JPH0526764Y2 - - Google Patents
Info
- Publication number
- JPH0526764Y2 JPH0526764Y2 JP9411887U JP9411887U JPH0526764Y2 JP H0526764 Y2 JPH0526764 Y2 JP H0526764Y2 JP 9411887 U JP9411887 U JP 9411887U JP 9411887 U JP9411887 U JP 9411887U JP H0526764 Y2 JPH0526764 Y2 JP H0526764Y2
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- terminal
- lead frame
- hole
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9411887U JPH0526764Y2 (US07655688-20100202-C00548.png) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9411887U JPH0526764Y2 (US07655688-20100202-C00548.png) | 1987-06-19 | 1987-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64342U JPS64342U (US07655688-20100202-C00548.png) | 1989-01-05 |
| JPH0526764Y2 true JPH0526764Y2 (US07655688-20100202-C00548.png) | 1993-07-07 |
Family
ID=30957271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9411887U Expired - Lifetime JPH0526764Y2 (US07655688-20100202-C00548.png) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526764Y2 (US07655688-20100202-C00548.png) |
-
1987
- 1987-06-19 JP JP9411887U patent/JPH0526764Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS64342U (US07655688-20100202-C00548.png) | 1989-01-05 |
