JPH0529122U - Chip type electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] Prevents cracking of the outer package due to pressure during bending of the lead terminals attached to the insulating outer package of the chip type electronic component at the bottom of the outer package, and to the mounting board. Improves the placement stability of. In a chip-type electronic component 40, an element body 3 to which a lead terminal is fixed is covered with an insulating outer package 1, and lead terminals 5 led out from this outer package are bent along side and bottom surfaces of the outer package, The lead terminal tip portion 9 is provided with a convex portion and a concave portion adjacent to the convex portion at the lead terminal attachment portion at the bottom corner, and the convex portion 45 is formed into a corner so that the bending angle becomes an acute angle.
Is pressed and bent, and is bent and formed so that the lead terminal tip 9 is positioned in the space of the recess 47.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip-type electronic component mounted on an electronic circuit board.

[0002]

[Prior Art]

 In recent years, there has been a strong demand for miniaturization of electronic devices and the like, and along with this demand, the size of inductors, capacitors, etc. mounted and mounted on the electronic circuit boards built into the electronic devices has also been reduced, and the chip shape covered with an insulating outer package As a result, automatic mounting by mounting machines is being implemented.

Generally, in a chip-type electronic component, the element body to which the lead terminals are fixed is covered with an insulating exterior body such as resin, and the lead terminals led out from the exterior body are bent along the side surface and the bottom surface of the exterior body. It has a structure attached to the bottom side of the outer package so as to be soldered to the board.

A terminal structure of the conventional chip-type electronic component will be described with reference to FIGS. 4 to 6.

In the cross-sectional views of FIGS. 4 to 6, the structures of the exterior resin and the lead terminal are left and right, and the materials are the same.

In the chip-type electronic component 10 of FIG. 4, lead terminals 5 protruding from both sides of the element body 3 are led out from the insulating outer package 1 and bent into an L-shape, and further the lead tip 9 is pressed to form the outer package. It is an example of the structure bent to the bottom.

At this time, the element body 3 is an element body such as an inductor or a capacitor, and the insulating outer casing 1 is a thermosetting resin such as an alkyd resin or an epoxy resin, and the synthetic resin is molded by a mold or the like. By doing so, it is integrally formed with the element body. Further, the lead terminal 5 is a plate-shaped metal, which is formed by rolling a good conductor such as copper into a thin plate, punching it, and plating it with nickel solder.

Next, in the chip-type electronic component 20 of FIG. 5, a concave portion 27 having an inclined surface that becomes deeper inside toward the tip of the attached lead terminal 5 is provided on the bottom surface of the insulating outer package 1. This is an example of a structure in which the bending angle 25 of the lead terminal to the bottom surface is an acute angle.

Next, in the chip-type electronic component 30 of FIG. 6, a lead 39 is formed by forming a claw portion 39 in which the tip end portion of the plate-shaped lead terminal 5 is slightly bent and forming a groove 37 on the bottom surface of the exterior body. This is an example of a structure in which the claw portion 39 is engaged with the groove 37 after the terminal is bent.

[0010]

[Problems to be solved by the device]

 However, according to the terminal structure of the first conventional example (FIG. 4), when the lead terminal 5 is bent, elastic return of the metal occurs at the tip 9 of the lead terminal, which causes the tip to become the outer resin bottom surface. Float away from you. For this reason, there is a problem that the mounting on the substrate becomes unstable at the time of mounting and soldering, and a soldering defect is likely to occur.

Further, when the tip 9 of the lead terminal is pressed, a strong pressure is applied to the bottom surface of the resin to cause a crack 7 in the resin, which deteriorates reliability such as deterioration of physical strength and deterioration of moisture resistance due to infiltration of water. Had a problem.

Next, according to the terminal structure of the second conventional example (FIG. 5), when the lead terminal tip is bent to the bottom surface of the exterior body, the bending angle is small even if the lead terminal tip is slightly returned. Although it is possible to maintain 25 at a right angle or an acute angle, the above-mentioned problem of instability of placement can be solved, but there is a problem that crack 7 is likely to occur on the resin bottom surface when the lead terminal tip 9 is pressed. Was.

Next, according to the terminal structure of the third conventional example (FIG. 6), since the claw portion 39 at the tip of the lead terminal is engaged with the recess 37 at the bottom of the resin, the tip of the lead terminal is fixed and the elasticity is improved. Although it does not float due to force, in order to firmly engage the claw portion 39 with the concave portion of the resin bottom surface, the lead terminal tip portion must be pressed strongly as in the conventional example of FIG. There is a problem that cracks are likely to occur, and further, in order to satisfactorily engage the claw portion with the concave portion, high precision is required for resin sealing and lead terminal bending processing, and processing is difficult. Had a point.

The present invention has been made in view of the above circumstances, and prevents cracks in the insulating outer casing due to pressure during bending of the lead terminal and eliminates the return due to the elasticity of the lead terminal. (EN) Provided is a chip-type electronic component having a terminal structure which prevents soldering failure due to unstable mounting of the electronic component during mounting.

[0015]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention is a chip-type electronic device in which the element body to which the lead terminals are fixed is covered with an insulating exterior body, and the lead terminals led out from the exterior body are bent along the side and bottom surfaces of the exterior body. In the component, a protrusion and a recess adjacent to this are provided at the lead terminal attachment part on the bottom surface of the exterior body, and the lead terminal tip is pressed so that the bend becomes an acute angle. The above object is achieved by forming a chip-type electronic component that is bent and formed so that the tip of the lead terminal is positioned in the recessed space.

[0016]

[Action]

 In the chip-type electronic component of the present invention, when the lead terminal is bent and formed on the bottom surface of the insulating exterior body, the tip of the lead terminal is pressed so as to be located in the space of the recess provided on the bottom surface, so that the exterior is directly packaged. No strong force is applied to the bottom of the body. Therefore, it is possible to prevent the bottom surface of the exterior body from being cracked.

Further, since the lead terminal portion bent to the bottom surface of the exterior body is bent at an acute angle with the convex portion provided on the bottom surface as an angle, the return due to the elasticity of the lead terminal does not pose a problem and the mounting safety is low. Qualitative is good. Therefore, defective soldering to the substrate is reduced.

[0018]

【Example】

 An embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of a chip-type electronic component having a terminal structure according to the present invention, and FIG. 2 is a perspective view showing a state in which the electronic component of the embodiment is mounted on a substrate.

In the chip-type electronic component 40 according to the present embodiment, the element body 3 to which the lead terminals 5 are fixed is covered with an insulating exterior body 1, and the lead terminals 5 derived from the exterior body are attached to the side surface and the bottom surface of the exterior body. In the chip-type electronic component bent along the above, a protrusion and a recess adjacent to the protrusion are provided at the lead terminal attachment portion at the bottom corner of the exterior body, and the protrusion 45 is formed into a corner so that the bending angle becomes an acute angle. The terminal tip portion 9 is pressed and bent, and the lead terminal tip is bent and formed in the space of the recess 47.

Therefore, the lead terminal tip portion 9 still has a margin to be bent in the recessed space, a strong force is not directly applied to the bottom surface of the exterior body, and the generation of cracks is prevented.

In the present embodiment, the element body 3 is an element body such as an inductor or a capacitor, and the insulating exterior body 1 is a thermosetting resin such as an alkyd resin or an epoxy resin, and the synthetic resin is used as a mold. It is integrally formed with the element main body 3 by performing a molding process using the above. Further, the lead terminal 5 is a plate-shaped metal, and is made by rolling a good conductor such as copper into a thin plate, punching and molding it, and plating it with nickel solder, as in the conventional example.

Further, in the present embodiment, in the shape of the insulating outer package 1, the side surface portion 43 along the plate-shaped lead terminal 5 has a notch having a thickness equal to or larger than the thickness of the lead terminal, and the lead terminal attached to the side surface portion is provided. Is molded so that it does not stick out from the chip shape. Further, the height of the convex portion at the bottom corner of the exterior body is set so that the lead terminal portion abutted on the convex portion is slightly exposed to the mounting board side from the bottom surface of the exterior body, so that the solder is surely used with thin solder. Can be joined with.

Further, the recessed space has a volume sufficient to push the tip of the lead terminal during bending.

Although the insulating outer casing in this embodiment is made of synthetic resin, it is not limited to this as long as it is an insulating substance, and may be, for example, ceramic.

Further, the shape of the convex portion provided at the bottom corner of the insulating outer package is not limited to the rectangular shape as in this embodiment, but a trapezoidal shape as shown in FIG. Alternatively, it may be a mountain with a rounded top like (B) 63.

[0027]

[Effect of the device]

 Since the chip-type electronic component of the present invention is configured as described above, it has the effects described below.

(1) When the lead terminal is bent and formed on the bottom surface of the insulating outer package, the tip of the lead terminal is pressed so as to be located in the space of the concave portion provided on the bottom surface. It has an excellent effect that it is possible to prevent cracks from being formed on the bottom surface of the exterior body by pressing without applying force.

(2) Further, since the lead terminal portion bent to the resin bottom surface is bent at an acute angle with the convex portion provided on the bottom surface as an angle, the elasticity of the lead terminal causes the lead terminal to return to the mounting substrate. There is an excellent effect that the placement is not unstable and soldering failure on the substrate is reduced.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a chip type electronic component according to the present invention.

FIG. 2 is a perspective view showing a state in which the chip-type electronic component of the embodiment is mounted on a substrate.

FIG. 3 is a partial cross-sectional view showing another embodiment of the uneven shape provided on the bottom surface of the resin outer package according to the present invention.

FIG. 4 is a cross-sectional view showing a terminal structure of a conventional resin mold chip type electronic component.

FIG. 5 is a cross-sectional view showing a terminal structure of a conventional resin mold chip type electronic component.

FIG. 6 is a cross-sectional view showing a terminal structure of a conventional resin mold chip type electronic component.

[Explanation of symbols] 1 Insulation outer body 3 Element body 5 Lead terminal 7 Crack 9 Lead terminal tip 10 Chip type electronic component 20 Chip type electronic component 25 Lead terminal bending angle at corner of insulation outer casing 27 Recessed portion of bottom of insulation outer casing 29 Lead terminal tip portion 30 Chip type electronic component 37 Recessed groove 39 Lead terminal tip claw portion 40 Chip type electronic component 43 Lead terminal attachment portion on the side surface of the insulating sheath 45 Convex portion at corner of insulating sheath 47 Recess at corner of insulating sheath 49 Lead terminal bending angle P at the corner of the insulating exterior body P Pressing force 51 Soldering land 53 Solder 55 Mounting board 61 Trapezoidal convex portion 62 Mountain convex portion

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Izumi Igawa, 6-16-20 Ueno, Taito-ku, Tokyo, Taiyo Denki Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A chip-type electronic component in which an element main body to which lead terminals are fixed is covered with an insulating exterior body, and the lead terminals led out from the exterior body are bent along the side surface and the bottom surface of the exterior body. On the lead terminal attachment part of
A convex portion and a concave portion adjacent thereto are provided, and the lead terminal tip portion is bent by pressing the lead terminal tip portion so that the bending angle is an acute angle and the lead terminal tip is positioned in the concave portion space. A chip-type electronic component characterized by being bent and formed.