JPH05275909A - Superhigh frequency functional parts - Google Patents

Abstract

PURPOSE:To provide a superhigh frequency functional past using a triplet resonator which includes a superhigh frequency circuit function, can contain other circuit component parts, and also can facilitate the surface packaging. CONSTITUTION:The ground planes 3a and 3b are provided on the upper and lower surfaces of a dielectric 2 which internally sinters a central conductor 1 in a single body. Both planes 3a and 3b are electrically connected to each other via a through hole 8 piercing through the dielectric so that a triplet resonator 4 is produced. Then a surface layer 9 made of an insulator is provided on the resonator 4, and an electronic parts 6 is set on the layer 9. A terminal 12 is added to the resonator 4 on the layer 9 for connection of the parts 6 to an external circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resonator consisting of a triplate type stripline for ultra high frequencies, that is, a central conductor is integrally formed in a dielectric by sintering and a ground plane is formed on the upper and lower surfaces of the dielectric. A resonator formed by
The present invention relates to a super-high frequency functional component including an electronic component combined with the resonator.

[0002]

2. Description of the Related Art High frequency region, especially 250 MHz to several GHz
For example, a triplate resonator used for a voltage control oscillator or a filter of a mobile communication device for ultra high frequencies as shown in FIG. 3 is shown in a vertical sectional view of FIG. 3B and a transverse sectional view of FIG. , A central conductor 1 made of silver or the like is integrally formed by sintering in a dielectric 2 such as alumina having a low high-frequency loss, and a ground plane 3 made of silver or the like connected to the ground is formed on both surfaces and side surfaces of the dielectric 2. Then, the end a of the center conductor 1 is used as an external connection terminal, and the other end b of the center conductor 1 is connected to the ground plane 3. As shown in (D), the center conductor 1 has an inductance L component of an equivalent circuit. To form
A capacitance C component is formed between the central conductor 1 and the ground plane 3.

[0003]

As described above, the conventional tri-plate type resonator 4 includes the upper and lower ground planes 3.
The resonator 4 itself can be used as a surface-mounted component because it covers the entire outer surface except the terminal a in order to secure electrical conduction (the mounting surface is referred to as a lower surface in this specification). , Can not be used as a substrate,
As shown in (A), it is soldered (7) and mounted on another mother board 5 together with another electronic component 6 to form an ultra-high frequency functional component such as a voltage controlled oscillator and a filter as described above. It was Therefore, the above-described conventional super-high frequency functional component has a problem that it is difficult to reduce the size.

In view of such problems, the present invention uses a tri-plate type resonator which has an ultra-high frequency circuit function, can mount other circuit components, and can be easily surface-mounted. The purpose is to provide a high-frequency functional component.

[0005]

In order to achieve the above object, the present invention provides a ground plane on the upper and lower surfaces of a dielectric body having a central conductor integrally sintered therein, and the upper and lower ground planes are connected to each other by the dielectric body. A triplate resonator electrically connected by a through hole provided in the resonator to form a surface layer made of an insulator on the resonator, and an electronic component is mounted on the surface layer. A terminal for connecting the electronic component to an external circuit is provided on a side surface of the resonator and / or the surface layer.

[0006]

Since the super high frequency functional component of the present invention has the above-mentioned configuration, the electrical conduction between the upper and lower ground planes of the resonator and a part of the capacitive component can be secured by the through hole, which allows the side surface of the resonator to be secured. It is not always necessary to provide the conductors for connecting the upper and lower ground planes, and the side surface can be used as the surface for forming the external connection terminal of the mounted electronic component.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a cross-sectional view (cross-sectional view taken along the line FF of FIG. 1B) showing an embodiment of a super high frequency functional component according to the present invention, and FIG. E sectional view, FIG. 2 is a perspective view. As shown in FIGS. 1A and 1B, in the present invention, the ground planes provided on the upper and lower surfaces of the central conductor 1 are electrically connected by a plurality of through holes 8. On the upper surface of the resonator 4, a surface layer 9 made of an insulator (preferably a dielectric material of the same material as the dielectric 2) is formed on the resonator 4, and a conductor 10 is formed on the surface layer 9. , The electronic component 6 is mounted and soldered (7). If necessary, the surface layer 9 may be provided therein with the conductor 11 for connecting the electronic components 6 therebetween.
To form a multilayer circuit. 8a is the central conductor 1
Through terminals for connecting the inner ends of the to the ground planes 3a and 3b, a is the terminal.

As described above, the upper and lower ground planes 3
The a and 3b are connected by a plurality of through holes 8 to ensure electrical conduction, and it is not necessary to provide the side ground plane 3c on the entire side surface. Then, the terminal 12 of the electronic component 6 is formed on at least one of the resonator 4 and the side surface of the surface layer 9 of the dielectric exposed surface 2a formed on the side surface. These terminals 12 are used, for example, for power supply connection, output, control voltage, modulation, grounding, and the like.

Although the above embodiment has been described as a single super high frequency functional component, when a plurality of tri-plate type resonators are formed in the lateral direction (in-plane) or stacked in the longitudinal direction. It goes without saying that the invention can also be applied to a multilayered high-frequency functional component as formed.

[0010]

According to the present invention, since the through hole connecting the upper and lower ground planes is provided in the triplate resonator, electrical conduction can be ensured by the through hole, whereby the side surface of the resonator can be secured. It is not always necessary to provide conductors for connecting the upper and lower ground planes, and the side surface can be used as the surface for forming the external connection terminal of the mounted electronic component,
In addition, since the surface layer made of the insulating layer is formed on the upper surface of the resonator, the resonator can be used as an electronic component mounting substrate, and as a result, the super high frequency functional component can be significantly downsized. Taking a voltage controlled oscillator as an example, the occupied area is about 15%,
The volume can be reduced by about 30%, and leadless can be realized.

[Brief description of drawings]

1A is a cross-sectional view (cross-sectional view taken along the line FF of FIG. 1B) showing an embodiment of a super-high frequency functional component according to the present invention, and FIG. It is an EE sectional view.

FIG. 2 is a perspective view of the embodiment.

3A is a perspective view showing a conventional super-high frequency functional component, FIG. 3B is a vertical cross-sectional view of a triplate resonator which constitutes the component, and FIG. 3C is a cross-sectional view of the resonator. (D) is an equivalent circuit diagram of the resonator.

[Explanation of symbols]

 1 Central Conductor 2 Dielectric 3, 3a-3c Ground Plane 4 Resonator 5 Mother Board 6 Electronic Component 8, 8a Through Hole 9 Surface Layer 10, 11 Conductor

Claims (1)

[Claims] 1. A ground plane is provided on the upper and lower surfaces of a dielectric body in which a center conductor is integrally sintered, and upper and lower ground planes are electrically connected by through holes provided through the dielectric body. The triplate resonator is formed, a surface layer made of an insulator is formed on the resonator, an electronic component is mounted on the surface layer, and a terminal for connecting the electronic component to an external circuit is connected to the resonator. And / or an ultrahigh frequency functional component provided on the side surface of the surface layer.