JPH05267004A - Manufacture of chip type thermistor - Google Patents

Manufacture of chip type thermistor

Info

Publication number
JPH05267004A
JPH05267004A JP6536792A JP6536792A JPH05267004A JP H05267004 A JPH05267004 A JP H05267004A JP 6536792 A JP6536792 A JP 6536792A JP 6536792 A JP6536792 A JP 6536792A JP H05267004 A JPH05267004 A JP H05267004A
Authority
JP
Japan
Prior art keywords
chip
molded body
fired
type thermistor
dried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6536792A
Other languages
Japanese (ja)
Inventor
Makoto Numata
真 沼田
Goro Takeuchi
吾郎 武内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP6536792A priority Critical patent/JPH05267004A/en
Publication of JPH05267004A publication Critical patent/JPH05267004A/en
Pending legal-status Critical Current

Links

Landscapes

  • Thermistors And Varistors (AREA)

Abstract

PURPOSE:To obtain a chip type thermistor at a lower cost by firing a chip molded body formed through dry or sheet molding to obtain a chip fired body. CONSTITUTION:Transition metal oxide materials, such as Mn, Ni, Cu and so on, are prepared and weighed according to a desired composition. These materials are mixed in a wet manner, and the resultant mixture is dehydrated and dried. It is then temporarily fired and ground in a wet manner using a ball mill. The ground material is dried, and subsequently, granulated with binder added. The granulated material is then placed in a metal mold, and pressed to form a chip molded body 6. The molded body 6 is chamfered to provide the whole circumference with a roundness 7. The binder is removed, and then the molded body 6 is fired. Conductive paste 8 is applied to part of both ends 1B and both major surfaces 1A of the fired molded body 1. It is then dried and baked to form electrodes 2, obtaining a chip type thermistor 10. This reduces its cost and minimizes the dispersion in its electric characteristics.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、NTCサーミスタ等を
構成するチップ型サーミスタの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip type thermistor which constitutes an NTC thermistor or the like.

【0002】[0002]

【従来の技術】NTCサーミスタはトランジスタ,IC
等の部品の温度補償用、あるいは温度センサ用等の用途
に広く使用されているが、特にチップ状のものすなわち
チップ型サーミスタの需要が最近急増している。図4に
示すようにこのチップ型サーミスタ36は、他の部品2
2,23等と共に基板24に面実装するために用いら
れ、リード線を不要とすることにより端部電極35を直
接基板24のパターン25にはんだ付けできるので、高
さ寸法が小さくなるため、この基板24を組込む各種電
子機器の小型薄型化に寄与するという利点を有してい
る。
2. Description of the Related Art NTC thermistors are transistors and ICs.
It is widely used for temperature compensation of components such as the above, or for temperature sensors, and the demand for chip-shaped ones, that is, chip-type thermistors, has recently been rapidly increasing. As shown in FIG. 4, this chip-type thermistor 36 is
2, 23, etc. are used for surface mounting on the substrate 24. Since the end electrodes 35 can be directly soldered to the pattern 25 of the substrate 24 by eliminating the lead wire, the height dimension becomes small. It has an advantage of contributing to miniaturization and thinning of various electronic devices incorporating the substrate 24.

【0003】次に従来のチップ型サーミスタの製造方法
を図3を参照して工程順に説明する。
Next, a conventional method for manufacturing a chip type thermistor will be described in the order of steps with reference to FIG.

【0004】先ず、Mn,Ni,Cu等の遷移金属酸化
物を原料として用いて、混合,乾燥,仮焼成,粉砕後
に、乾式成形法によってブロック状に成形した後焼成し
て、工程Aのようにブロック焼成体30を得る。あるい
は前記粉砕後に、湿式成形法によってシート状に成形し
た後焼成して、工程Bのようにシート焼成体31を得
る。
First, using a transition metal oxide such as Mn, Ni, or Cu as a raw material, after mixing, drying, calcination, and crushing, it is molded into a block shape by a dry molding method and then calcined. Then, the block fired body 30 is obtained. Alternatively, after the pulverization, a sheet-shaped fired body 31 is obtained as in the step B after forming into a sheet by a wet molding method and then firing.

【0005】次に、ブロック焼成体30をワイヤーソ
ー,スライサー等のカッターでシート状に切断した後、
平面ラッピングを施して所望の厚みに調整して、工程C
のようにシート焼成体32を得る。同様にして、前記シ
ート焼成体31に平面ラッピングを施して所望の厚みに
調整する。この時点におけるシート焼成体31,32の
形状は異なっているが、実質的同一のものであり以下シ
ート焼成体32で代表させて説明する。
Next, after the block fired body 30 is cut into a sheet with a cutter such as a wire saw or a slicer,
Apply plane wrapping to adjust the thickness to the desired value, then process C
The sheet fired body 32 is obtained as described above. Similarly, the sheet calcined body 31 is subjected to flat lapping to adjust it to a desired thickness. The shapes of the sheet fired bodies 31 and 32 at this time are different, but they are substantially the same, and the sheet fired body 32 will be described below as a representative.

【0006】次に、シート焼成体32を柱状に切断して
工程Dのように方形状のチップ状の焼成体33を得る。
続いて、この焼成体33をバレル研磨によって面取りを
行って、工程Eのように丸み34を形成する。次にこの
焼成体33の両端部及び両主表面の一部にAg−Pd合
金等の導電ペーストを塗布し、乾燥後、導電ペーストを
焼付けてのの端部電極35を形成したチップ型サーミス
タ36を製造する。
Next, the sheet fired body 32 is cut into a columnar shape to obtain a rectangular chip-shaped fired body 33 as in step D.
Subsequently, the fired body 33 is chamfered by barrel polishing to form a roundness 34 as in step E. Next, a conductive paste such as an Ag-Pd alloy is applied to both ends and a part of both main surfaces of the fired body 33, and after drying, the chip type thermistor 36 having the end electrodes 35 formed by baking the conductive paste is formed. To manufacture.

【0007】[0007]

【発明が解決しようとする課題】ところで従来のチップ
型サーミスタ製造方法では、図3に示したように多くの
工程を必要とするのでコストアップとなり、さらに個々
のチップに分離する前のブロック状もしくはシート状の
成形体のままで焼成を行って、ブロック焼成体を形成し
ているので、製造されたチップ型サーミスタの電気的特
性にバラツキが生じるという問題がある。
By the way, in the conventional chip type thermistor manufacturing method, many steps are required as shown in FIG. 3, resulting in an increase in cost, and further in a block shape before being divided into individual chips or Since a block fired body is formed by firing the sheet-shaped molded body as it is, there is a problem in that electrical characteristics of the manufactured chip-type thermistor vary.

【0008】すなわち、ブロック状もしくはシート状の
成形体のままで焼成を行うと、焼成雰囲気の影響を受け
て、焼成体全体の比抵抗が均一にならず、焼成体表面と
中心部で比抵抗が異なる傾向がある。このため、その後
の工程でチップ化した場合に、個々のチップ型サーミス
タ間で電気的特性にバラツキが避けられなくなる。
That is, if firing is performed on the block-shaped or sheet-shaped molded body as it is, the specific resistance of the entire baked body is not uniform due to the influence of the firing atmosphere, and the specific resistance on the surface of the fired body and in the central portion. Tend to be different. For this reason, when chips are formed in the subsequent process, variations in electrical characteristics among individual chip-type thermistors cannot be avoided.

【0009】本発明は以上のような問題に対処してなさ
れたもので、コストダウンを図ると共に電気的特性のバ
ラツキを小さく押えるようにしたチップ型サーミスタの
製造方法を提供することを目的とするものである。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a chip type thermistor which is capable of reducing the cost and suppressing variations in electrical characteristics. It is a thing.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
に本発明は、サーミスタ材料から乾式成形法またはシー
ト成形法によってチップ状成形体を成形する工程と、こ
のチップ状成形体の焼成を行いチップ状の焼成体を得る
工程とを含むことを特徴とするものである。
To achieve the above object, the present invention provides a step of molding a chip-shaped molded body from a thermistor material by a dry molding method or a sheet molding method, and firing the chip-shaped molded body. And a step of obtaining a chip-shaped fired body.

【0011】[0011]

【作用】本発明の構成によれば、乾式成形法またはシー
ト成形法によって成形したチップ状成形体に対して焼成
を行った後、このチップ状の焼成体の両端部に電極を形
成してチップ型サーミスタを製造するようにしたので、
工程が少なくなるためコストダウンを図ることができる
と共に、チップ型サーミスタの電気的特性のバラツキを
小さく抑えることができる。
According to the structure of the present invention, after the chip-shaped molded body molded by the dry molding method or the sheet molding method is fired, electrodes are formed on both ends of the chip-shaped fired body to form the chip. I made a type thermistor,
Since the number of steps is reduced, the cost can be reduced and the variation in the electrical characteristics of the chip type thermistor can be suppressed.

【0012】[0012]

【実施例】以下図面を参照して本発明の実施例を説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.

【0013】図1は本発明のチップ型サーミスタの製造
方法によって製造されるチップ型サーミスタを示す断面
図で、本チップ型サーミスタ10は、乾式成形法または
シート成形法によって成形され焼成されたチップ状のN
TCサーミスタ焼成体1と、この焼成体1の両端部1B
に一部が両主表面1Aを覆うように形成されたフリット
を含有するAg/Pd合金から成る電極2を備えてい
る。
FIG. 1 is a sectional view showing a chip-type thermistor manufactured by the method for manufacturing a chip-type thermistor of the present invention. The chip-type thermistor 10 is a chip-shaped thermistor formed by a dry molding method or a sheet molding method. N
TC thermistor fired body 1 and both ends 1B of this fired body 1
Is provided with an electrode 2 made of an Ag / Pd alloy containing frit, a part of which covers both main surfaces 1A.

【0014】次に本発明のチップ型サーミスタの製造方
法を図2を参照して工程順に説明する。
Next, a method of manufacturing the chip type thermistor of the present invention will be described in the order of steps with reference to FIG.

【0015】先ず、Mn,Ni,Cu等の遷移金属酸化
物として各々Mn304,NiO,CuOを原料として
用い、目的組成となるように秤量し、湿式混合後、脱水
乾燥し、800乃至1000℃で2時間仮焼成した後、
ボールミルによって湿式粉砕する。乾燥後、バインダー
としてポリビニルアルコールを加えて造粒後、2.3×
1.43mmの金型に材料を充填し、3トン/cm2
圧力を加えて、工程Aのようにチップ状の成形体6を成
形する。すなわち、乾式成形法によってチップ状の成形
体6を得るようにする。このとき成形体6の厚みは1.
14mmであった。またシート成形法の場合、所望の厚
みのシート成形体を形成し、これをチップ状に切断、あ
るいはプレス等で打ち抜いてチップ状成形体を形成す
る。
First, Mn304, NiO, and CuO, which are transition metal oxides such as Mn, Ni, and Cu, are used as raw materials, weighed so as to have a desired composition, wet-mixed, dehydrated and dried, and dried at 800 to 1000 ° C. After calcination for 2 hours,
Wet grind with a ball mill. After drying, add polyvinyl alcohol as a binder and granulate 2.3 ×
A 1.43 mm die is filled with the material, and a pressure of 3 ton / cm 2 is applied to mold the chip-shaped molded body 6 as in step A. That is, the chip-shaped molded body 6 is obtained by the dry molding method. At this time, the thickness of the molded body 6 is 1.
It was 14 mm. In the case of the sheet molding method, a sheet molded body having a desired thickness is formed, and the sheet molded body is cut into chips or punched with a press or the like to form chip shaped bodies.

【0016】次に、このチップ状の成形体6をグリーン
バレル研磨によって面取りを行って、工程Bのように全
周に丸み7を形成する。続いてこの成形体6を焼成炉に
よって脱バインダー処理した後、1200乃至1300
℃で焼成を行って、構成Cのようにチップ状の成形体1
を形成する。次に、この成形体1の両端部1B及び両主
表面1Aの一部に電極を形成すべくフリットを含有する
Ag/Pd合金から成る導電ペースト8を工程Dのよう
に塗布する。
Next, the chip-shaped molded body 6 is chamfered by green barrel polishing to form a roundness 7 on the entire circumference as in step B. Subsequently, the molded body 6 is debindered in a firing furnace, and then 1200 to 1300
As shown in Structure C, a chip-shaped molded body 1 is obtained by firing at 1 ° C.
To form. Then, a conductive paste 8 made of Ag / Pd alloy containing a frit is applied to both ends 1B of the molded body 1 and a part of both main surfaces 1A as in step D so as to form electrodes.

【0017】次に、焼成体1を150℃で乾燥し、ベル
ト炉によって700乃至900℃で焼付けて、工程Eの
ように電極2を形成する。これによって図1に示した構
造のチップ型サーミスタ10が製造される。
Next, the fired body 1 is dried at 150 ° C. and baked at 700 to 900 ° C. in a belt furnace to form the electrode 2 as in step E. As a result, the chip type thermistor 10 having the structure shown in FIG. 1 is manufactured.

【0018】このような本発明の製造方法によれば、乾
式成形法またはシート成形法によってチップ状の成形体
6を成形した後焼成を行ってチップ状の焼成体1を形成
するので、図3の従来の製造方法に比較して工程数を少
なくすることができる。従ってコストダウンを図ること
ができる。さらに表1に示すように電気的特性のバラツ
キを小さくすることができる。
According to the manufacturing method of the present invention as described above, since the chip-shaped molded body 6 is molded by the dry molding method or the sheet molding method, the chip-shaped molded body 6 is fired to form the chip-shaped baked body 1. It is possible to reduce the number of steps as compared with the conventional manufacturing method. Therefore, the cost can be reduced. Furthermore, as shown in Table 1, it is possible to reduce variations in electrical characteristics.

【0019】すなわち、次の表1はa乃至hの8種類の
試料を用意して、本発明の製造方法を適用して得られた
電気的特性Bを、従来方法である切り出し法によって得
られた電気的特性Aと比較して示すものである。なお、
各電気的特性は表の下段に示すように、変動係数の値を
求めることによって示した。
That is, the following Table 1 shows that electrical characteristics B obtained by applying eight kinds of samples a to h and applying the manufacturing method of the present invention are obtained by the cutting method which is a conventional method. It is shown in comparison with the electrical characteristic A. In addition,
Each electrical characteristic was shown by obtaining the value of the coefficient of variation as shown in the lower part of the table.

【0020】[0020]

【表1】 [Table 1]

【0021】表1から明らかなように、本発明によって
得られた電気的特性Bにおいては、a乃至hの8種類の
全てにわたってRC.V及びBC.Vのいずれも、従来
の電気的特性Aにおける各値よりも小さな値を示してお
り、バラツキが小さくなっていることが理解される。
As is clear from Table 1, in the electrical characteristics B obtained by the present invention, RC. V and BC. Each of V shows a value smaller than each value in the conventional electrical characteristic A, and it is understood that the variation is small.

【0022】この理由としては、本発明では従来のよう
にブロック状もしくはシート状の成形体のまま焼成を行
うことなく、チップ状の成形体6となした後焼成を行う
ようにしたことが挙げられる。すなわち、成形体形状を
小さくすることにより、チップ状焼成体の比抵抗が均一
になる結果、電気的特性のバラツキを小さく抑えること
ができるようになる。
The reason for this is that, in the present invention, the block-shaped or sheet-shaped molded body is not fired as it is, but the chip-shaped molded body 6 is fired after firing. Be done. That is, by reducing the shape of the molded body, the specific resistance of the chip-shaped fired body becomes uniform, and as a result, it becomes possible to suppress variations in electrical characteristics.

【0023】[0023]

【発明の効果】以上述べたように本発明によれば、乾式
成形法またはシート成形法によって成形したチップ状成
形体に対して焼成を行った後チップ状の焼成体を得るよ
うにしたので、工程を少なくしてコストダウンが図れる
と共に、電気的特性のバラツキを小さく抑えられるチッ
プ型サーミスタの製造方法を提供することができる。
As described above, according to the present invention, since the chip-shaped molded body molded by the dry molding method or the sheet molding method is fired, the chip-shaped fired body is obtained. It is possible to provide a method of manufacturing a chip type thermistor that can reduce the number of steps to reduce the cost and suppress the variation in electrical characteristics.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のチップ型サーミスタの製造方法によっ
て製造されたチップ型サーミスタを示す断面図である。
FIG. 1 is a cross-sectional view showing a chip thermistor manufactured by a method of manufacturing a chip thermistor of the present invention.

【図2】本発明のチップ型サーミスタの製造方法を工程
順に示す説明図である。
FIG. 2 is an explanatory view showing a method of manufacturing a chip type thermistor of the present invention in process order.

【図3】従来のチップ型サーミスタの製造方法を工程順
に示す説明図である。
FIG. 3 is an explanatory view showing a method of manufacturing a conventional chip type thermistor in process order.

【図4】チップ型サーミスタを面実装に用いた例を示す
断面図である。
FIG. 4 is a cross-sectional view showing an example in which a chip type thermistor is used for surface mounting.

【符号の説明】[Explanation of symbols]

1 焼成体 2 電極 6 乾式成形体 10 チップ型サーミスタ 1 Fired Body 2 Electrode 6 Dry Molded Body 10 Chip Type Thermistor

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 サーミスタ材料から乾式成形法またはシ
ート成形法によってチップ状成形体を成形する工程と、
このチップ状成形体の焼成を行いチップ状の焼成体を得
る工程とを含むことを特徴とするチップ型サーミスタの
製造方法。
1. A step of molding a chip-shaped molded body from a thermistor material by a dry molding method or a sheet molding method,
And a step of firing the chip-shaped molded body to obtain a chip-shaped fired body.
JP6536792A 1992-03-23 1992-03-23 Manufacture of chip type thermistor Pending JPH05267004A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6536792A JPH05267004A (en) 1992-03-23 1992-03-23 Manufacture of chip type thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6536792A JPH05267004A (en) 1992-03-23 1992-03-23 Manufacture of chip type thermistor

Publications (1)

Publication Number Publication Date
JPH05267004A true JPH05267004A (en) 1993-10-15

Family

ID=13284925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6536792A Pending JPH05267004A (en) 1992-03-23 1992-03-23 Manufacture of chip type thermistor

Country Status (1)

Country Link
JP (1) JPH05267004A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053085A1 (en) * 2006-11-10 2008-05-15 Epcos Ag Electrical assembly with PTC resistor elements
US7986214B2 (en) 2006-11-10 2011-07-26 Epcos Ag Electrical assembly with PTC resistor elements

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053085A1 (en) * 2006-11-10 2008-05-15 Epcos Ag Electrical assembly with PTC resistor elements
US7928828B2 (en) 2006-11-10 2011-04-19 Epcos Ag Electrical assembly with PTC resistor elements
US7986214B2 (en) 2006-11-10 2011-07-26 Epcos Ag Electrical assembly with PTC resistor elements

Similar Documents

Publication Publication Date Title
JPH04283902A (en) Ntc thermistor element
US4148853A (en) Process for the manufacture of a capacitor dielectric with inner blocking layers
JPH05267004A (en) Manufacture of chip type thermistor
JP2976244B2 (en) Method for manufacturing NTC thermistor element
JP3223830B2 (en) Varistor element manufacturing method
JP2503731B2 (en) Dielectric ceramic composition for low temperature sintering
CN114300230B (en) Ferrite sintered body and coiled coil component
US11557410B2 (en) Ceramic material, varistor, and method for producing the ceramic material and the varistor
JP2016054225A (en) Semiconductor ceramic composition for negative characteristic thermistor, and negative characteristic thermistor
JP3284873B2 (en) Manufacturing method of chip type thermistor
EP0751539A2 (en) Positive characteristics thermistor device
KR100295282B1 (en) Fabrication method of the low-breakdown voltage disk and chip varistor
JPH1092606A (en) Chip thermistor and its manufacture
JP3625053B2 (en) Chip-type thermistor and manufacturing method thereof
WO2024042767A1 (en) Thermistor element and method for producing same
JP2864731B2 (en) Positive characteristic thermistor and manufacturing method thereof
JP2658581B2 (en) Oxide semiconductor composition
JPH0982504A (en) Chip thermistor and its manufacture
JP2000357603A (en) Chip-type thermistor and manufacture method thereof
JPH07201527A (en) Manufacture of conductive chip-type ceramic device
JP2666401B2 (en) Method for manufacturing reduction-reoxidation type semiconductor porcelain element
JP2612247B2 (en) Manufacturing method of NTC thermistor
JP2520699B2 (en) Method of manufacturing voltage-dependent nonlinear resistor
JPH06208909A (en) Manufacture of zno varistor
JPH07183105A (en) Chip type thermistor

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20010904