JPH05283577A - Method and apparatus for separating support frame from multilayer lead frame - Google Patents

Abstract

PURPOSE:To separate a support part surely from a plane holder, by bending an edge part of the plane holder projected from an edge of a long sheet-shaped lead frame, which has been bonded with the plane holder together in a body. CONSTITUTION:A power-supply or grounding plane holder 10b or 10c is formed wider than a long sheet-shaped lead frame 10a. A separating notched part 12 is formed previously in a position, in which support parts 40a and 40b are separated from the holders 10b and 10c. The plane holders 10b and 10c are layered on the long sheet-shaped lead frame 10a, and they are bonded together in a body. Then, a bending step is carried out while edge parts of the plane holders 10b and 10c projected from an edge of the long sheet-shaped lead frame 10a are firmly clamped so that the housing parts 40a and 40b are separated from the plane holders 10b and 10c. In this way, a manufacturing step is effectively carried out for separating a support from a plane part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for separating a support frame for a multilayer lead frame.

[0002]

2. Description of the Related Art As shown in FIG. 4, a multi-layered lead frame has a power plane 3 and a ground plane 4 and the like in layers different from the lead frame 2, and an electrically insulating layer 5 such as polyimide is sandwiched between the layers. It is formed by stacking. When manufacturing this multi-layered lead frame, a strip of a lead frame strip having a plurality of lead frames is formed into a strip, and a strip of power plane or ground plane is formed separately from the strip of lead frame. It is formed by stacking a plain holder for use on the lead frame strip and pressing it. It should be noted that a plurality of rectangular frame-shaped or rectangular plate-shaped plane portions are formed on the plane holder serving as a power plane and a ground plane in accordance with the lead frame. These plane parts are supported by a support frame corresponding to the side rail parts of the lead frame strip, and the support frame of the plane holder is substantially the same as the support frame shape of the lead frame strip.

After stacking the plane holders on the lead frame strips as described above, the multilayer lead frame finally has a power plane 3 and a ground plane on the lower surface of one strip of lead frame 2. 4 are provided in joined form. Therefore, after the plane holders on which the power planes and the ground planes are formed are superposed on the lead frame strips and joined, the power insulating planes 5 and the ground planes 4 other than the electrical insulating layer 5 are separated and removed. To For this reason, a notch for cutting is provided in the portion where the power supply plane 3 and the ground plane 4 are hung on the support frame, and after stacking the plane holders, the support frame is bent using the notch portion as a fulcrum. As a result, the power supply plane 3 and the ground plane 4 are left on the lead frame 2 side to separate the support frame. Since the power supply plane 3 and the ground plane 4 need to be set to the power supply potential and the ground potential, respectively, when the plane holders are stacked and joined,
Connecting pieces 6 and 7 extending to the side of the ground plane 4
Are connected to the power lead and the ground lead of the lead frame 2 by spot welding.

[0004]

By the way, as shown in FIG. 4, after the plane holder is laminated on the strip-shaped lead frame strip as described above, the unnecessary supporting frame portion of the plane holder is separated and removed. The work of manufacturing a multi-layered lead frame having various cross-sectional shapes has been performed manually by hand.
The supporting frame portion of the plain holder after joining was separated and removed by bending. Therefore, the workability in the manufacturing process is low and the product is uneven, the fracture surface after separating the support frame is uneven and burrs easily occur, and the section bar part between adjacent planes is separated. There was a problem that the product part may be marked when it is disassembled. Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to efficiently perform a work of separating a support frame such as a power plane or a ground plane in a manufacturing process of a multilayer lead frame. The present invention aims to provide a method and a device for separating a supporting frame of a multilayer lead frame, which is capable of producing a good product.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, a lead frame strip having a plurality of lead frames is formed in a strip shape, and a plane holder different from the lead frame strip having a power plane or a ground plane joined to the lead frame is formed. Is formed in a strip shape, the plane holder and the lead frame strip are aligned and laminated, and then unnecessary supporting frames other than the power plane or the ground plane are separated and removed from the plane holder. In the method for separating and removing the supporting frame of the multilayer lead frame, the width size of the plane holding body is formed to be wider than the width size of the lead frame strip, and the supporting frame is separated from the plane holding body. A notch for separation is formed in advance, and the plane holder is attached to the lead frame strip. After integrally joined to the layers, by gripping the side edges of the plane holder projecting from the side edges of the lead frame strip,
The supporting frame is separated and removed from the plane holder by performing a bending operation. In addition, a lead frame strip formed in a strip shape and a plane holder for a power plane or a ground plane formed in a strip shape wider than the lead frame strip are stacked and integrally joined to form a laminated body. On the other hand, a support frame separating device for a multilayer lead frame for separating and removing unnecessary supporting frames other than a power plane or a ground plane from the plane holder, wherein the leads of the power plane or the ground plane of the laminate are provided. A clamping mechanism that clamps and supports the bonding range to the frame band in the thickness direction,
It has a gripper that clamps the support frame of the plane holder, and a swing mechanism that swings the gripper in the up-down direction to bend the support frame.

[0006]

[Operation] After stacking and integrally joining the plane holder formed with the plane used as the power plane or the ground plane to the strip-shaped strip of lead frame, the clamp is used to clamp and support the laminate. , The gripper holds the support frame of the plane holder for the power plane or the ground plane, and the swinging mechanism swings the gripper up and down to bend the support frame to separate the unnecessary support frame. Remove.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view showing a schematic configuration of a support frame separating device for a multilayer lead frame according to the present invention. The multi-layered lead frame of this embodiment comprises three layers of a lead frame, a power plane and a ground plane. FIG. 1 shows a lead frame strip 10a and a power plane holder 10b which form the lead frame, the power plane and the ground plane. , A state in which the support frame is separated and operated with respect to the laminated body to which the ground plane holder 10c is joined. 10a, 10b, and 10c are integrally joined with the electrically insulating layer 5 interposed therebetween.

The lead frame strip 10a shown in FIG.
Power plane holder 10b, ground plane holder 10c
Shows a state where these are viewed from the end face direction. The plane holders 10b, 1b that serve as power planes and ground planes are larger than the width size of the lead frame strip 10a of the uppermost layer.
The width size of 0c is increased so that the side edge portions of the plane holders 10a and 10b for the power supply plane and the ground plane project outside the lead frame strip 10a. This protruding side edge portion becomes a portion that is clamped to break off the support frame. The power supply plane frame 10b and the ground plane frame 10b are separated and removed at the outside of the area joined by the electrically insulating layer 5, and the separation V notch 1 is formed at the boundary position.
2 is provided. The portion separated and removed by the frames 10b and 10c is called a support frame.

In FIG. 1, reference numerals 14 and 16 are an upper die and a lower die for sandwiching and supporting the laminated body from above and below. FIG. 2 shows a state in which the laminated body is clamped by the upper die 14 and the lower die 16 as viewed from the side. A plurality of lead frames are formed on the lead frame strip 10a at regular intervals, and the electrical insulating layer 5 for joining the power plane and the ground plane is also formed at regular intervals accordingly. The upper die 14 and the lower die 16 described above clamp the area of this electrically insulating layer 5, that is, the area where the power plane and the ground plane are joined.

Since the electrically insulating layer 5 is not present in the section bar portion connecting between the adjacent laminated body portions, this section bar portion is thin due to the absence of the electrically insulating layer 5. Therefore, as shown in FIG. 2, with respect to the section bar bar portion, a clamp member 18 for sandwiching and supporting the section bar portion of the laminated body is provided separately from the upper die 14. By providing the clamp member 18 separately from the upper die 14 in this manner, suitable clamp support according to the thickness of the layered body of the frame becomes possible, the work of separating and removing the support frame can be performed accurately, and the section bar can be separated after separation. It is possible to prevent the pieces from coming apart and to be displaced, and it is possible to solve the problem that the lead frame has a mark.

Next, the structure of the portion for bending the supporting frame in the supporting frame separating device shown in FIG. 1 will be described. The bent portion of the support frame includes a gripper 20 that clamps the side edges of the power supply plane holder 10b and the ground plane holder 10c at once, a support block 22 for supporting the gripper 20, and a support block 22. Drive arm 2 that moves up and down
4 and. The support block 22 is pivotally supported by the drive arm 24 by a shaft 26, and the gripper 2 of the support block 22 is supported.
The mounting side of 0 is swingable. Guide 28,
A reference numeral 30 regulates and guides the drive arm 24 so as to be independently movable in the horizontal direction and the vertical direction during the bending operation. The vertical movement of the drive arm 24 is controlled to move within a predetermined range by a drive mechanism such as a pulse motor. The drive arm 24 is constantly urged outward by an air cylinder 32 to be supported.

The gripper 2 at the start of bending
The set position of 0 varies depending on the frame width of the product.
Therefore, a positioning mechanism such as a pulse motor is provided in order to adjust the set position of the gripper 20 when applying different products. When adjusting the set position of the gripper 20, and when setting the moving range in the mechanism for moving the drive arm 24 up and down, the moving position may be detected and driven by a sensor or the like. The gripper 20, the support block 22, the drive arm 24, and the like are similarly arranged at the other side edge portion of the frame.

When the supporting frame is separated and removed by the supporting frame separating device of the present embodiment, first, as shown in FIG. 1, the lead frame strip 10a, the power plane holder 10b,
Side edges of the plane holders 10b and 10c that clamp the laminated body of the ground plane holding body 10c with the upper die 14 and the lower die 16 and hold the planes to be the power plane and the ground plane of the laminated body with the gripper 20. And then the air cylinder 32 is urged inward to drive the drive arm 2
The support frame is separated by reciprocating 4 up and down a plurality of times. When the drive arm 24 moves up and down,
The side edges are bent by the circular arc movement whose radius is the length obtained by adding and B, and the supporting frame is separated. When the drive arm 24 is actually moved up and down, the range of up and down movement should be relatively large at first and moved at a low speed, and after moving up and down several times, the range of movement should be narrowed and moved faster. Suitable separation can be achieved without causing burrs on the fracture surface. In addition, when returning the drive arm 24 to the upper position, it is preferable that the drive arm 24 is returned to the horizontal position at first, and after being moved up and down several times, it is moved without returning to the horizontal position.

By moving the drive arm 24 up and down and swinging the side edge of the plane holder a plurality of times as described above, the support frames on both sides of the plane holder are separated and removed. Since the separated support frames on both sides are held as they are by the grippers 20, 20, the clamp of the plane holder by the upper die 14 and the lower die 16 is released, the product is taken out, and the clamp by the gripper 20 is released. This allows the support frame to be eliminated. Since the separated section bar remains on the lower die 16 by separating the support frame, it can be easily eliminated.

FIG. 3 shows a state in which the support frame and the section bar are separated and removed from the laminated body of the lead frame strip 10a, the power plane holder 10b, and the ground plane holder 10c. In the figure, the C portion is a range where the power plane and the ground plane are joined, 40a and 40b are support frames, and 42 is a section bar. The support frames 40a and 40b are separated and removed in a rail shape from the side edge portions of the frame formed in a strip shape as shown in the figure, and the section bar 42 is separated and removed from between the adjacent power planes and ground planes. In this way, a multilayer lead frame in which the power plane and the ground plane are joined to the strip-shaped strip of lead frame is obtained. The plane holders for the power planes and ground planes are wider than the lead frame strips as shown in the figure, and are formed so that they can be bent and separated.However, the plane holders for the power planes and ground planes are made of lead. It is enough to make it wider by about 3 mm on one side than the frame strip.

As described above, in the supporting frame separating device for a multilayer lead frame according to the present invention, the laminated body is securely clamped, and the bending operation of the supporting frame for holding the power plane and the ground plane is performed by mechanical control. Since the supporting frame is separated by performing the separation, the supporting frame can be efficiently separated, and a good product can be manufactured without causing burrs or the like. In addition, it is possible to manufacture a product of stable quality without variation due to the machine operation. Further, by separating and removing the support frame by a mechanical operation, it becomes possible to automate the separation and removal work of the support frame.

In the above embodiment, the method of separating and removing the supporting frame was described for the three-layer multilayer lead frame. However, in addition to the lead frame strip, another two-layer multilayer lead frame or four or more layers is provided. The same applies to the multi-layered lead frame. Further, in the apparatus of the above-described embodiment, even if the width size of the lead frame is different for different products, it can be dealt with by adjusting the position of the gripper 20, but it can also be used for products with different sizes in this way. It is possible.

[0018]

As described above, according to the method and the device for separating the supporting frame of the multilayer lead frame according to the present invention,
The support frame can be reliably separated and removed from the plane holder for the power plane or ground plane that is joined to the lead frame strip, and it is possible to stably manufacture good products with no quality variations and also to automate it. It produces a remarkable effect such as efficient production.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a schematic configuration of a support frame separation device for a lead frame.

FIG. 2 is an explanatory diagram showing a state in which a laminated body is clamped by an upper die and a lower die.

FIG. 3 is an explanatory view showing a state in which a support frame is separated.

FIG. 4 is a cross-sectional view showing a configuration example of a multilayer lead frame.

[Explanation of symbols]

 2 lead frame 3 power plane 4 ground plane 5 electrical insulation layer 10a lead frame strip 10b power plane holder 10c ground plane holder 12 V notch 14 upper die 16 lower die 18 clamp member 20 gripper 22 support block 24 drive arm 26 Shaft 28, 30 Guide 40a, 40b Support frame 42 Section bar

Claims (2)

[Claims] 1. A lead frame strip having a plurality of lead frames is formed in a strip shape, and is separate from the lead frame strip having a power plane or a ground plane joined to the lead frame. After the plane holder is formed in a strip shape and the plane holder and the lead frame strip are aligned and laminated, an unnecessary supporting frame or the like other than the power plane or the ground plane is removed from the plane holder. A method for separating and removing a supporting frame of a multilayer lead frame for separating and removing, wherein the width size of the plane holder is formed wider than the width size of the lead frame strip, and the supporting frame is separated from the plane holder. A notch for separation is formed in advance at the position, and the plane is held on the lead frame strip. After being laminated and integrally joined, the side edge portion of the plane holder protruding from the side edge of the lead frame strip is gripped, and a bending operation is performed to remove the support frame from the plane holder. A method of separating a supporting frame of a multilayer lead frame, which comprises separating and removing. 2. A strip-shaped lead frame strip, and a strip-shaped plane holder wider than the strip of the lead frame for power supply planes or ground planes are laminated and integrally joined. What is claimed is: 1. A support frame separating device for a multilayer lead frame for separating and removing an unnecessary supporting frame other than a power plane or a ground plane from the plane holder with respect to the laminate, the power plane or the ground plane of the laminate. Clamping mechanism for clamping and supporting the joining range of the lead frame belt-shaped body in the thickness direction, a gripper for clamping the support frame of the plane holding body, and swinging the gripper in the vertical direction to support the support frame. A supporting frame separating device for a multilayer lead frame, comprising: a swinging mechanism for bending operation.