JPH05281296A - Test head of semiconductor test device - Google Patents

Abstract

PURPOSE:To obtain a test head of an IC test device without requiring inversion of the test head and replacement of a connection assembly and a performance board. CONSTITUTION:A test head for semiconductor test device is provided with a test head main body 1a, a first performance board 2 is provided on the upper surface of the test head main body 1a, and at the same time a second performance board 3 is provided on the upper surface of the lower surface. A connection assembly 21 and a pin card 6 are provided within the test head main body 1a, where the connection assembly 21 electrically connects the performance board and the pin card 6. The connection assembly 21 is provided with a selection switch for switching the pin card 6 to either the first performance board 2 or the second performance board 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor (hereinafter referred to as I
C) test apparatus test head, and more particularly to an IC test apparatus test head that does not require test head reversal and connection assembly and performance board replacement.

[0002]

2. Description of the Related Art A conventional example of a test head of an IC test apparatus will be described with reference to FIGS. 1, 2 and 3. In the conventional test head 1, the performance board 2 electrically connected to the IC to be tested is mounted only on the upper surface of the test head 1.

Here, as shown in FIG. 2, when the packaged IC 4 which is a finished product is to be tested, the performance board 2 having the IC socket 5 attached thereto is attached to the test head 1 and the packaged IC 4 is attached to the test head 1. Attach to IC socket 5. The lever 5a is used to attach and detach the packaged IC 4 to the IC socket 5. A connector 7a, a gold pad 8 and other connecting members are provided on the bottom surface side of the performance board 2, and the packaged IC 4 is tested through these connecting members.
It is electrically connected to a large number of pin cards 6 housed in the head 1. Mating connector 7 that fits into connector 7a
b, the probe contact pin 9 which is pressed against the gold pad 8 is attached to the pin card 6 side.

As shown in FIG. 3, when a semi-finished wafer IC is tested, the performance board 3 is mounted on the upper surface of the test head 1. In this case, on the upper surface of the performance board 3, although not shown, a connecting member for electrically connecting with a connecting member on the upper surface of the wafer prober 11 containing the wafer IC to be tested, for example, a gold pad. Is provided. On the lower surface side of the performance board 3, connection members similar to those on the lower surface of the performance board 2 shown in FIG. 2B are provided. When testing a wafer IC,
The head 1 is turned upside down, and the performance board 3 is faced downward so that the performance board 3 is superposed on the wafer prober 11 and electrically connected to each other.

The test head 1 is a cooling air duct 1
It is connected to the IC test apparatus main body 15 via three and a large number of cables 14. The air duct 13 and the cable 14 are suspended and held by a support 16 extending from the IC test apparatus body 15 in the middle thereof. test·
The reason for reversing the head 1 is to make the distance from the test wafer 1C as short as possible to facilitate transmission of high frequency signals.

By the way, in recent years, the number of pins of the test head 1 has increased with the increase in the size of ICs.
The weight of the head 1 reaches a large weight of, for example, 200 kg, and the size of the head 1 also increases, so that the member for reversing the test head 1 becomes large and expensive. And
When the test head 1 is turned over, a great stress is applied to the cable 14, which may lead to a disconnection accident. Under such circumstances, there has been proposed a test head which does not need to be inverted regardless of whether the IC to be tested is a packaged IC or a wafer IC (Japanese Patent Application No. 3-103).
324586).

A test head which does not need to be inverted will be described below with reference to FIGS. 4 and 5. The test head 1 includes a performance board 2, a connection assembly 21, a test head body 1a, a connection assembly 22 and a performance board 3. An IC socket 5 for mounting a packaged IC to be tested is mounted on the upper surface of the performance board 2, and a lower surface of the IC socket 5 is connected to a terminal pin of the IC socket 5 and a connection assembly 21.
And a connecting member 2a for connecting to. Connection member 2
As a, for example, the connector 7a or the gold pad 8 shown in FIG. 2B is used.

On the underside of the performance board 3 is a wafer prober 11 containing a wafer IC to be tested.
A connecting member 3a electrically connected to the connecting member on the upper surface of the connecting member 3a, and an upper surface of the connecting member 3b electrically connecting to the connecting member 3a and connecting to the connection assembly 22. As the connecting members 3a and 3b, for example, the connector 7a or the gold pad 8 shown in FIG. 2B is used.

A through hole 23 having a substantially square horizontal cross section is formed in the test head main body 1a in the vertical direction, and a plurality of pin cards 6 are accommodated horizontally and in multiple stages around the through hole 23. .. Therefore, the pin card 6 is perpendicular to the peripheral surface of the through hole. A connector 6 a is attached to the pin card 6 so as to face the peripheral surface of the through hole 23. The connection assembly 21 is a tubular body having a ring-shaped flange portion 21a at the upper edge thereof, and can be inserted into and removed from the through hole 23 of the test head main body 1a from above, and a pin is attached to the outer peripheral surface of the tubular body. A connector 26 fitted to the connector 6a of the card 6 is attached. Flange 21
The connection member 2 on the lower surface of the performance board 2 is shown in a.
A connecting member 28 for connecting to a is provided. As the connecting member 28, the connecting member 2 of the performance board 2 is used.
Depending on whether a is connector 7a or gold pad 8 of FIG. 2B, connector 7b or probe contact pin 9 is used. The contact of the connector 7b or the gold pad 8 is connected to the contact of the corresponding connector 26.

The connection assembly 22 is constructed in substantially the same manner as the connection assembly 21. However, it differs in that it can be inserted into and removed from the through hole 23 of the test head body 1a from below. A connector 31 fitted to the connector 6a of the pin card 6 is provided on the outer peripheral surface of the tubular body, and a connecting member 32 for connecting to the connecting member 3b on the upper surface of the performance board 3 is provided on the lower surface of the flange portion 22a. Is provided.

[0011]

[Problems to be Solved by the Invention]
The head in which the connection assembly 22 and the performance board 3 are combined is inserted into and removed from the through hole 23 of the test head body 1a from below, so that the test can be performed even when testing the wafer IC. There is no need to reverse the head. However, depending on whether the IC to be tested is a packaged IC or a wafer IC, connection assembly 21 and performance
The one in which the board 2 is combined or the one in which the connection assembly 22 and the performance board 3 are combined is selectively used, and the connection assembly and the performance board are selected according to the IC to be tested. You have to replace it each time.

The present invention includes a switch in the connection assembly so that the connector of the pin card can be selectively connected to either of the performance boards provided on the upper and lower surfaces of the test head for testing. -Eliminates the need to reverse the head and replace the connection assembly and performance board.

[0013]

[Means for Solving the Problems] Test head body 1a
And a first performance board 2 on the upper surface of the test head body 1a and a second performance board 3 on the lower surface thereof. The connection assembly 21 is provided in the test head body 1a. And the pin card 6, where the connection assembly 21 electrically connects the performance board 2 or the performance board 3 to the pin card 6, and the connection assembly 21 is the pin card. A test head for a semiconductor test apparatus having a changeover switch for connecting 6 to either the first performance board 2 or the second performance board 3 was constructed.

[0014]

Embodiments of the present invention will be described with reference to FIGS. 6 and 2 '. The test head of the IC test apparatus of the present invention comprises a test head body 1a, a performance board 2 on the upper surface of the test head body 1a, and a performance board 3 on the lower surface thereof. .. A connection assembly 21 and a pin card 6 are provided in the test head body 1a.

The performance board 2 on the upper surface of the test head body 1a has an IC socket 5 for mounting the packaged IC to be tested on its upper surface. The lower surface of the performance board 2 is provided with a connecting member 2a which is connected to the terminal pins of the IC socket 5 and also to the connecting member 28 of the connection assembly 21.

The performance board 3 on the lower surface of the test head body 1a has a wafer I to be tested on its lower surface.
A connecting member 3a for electrically connecting with a connecting member on the upper surface of the wafer prober 11 for accommodating C is provided. On the upper surface of the performance board 3, the connection assembly 21 is electrically connected to the connection member 3a.
The connecting member 3b is also provided for electrically connecting to the connecting member 32. The difference from the conventional example of the test head of the present invention is that the packaged IC which is a finished product and a performance board 3 which is compatible with the packaged IC are provided on the lower surface of the test head body 1a to test the packaged IC. I just made it.

A vertical through hole 23 is formed in the test head body 1a, and a plurality of pin cards 6 are mounted around the through hole 23 at right angles to the peripheral surface of the through hole 23. The pin card 6 is provided with a connector 6a facing the through hole 23. The connection assembly 21 has a flange portion 2 on the upper edge and the lower edge.
It is a tubular body having 1a and 22a, and this tubular body has a shape conjugate with the through hole 23 of the test head body 1a. The connecting member 28 described above has the flange portion 21a.
And the connecting member 32 is attached to the flange portion 22a. On the outer peripheral surface of the cylindrical body of the connection assembly 21, there is provided a connector 26 that fits with the connector 6a of the pin card 6. As shown in FIG. 7, the connector 26 is connected to the movable contacts of the changeover switches 40 according to the present invention. One of the fixed contacts of each of the changeover switches 40 is connected to the connecting member 28 of the flange portion 21a, and the other is connected to the connecting member 32 of the flange portion 22a.

FIG. 8 is a diagram showing another embodiment of the present invention. The test head body 1a is provided with the performance board 2 on the upper surface thereof, the performance board 3 is provided on the lower surface thereof, and the pin card 61 and the pin card 62 are provided in the test head body 1a.
Switch 1 and pin card 62 respectively
01 and the changeover switch 402 are connected to the performance board 2 or the performance board 3 so that two or more kinds of ICs can be inverted at the same time and the connection assembly and the performance board can be replaced. It can be easily implemented without the need to perform it.

[0019]

The test head of the present invention is as described above, and the changeover switch 4 shown in FIG. 7 is used.
By switching the movable contact of 0 to the upper side, the test of the packaged IC connected to the performance board 2 can be performed. Then, the changeover switch 40
By switching the movable contact of the lower side to the lower side, the wafer IC or the packaged IC connected to the performance board 3 different from the performance board 2 can be tested. These different tests can be easily performed without the need to invert the test head and replace the connection assembly and performance board.

[Brief description of drawings]

FIG. 1 shows a principle view of a test head, in which A is a plan view thereof and B is a sectional view taken along line CC ′ of A.

FIG. 2 shows a performance board, where A is a perspective view and B is a cross-sectional view.

FIG. 3 is a perspective view of a conventional example of an IC test apparatus.

FIG. 4 is an exploded perspective view of a conventional example of an IC test device.

FIG. 5 is a diagram illustrating electrical connection between a performance board, a connection assembly, and a test head body.

FIG. 6 is an exploded perspective view of an embodiment of the present invention.

FIG. 7 is a diagram illustrating switching of a signal circuit by a changeover switch.

FIG. 8 is a diagram showing another embodiment of the present invention.

[Explanation of symbols]

 1a Test head body 2 1st performance board 3 2nd performance board 6-pin card 21 Connection assembly 40 Changeover switch

Claims (1)

[Claims] 1. A test head body comprising a test head
The head body has a first performance board on the upper surface and a second performance board on the lower surface, and a connection is made in the test head body.
Assembly and pin card, where the connection assembly is the performance board and pin card.
The electrical connection between the card and the connection assembly, the pin assembly
A test head for a semiconductor test device, comprising a changeover switch for changing and connecting to either the board or the second performance board.