JPH05275821A - Connector for flexible substrate, and electronic equipment - Google Patents
Connector for flexible substrate, and electronic equipmentInfo
- Publication number
- JPH05275821A JPH05275821A JP9601092A JP9601092A JPH05275821A JP H05275821 A JPH05275821 A JP H05275821A JP 9601092 A JP9601092 A JP 9601092A JP 9601092 A JP9601092 A JP 9601092A JP H05275821 A JPH05275821 A JP H05275821A
- Authority
- JP
- Japan
- Prior art keywords
- pair
- flexible
- board
- printed
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板とフレキ
シブル基板との接続装置及びその接続したプリント基板
を収納した電子機器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device for connecting a printed board and a flexible board, and an electronic device containing the connected printed board.
【０００２】[0002]
【従来の技術】本発明の出願人は、産業装置用の超小型
ビデオカメラの先願例として例えば特願平３−２９４３
１２号を先に出願している。そして、この先願例では、
複数のプリント基板間をフレキシブル基板で接続したも
のをジグザグ状に折り畳んでカメラケース内に収納して
いる。2. Description of the Related Art The applicant of the present invention has filed, for example, Japanese Patent Application No. 3-2943 as a prior application example of a micro video camera for industrial equipment.
I applied for No. 12 first. And in this earlier application example,
A plurality of printed circuit boards connected by a flexible circuit board are folded in a zigzag shape and stored in a camera case.
【０００３】しかし、複数のプリント基板をジグザグ状
に折り畳む構造では、フレキシブル基板に引っ張りやよ
じれのストレスが作用して、フレキシブル基板の半田付
け部分が剥離し易い。However, in a structure in which a plurality of printed circuit boards are folded in a zigzag pattern, tensile or kinking stress acts on the flexible circuit boards, and the soldered portions of the flexible circuit boards are easily peeled off.
【０００４】そこで従来から、図５に示すようなフレキ
シブル基板の接続装置が考えられている。これは、両面
プリント基板の場合、プリント基板１の両面１ａ、１ｂ
に一定ピッチで形成された複数のランド２ａ、２ｂに、
一対のフレキシブル基板３ａ、３ｂの複数の信号線４を
熱圧着等による半田付けによって接続する。この際、プ
リント基板１の端部とランド２ａ、２ｂとの間の両面１
ａ、１ｂの余白部分と両フレキシブル基板３ａ、３ｂと
の間に介在した両面接着テープや熱可塑性樹脂テープ等
にて形成された一対の補強用テープ５ａ、５ｂをプリン
ト基板１の両面１ａ、１ｂと両フレキシブル基板３ａ、
３ｂの対向面３０ａ、３０ｂとの両方に熱圧着等にて接
着したものである。この場合、一対の補強用テープ５
ａ、５ｂによって、両フレキシブル基板３ａ、３ｂの剥
離強度が補強され、両フレキシブル基板３ａ、３ｂのラ
ンド２ａ、２ｂへの半田付け部分が剥れにくくなる。Therefore, a flexible board connecting device as shown in FIG. 5 has been conventionally considered. In the case of a double-sided printed circuit board, this is both sides 1a, 1b of the printed circuit board 1.
A plurality of lands 2a, 2b formed at a constant pitch,
The plurality of signal lines 4 of the pair of flexible boards 3a and 3b are connected by soldering such as thermocompression bonding. At this time, both sides 1 between the end of the printed circuit board 1 and the lands 2a, 2b.
A pair of reinforcing tapes 5a and 5b formed by a double-sided adhesive tape or a thermoplastic resin tape interposed between the margins of a and 1b and the flexible boards 3a and 3b are attached to both sides 1a and 1b of the printed circuit board 1. And both flexible boards 3a,
It is adhered to both the facing surfaces 30a and 30b of 3b by thermocompression bonding or the like. In this case, a pair of reinforcing tapes 5
By a and 5b, the peel strength of both flexible boards 3a and 3b is reinforced, and the soldered portions of both flexible boards 3a and 3b to lands 2a and 2b are less likely to peel off.
【０００５】[0005]
【発明が解決しようとする課題】しかし、ビデオカメラ
等の電子機器の小型化に伴うプリント基板１の高密度実
装により、従来は、両補強用テープ５ａ、５ｂのプリン
ト基板１の両面１ａ、１ｂへの接着巾Ｗ1 を１〜２ｍｍ
程度しかとれず、両フレキシブル基板３ａ、３ｂの剥離
強度をあまり高くすることができないと言う問題があっ
た。However, due to the high-density mounting of the printed circuit board 1 accompanying the miniaturization of electronic devices such as video cameras, the both sides 1a, 1b of the printed circuit board 1 of both reinforcing tapes 5a, 5b have been conventionally used. Adhesive width W 1 to 1 to 2 mm
However, there is a problem that the peel strength of both flexible substrates 3a and 3b cannot be increased so much.
【０００６】本発明は、上記の問題を解決するためにな
されたものであって、フレキシブル基板の剥離強度を飛
躍的に向上することができるフレキシブル基板の接続装
置及び電子機器を提供することを目的としている。The present invention has been made to solve the above problems, and it is an object of the present invention to provide a flexible substrate connecting device and electronic equipment capable of dramatically improving the peel strength of a flexible substrate. I am trying.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
の本発明のフレキシブル基板の接続装置の請求項１は、
プリント基板の両面のランドに一対のフレキシブル基板
の信号線を両側から接続するフレキシブル基板の接続装
置において、上記一対のフレキシブル基板の対向面に接
着した一対の補強用テープの一端側を上記プリント基板
の両面に接着すると共に、これら一対の補強用テープの
他端側どうしを相互に接着したものである。請求項２
は、プリント基板の一方の面のランドに一枚のフレキシ
ブル基板の信号線を接続するフレキシブル基板の接続装
置において、上記プリント基板の他方の面にダミー用フ
レキシブル基板を接続し、上記フレキシブル基板とダミ
ー用フレキシブル基板の対向面に接着した一対の補強用
テープの一端側を上記プリント基板の両面に接着すると
共に、これら一対の補強用テープの他端側どうしを相互
に接着したものである。請求項３は、プリント基板の一
方の面のランドに一枚のフレキシブル基板の信号線を接
続するフレキシブル基板の接続装置において、一対の補
強用テープの一端側を上記プリント基板の両面に接着す
ると共に、これら一対の補強用テープの他端側どうしを
相互に接着し、上記フレキシブル基板を上記一対の補強
用テープの一方の外側面に接着したものである。According to a first aspect of the present invention, there is provided a flexible board connecting device for achieving the above object.
In a flexible board connecting device for connecting signal lines of a pair of flexible boards to lands on both sides of a printed board from both sides, one end side of a pair of reinforcing tapes adhered to opposite surfaces of the pair of flexible boards is connected to the printed board. In addition to adhering to both surfaces, the other end sides of the pair of reinforcing tapes are adhered to each other. Claim 2
Is a flexible board connecting device for connecting a signal line of one flexible board to a land on one side of the printed board, a dummy flexible board is connected to the other side of the printed board, and the flexible board and the dummy are connected. One end side of a pair of reinforcing tapes adhered to the opposite surfaces of the flexible substrate is adhered to both sides of the printed circuit board, and the other end sides of the pair of reinforcing tapes are adhered to each other. According to a third aspect of the present invention, in a flexible board connecting device for connecting a signal line of a single flexible board to a land on one surface of the printed board, one end side of a pair of reinforcing tapes is bonded to both sides of the printed board. The other ends of the pair of reinforcing tapes are bonded to each other, and the flexible substrate is bonded to one outer surface of the pair of reinforcing tapes.
【０００８】[0008]
【作用】上記のように構成された本発明のフレキシブル
基板の接続装置の請求項１〜３は、一対の補強用テープ
の一端側のプリント基板への接着巾が小さくても、これ
ら一対の補強用テープの他端側が相互に接着されている
ので、プリント基板に対する一対の補強用テープの接着
強度が非常に高い。そして、フレキシブル基板と補強用
テープとの接着巾が非常に長いので、プリント基板に対
するフレキシブル基板の剥離強度が飛躍的に向上する。
請求項４の電子機器は、剥離強度が非常に高いフレキシ
ブル基板を折り曲げるようにして、複数のプリント基板
をジグザグ状に折り畳んでケース内にコンパクトに収納
することができる。According to the first to third aspects of the flexible board connecting device of the present invention constructed as described above, the pair of reinforcing tapes can be reinforced even if the width of one end of the reinforcing tape to the printed board is small. Since the other ends of the tapes are bonded to each other, the adhesive strength of the pair of reinforcing tapes to the printed circuit board is very high. Further, since the adhesive width between the flexible substrate and the reinforcing tape is very long, the peel strength of the flexible substrate from the printed circuit board is dramatically improved.
In the electronic device according to the fourth aspect, the flexible printed circuit board having a very high peeling strength is bent so that the plurality of printed circuit boards can be folded in a zigzag shape and compactly housed in the case.
【０００９】[0009]
【実施例】以下、本発明のフレキシブル基板の接続装置
及び電子機器の実施例を図１〜図４を参照して説明す
る。なお、図５と同一構造部には同一の符号を付して説
明の重複を省く。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a flexible board connecting device and electronic equipment according to the present invention will be described below with reference to FIGS. The same structural parts as those in FIG. 5 are designated by the same reference numerals to omit redundant description.
【００１０】まず、図１の（Ａ）及び（Ｃ）に示すよう
に、両面プリント基板の場合、プリント基板１の両面１
ａ、１ｂの複数のランド２ａ、２ｂに、一対のフレキシ
ブル基板３ａ、３ｂの複数の信号線４を熱圧着等による
半田付けによって接続する際、図５に示した従来の補強
用テープ５ａ、５ｂの接着巾Ｗ1 の数倍の巾（長さ）Ｗ
2 を有する一対の補強用テープ６ａ、６ｂを用いる。な
お、これらの補強用テープ６ａ、６ｂは従来同様、両面
接着テープや熱可塑性樹脂テープ等にて形成されてい
る。First, as shown in FIGS. 1A and 1C, in the case of a double-sided printed board, both sides 1 of the printed board 1 are printed.
When connecting the plurality of signal lines 4 of the pair of flexible substrates 3a and 3b to the plurality of lands 2a and 2b of a and 1b by soldering such as thermocompression bonding, the conventional reinforcing tapes 5a and 5b shown in FIG. Width (length) W that is several times the adhesive width W 1
A pair of reinforcing tapes 6a and 6b having 2 are used. The reinforcing tapes 6a and 6b are formed of double-sided adhesive tape, thermoplastic resin tape, or the like, as in the conventional case.
【００１１】そして、図１の（Ｂ）に示すように、これ
ら一対の補強用テープ６ａ、６ｂの外側面６０ａ、６０
ｂを一対のフレキシブル基板３ａ、３ｂの対向面３０
ａ、３０ｂに熱圧着等にて接着し、これら一対の補強用
テープ６ａ、６ｂの対向面６１ａ、６１ｂの一端側６２
ａ、６２ｂをプリント基板１の両面１ａ、１ｂに接着す
ると共に、これら一対の補強用テープ６ａ、６ｂの対向
面６１ａ、６１ｂの他端側６３ａ、６３ｂどうしを相互
に熱圧着等にて接着したものである、。Then, as shown in FIG. 1B, the outer side surfaces 60a, 60 of the pair of reinforcing tapes 6a, 6b.
b is the facing surface 30 of the pair of flexible substrates 3a and 3b.
a and 30b by thermocompression bonding or the like, and one end side 62 of the facing surfaces 61a and 61b of the pair of reinforcing tapes 6a and 6b.
a and 62b are bonded to both surfaces 1a and 1b of the printed circuit board 1, and the opposite ends 63a and 63b of the facing surfaces 61a and 61b of the pair of reinforcing tapes 6a and 6b are bonded to each other by thermocompression bonding or the like. It is a thing.
【００１２】この際、図２に示すように、上下２段の熱
圧着面７ａ、７ｂを有する特殊形状の一対のヒータチッ
プ７を用いて、上記の熱圧着動作を効率良く行える。At this time, as shown in FIG. 2, the above-described thermocompression bonding operation can be efficiently performed by using a pair of specially shaped heater chips 7 having upper and lower thermocompression bonding surfaces 7a and 7b.
【００１３】即ち、最初に、図２の（Ａ）に示すよう
に、一対のヒータチップ７の熱圧着面７ａで一対のフレ
キシブル基板３ａ、３ｂの先端をプリント基板１の両面
１ａ、１ｂのランド２ａ、２ｂ上に上下から熱圧着し
て、両ランド２ａ、２ｂ上に塗布されている半田を溶か
してフレキシブル基板３ａ、３ｂの信号線４の先端を両
ランド２ａ、２ｂ上に半田付けする。That is, first, as shown in FIG. 2A, the tips of the pair of flexible boards 3a and 3b are attached to the lands of both sides 1a and 1b of the printed board 1 by the thermocompression bonding surfaces 7a of the pair of heater chips 7. Thermocompression bonding is performed from above and below on the lands 2a and 2b to melt the solder applied on the lands 2a and 2b to solder the tips of the signal lines 4 of the flexible boards 3a and 3b onto the lands 2a and 2b.
【００１４】次に、図２の（Ｂ）に示すように、一対の
ヒータチップ７の熱圧着面７ａ、７ｂの両方を使用し
て、一対のフレキシブル基板３ａ、３ｂの上から一対の
補強用テープ６ａ、６ｂの両端側６２ａ、６２ｂ及び６
３ａ、６３ｂを上下から同時に熱圧着して、これら一対
の補強用テープ６ａ、６ｂの外側面６０ａ、６０ｂに一
対のフレキシブル基板３ａ、３ｂの対向面３０ａ、３０
ｂを接着し、これら一対の補強用テープ６ａ、６ｂの対
向面６１ａ、６１ｂの一端側６２ａ、６２ｂをプリント
基板１の両面１ａ、１ｂに接着すると共に、これら一対
の補強用テープ６ａ、６ｂの対向面６１ａ、６１ｂの他
端側６３ａ、６３ｂどうしを相互に接着して、図１の
（Ｂ）に示すフレキシブル基板の接続装置８を完成す
る。Next, as shown in FIG. 2B, by using both of the thermocompression bonding surfaces 7a and 7b of the pair of heater chips 7, a pair of reinforcing substrates 3a and 3b are reinforced from above. Both ends 62a, 62b and 6 of the tapes 6a, 6b
3a and 63b are simultaneously thermocompressed from above and below, and the opposing surfaces 30a and 30 of the pair of flexible substrates 3a and 3b are attached to the outer surfaces 60a and 60b of the pair of reinforcing tapes 6a and 6b.
b is adhered, one end sides 62a, 62b of the facing surfaces 61a, 61b of the pair of reinforcing tapes 6a, 6b are adhered to both surfaces 1a, 1b of the printed circuit board 1, and the pair of reinforcing tapes 6a, 6b are bonded together. The other ends 63a and 63b of the facing surfaces 61a and 61b are adhered to each other to complete the flexible board connecting device 8 shown in FIG. 1B.
【００１５】以上のように構成されたフレキシブル基板
の接続装置８によれば、プリント基板１の両面１ａ、１
ｂへの一対の補強用テープ６ａ、６ｂの一端側６２ａ、
６２ｂの接着巾Ｗ1 が従来と同じ１〜２ｍｍ程度であっ
ても、これら一対の補強用テープ６ａ、６ｂの他端側６
３ａ、６３ｂが相互に接着されているので、プリント基
板１に対する一対の補強用テープ６ａ、６ｂの接着強度
が非常に高い。そして、一対のフレキシブル基板３ａ、
３ｂと一対の補強用テープ６ａ、６ｂとの接着巾Ｗ2 が
従来の数倍と非常に長いので、プリント基板１に対する
一対のフレキシブル基板３ａ、３ｂの剥離強度が飛躍的
に向上する。According to the flexible board connecting device 8 configured as described above, both sides 1a, 1 of the printed board 1 are connected.
a pair of reinforcing tapes 6a, 6b on one end side 62a,
Even if the adhesive width W 1 of 62b is about 1 to 2 mm, which is the same as the conventional one , the other end side 6 of the pair of reinforcing tapes 6a and 6b is
Since 3a and 63b are adhered to each other, the adhesive strength of the pair of reinforcing tapes 6a and 6b to the printed circuit board 1 is very high. Then, a pair of flexible substrates 3a,
Since the bonding width W 2 between the 3b and the pair of reinforcing tapes 6a and 6b is several times as long as the conventional one, the peel strength of the pair of flexible boards 3a and 3b from the printed board 1 is dramatically improved.
【００１６】なお、フレキシブル基板３ａ、３ｂの剥離
強度を測定した結果、フレキシブル基板３ａ、３ｂを図
１の（Ｂ）で矢印ａ、ｂ方向に直角に引っ張った時の強
度が、従来の約９００ｇｆから約１９００ｇｆに向上し
た。また、フレキシブル基板３ａ、３ｂを図１の（Ｃ）
で矢印ｃ、ｄ方向によじった時の強度が、従来の約８０
ｇｆから約７００ｇｆに向上した。As a result of measuring the peel strength of the flexible boards 3a and 3b, the strength when the flexible boards 3a and 3b are pulled at right angles in the directions of arrows a and b in FIG. 1B is about 900 gf. To about 1900 gf. In addition, the flexible boards 3a and 3b are shown in FIG.
The strength when twisted in the directions of arrows c and d is about 80
It improved from gf to about 700 gf.
【００１７】また、フレキシブル基板３ａ、３ｂの剥離
強度が非常に高いことから、補強用テープ６ａ、６ｂの
プリント基板１の両面１ａ、１ｂへの接着巾Ｗ1 を従来
より小さくして、プリント基板１の小型化及び高密度実
装化を促進できる。Further, since the peeling strength of the flexible boards 3a and 3b is very high, the adhesive width W 1 of the reinforcing tapes 6a and 6b to the both surfaces 1a and 1b of the printed board 1 is made smaller than the conventional one , and the printed board is made smaller. It is possible to promote downsizing and high-density mounting.
【００１８】次に、図３に示すように、片面プリント基
板の場合、プリント基板１の一方の面１ａのランド２ａ
に一枚のフレキシブル基板３ａの信号線４を接続するフ
レキシブル基板の接続装置８では、図３に１点鎖線で示
すように、ダミーのフレキシブル基板９の内側面９０の
先端をプリント基板１の他方の面１ｂに熱圧着等にて接
着する。そして、フレキシブル基板３ａの対向面（内側
面）３０ａとダミーのフレキシブル基板９の内側面９０
とに前述同様に熱圧着等にて接着した一対の補強用テー
プ６ａ、６ｂの一端側６２ａ、６２ｂをプリント基板１
の両面１ａ、１ｂに前述同様に熱圧着等にて接着すると
共に、これら一対の補強用テープ６ａ、６ｂの他端側６
３ａ、６３ｂどうしを前述同様に熱圧着等にて接着す
る。Next, as shown in FIG. 3, in the case of a single-sided printed circuit board, the land 2a on one surface 1a of the printed circuit board 1 is used.
In the flexible board connecting device 8 for connecting the signal line 4 of the one flexible board 3a to the other side of the printed board 1, the tip of the inner side surface 90 of the dummy flexible board 9 is connected to the other side of the printed board 1 as shown by the alternate long and short dash line in FIG. The surface 1b is bonded by thermocompression bonding or the like. Then, the facing surface (inner side surface) 30a of the flexible board 3a and the inner side surface 90 of the dummy flexible board 9 are formed.
The one end side 62a, 62b of the pair of reinforcing tapes 6a, 6b adhered to each other by thermocompression bonding or the like as described above is attached to the printed circuit board 1
Are bonded to both surfaces 1a, 1b by thermocompression bonding as described above, and the other end side 6 of the pair of reinforcing tapes 6a, 6b is bonded.
3a and 63b are bonded together by thermocompression bonding or the like as described above.
【００１９】このフレキシブル基板の接続装置８も前述
同様の高い剥離強度が得られる。The flexible substrate connecting device 8 also has the same high peel strength as described above.
【００２０】なおこの際、図３に１点鎖線で示したダミ
ーのフレキシブル基板９を使用せずに、一対の補強用テ
ープ６ａ、６ｂのみによって一枚のフレキシブル基板３
ａを補強しても、そのフレキシブル基板３ａの剥離強度
を向上できる。At this time, without using the dummy flexible substrate 9 shown by the one-dot chain line in FIG. 3, one flexible substrate 3 is formed only by the pair of reinforcing tapes 6a and 6b.
Even if a is reinforced, the peel strength of the flexible substrate 3a can be improved.
【００２１】次に、図４は電子機器の一例である産業装
置用の超小型のビデオカメラ１０を示したものであり、
複数のプリント基板１間を前述したフレキシブル基板の
接続装置８のフレキシブル基板３ａ、３ｂによって接続
し、これら複数のプリント基板１をフレキシブル基板３
ａ、３ｂ部分でジグザグ状に折り畳んで、筒型のケース
１１内にコンパクトに収納したものである。なお、ケー
ス１１の一端側には光学レンズ１２及びＣＣＤ１３が取
り付けられ、他端側にはケーブルコネクター１４が取り
付けられている。そして、複数のプリント基板１の両面
１ａ、１ｂにはＣＣＤ駆動回路及び信号処理回路が高密
度実装されていて、これらの回路は引出用フレキシブル
基板１５ａ、１５ｂによってＣＣＤ１３及びケーブルコ
ネクター１４に接続されている。なお、これらのフレキ
シブル基板１５ａ、１５ｂも前述同様にフレキシブル基
板の接続装置８によって補強されている。Next, FIG. 4 shows a microminiature video camera 10 for an industrial apparatus, which is an example of electronic equipment.
The plurality of printed boards 1 are connected by the flexible boards 3a and 3b of the flexible board connecting device 8 described above, and the plurality of printed boards 1 are connected to each other.
It is zigzag-folded at the portions a and 3b and compactly housed in a cylindrical case 11. The optical lens 12 and the CCD 13 are attached to one end of the case 11, and the cable connector 14 is attached to the other end. A CCD driving circuit and a signal processing circuit are mounted on both sides 1a, 1b of the plurality of printed circuit boards 1 at a high density, and these circuits are connected to the CCD 13 and the cable connector 14 by the flexible drawing boards 15a, 15b. There is. The flexible boards 15a and 15b are also reinforced by the flexible board connecting device 8 as described above.
【００２２】このように構成されたビデオカメラ１０に
よれば、前述したように剥離強度が非常に高いフレキシ
ブル基板３ａ、３ｂをジグザグ状に折り曲げるので、ケ
ース１１内に対する複数のプリント基板１の組込みや分
解時にフレキシブル基板３ａ、３ｂが図１で矢印ａ、ｂ
方向に強く引っ張られたり、図１で矢印ｃ、ｄ方向に強
くよじられたりしても、フレキシブル基板３ａ、３ｂが
剥れにくく、その組込みや分解の作業性や安全性を向上
できる上に、複数のプリント基板１の小型化及び高密度
実装化の促進により、ビデオカメラ１０の小型、軽量化
を促進できる。According to the video camera 10 thus constructed, the flexible boards 3a and 3b having extremely high peeling strength are bent in a zigzag shape as described above, so that a plurality of printed boards 1 can be assembled in the case 11. When disassembled, the flexible boards 3a and 3b are indicated by arrows a and b in FIG.
The flexible boards 3a and 3b are not easily peeled off even if they are strongly pulled in the direction or strongly twisted in the directions of the arrows c and d in FIG. 1, and the workability and safety of assembling and disassembling the flexible boards 3a and 3b can be improved. By miniaturizing the plurality of printed circuit boards 1 and promoting high-density mounting, it is possible to reduce the size and weight of the video camera 10.
【００２３】以上、本発明の実施例に付き述べたが、本
発明は上記の実施例に限定されることなく、本発明の技
術的思想に基づいて各種の変更が可能である。Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and various modifications can be made based on the technical idea of the present invention.
【００２４】[0024]
【発明の効果】以上のように構成された本発明のフレキ
シブル基板の接続装置及び電子機器は次のような効果を
奏する。EFFECT OF THE INVENTION The flexible substrate connecting device and electronic equipment of the present invention configured as described above have the following effects.
【００２５】請求項１〜３のフレキシブル基板の接続装
置は、プリント基板への補強用テープの接着巾が小さく
ても、プリント基板に対するフレキシブル基板の剥離強
度を飛躍的に向上することができるので、フレキシブル
基板の引っ張りやよじれによるフレキシブル基板の剥離
を未然に防止できて、耐久性、信頼性を向上できる。According to the flexible board connecting device of the first to third aspects, the peeling strength of the flexible board from the printed circuit board can be dramatically improved even if the adhesive width of the reinforcing tape to the printed circuit board is small. It is possible to prevent peeling of the flexible substrate due to pulling or kinking of the flexible substrate, and improve durability and reliability.
【００２６】請求項１〜３のフレキシブル基板の接続装
置は、プリント基板への補強用テープの接着巾を小さく
できることから、プリント基板の小型化、高密度実装化
を促進できる。In the flexible board connecting device according to the first to third aspects, since the adhesion width of the reinforcing tape to the printed board can be made small, miniaturization of the printed board and high-density mounting can be promoted.
【００２７】請求項４の電子機器は、剥離強度が非常に
高いフレキシブル基板を折り曲げるようにして、複数の
プリント基板をジグザグ状に折り畳んでケース内にコン
パクトに収納することができるので、ケース内への複数
のフレキシブル基板の組込み時に、フレキシブル基板が
剥れにくく、その組込みや分解の作業性や安全性を向上
できる。In the electronic device according to the fourth aspect of the present invention, the flexible printed circuit board having a very high peeling strength is bent so that a plurality of printed circuit boards can be folded in a zigzag shape and compactly stored in the case. When a plurality of flexible boards are assembled, the flexible boards are unlikely to come off, and the workability and safety of assembly and disassembly can be improved.
【００２８】請求項４の電子機器は、複数のプリント基
板の小型化及び高密度実装化の促進により、電子機器の
小型、軽量化を促進できる。According to the electronic device of the fourth aspect, the miniaturization and the weight reduction of the electronic device can be promoted by promoting miniaturization and high-density mounting of the plurality of printed circuit boards.
【図１】本発明のフレキシブル基板の接続装置を説明す
る側面図及び平面図である。FIG. 1 is a side view and a plan view illustrating a flexible board connecting device of the present invention.
【図２】同上のフレキシブル基板の接続装置の熱圧着に
よる接着動作を説明する側面図である。FIG. 2 is a side view for explaining a bonding operation by thermocompression bonding of the flexible board connecting device of the above.
【図３】同上のフレキシブル基板の接続装置の変形例を
説明する側面図である。FIG. 3 is a side view for explaining a modified example of the above flexible board connecting device.
【図４】同上のフレキシブル基板の接続装置によって接
続された複数のプリント基板を収納したビデオカメラを
説明する斜視図である。FIG. 4 is a perspective view illustrating a video camera that accommodates a plurality of printed boards that are connected by the above flexible board connecting device.
【図５】従来のフレキシブル基板の接続装置を説明する
平面図及び側面図である。5A and 5B are a plan view and a side view illustrating a conventional flexible board connecting device.
１ プリント基板 １ａ、１ｂ プリント基板の両面 ２ａ、２ｂ ランド ３ａ、３ｂ フレキシブル基板 ４ フレキシブル基板の信号線 ３０ａ、３０ｂ フレキシブル基板の対向面 ６ａ、６ｂ 補強用テープ ６０ａ、６０ｂ 補強用テープの外側面 ６１ａ、６１ｂ 補強用テープの対向面 ６２ａ、６２ｂ 補強用テープの一端側 ６３ａ、６３ｂ 補強用テープの他端側 ８ フレキシブル基板の接続装置 ９ ダミーのフレキシブル基板 ９０ ダミーのフレキシブル基板の内側面 １０ ビデオカメラ（電子機器） １１ ケース 1 Printed Circuit Board 1a, 1b Both Sides of Printed Circuit Board 2a, 2b Lands 3a, 3b Flexible Board 4 Signal Lines of Flexible Board 30a, 30b Opposing Surfaces of Flexible Board 6a, 6b Reinforcing Tape 60a, 60b Outer Surface of Reinforcing Tape 61a, 61b Opposing surfaces of reinforcing tape 62a, 62b One end side of reinforcing tape 63a, 63b Other end side of reinforcing tape 8 Flexible board connecting device 9 Dummy flexible board 90 Inner side surface of dummy flexible board 10 Video camera (electronic Equipment) 11 cases
Claims (4)
キシブル基板の信号線を両側から接続するフレキシブル
基板の接続装置において、 上記一対のフレキシブル基板の対向面に接着した一対の
補強用テープの一端側を上記プリント基板の両面に接着
すると共に、これら一対の補強用テープの他端側どうし
を相互に接着したことを特徴とするフレキシブル基板の
接続装置。1. A flexible board connecting device for connecting signal lines of a pair of flexible boards to lands on both sides of a printed board from both sides, wherein one end side of a pair of reinforcing tapes adhered to opposite surfaces of the pair of flexible boards. Is bonded to both sides of the printed circuit board, and the other end sides of the pair of reinforcing tapes are bonded to each other.
フレキシブル基板の信号線を接続するフレキシブル基板
の接続装置において、 上記プリント基板の他方の面にダミー用フレキシブル基
板を接続し、 上記フレキシブル基板とダミー用フレキシブル基板の対
向面に接着した一対の補強用テープの一端側を上記プリ
ント基板の両面に接着すると共に、これら一対の補強用
テープの他端側どうしを相互に接着したことを特徴とす
るフレキシブル基板の接続装置。2. A flexible board connecting device for connecting a signal line of one flexible board to a land on one surface of the printed board, wherein a dummy flexible board is connected to the other surface of the printed board. One end side of a pair of reinforcing tapes adhered to the opposing surfaces of the substrate and the dummy flexible substrate is adhered to both sides of the printed circuit board, and the other end sides of the pair of reinforcing tapes are adhered to each other. Flexible board connection device.
フレキシブル基板の信号線を接続するフレキシブル基板
の接続装置において、 これら一対の補強用テープの一端側を上記プリント基板
の両面に接着すると共に、これら一対の補強用テープの
他端側どうしを相互に接着し、 上記フレキシブル基板を上記一対の補強用テープの一方
の外側面に接着したことを特徴とするフレキシブル基板
の接続装置。3. A flexible board connecting device for connecting a signal line of one flexible board to a land on one surface of the printed board, wherein one end side of the pair of reinforcing tapes is bonded to both sides of the printed board. At the same time, the other end side of the pair of reinforcing tapes is bonded to each other, and the flexible substrate is bonded to one outer surface of the pair of reinforcing tapes.
ル基板の接続装置によって複数のプリント基板間を接続
し、 上記複数のプリント基板を上記フレキシブル基板部分で
ジグザク状に折り畳んでケース内に収納してある電子機
器。4. The flexible board connecting device according to claim 1, 2 or 3 is used to connect between a plurality of printed boards, and the plurality of printed boards are folded in a zigzag shape at the flexible board portion and stored in a case. Electronic device
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9601092A JPH05275821A (en) | 1992-03-24 | 1992-03-24 | Connector for flexible substrate, and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9601092A JPH05275821A (en) | 1992-03-24 | 1992-03-24 | Connector for flexible substrate, and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05275821A true JPH05275821A (en) | 1993-10-22 |
Family
ID=14153223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9601092A Pending JPH05275821A (en) | 1992-03-24 | 1992-03-24 | Connector for flexible substrate, and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05275821A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193362A (en) * | 1993-12-27 | 1995-07-28 | Saitama Nippon Denki Kk | Mounting of electronic component and heater tool |
| WO2000065888A1 (en) * | 1999-04-22 | 2000-11-02 | Rohm Co., Ltd. | Circuit board, battery pack, and method of manufacturing circuit board |
| EP1093326A2 (en) * | 1999-10-15 | 2001-04-18 | Japan Aviation Electronics Industry, Limited | Printed-circuit board module |
| JP2007227855A (en) * | 2006-02-27 | 2007-09-06 | Fujikura Ltd | Rigid-board interconnection structure |
| KR101331765B1 (en) * | 2011-09-27 | 2013-11-20 | 주식회사 트레이스 | Double Side ACF Pre and Main Bonding Automatic Pressure Bonding Method |
-
1992
- 1992-03-24 JP JP9601092A patent/JPH05275821A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193362A (en) * | 1993-12-27 | 1995-07-28 | Saitama Nippon Denki Kk | Mounting of electronic component and heater tool |
| WO2000065888A1 (en) * | 1999-04-22 | 2000-11-02 | Rohm Co., Ltd. | Circuit board, battery pack, and method of manufacturing circuit board |
| US6531662B1 (en) | 1999-04-22 | 2003-03-11 | Rohm Co., Ltd. | Circuit board, battery pack, and method of manufacturing circuit board |
| EP1093326A2 (en) * | 1999-10-15 | 2001-04-18 | Japan Aviation Electronics Industry, Limited | Printed-circuit board module |
| EP1093326A3 (en) * | 1999-10-15 | 2002-05-22 | Japan Aviation Electronics Industry, Limited | Printed-circuit board module |
| JP2007227855A (en) * | 2006-02-27 | 2007-09-06 | Fujikura Ltd | Rigid-board interconnection structure |
| KR101331765B1 (en) * | 2011-09-27 | 2013-11-20 | 주식회사 트레이스 | Double Side ACF Pre and Main Bonding Automatic Pressure Bonding Method |
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