the tape is not pulled out.

According to the above-described structure, the resin molding die according to the present invention has the stepped portion formed at the edge of the resin injection chamber of the lower die, which is in contact with the lead group.
For example, when a semiconductor chip mounted on a TAB tape is resin-sealed, the step of the lower die is engaged with the edge of the tape, and the tape is cut into the lead by the pressing force of the upper die and the lower die. As a result, the gap between the leads can be reduced.

Further, the resin molding die according to the present invention has the above-mentioned structure, and the convex portion is formed at the end edge portion of the resin injection chamber of the upper die, which is not in contact with the lead group. Thus, for example, when the semiconductor chip mounted on the TAB tape is resin-sealed, the convex portion of the upper mold and the tape can be brought into close contact with each other even in a portion that does not contact the lead group.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. The TAB tape shown in FIG. 3 is the same as that conventionally used, that is, for each frame 35 on a tape-shaped film (substrate) 34 made of an insulating material and having sprocket holes 31 formed at both ends. The gold-plated leads 36 are formed. The leads 36 are provided only on one surface of the TAB tape (hereinafter, this surface is referred to as the surface of the TAB tape).

At the center of each frame 35 of the film 34,
As shown in FIG. 4, there is a device hole 33 for mounting the semiconductor IC chip 32, and two kinds of punched portions 42 and 44 are formed around the device hole 33 as shown in FIG. Further, the leads 36 are composed of four lead groups 36 for each frame 35.
IC chip 3 is divided into a, 36b, 36c and 36d.
2 is pulled out in four directions of up, down, left and right in FIG. The film 34 has a thickness of 75 microns and the leads 36 have a thickness of 35 microns. The film 34 is made of polyimide having good heat resistance and stretch resistance.

The punched-out portion 42 is formed in the resin-sealed area surrounded by the one-dot chain line L, and the punched-out portion 44 is formed outside the resin-sealed area. Further, the center portion (resin-sealed portion) of the TAB tape is supported by the support portions 46 formed on the upper right, upper left, and lower left of FIG. 3, and when the TAB tape is packed, especially the IC chip 32 is mounted. This TA in
This prevents the lead 36 from moving when the B tape is packed and conveyed.

The resin molding die shown in FIG. 1 and FIG.
It comprises an upper die 2 for holding the front surface of the AB tape from above and a lower die 4 for holding the TAB tape from the back surface. As shown in FIG. 2, the upper mold 2 has a pot 12 which is a resin supply port, a cavity 14a which is a resin injection chamber, and a gate 16a which is an injection port for injecting the resin into the cavity 14a. Ejector pins 18a are provided for removing the molded resin product from the mold. Further, on the contact surface 2a of the upper die 2 with the TAB tape, among the four corners of the cavity 14a, the gate 1
Adjacent to the three corners other than the corner where 6a is formed, a convex portion 26 having a height approximately equal to the thickness of the lead 36 is formed.

As shown in FIG. 1, the lower die 4 and the upper die 2 are also provided.
Similarly, a cavity 14b which is a resin injection chamber and a gate 16b which is an injection port for injecting resin into the cavity 14b are formed, and the ejector pin 18b is also provided.
Is provided. Further, air vents 22 for discharging the air and gas in the cavities 14a and 14b to the outside when the resin is injected into the lower mold 4 are formed at three corners of the cavity 14b other than the corner where the gate 16b is formed. Has been done. The reason why only one pot 12 is provided is that if the supply ports are provided on the upper and lower sides, a seam of the resin is created when the resin entering from two directions merges, and the trace remains after the resin molding. is there.

The lower mold 4 shown in FIG.
A stepped portion 24 having a height slightly smaller than the thickness of the film 34 (for example, a height smaller than the thickness of the film 34 by the thickness of the lead) is formed at a portion of the end edge along the line b which abuts the lead groups 36a to 36d. Has been done.

Next, the procedure for resin sealing the IC chip 32 will be described. The area of the TAB tape which is resin-sealed is the portion surrounded by the alternate long and short dash line L shown in FIG. The alternate long and short dash line L is a line drawn slightly inward from the edge of the punched portion 44. In the transfer molding method, first, a TAB tape is placed between the upper mold 2 and the lower mold 4, and the TAB tape is sandwiched between both molds. At this time,
As shown in FIG. 4, in the lower die 4, the step portion 24 meshes with the film 34 at the end portion of the punching portion 44. Further, as shown in FIG. 5, the protrusions 26 formed at the corners of the upper mold 2 come into close contact with the supporting portions 46 of the TAB tape. In this way, the upper mold 2 and the lower mold 4 are brought into close contact with the TAB tape, and then the molten thermosetting resin is poured from the pot 12 and the gate 16a,
It is pressed into the cavities 14a and 14b via 16b. Then, after leaving the resin for several hours or heating to cure the injected resin, the ejector pins 18a and 18b are pushed to take out the resin-molded TAB tape from the mold, and the resin sealing work is completed. FIG. 6 shows a TAB tape formed in this way, and a resin sealing region 48 in which the IC chip 32 is sealed with a thermosetting resin is formed.

By the way, when the TAB tape is sandwiched by using the conventional resin molding die as described above, a gap is formed between the adjacent leads in each lead group 36a, 36b, 36c, 36d due to the thickness of the leads. Therefore, when the resin is injected, the resin may flow out from between the leads to cause burrs. On the other hand, in the above-described embodiment, the step portion 24 is provided at the edge of the lower die 4 along the cavity 14b, and the film 34 is engaged with the step portion 24. Therefore, when the two dies 2 and 4 are pressed, the film 34 is generally softer than the leads 36, so that the leads sink into the film. That is, in this embodiment, when the resin is sealed, the film 34 bites between the adjacent leads, and the gap between the leads is reduced, so that the resin cannot enter between the leads. Therefore, it is possible to prevent a resin burr between the leads when the resin is sealed.

Further, as shown in FIG. 2, the upper mold 2 is provided with the protrusions 26 having the same thickness as the lead thickness at the three corners other than the corner where the gate 16a is formed. Since the upper die 2 and the upper die 2 can be completely brought into close contact with each other, it is possible to prevent the resin burr from being generated on the support portion 46 of the TAB tape on which the leads are not formed. An air vent 22 is provided at the corner of the cavity 14b of the lower mold 4, but since this groove is extremely narrow, the resin does not enter this air vent.

Thus, in the first embodiment, the upper die 2
By performing resin sealing with the lower die 4 and the lower die 4, it is possible to prevent the generation of burrs as described above. Therefore, when punching the resin-sealed TAB tape, the leads are deformed or broken by the burrs. There is nothing to do.

In the first embodiment, the case where the convex portions 26 are formed at the three corners of the cavity 14a of the upper mold 2 has been described, but the present invention is not limited to this. As shown in FIG. 7, the convex portion 26a may be formed at all four corners. However, when the convex portion is formed at the corner where the gate 16a is provided, the convex portion is not formed in the portion corresponding to the resin flow path as shown in FIG. In addition, the portion of the convex portion 26 in contact with the resin sealing region is
The entire shape of the convex portion may be any shape as long as it is formed to have the same shape as the portion of the supporting portion 46 that contacts the resin sealing region. Therefore, the overall shape of the convex portion is shown in FIG.
The shape is not limited to that shown in FIG. 7, but may be a substantially square shape as shown in FIG. 7, or may be formed like a strip-like weir.

Next, a second embodiment of the present invention will be described with reference to FIGS. 8 and 9. FIG. 8 is a schematic plan view of a TAB tape which is a second embodiment of the present invention, and FIG. 9 is a schematic enlarged sectional view of the TAB tape taken along the line CC. In the second embodiment, components having the same functions as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The TAB tape (flexible tape) of the second embodiment differs from the TAB tape used in the first embodiment in that the surface of the TAB tape in the case shown in FIG. 3 as shown in FIGS. 8 and 9. That is, the protruding portion 52 having a height substantially equal to the thickness of the lead 36 is formed on the outer side of the resin sealing region L, which is the side supporting portion 46. The protrusion 52 is formed of the same polyimide as the component of the film 34, and
Attach to position 6. The other structure of the TAB tape is similar to that of the first embodiment. According to the second embodiment, the formation of the protrusions 52 further reduces the risk of product defects due to deformation of the leads 36 during packaging and transportation of the product with the IC chip 32 mounted.

Using the TAB tape of the second embodiment, IC
As the resin molding die used when the chip is resin-sealed, the lower die 4 of the first embodiment and the conventional upper die 102 having a flat contact surface are used. be able to. To seal the IC chip 32 with resin, first, a TAB tape is placed between the upper mold 102 and the lower mold 4, and the TAB tape is sandwiched between the upper mold 102 and the lower mold 4. At this time, the lower mold 4 has the step portion 24 as in the first embodiment.
Meshes with the edge of the film 34. Further, since the protrusions 52 are formed on the support portion 46 of the TAB tape, the corners of the upper mold 102 are in complete contact with the protrusions 52.
After that, the resin sealing work is performed as described in detail in the first embodiment.

According to the TAB tape of the second embodiment, even if the conventional upper mold 102 is used, the supporting portion 4 of the film 34 is
Since the protrusion 52 is formed on the support 6, the film 34 and the upper mold 102 can be brought into close contact with each other at the support 46 as well. Therefore, similarly to the first embodiment, it is possible to prevent the resin burr from being generated in the support portion.

In the second embodiment, the case where the protrusion 52 is formed on the entire support portion 46 of the TAB tape shown in FIG. 3 has been described, but the present invention is not limited to this. , For example, as shown in FIG.
May further include a weir 54 formed in a strip shape along the resin sealing region L. The weir 54 is made of a polyimide resin like the film 34 and the protrusion 52. Dam 54
The detailed structure of the lead 36 on the lead 36 is described in US Pat. No. 5,031,022.

Further, in order to reduce the risk that the resin is blocked by the TAB tape during the resin sealing and the resin does not flow smoothly from the cavities 14a to 14b, a punching portion 56 is additionally provided on the film 34. Good. This punching section 56 is shown in FIG.
Is formed in four film regions formed between the lead groups 36. The punching portion 56 is not limited to the TAB tape shown in FIG. 10, but the same effect can be obtained by forming the punched portion 56 on the TAB tape shown in FIGS.

Further, in the above embodiment, the case where the flexible tape is the TAB tape has been described.
The present invention is not limited to this, and the semiconductor chip may be mounted on another film-shaped tape.

[0036]

As described above, according to the present invention, a step portion is formed at the edge of the resin injection chamber of the lower die, which is in contact with the lead group, so that it is mounted on, for example, a TAB tape. When the semiconductor chip is sealed with resin, the step portion engages with the edge of the tape, and the lead is inserted into the film by the pressing force of the upper mold and the lower mold, so the gap between the leads can be reduced, and therefore the lead can be reduced. It is possible to provide a metal mold for resin molding that can prevent resin burrs from occurring in between.

Further, according to the present invention, since the convex portion is formed at the end portion of the resin injection chamber of the upper die which does not come into contact with the lead group, the upper die that does not come into contact with the lead group is formed. It is possible to prevent a gap from being formed between the mold portion and the tape, and therefore, for example, when molding a semiconductor chip mounted on a TAB tape with resin, burrs can be generated in a supporting portion. A mold can be provided.

Further, according to the present invention, the semiconductor chip is resin-sealed by forming the protrusion on the portion of the flexible base material which is in contact with the resin-sealed region and where the lead group is not drawn out. At this time, since the portion of the base material where the lead group is not drawn out and the mold can be brought into close contact with each other, it is possible to prevent the resin burr from being generated in the portion where the lead group of the base material is not drawn out. Material and TAB tape can be provided.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a lower mold of a resin molding mold that is a first embodiment of the present invention.

FIG. 2 is a schematic plan view of an upper die of a resin molding die that is the first embodiment of the present invention.

FIG. 3 is a schematic plan view of a TAB tape as a first embodiment of the flexible base material of the present invention.

FIG. 4 is a schematic plan view of the TAB tape shown in FIG. 3 when sandwiched by a resin molding die and viewed from the direction of arrow AA.

5 is a schematic cross-sectional view when the TAB tape shown in FIG. 3 is sandwiched by a resin molding die and viewed from the direction of arrows BB.

6 is a schematic plan view of a base material when an IC chip which is one of semiconductor elements is mounted on the TAB tape shown in FIG. 3 and resin-sealed.

FIG. 7 is a schematic plan view showing a modified example of the upper mold of the resin molding mold.

FIG. 8 is a schematic plan view of a TAB tape that is a second embodiment of the present invention.

FIG. 9C of the TAB tape which is the second embodiment of the present invention
FIG. 6 is a schematic enlarged cross-sectional view taken along arrow C.

FIG. 10 is a schematic plan view of a TAB tape that is a third embodiment of the present invention.

FIG. 11 is a schematic plan view of a conventional TAB tape.

FIG. 12 is a schematic cross-sectional view showing a state in which a conventional TAB tape is sandwiched by a resin molding die.

[Explanation of symbols] 2 Upper mold 4 Lower mold 12 Pot 14 Cavity 16 Gate 18 Eject pin 22 Air vent 24 Stepped portion 26 Convex portion 31 Sprocket hole 32 IC chip 33 Device hole 34 Film 35 Each frame 36 Lead 36a to 36d Lead 42,44 Punching part 46 Support part 48 Resin 52 Projection part 54 Weir 56 Punching part

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01L 21/60 311 W 6918-4M 23/28 A 8617-4M 23/50 G 9272-4MY Y 9272 -4M

Claims (23)

[Claims] 1. A flexible base material for mounting a semiconductor chip, comprising the following structure: a substrate made of a flexible synthetic resin and having a mounting portion for mounting a semiconductor chip; A group of electrically conductive leads formed on the surface of the substrate, the group of leads being located on a mounting portion for mounting the semiconductor chip, from a position facing an electrical connection point with the outside of the semiconductor chip. A plurality of leads formed toward a predetermined position of the flexible substrate; and in a region of the surface of the substrate where the leads are not formed, a thickness of the leads of the leads is approximately A protrusion formed to have the same thickness. 2. The flexible base material according to claim 1, wherein the substrate is made of polyimide. 3. The flexible substrate according to claim 1, wherein the protrusion is made of polyimide. 4. The flexible base material according to claim 1, wherein each lead wire of the lead group includes gold plating. 5. The flexible base material according to claim 1, further comprising resin leakage preventing means for preventing resin leakage when a semiconductor chip is sealed with resin at a predetermined position of the lead group. 6. The flexible base material according to claim 5, wherein the resin leakage prevention means is made of polyimide. 7. The flexible substrate according to claim 1, wherein the lead group extends in four directions from a mounting position for mounting the semiconductor chip on the surface of the substrate. 8. The projecting portion is formed in three parts of the parts where the four lead groups formed by the respective lead groups and the substrate are not drawn out. Flexible base material. 9. The flexible base material according to claim 8, wherein a plurality of the substrates are continuously formed at predetermined intervals and are formed in a tape shape. 10. The flexible base material according to claim 9, wherein the tape-shaped substrate is further provided with sprocket holes on both sides thereof. 11. A TAB tape including the following structure: a substrate made of a flexible synthetic resin and having mounting positions for mounting semiconductor chips at predetermined intervals; A group of leads having a desired length formed from a position facing an electric contact with the outside of the semiconductor chip, and having a lead on a portion of the surface of the substrate where the group of leads is not drawn out. A protrusion formed to have a thickness approximately equal to the thickness of the leads of the group. 12. The TAB tape according to claim 11, wherein the substrate is made of polyimide. 13. The TAB tape according to claim 11, wherein the protrusion is made of polyimide. 14. The TAB tape according to claim 11, wherein each lead of the lead group includes gold plating. 15. The TAB tape according to claim 11, further comprising resin leakage preventing means for preventing resin leakage when a semiconductor chip is sealed with resin at a predetermined position of the lead group. 16. The TA according to claim 15, wherein the resin leakage preventing means is made of polyimide.
B tape. 17. The TAB tape according to claim 11, wherein the lead group extends in four directions from a mounting position on the surface of the substrate for mounting the semiconductor chip. 18. The projection is formed in three parts of the parts where the four lead groups formed of the respective lead groups and the substrate are not drawn out. TAB tape. 19. The TAB tape according to claim 11, wherein the substrate further comprises sprocket holes on both sides thereof. 20. A TAB tape including the following structure: a substrate made of a flexible polyimide resin and having mounting positions for mounting semiconductor chips at predetermined intervals, the substrate having sprocket holes on both sides thereof. Further provided; a lead group having a desired length and having conductivity, which is formed in a desired length from a position facing the electric contact with the outside of the semiconductor chip in the above-mentioned mounting position of the substrate; and the substrate A protrusion made of a polyimide resin formed on a surface of the lead group in which the lead group is not drawn out to a thickness substantially equal to the thickness of the lead of the lead group. 21. A mold for mounting a semiconductor chip at a predetermined position on a flexible base material having a plurality of conductive leads formed on its surface and resin-sealing it, including the following structure: An upper mold that abuts the surface of the flexible base material; and a flexible mold that abuts the back surface of the flexible base material and is the edge portion of the container into which the resin is injected and that the lead abuts. Lower mold with a stepped portion having a height slightly smaller than the thickness of the base material. 22. A convex portion having a height approximately equal to the thickness of the lead is formed at a portion which is an edge portion of the container into which the resin of the upper mold is poured and which does not come into contact with the lead. The mold according to claim 21, wherein the mold is a mold. 23. A mold for mounting a semiconductor chip at a predetermined position on a flexible base material having a plurality of conductive leads formed on its surface and resin-sealing it, including the following structure: A top metal which is in contact with the surface of the flexible base material and has a convex portion having a height approximately equal to the thickness of the lead formed in the end edge portion of the container into which the resin is injected and not in contact with the lead. Mold; and a lower mold that contacts the back surface of the flexible base material.