JPH05283556A - Electronic component and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain an electronic component of a fine pattern of a thin film having an element which has no irregularity in shape by obtaining a glazed alumina board having very small warpage. CONSTITUTION:An alkali-free glaze 2 having smaller thermal expansion coefficient than that of an alumina board 1 is baked at a high temperature to be formed at a recess side of the board 1 which is warped by a predetermined amount in a predetermined direction obtained by utilizing a difference of shrinkage factors generated at the time of burning due to differences of particle size and distribution of alumina powder. Thus, a glazed alumina board having a low cost, high strength, excellent environmental resistant reliability and surface smoothness and very small warpage is obtained. Since an electronic component is obtained through photolithography technique by using the board, an irregularity in exposure of the pattern due to warpage of the board can be eliminated. When the board is divided into individual products after an element is formed, the component having a micropattern of a thin film state having excellent quality in the element can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having an alumina substrate, a glass glaze formed on one side of the alumina substrate, an electrode formed on a part of the substrate, and an element portion connected to the electrode. The present invention relates to a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, alumina-based materials have been used as a base substrate for electronic parts having thin film fine patterns as element parts because of their advantages of low cost, high strength, environmental reliability and surface smoothness. An organic binder, a plasticizer, and a solvent are added to the ceramic powder to be mixed and stirred to form a slurry, which is then formed into a sheet by the doctor blade method (hereinafter referred to as a green sheet) and then fired. Alkali-free high-transition-temperature glass containing silicon oxide, barium oxide, or the like as a main component was formed on one surface of the irregularly warped alumina substrate obtained by about 110.
Those that are fired at a high temperature of 0 to 1200 ° C. are often used. Then, an electrode is formed on this substrate, a thin film is formed on the surface by, for example, vapor deposition, and then an element portion having a predetermined fine pattern connected to the electrode is formed by using a photolithography technique. An electronic component is configured by covering the portion and the surface electrode with an inorganic or organic film.

[0003]

However, in the above structure, an alumina substrate (coefficient of thermal expansion of 75 to 80 × 10 ⁻⁷ / ° C.) obtained by firing a green sheet whose main component is an alumina powder having a large particle size distribution is used. ), The alkali-free high-transition-point glass (coefficient of thermal expansion is 60 to 70 × 10 ⁻⁷ / ° C.) whose main component is silicon oxide, barium oxide, etc.
Since the glaze is formed by baking at a high temperature of about 1100 to 1200 ° C., a substrate in which the glaze side is convexly warped by about 100 μm per 2 inches, and further,
The proximity aligner is used to form a gap to improve the yield against mask contamination, and the exposure is focused on the center of the substrate. Therefore, the resolution of the formed pattern becomes worse as the distance from the center of the substrate increases. Was far from that of the mask. That is, for example, when the substrate is divided into individual products after the element portion is formed, there is a problem that the distribution of the resistance value becomes large.

In view of the above problems, the present invention provides an electronic component having an element portion which is a fine pattern of a thin film and has no shape variation by obtaining a glazed alumina substrate having a very small warp, and a manufacturing method thereof. To do.

[0005]

In order to achieve the above object, an electronic component of the present invention comprises an alumina substrate and an alkali-free aluminum oxide formed on one surface of the alumina substrate, containing silicon oxide, barium oxide or the like as a main component. Glass glaze, a conductor for an electrode formed on a part of the alumina substrate, and a thin film such as a conductor or a dielectric or resistor having a predetermined shape formed on the glass glaze so as to be connected to the electrode. It is composed of an element part.

Further, the manufacturing method thereof includes a step of laminating and pressing two or more green sheets having different average particle diameters of alumina, followed by firing to obtain an alumina substrate which is warped in a certain direction by a certain amount, and on one surface of the alumina substrate. After screen-printing a glass paste containing silicon oxide, aluminum oxide, barium oxide, calcium oxide, etc. as a main component, the firing is performed to obtain a glazed alumina substrate with small warpage, and a conductor is provided on a part of the glazed alumina substrate. Forming by a thin film forming method such as vapor deposition or a thick film forming method such as firing a conductor paste, and forming a thin film such as a conductor, a dielectric or a resistor on the glaze, resist coating, exposure, development, etching And a step of forming an element portion in contact with an electrode having a predetermined shape through resist stripping.

[0007]

According to this structure, due to the difference in the particle size and distribution of the alumina powder, the difference in shrinkage that occurs during firing is used to obtain a certain amount of heat in the concave side of the alumina substrate that is warped in a certain direction. By baking an alkali-free glaze with a small expansion coefficient at a high temperature to form it, we obtained a glazed alumina substrate with low warp, high strength, environmental reliability and surface smoothness and very small warpage. Since the electronic component is obtained through the photolithography technique, it is possible to eliminate the exposure variation of the pattern due to the warp of the substrate, which is a conventional problem. Therefore, when the substrate is divided into individual products after the element portion is formed, it is necessary to provide an electronic component having a fine film-like fine pattern in the element portion, which is excellent in quality, such as one having a small resistance value distribution. You can

[0008]

(Embodiment 1) A magnetoresistive effect element will be described below as an electronic component of an embodiment of the present invention with reference to the drawings. FIG. 1 is a sectional view of a magnetoresistive effect element according to an embodiment of the present invention, and FIG. 2 is a top view. Also,
Table 1 shows the pattern width, resistance value, and midpoint potential value of the magnetoresistive effect element according to one embodiment of the present invention and the conventional magnetoresistive effect element.

In FIG. 1, 1 is an alumina substrate, 2 is an alkali-free glass glaze composed mainly of silicon oxide, barium oxide, etc. formed on one side of this alumina substrate 1, 3 is a metal thin film, and 4 is an electrode. The electrodes 4 are formed at both ends of the alumina substrate 1 from the top surface to the bottom surface of the alumina substrate 1, and the metal thin film 3 constituting the element portion is formed on the glass glaze 2 so that both ends overlap the electrodes 4. It is connected to the electrode 4 by being formed. 5
Is a protective film formed so as to cover the metal thin film 3.

The magnetoresistive element according to one embodiment of the present invention is
On the alumina substrate 1, there is a glass glaze 2 having 60 wt% of silicon oxide and 25 wt% of barium oxide as its main components, and on top of that, a permalloy having a thickness of 0.1 μm and a width of 10 μm is formed into a stripe-like shape. A magnetic thin metal film 3 is formed. Further, the electrode 4 having a silver: palladium ratio of 13:87 is in contact with the ferromagnetic metal thin film 3, and the ferromagnetic metal thin film 3, the glass glaze 2 and the electrode 4 are protected by an epoxy resin. 5 is a covered structure.

With respect to the magnetoresistive effect element constructed as described above, the results of comparative evaluation with the conventional element will be shown.

The evaluation was carried out by comparing the pattern width, the resistance value, and the midpoint potential value of the magnetoresistive effect element of one embodiment of the present invention and the conventional element.

The pattern width was measured by observing with a scanning electron microscope. The resistance value and the midpoint potential value were measured by configuring as shown in FIG. In FIG. 2, 6 is a current supply terminal (+), 7 is a GND terminal, and 8 and 9 are output terminals. Resistance value is 6-7
The interval was measured. As the midpoint potential value, the potential between 7-8 and 7-9 when 5 V was applied during 6-7 was determined.

[0014]

[Table 1]

As is clear from (Table 1), the pattern width, the resistance value, and the midpoint potential value of the magnetoresistive effect element according to one embodiment of the present invention are smaller than those of the conventional element. It can be seen that the accuracy of the characteristics has improved.

(Embodiment 2) Next, a method of manufacturing the magnetoresistive effect element of Embodiment 1 will be described.

Alumina (average particle size 0.2 μm) powder was used as the inorganic component of the substrate material, polyvinyl butyral as the organic binder, di-n-butyl phthalate as the plasticizer, and a mixed solution of toluene and ethanol as the solvent (60:40 ratio). ) Was mixed in the following proportions, and wet pulverization was performed to obtain a slurry.

Alumina powder 100 parts Polyvinyl butyral 15 parts Di-n-butyl phthalate 10 parts Mixed solution of toluene and ethanol 20 parts Next, air bubbles were removed from the slurry by vacuum degassing to adjust the viscosity. The slurry was coated on a polyester film support using a doctor blade and dried in an oven to prepare a green sheet having a thickness of 0.5 mm.
The green sheet was removed from the support and cut into 80 mm squares.

On the other hand, the average particle size of alumina is 2 μm.
An 80 mm square green sheet was produced by the same method using the m sheet. Next, the above two kinds of green sheets were laminated and pressed at a temperature of 100 ° C. and 100 kg / cm ² . After that, the temperature is raised at a rate of 100 ° C / h to 1600 ° C.
After holding for 1 hour at room temperature, it was taken out at room temperature. The alumina substrate taken out was cut into a predetermined size with a laser, and a through hole was further formed. On the concave surface of the alumina substrate, for example, a glass paste containing 60 wt% of silicon oxide and 25 wt% of barium oxide as a main component and having a thermal expansion coefficient of 68 × 10 ⁻⁷ is screen-printed and baked at 1100 ° C. A conductor paste having a silver to silver ratio of 13:87 was screen-printed on the through holes and the lands and fired at 850 ° C. Place this substrate on the vacuum deposition machine,
After evacuation to a predetermined vacuum degree, permalloy was vapor-deposited to a thickness of 0.1 μm. Then, resist coating, exposure using a mask that is an aggregate of independent patterns, development, etching, and resist stripping were performed to obtain an element portion having a target shape.
Next, for example, an epoxy resin is screen-printed on the entire surface of the substrate and cured, and then each through hole is diced into four parts to obtain 255 elements as shown in FIG. 1 and FIG. The lead wire was soldered to.

Tables 2 and 3 show the relationship between the position of the element before the substrate is divided and the pattern width of the resistor, the resistance value, and the midpoint potential value in comparison with the element obtained by the manufacturing method of the present embodiment. The elements are shown for comparison. FIG. 3 shows the position of each element before the substrate is divided. Numbers in circles in FIG. 3 correspond to those in (Table 2) and (Table 3).

[0021]

[Table 2]

[0022]

[Table 3]

As is clear from (Table 2) and (Table 3),
The element obtained by the manufacturing method of the present example had characteristics close to the design value without depending on the position on the substrate before division, but in the conventional element, the design depends on the position, that is, the more the design deviates from the center of the substrate. It can be seen that the deviation from the value was large.

Table 4 shows the warp values of the glazed alumina substrate of this example and the conventional example (the warp value here means a measured value in the long side direction of the substrate).

[0025]

[Table 4]

As is clear from this (Table 4), the warp of the glazed alumina substrate in this example is 1/5 or less of the warp of the glazed alumina substrate in the conventional example.

Table 5 shows the yields of the devices obtained by the manufacturing method of this embodiment and the devices manufactured by the conventional manufacturing method (good products are selected according to the resistance value and the midpoint potential value, and the standard is the conventional device). Same as).

[0028]

[Table 5]

As is clear from (Table 5), when the magnetoresistive effect element is obtained by the manufacturing method of this embodiment, the yield is improved by 35% as compared with the conventional method.

As described above, according to this embodiment, two or more green sheets having different average particle diameters of alumina obtained by the doctor blade method are laminated and pressure-bonded and fired to form an alumina substrate warped in a certain direction by a certain amount. After obtained, a glass paste containing silicon oxide, barium oxide, etc., whose main coefficient of thermal expansion was slightly smaller than that of alumina, was screen-printed on the concave surface of this alumina substrate and then baked at 1000 ° C. or higher. Since the element portion is formed on the glazed alumina substrate having a small warpage, the pattern width distribution due to the exposure variation that has occurred before is 3% per element. %, 2% was 10% per substrate
The accuracy of characteristics such as resistance value and midpoint potential value is also improved, and the manufacturing yield is improved by 35% as compared with the conventional method.

(Embodiment 3) FIG. 4 is a sectional view of a magnetoresistive effect element according to another embodiment of the present invention.

In this embodiment, the glass glaze 2 is formed so as to come into flush contact with the electrode 4. In this case, the glass glaze 2 may not be flush with the electrode 4. For example, the structure may be such that a part thereof overlaps the electrode 4.

The structure of the magnetoresistive effect element according to this embodiment is such that lead oxide 50 wt% and boron oxide 5 wt% are formed on an alumina substrate.
And except that the glass glaze 2 containing 35 wt% of silicon oxide and 5 wt% of aluminum oxide as main components is formed,
The configuration is the same as that of the first embodiment.

The surface roughness of the glass glaze 2 is 0.
It was 20 μmRa or less. The results of comparative evaluation of the magnetoresistive effect element configured as described above with the conventional element are shown.

The evaluation was carried out by comparing the pattern width, resistance value and midpoint potential value of the magnetoresistive effect element of this example and the conventional element as in the case of Example 1.

The pattern width was measured by scanning electron microscope observation. The resistance value and the midpoint potential value are as shown in FIG.
It was configured and measured as follows. The midpoint potential value is 5 during 6-7.
The potential between 7-8 and 7-9 when V was applied was determined.

Similarly, as is clear from (Table 1), variations in the pattern width, resistance value, and midpoint potential value of the magnetoresistive effect element of one embodiment of the present invention are smaller than those of the conventional element. It can be seen that the accuracy of the characteristics has improved.

(Embodiment 4) Next, a method of manufacturing the magnetoresistive effect element of Embodiment 3 will be described.

50 wt% of lead oxide, 5 wt% of boron oxide, and 35 wt% of silicon oxide were formed on one surface of the alumina through-hole substrate.
% And aluminum oxide 5 wt% as a main component in the inorganic content are screen-printed and then fired at 850 ° C., and a conductor paste having a palladium to silver ratio of 13:87 is screen-printed on the through holes and lands. Then, it was baked at 800 ° C. After that, the fired substrate was placed in a vacuum vapor deposition machine, evacuated to a predetermined degree of vacuum, and then permalloy was vapor deposited to a thickness of 0.1 μm. And resist coating,
Exposure using a mask, which is a collection of independent patterns,
After development, etching, and resist stripping, an element portion having a target shape was obtained. Next, after epoxy-based resin is screen-printed on the entire surface of the substrate and cured, each through hole is diced into four parts to obtain 255 elements as shown in FIG.
Then, a lead wire was soldered to the back electrode.

Table 6 shows the relationship between the position of the element before the substrate is divided, the pattern width of the resistor, the resistance value, and the midpoint potential value of the element obtained by the manufacturing method of this embodiment.

The numbers indicating the positions of the respective elements before the substrate is divided correspond to the circled numbers in FIG.

[0042]

[Table 6]

As is clear from (Table 3) and (Table 6),
The element obtained by the manufacturing method of the present example had characteristics close to the design value without depending on the position on the substrate before division, but in the conventional element, the design depends on the position, that is, the more the design deviates from the center of the substrate. It can be seen that the deviation from the value was large.

As described above, also in this embodiment, the same effect as that of the third embodiment can be obtained. (Fifth Embodiment) Next, another example of the manufacturing method of the third embodiment will be described.

15 wt% of lead oxide, 5 wt% of boron oxide, and 70 wt% of silicon oxide were formed on one surface of the alumina through-hole substrate.
%, Aluminum oxide 5 wt% and alkali metal oxide 2
A glass paste containing wt% as a main component in the inorganic content is screen-printed and fired at 900 ° C., and a conductor paste having a palladium: silver ratio of 13:87 is screen-printed on through holes and lands at 850 ° C. Baked. Then, the fired substrate was placed in a vacuum vapor deposition machine, evacuated to a predetermined vacuum degree, and then permalloy was vapor deposited to a thickness of 0.1 μm. Then, an element portion having a target shape was obtained through resist coating, exposure using a mask which is an aggregate of independent patterns, development, etching, and resist stripping. Next, epoxy resin is screen-printed on the entire surface of the substrate and cured, and each through hole is diced into four parts to obtain 255 elements as shown in FIG. 4, and then lead wires are soldered to the back surface electrodes. I attached it.

Also in the magnetoresistive effect element obtained in this example, the same effect as in Example 4 was obtained.

(Sixth Embodiment) Next, another embodiment of the present invention will be described.

In the magnetoresistive element of this example, as shown in FIG. 4, there was an electrode 4 having a silver: palladium ratio of 13:87 on a part of an alumina substrate 1, 50 wt% of lead oxide and 5 wt% of boron oxide. The glass glaze 2 mainly composed of 35 wt% of silicon oxide and 5 wt% of aluminum oxide is the conductor electrode 4
, So as to cover the alumina substrate 1. On top of that, a permalloy having a thickness of 0.1 μm and a width of 10 μm is in contact with the electrode in the shape of a folded stripe, and the permalloy film, the glass glaze 2, and the alumina substrate 1 are formed.
The electrode 4 on the upper surface is covered with an epoxy resin. The surface roughness of the glaze 2 was 0.20 μmRa or less.

The results of comparative evaluation of the magnetoresistive effect element having the above-described structure with the conventional element are shown in Table 7.

The evaluation was carried out by comparing the number of occurrences of breaks in the pattern of the magnetoresistive effect element of the embodiment of the present invention and the conventional element and the occurrence of worm eating.

[0051]

[Table 7]

As is clear from (Table 7), the magnetoresistive effect element according to the embodiment of the present invention is free from the disconnection of the pattern and the erosion of the worm which is the conventional element.

As described above, according to this embodiment, an electronic component having an element portion composed of a fine pattern of a thin film free from disconnection and insect erosion was obtained.

(Embodiment 7) Next, a manufacturing method of Embodiment 6 will be described.

A conductive paste having a palladium: silver ratio of 13:87 was screen-printed on the lands and through-holes of the alumina through-hole substrate and baked at 850 ° C., and 50 wt% of lead oxide and 5 wt% of boron oxide were formed on one surface. %, Silicon oxide 35% by weight, and aluminum oxide 5% by weight after screen printing a glass paste containing inorganic components as main components in the inorganic content 75
After firing at 0 ° C., the fired substrate is placed in a vacuum vapor deposition machine and evacuated to a predetermined vacuum degree, and then Permalloy is set to 0.1.
It was deposited to a thickness of μm. Then, resist coating, exposure using a mask that is an aggregate of independent patterns, development,
After the etching and the resist peeling, an element portion having a target shape was obtained. Next, epoxy resin is screen-printed on the entire surface of the substrate and cured, and each through hole is diced into four parts to obtain 255 elements as shown in FIG. 4, and then lead wires are soldered to the back surface electrodes. I attached it.

Table 8 shows the yields of the device obtained by the manufacturing method of this example and the device obtained by the conventional manufacturing method.

[0057]

[Table 8]

As is clear from Table 8, when the magnetoresistive effect element is obtained by the manufacturing method of this embodiment, the yield (good products are selected according to the resistance value and the midpoint potential value, and the standard is the conventional element). It is understood that the same) is improved by 10% as compared with the conventional method.

As described above, according to this embodiment, the manufacturing yield can be improved. (Embodiment 8) Next, another example of the manufacturing method of Embodiment 6 will be described.

A conductive paste having a palladium: silver ratio of 13:87 was screen-printed on the lands and through-holes of the alumina through-hole substrate and baked at 900 ° C., and 15 wt% lead oxide and 5 wt% boron oxide were formed on one surface. %, Silicon oxide 70 wt%, aluminum oxide 5 wt%, and a glass paste containing alkali metal oxide 2 wt% as a main component in the inorganic content is screen-printed and fired at 850 ° C., and then the fired substrate is placed in a vacuum deposition machine. After being installed and evacuated to a predetermined vacuum degree, permalloy was vapor-deposited to a thickness of 0.1 μm. Then, an element portion having a target shape was obtained through resist coating, exposure using a mask which is an aggregate of independent patterns, development, etching, and resist stripping. Next, epoxy resin is screen-printed on the entire surface of the substrate and cured, and then each through hole is diced so as to be divided into four to obtain 255 elements as shown in FIG. 4. After that, a lead wire is soldered to the back electrode. I attached it.

Also in the magnetoresistive effect element obtained in this Example 8, the same production yield result as in Example 7 was obtained.

[0062]

As described above, according to the present invention, it is possible to eliminate the variation in the pattern shape caused by the large warp of the conventional substrate, and improve the accuracy of the characteristics and the yield. And the manufacturing method thereof can be realized.

[Brief description of drawings]

FIG. 1 is a sectional view of a magnetoresistive effect element according to an embodiment of the present invention.

FIG. 2 is a top view of the magnetoresistive effect element.

FIG. 3 shows a magnetoresistive element according to the present invention and a conventional magnetoresistive element.
Top view of alumina through-hole substrate showing the position of each element before substrate division

FIG. 4 is a sectional view of a magnetoresistive effect element according to another embodiment of the present invention.

[Explanation of symbols]

 1 Alumina substrate 2 Glass glaze 3 Metal thin film 4 Electrode

Claims (15)

[Claims] 1. An alumina substrate, a glass glaze formed on one surface of the alumina substrate and containing lead oxide, boron oxide, silicon oxide, and aluminum oxide as main components, and electrodes formed on both ends of the alumina substrate. And an element part formed of a thin film such as a conductor or a dielectric or a resistor having a predetermined shape, which is formed on the glass glaze so as to be connected to the electrode. 2. An alumina substrate, an alkali-free glass glaze formed on one surface of the alumina substrate, electrodes formed at both ends of the alumina substrate, and an electrode formed on the glass glaze so as to be connected to each other. An electronic component including an element portion formed of a formed conductor or a thin film such as a dielectric or a resistor. 3. An alumina substrate and electrodes formed on both ends of the alumina substrate, and formed on one side of the alumina substrate so as to partially overlap the electrode or come into flush contact with the electrode and to be oxidized. It consists of a glass glaze containing lead, boron oxide, silicon oxide, and aluminum oxide as main components, and a thin film such as a conductor or a dielectric or resistor of a predetermined shape formed on the glass glaze so as to be connected to the electrode. An electronic component consisting of an element section. 4. The electronic component according to claim 1, wherein the surface roughness of the glaze is 0.20 μmRa or less. 5. The glass glaze contains 10 to 70 lead oxide.
The electronic component according to claim 1 or 3, characterized in that the wt% and silicon oxide are in the range of 30 to 80 wt%, and the sum of the two is contained in an amount of 60 wt% or more and less than 100 wt%. 6. The electronic component according to claim 1, wherein the content of the alkali metal oxide contained in the glass glaze is 2 wt% or less. 7. The electronic component according to claim 2, wherein the pattern width of the element portion is 50 μm or less. 8. The electronic component according to claim 2, wherein the variation in the pattern width of the element portion is within 2%. 9. A step of baking a glass paste containing lead oxide, boron oxide and silicon oxide as main components on one surface of an alumina substrate after screen printing, and a conductor paste as an electrode on both ends of the alumina substrate after screen printing and baking. And a step of forming a thin film such as a conductor or a dielectric or a resistor on the glaze to form an element portion having a predetermined shape. 10. A step of laminating and press-bonding two or more green sheets having different average particle diameters of alumina, followed by firing to obtain an alumina substrate having a certain amount of warpage in a certain direction, and silicon oxide and oxide on one side of the alumina substrate. After screen-printing a glass paste containing barium or the like as a main component, firing it to obtain a warped small glaze alumina substrate, forming a conductor as an electrode on a part of this glaze alumina substrate, and conducting on the glaze. And a step of forming a thin film such as a body or a dielectric or a resistor, and forming an element part in contact with an electrode having a predetermined shape. 11. A step of screen-printing a conductor paste as an electrode on an alumina substrate, followed by firing, and lead oxide and boron oxide on one surface of the alumina substrate so as to partially overlap the electrode or make flush contact with the electrode. Screen-printing a glass paste containing silicon oxide and aluminum oxide as the main components, baking it, forming a thin film such as a conductor, dielectric, or resistor on the glass glaze surface, and connecting the thin film to an electrode And a step of forming an element portion having a predetermined shape. 12. A warp of a substrate consisting of an alumina substrate and a glass glaze containing lead oxide, boron oxide and silicon oxide as main components formed on one surface of the alumina substrate is 20 μm or less. The method for manufacturing an electronic component according to claim 9. 13. The firing temperature of the glass paste is 600 ° C. to 950 ° C., as claimed in claim 9 or 11.
A method for manufacturing the described electronic component. 14. A warp of an alumina substrate and a substrate composed of an alkali-free glass glaze containing silicon oxide, barium oxide or the like as a main component formed on one surface of the alumina substrate has a warp of 20 μm or less. Claim 1
0. A method of manufacturing an electronic component according to item 0. 15. A screened glass paste having a warp of 20 μm or less is printed on the concave surface of the alumina substrate, the glass paste containing silicon oxide, barium oxide or the like as a main component and having a coefficient of thermal expansion smaller than that of alumina. The method of manufacturing an electronic component according to claim 10, wherein the method is obtained by firing at 1000 ° C. or higher.