JPH0528774Y2 - - Google Patents
Info
- Publication number
- JPH0528774Y2 JPH0528774Y2 JP4849087U JP4849087U JPH0528774Y2 JP H0528774 Y2 JPH0528774 Y2 JP H0528774Y2 JP 4849087 U JP4849087 U JP 4849087U JP 4849087 U JP4849087 U JP 4849087U JP H0528774 Y2 JPH0528774 Y2 JP H0528774Y2
- Authority
- JP
- Japan
- Prior art keywords
- shaft
- electrostatic adsorption
- film forming
- forming chamber
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001179 sorption measurement Methods 0.000 claims description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 14
- 239000000758 substrate Substances 0.000 description 17
- 238000012423 maintenance Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Jigs For Machine Tools (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4849087U JPH0528774Y2 (enrdf_load_stackoverflow) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4849087U JPH0528774Y2 (enrdf_load_stackoverflow) | 1987-03-30 | 1987-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63153538U JPS63153538U (enrdf_load_stackoverflow) | 1988-10-07 |
JPH0528774Y2 true JPH0528774Y2 (enrdf_load_stackoverflow) | 1993-07-23 |
Family
ID=30870067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4849087U Expired - Lifetime JPH0528774Y2 (enrdf_load_stackoverflow) | 1987-03-30 | 1987-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0528774Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009235429A (ja) * | 2008-03-25 | 2009-10-15 | Iwate Univ | スパッタ装置 |
-
1987
- 1987-03-30 JP JP4849087U patent/JPH0528774Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63153538U (enrdf_load_stackoverflow) | 1988-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20220216035A1 (en) | Vacuum processing apparatus and maintenance apparatus | |
KR100242529B1 (ko) | 정전척을 가지는 재치대 및 이것을 사용한 플라즈마 처리장치 | |
JP5851131B2 (ja) | 静電チャック、真空処理装置 | |
JP2009117845A5 (enrdf_load_stackoverflow) | ||
JPWO2004084298A1 (ja) | 静電チャックを用いた基板保持機構およびその製造方法 | |
TW201140729A (en) | Cleaning method for transfer arm, cleaning method for substrate processing apparatus and substrate processing apparatus | |
JPH0528774Y2 (enrdf_load_stackoverflow) | ||
KR0156263B1 (ko) | 이온주입장치 | |
JP2020036003A (ja) | 電気的に絶縁されたピンリフター | |
US6719849B2 (en) | Single-substrate-processing apparatus for semiconductor process | |
CN217026075U (zh) | 一种化学气相沉积设备 | |
WO1992015115A1 (en) | Semiconductor manufacturing equipment | |
JP3225170B2 (ja) | 真空処理装置 | |
JPH03261161A (ja) | 縦型熱処理装置 | |
JPH11233601A (ja) | 静電吸着装置及びそれを用いた試料処理装置 | |
WO2010140478A1 (ja) | 搬送モジュール | |
CN113539934A (zh) | 基板固定装置 | |
JP2006299358A (ja) | 真空成膜装置及び真空成膜方法 | |
JPH0722500A (ja) | 処理装置 | |
TWI793727B (zh) | 供電裝置及表面處理機 | |
KR20140141088A (ko) | 클리닝 부재 및 이를 이용한 클리닝 방법 | |
JPH06275702A (ja) | 基板搬送装置 | |
JP2024014680A (ja) | 基板処理装置、基板保持装置及び基板保持方法 | |
JP4536450B2 (ja) | 真空成膜装置 | |
JP2000349139A (ja) | 真空処理装置の基板取り外し方法および真空処理装置 |