JPH05263045A - Film-forming coating liquid and its production - Google Patents

Film-forming coating liquid and its production

Info

Publication number
JPH05263045A
JPH05263045A JP4060057A JP6005792A JPH05263045A JP H05263045 A JPH05263045 A JP H05263045A JP 4060057 A JP4060057 A JP 4060057A JP 6005792 A JP6005792 A JP 6005792A JP H05263045 A JPH05263045 A JP H05263045A
Authority
JP
Japan
Prior art keywords
coating
alkoxysilane
film
silica sol
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4060057A
Other languages
Japanese (ja)
Other versions
JP3320440B2 (en
Inventor
Akira Nakajima
島 昭 中
Michio Komatsu
松 通 郎 小
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JGC Catalysts and Chemicals Ltd
Original Assignee
Catalysts and Chemicals Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Catalysts and Chemicals Industries Co Ltd filed Critical Catalysts and Chemicals Industries Co Ltd
Priority to JP06005792A priority Critical patent/JP3320440B2/en
Publication of JPH05263045A publication Critical patent/JPH05263045A/en
Application granted granted Critical
Publication of JP3320440B2 publication Critical patent/JP3320440B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To provide the subject liq. which contains a reactional product of a silica sol prepd. by the hydrolysis and polycondensation of a specific alkoxysilane with the alkoxysilane or its partial hydrolyzate and forms a voidless and pinholeless dense film by specifying the ion concn. of the liq. CONSTITUTION:This coating liq. contains a reactional product of a silica sol prepd. by the hydrolysis and polycondensation of an alkoxysilane of the formula: RnSi(OR')4-n (wherein R and R' are each 1-8C alkyl, aryl, or vinyl; and (n) is 0-3) with the alkoxysilane or its partial hydrolyzate, and has an ion concn. of 1.0mmol/l or lower.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の技術分野】本発明は、被膜形成用塗布液および
その製造方法に関し、さらに詳しくは、ボイド、ピンホ
ールなどのほとんどない緻密な被膜が得られるような被
膜形成用塗布液およびその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating solution for forming a coating film and a method for producing the same, and more specifically, a coating solution for forming a coating film and a method for producing the same for obtaining a dense coating film with few voids and pinholes. Regarding

【0002】[0002]

【発明の技術的背景】半導体用絶縁膜などにおいては、
基材との密着性、機械的強度、耐薬品性、耐湿性、絶縁
性などに優れていることが必要とされているが、このた
めには被膜にボイド、ピンホールなどが少なければ少な
い程好ましく、このような優れた性質を有するシリカ系
被膜の形成が半導体装置などを製造する際に望まれてい
る。
TECHNICAL BACKGROUND OF THE INVENTION In semiconductor insulating films, etc.,
It is required to have excellent adhesion to the base material, mechanical strength, chemical resistance, moisture resistance, insulation, etc. For this purpose, the smaller the number of voids and pinholes in the coating, the less Formation of a silica-based coating film having such excellent properties is desired when manufacturing a semiconductor device or the like.

【0003】このようなシリカ系被膜は、たとえば特開
平3−263476号公報に記載されているような塗布
液、すなわち一般式Rn Si(OR’)4-n (式中、
R、R’は炭素数1〜8のアルキル基、アリール基また
はビニル基を表わし、nは0〜3の整数である。)で示
されるアルコキシシランを加水分解重縮合して得られる
シリカゾル(A)と、前記アルコキシシランまたはその
部分加水分解物(B)との反応物を含有する被膜形成用
塗布液を用いて形成することができる。
Such a silica-based coating is formed by a coating solution as described in, for example, Japanese Patent Application Laid-Open No. 3-263476, that is, a general formula R n Si (OR ') 4-n (wherein
R and R'represent an alkyl group having 1 to 8 carbon atoms, an aryl group or a vinyl group, and n is an integer of 0 to 3. ) Is formed by using a coating solution for forming a film, which contains a reaction product of a silica sol (A) obtained by hydrolytic polycondensation of an alkoxysilane represented by (4) and the alkoxysilane or a partial hydrolyzate (B) thereof. be able to.

【0004】本発明者らは、より一層ボイド、ピンホー
ルなどの少ない緻密なシリカ系被膜を得るべく鋭意検討
したところ、上記式で示されるアルコキシシランを加水
分解重縮合してシリカゾルを得る際に触媒として用いら
れるアルカリ、あるいは前記アルコキシシランを部分加
水分解する際に触媒として用いられる酸またはアルカリ
がイオンとして塗布液中に残存していると、このイオン
に起因して、塗布液から形成された被膜にボイド、ピン
ホールなどが生じたり、あるいは絶縁性などの被膜特性
が低下することが見出された。
The inventors of the present invention have made earnest studies to obtain a dense silica-based coating film having fewer voids and pinholes. As a result, when an alkoxysilane represented by the above formula is hydrolyzed and polycondensed, a silica sol is obtained. When an alkali used as a catalyst or an acid or an alkali used as a catalyst when partially hydrolyzing the alkoxysilane remains as ions in the coating liquid, the ions are formed from the coating liquid. It has been found that the coating has voids, pinholes, etc., or the coating characteristics such as insulation are deteriorated.

【0005】本発明者らは、さらに検討を重ねた結果、
塗布液中に含まれているイオン濃度を低くして1.0ミ
リモル/リットル以下にすると、ボイド、ピンホールな
どがほとんどない緻密なシリカ系被膜が得られることを
見出し、本発明を完成させるに至った。
As a result of further studies, the present inventors have found that
It was found that when the concentration of ions contained in the coating liquid is lowered to 1.0 mmol / liter or less, a dense silica-based coating film with few voids and pinholes can be obtained, and the present invention is completed. I arrived.

【0006】[0006]

【発明の目的】本発明は、上記従来技術の問題点を解決
するためになされたものであって、ボイド、ピンホール
などがほとんどなく、緻密であって、密着性、機械的強
度、耐薬品性、耐湿性、絶縁性などに優れ、さらに比誘
電率が低いシリカ系被膜を形成することができるような
被膜形成用塗布液、およびこのような優れた性質を有す
る被膜形成用塗布液を製造することができる被膜形成用
塗布液の製造方法を提供することを目的としている。
DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art. It is dense and has little voids, pinholes, etc., and has a high degree of adhesion, mechanical strength and chemical resistance. A coating solution for forming a film, which has excellent properties, moisture resistance, insulation properties, and can form a silica-based coating having a low relative dielectric constant, and a coating solution for forming a film having such excellent properties. It is an object of the present invention to provide a method for producing a coating liquid for forming a coating film which can be used.

【0007】[0007]

【発明の概要】本発明に係る被膜形成用塗布液は、一般
式Rn Si(OR’)4-n (式中、R、R’は炭素数1
〜8のアルキル基、アリール基またはビニル基を表わ
し、nは0〜3の整数である。)で示されるアルコキシ
シランを加水分解重縮合して得られるシリカゾル(A)
と、前記アルコキシシランまたはその部分加水分解物
(B)との反応物を含む被膜形成用塗布液であって、該
塗布液中のイオン濃度が1.0ミリモル/リットル以下
であることを特徴としている。
SUMMARY OF THE INVENTION A coating solution for forming a coating film according to the present invention has a general formula R n Si (OR ') 4-n (wherein R and R'have 1 carbon atoms).
~ 8 represents an alkyl group, an aryl group or a vinyl group, and n is an integer of 0-3. ) A silica sol (A) obtained by hydrolytic polycondensation of an alkoxysilane represented by
And a reaction product of the above-mentioned alkoxysilane or a partial hydrolyzate thereof (B) with each other, wherein the ion concentration in the coating liquid is 1.0 mmol / liter or less. There is.

【0008】上記被膜形成用塗布液は、被膜形成用塗布
液の製造過程で、被膜形成用塗布液の原料として用いら
れる前記シリカゾル(A)、前記アルコキシシランまた
はその部分加水分解物(B)を含む液および被膜形成用
塗布液のいずれかに、陽イオン交換樹脂による処理と陰
イオン交換樹脂による処理とを行なって、被膜形成用塗
布液中のイオン濃度を1.0ミリモル/リットル以下と
することによって製造することができる。
The coating liquid for forming a coating film contains the silica sol (A), the alkoxysilane or a partial hydrolyzate thereof (B) used as a raw material for the coating liquid for forming a coating film in the process of producing the coating liquid for forming a coating film. The cation exchange resin treatment and the anion exchange resin treatment are performed on either the liquid containing solution or the coating solution for forming a film to reduce the ion concentration in the coating solution for forming a film to 1.0 mmol / liter or less. It can be manufactured.

【0009】[0009]

【発明の具体的説明】以下、本発明に係る被膜形成用塗
布液およびその製造方法について具体的に説明する。
DETAILED DESCRIPTION OF THE INVENTION The coating solution for forming a coating film and the method for producing the same according to the present invention will be specifically described below.

【0010】被膜形成用塗布液 本発明に係る被膜形成用塗布液には、一般式Rn Si
(OR’)4-n (式中、R、R’は炭素数1〜8のアル
キル基、アリール基またはビニル基を表わし、nは0〜
3の整数である。)で示されるアルコキシシランを加水
分解重縮合して得られるシリカゾル(A)と、前記アル
コキシシランまたはその部分加水分解物(B)との反応
物が含まれている。
Coating Solution for Forming a Film The coating solution for forming a film according to the present invention has the general formula R n Si
(OR ') 4-n (In the formula, R and R'represent an alkyl group having 1 to 8 carbon atoms, an aryl group or a vinyl group, and n is 0 to
It is an integer of 3. ), A reaction product of the silica sol (A) obtained by hydrolytic polycondensation of an alkoxysilane and the alkoxysilane or a partial hydrolyzate thereof (B).

【0011】また、本発明に係る被膜形成用塗布液で
は、塗布液中のイオン濃度が1.0ミリモル/リットル
以下、好ましくは0.6ミリモル/リットル以下であ
る。このイオン濃度は、塗布液中の陽イオンおよび陰イ
オンの合計イオン濃度を意味し、本発明では陽イオン濃
度および陰イオン濃度は、次のようにして測定される。
In the coating liquid for forming a coating film according to the present invention, the ion concentration in the coating liquid is 1.0 mmol / liter or less, preferably 0.6 mmol / liter or less. This ion concentration means the total ion concentration of the cations and anions in the coating liquid, and in the present invention, the cation concentration and the anion concentration are measured as follows.

【0012】被膜形成用塗布液10mlを90mlの精製純
水と混合し、室温で1時間攪拌した後、この混合液を濾
過し、さらに濾過後の濾材に100mlの精製純水を通し
て濾液を回収する。
10 ml of the coating liquid for forming a film was mixed with 90 ml of purified pure water, stirred at room temperature for 1 hour, filtered, and 100 ml of purified pure water was passed through the filter medium after filtration to collect the filtrate. ..

【0013】この回収濾液に含まれている金属イオン濃
度を原子吸光法で測定し、アンモニウムイオン濃度およ
び陰イオン濃度をイオンクロマトグラフィー法で測定す
る。本発明においては、被膜形成用塗布液中のイオン濃
度を1.0ミリモル/リットル以下と極めて低くするこ
とにより、従来の被膜にくらべてボイド、ピンホールな
どがほとんどなく、緻密であって、密着性、機械的強
度、耐薬品性、耐湿性、絶縁性などに優れ、さらに比誘
電率が低いシリカ系被膜を形成することができる。
The metal ion concentration contained in this recovered filtrate is measured by the atomic absorption method, and the ammonium ion concentration and the anion concentration are measured by the ion chromatography method. In the present invention, the ion concentration in the coating solution for forming a coating is extremely low, 1.0 mmol / liter or less, so that there are few voids and pinholes as compared with the conventional coating, and it is dense and adheres well. It is possible to form a silica-based coating having excellent properties, mechanical strength, chemical resistance, moisture resistance, insulation, etc., and having a low relative dielectric constant.

【0014】すなわち、前記シリカゾル(A)とアルコ
キシシランまたはその部分加水分解物(B)との反応物
を含む被膜形成用塗布液は、アルコキシシランの加水分
解の際に触媒として用いた酸またはアルカリを含んでお
り、被膜形成用塗布液中でイオンとして存在している。
That is, the coating solution for forming a film containing the reaction product of the silica sol (A) and the alkoxysilane or its partial hydrolyzate (B) is the acid or alkali used as a catalyst during the hydrolysis of the alkoxysilane. And are present as ions in the coating liquid for forming a film.

【0015】これらの酸またはアルカリは、塗布液中に
含まれているアルコキシシランの重縮合がさらに進行し
て被膜が形成される時の重縮合用触媒として作用する。
このため、被膜形成時に、塗布液中に含まれているアル
コキシシランの重縮合速度が速くなり、塗布液中の酸ま
たはアルカリ、あるいは有機溶媒の一部が取り込まれた
状態のままで成膜化が進むことがある。これらの酸また
はアルカリ、あるいは有機溶媒の一部は基材上に形成さ
れた被膜を加熱して硬化させる際にガス化して除去され
るが、その跡がボイドやピンホールになる場合があり、
このため被膜の緻密性が低下する。
These acids or alkalis act as a polycondensation catalyst when the polycondensation of the alkoxysilane contained in the coating liquid proceeds further to form a film.
As a result, the polycondensation rate of the alkoxysilane contained in the coating solution becomes faster during film formation, and the film is formed with the acid or alkali in the coating solution or part of the organic solvent incorporated. May progress. Some of these acids or alkalis or organic solvents are gasified and removed when the coating formed on the substrate is heated and cured, but the traces may become voids or pinholes,
For this reason, the denseness of the coating is lowered.

【0016】さらに被膜を加熱して硬化した後も、上記
のような酸またはアルカリの一部、あるいは金属イオン
が被膜中に残留していると、これらが不純物として作用
し、たとえば絶縁性などの被膜の特性が低下する場合が
ある。
Even after the coating is heated and cured, if some of the above acids or alkalis or metal ions remain in the coating, they act as impurities, and, for example, insulative properties. The properties of the coating may deteriorate.

【0017】本発明においては、上記のような塗布液中
に残存する酸イオンまたはアルカリイオン、さらに触媒
として用いたり不純物として残存する微量の金属イオン
などのような塗布液中に含まれているイオンを除去する
ことにより、被膜形成時のボイド、ピンホールなどが発
生する原因が取り除かれると同時に絶縁性が向上し、比
誘電率の低い被膜を得ることができる。
In the present invention, ions contained in the coating solution such as acid ions or alkali ions remaining in the coating solution as described above, and trace amounts of metal ions used as a catalyst or remaining as impurities. By removing the, the cause of generation of voids, pinholes, etc. at the time of forming the film is removed, and at the same time the insulating property is improved and a film having a low relative dielectric constant can be obtained.

【0018】被膜形成用塗布液の製造方法 上記のような本発明に係る被膜形成用塗布液は、被膜形
成用塗布液の製造過程で、被膜形成用塗布液の原料とし
て用いられるシリカゾル(A)、およびアルコキシシラ
ンまたはその部分加水分解物(B)を含む液、ならびに
これらの原料から得られた被膜形成用塗布液のいずれか
に、陽イオン交換樹脂による処理と陰イオン交換樹脂に
よる処理とを行なって、被膜形成用塗布液中のイオン濃
度を1.0ミリモル/リットル以下とすることによって
製造することができる。
Method for producing coating liquid for forming film The coating liquid for forming a coating film according to the present invention as described above is a silica sol (A) used as a raw material for the coating liquid for forming a film in the process of producing the coating liquid for forming a film. , And a liquid containing alkoxysilane or a partial hydrolyzate thereof (B), and a coating liquid for forming a film obtained from these raw materials are treated with a cation exchange resin and an anion exchange resin. Then, it can be produced by setting the ion concentration in the coating liquid for forming a film to 1.0 mmol / liter or less.

【0019】上述した陽イオン交換樹脂による処理と陰
イオン交換樹脂による処理とを行なう際には、陽イオン
交換樹脂と陰イオン交換樹脂とで交互に処理してもよ
く、また陽イオン交換樹脂と陰イオン交換樹脂との混合
樹脂で処理してもよい。
When the treatment with the cation exchange resin and the treatment with the anion exchange resin are performed, the cation exchange resin and the anion exchange resin may be alternately treated, or the cation exchange resin and the cation exchange resin may be used. It may be treated with a mixed resin with an anion exchange resin.

【0020】また、被膜形成用塗布液の原料として用い
られるシリカゾル(A)は、次のような方法で得ること
ができる。すなわちシリカゾル(A)は、下記一般式で
示されるアルコキシシランを、水、有機溶媒およびアル
カリ触媒の存在下に加水分解重縮合させることにより得
られ、このようなシリカゾルの調製法としては、従来よ
り公知の方法を採用することができる。
The silica sol (A) used as a raw material for the coating liquid for forming a film can be obtained by the following method. That is, the silica sol (A) is obtained by subjecting an alkoxysilane represented by the following general formula to hydrolysis polycondensation in the presence of water, an organic solvent and an alkali catalyst. A known method can be adopted.

【0021】Rn Si(OR’)4-n 式中、nは0〜3の整数を表わし、R、R’は炭素数1
〜8のアルキル基、アリール基またはビニル基を表わし
ている。
R n Si (OR ') 4-n In the formula, n represents an integer of 0 to 3, and R and R'have 1 carbon atoms.
Represents an alkyl group, an aryl group or a vinyl group of 8;

【0022】このようなアルコキシシランの具体例とし
ては、テトラメトキシシラン、テトラエトキシシラン、
テトライソプロポキシシラン、テトラブトキシシラン、
テトラオクチルシラン、メチルトリメトキシシラン、メ
チルトリエトキシシラン、エチルトリエトキシシラン、
メチルトリイソプロポキシシラン、メチルトリブトキシ
シラン、オクチルトリエトキシシラン、フェニルトリメ
トキシシラン、ビニルトリメトキシシラン、ジメチルジ
メトキシシラン、ジエチルジエトキシシラン、トリメチ
ルモノメトキシシラン、トリエチルモノエトキシシラン
などが挙げられる。
Specific examples of such alkoxysilanes include tetramethoxysilane, tetraethoxysilane,
Tetraisopropoxysilane, tetrabutoxysilane,
Tetraoctylsilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltriethoxysilane,
Examples thereof include methyltriisopropoxysilane, methyltributoxysilane, octyltriethoxysilane, phenyltrimethoxysilane, vinyltrimethoxysilane, dimethyldimethoxysilane, diethyldiethoxysilane, trimethylmonomethoxysilane, and triethylmonoethoxysilane.

【0023】本発明においては、これらのアルコキシシ
ランを単独で用いてもよく、2種以上組み合わせて用い
てもよい。有機溶媒としては、アルコール類、ケトン
類、エーテル類、エステル類などが挙げられ、より具体
的には、たとえばメタノール、エタノール、プロパノー
ル、ブタノールなどのアルコール類、メチルセロソル
ブ、エチルセロソルブなどのエチレングリコールエーテ
ル類、エチレングリコール、プロピレングリコールなど
のグリコール類、酢酸メチル、酢酸エチル、乳酸メチル
などのエルテル類などが用いられる。
In the present invention, these alkoxysilanes may be used alone or in combination of two or more. Examples of the organic solvent include alcohols, ketones, ethers, esters and the like. More specifically, for example, alcohols such as methanol, ethanol, propanol, butanol, etc., ethylene glycol ethers such as methyl cellosolve, ethyl cellosolve, etc. Examples thereof include glycols such as ethylene glycol and propylene glycol, and ethers such as methyl acetate, ethyl acetate and methyl lactate.

【0024】アルカリ触媒としては、アンモニア、アミ
ン、アルカリ金属触媒、第4級アンモニウム化合物、ア
ミン系カップリング剤など、水溶液中でアルカリ性を示
す化合物が用いられ、反応混合物のpHが7〜12、好
ましくは8〜11となるような量で用いられる。
As the alkali catalyst, compounds showing alkalinity in an aqueous solution such as ammonia, amine, alkali metal catalyst, quaternary ammonium compound and amine coupling agent are used, and the pH of the reaction mixture is preferably 7 to 12. Is used in an amount such that it is 8-11.

【0025】シリカゾル(A)の調製法をさらに詳細に
説明すると、たとえば、水−アルコール混合溶媒を攪拌
しながら、この混合溶媒にアルコキシシランおよび、た
とえばアンモニア水などのようなアルカリ触媒を添加し
てアルコキシシランを反応させる。
The method for preparing the silica sol (A) will be described in more detail. For example, while stirring a water-alcohol mixed solvent, an alkoxysilane and an alkali catalyst such as aqueous ammonia are added to the mixed solvent. React with alkoxysilane.

【0026】この際、水は、アルコキシシランに含まれ
るSi−OR基1モル当り5〜50モル、好ましくは5
〜25モルとなるような量で用いられ、アルカリ触媒
は、前記のpHとなる量で、たとえば0.01〜1.0
モル/SiO2 モル、好ましくは0.05〜0.8モル
/SiO2 モルとなるような量で配合される。
At this time, water is 5 to 50 mol, preferably 5 to 1 mol per 1 mol of Si-OR groups contained in the alkoxysilane.
The amount of the alkali catalyst used is such that the above-mentioned pH is reached, for example, 0.01-1.0.
It is blended in an amount such that it is mol / SiO 2 mol, preferably 0.05 to 0.8 mol / SiO 2 mol.

【0027】アルコキシシランの加水分解重縮合反応
は、通常、常圧下で用いられている溶媒の沸点以下の温
度で、好ましくはこの沸点より5〜10℃低い温度で行
なわれるが、オートクレーブなどの耐熱耐圧容器中で加
圧しながら行なうこともでき、この場合には、溶媒が常
圧下で示す沸点よりも高い温度で行なわれる。
The hydrolysis polycondensation reaction of the alkoxysilane is usually carried out at a temperature not higher than the boiling point of the solvent used under normal pressure, preferably at a temperature 5 to 10 ° C. lower than this boiling point. It can also be carried out under pressure in a pressure vessel, and in this case, it is carried out at a temperature higher than the boiling point of the solvent under normal pressure.

【0028】このような条件下でアルコキシシランを加
水分解すると、アルコキシシランの重縮合が三次元的に
進行し、シリカ粒子が生成し、生成したシリカ粒子が成
長する。
When the alkoxysilane is hydrolyzed under such conditions, polycondensation of the alkoxysilane proceeds three-dimensionally, silica particles are produced, and the produced silica particles grow.

【0029】また、このようにしてシリカ粒子を生成・
成長させた後、用いられている溶媒の沸点以上の温度で
一定時間加熱処理を行なってもよい。このような加熱処
理を行なうと、アルコキシシランの重縮合がより一層促
進され、密度の大きなシリカ粒子が分散したシリカゾル
が得られる。
In this way, silica particles are produced.
After the growth, the heat treatment may be performed at a temperature equal to or higher than the boiling point of the solvent used for a certain period of time. By performing such heat treatment, polycondensation of alkoxysilane is further promoted, and a silica sol in which silica particles having a high density are dispersed can be obtained.

【0030】このようにしてシリカゾルが得られるが、
本発明で用いられるシリカゾル(A)としては、平均粒
径が約50〜500オングストローム、特に100〜5
00オングストロームである均一なシリカ粒子が溶媒中
に分散したシリカゾルが好ましい。この粒径が50オン
グストローム未満の場合、このようなシリカ粒子を含む
シリカゾルを原料として得られる被膜形成用塗布液を用
いて被膜を形成すると、形成された膜面にクラックが発
生する場合があり、また、シリカゾル中に含まれている
シリカ粒子の平均粒径が500オングストロームを超え
ると被膜中のボイドが多発し、緻密な被膜が得られない
場合がある。
A silica sol is thus obtained,
The silica sol (A) used in the present invention has an average particle size of about 50 to 500 angstroms, particularly 100 to 5 angstroms.
A silica sol in which uniform silica particles of 00 angstrom are dispersed in a solvent is preferable. When the particle size is less than 50 angstroms, when a film is formed using a coating solution for forming a film obtained by using silica sol containing such silica particles as a raw material, cracks may occur on the formed film surface, Further, when the average particle diameter of silica particles contained in the silica sol exceeds 500 angstroms, voids in the coating often occur and a dense coating may not be obtained.

【0031】本発明では、シリカ粒子が、SiO2 換算
で約50重量%以下、好ましくは40重量%以下となる
量でシリカゾル中に含まれていることが望ましい。この
シリカゾル中に含まれているシリカ粒子の含量が50重
量%を超えるとゲル化し易い傾向がある。
In the present invention, it is desirable that the silica particles are contained in the silica sol in an amount of about 50% by weight or less, preferably 40% by weight or less in terms of SiO 2 . If the content of silica particles contained in this silica sol exceeds 50% by weight, gelation tends to occur.

【0032】本発明においては、上記方法で得られた未
精製のシリカゾルをそのまま用いることもできるが、後
述するようなシリカゾル(A)とアルコキシシランまた
はその部分加水分解物(B)との反応を行なう前に、予
めシリカゾルから限外ろ過などの手段により、溶媒を水
と有機溶媒との混合溶媒から水に置換させておくことが
好ましい。
In the present invention, the unpurified silica sol obtained by the above method can be used as it is, but the reaction between the silica sol (A) and the alkoxysilane or its partial hydrolyzate (B) as described below is carried out. Before carrying out, it is preferable to replace the solvent from the mixed solvent of water and the organic solvent with water in advance by means such as ultrafiltration from silica sol.

【0033】このような溶媒置換操作は、上述したシリ
カゾルの加熱処理前に行なってもよい。本発明では、上
記のようにして得られたシリカゾルに対して、陽イオン
交換樹脂および陰イオン交換樹脂による脱イオン処理を
行なってもよい。
Such solvent replacement operation may be carried out before the above-mentioned heat treatment of the silica sol. In the present invention, the silica sol obtained as described above may be subjected to a deionization treatment with a cation exchange resin and an anion exchange resin.

【0034】本発明の被膜形成用塗布液には、このよう
にして得られたシリカゾル(A)を、アルコキシシラン
またはその部分加水分解物(B)と反応して得られた反
応物が用いられる。
A reaction product obtained by reacting the silica sol (A) thus obtained with an alkoxysilane or a partial hydrolyzate (B) thereof is used in the coating solution for forming a film of the present invention. ..

【0035】上記シリカゾル(A)との反応に用いられ
るアルコキシシランは、シリカゾル(A)の原料として
用いたアルコキシシランと同様に一般式Rn Si(O
R’) 4-n (式中、R、R’は炭素数1〜8のアルキル
基、アリール基またはビニル基を表わし、nは0〜3の
整数である。)で示されるアルコキシシランの中から選
択されるが、必ずしもシリカゾル(A)の原料として用
いたアルコキシシランと同一である必要はない。
Used in the reaction with the above silica sol (A)
Alkoxysilane as a raw material for silica sol (A)
Similar to the used alkoxysilane, the general formula RnSi (O
R ') 4-n(In the formula, R and R'are alkyl having 1 to 8 carbons.
Represents a group, an aryl group or a vinyl group, and n is 0 to 3
It is an integer. ) Alkoxysilane
Selected as a raw material for silica sol (A)
It does not have to be the same as the alkoxysilane used.

【0036】シリカゾル(A)とアルコキシシランまた
はその部分加水分解物(B)と反応の反応過程では、シ
リカゾル中でシリカ粒子の成長あるいは新たなシリカ粒
子の生成は起こらず、シリカゾル(A)中に含まれてい
るシリカ粒子の表面で、このシリカ粒子と新たなアルコ
キシシランまたはその部分加水分解物(B)との結合反
応が起こり、その結果、本発明の目的にかなった塗布液
が得られる。
In the reaction process of the reaction between the silica sol (A) and the alkoxysilane or its partial hydrolyzate (B), the growth of silica particles or the formation of new silica particles does not occur in the silica sol, and On the surface of the silica particles contained therein, a binding reaction between the silica particles and a new alkoxysilane or a partial hydrolyzate (B) thereof occurs, and as a result, a coating solution meeting the object of the present invention can be obtained.

【0037】上記のように本発明の被膜形成用塗布液に
は、シリカゾル(A)とアルコキシシランとの反応物を
用いることができるが、シリカゾル(A)とアルコキシ
シランの部分加水分解物との反応物を用いることが好ま
しい。このようにシリカゾル(A)とアルコキシシラン
の部分加水分解物とを混合して反応させると、ゾルの凝
集によるゲル化が起こり難くなる傾向がある。
As described above, a reaction product of silica sol (A) and an alkoxysilane can be used in the coating solution for forming a coating film of the present invention, but a reaction product of silica sol (A) and a partial hydrolyzate of alkoxysilane is used. It is preferable to use a reactant. When the silica sol (A) and the partial hydrolyzate of the alkoxysilane are mixed and reacted as described above, gelation due to aggregation of the sol tends not to occur.

【0038】アルコキシシランの部分加水分解を行なう
際には、通常、水、有機溶媒、酸またはアルカリ触媒が
用いられる。有機溶媒およびアルカリ触媒としては、前
述したものが挙げられる。また、酸触媒としては、具体
的には、塩酸、硝酸、硫酸などの無機酸、酢酸、シュウ
酸などの有機酸、あるいは金属石鹸などのような水溶液
中で酸性を示す化合物が用いられる。
When the partial hydrolysis of the alkoxysilane is carried out, water, an organic solvent, an acid or an alkali catalyst is usually used. Examples of the organic solvent and the alkali catalyst include those mentioned above. As the acid catalyst, specifically, inorganic acids such as hydrochloric acid, nitric acid, sulfuric acid, organic acids such as acetic acid and oxalic acid, or compounds showing acidity in an aqueous solution such as metal soap are used.

【0039】アルコキシシランの部分加水分解に用いら
れる水の量は、通常、アルコキシシランに含まれるSi
−OR基1モル当り0.1〜2モル、好ましくは0.5
〜2モルである。アルコキシシランの部分加水分解を行
なう際に酸触媒を用いる場合には、反応液のpHが、通
常、0〜6、好ましくは1〜3となるような量で、また
アルカリ触媒を用いる場合には、反応液のpHが、通
常、7〜10、好ましくは7〜8となるような量で用い
られる。
The amount of water used for partial hydrolysis of the alkoxysilane is usually the Si contained in the alkoxysilane.
0.1 to 2 mol, preferably 0.5 per mol of the OR group.
~ 2 moles. When an acid catalyst is used in the partial hydrolysis of alkoxysilane, the pH of the reaction solution is usually 0 to 6, preferably 1 to 3, and when an alkali catalyst is used. The reaction solution is used in such an amount that the pH of the reaction solution is usually 7 to 10, preferably 7 to 8.

【0040】上記のような条件で得られるアルコキシシ
ラン部分加水分解物の分子量は、ポリスチレン換算分子
量で約100〜10,000、好ましくは500〜5,
000であることが望ましい。
The molecular weight of the partially hydrolyzed alkoxysilane obtained under the above conditions is about 100 to 10,000, preferably 500 to 5, in terms of polystyrene equivalent molecular weight.
000 is desirable.

【0041】本発明では、このような方法でアルコキシ
シランの部分加水分解物が得られるが、次のような方法
によっても得ることができる。 1)一般式R1 n Si(OR2 4-n (式中、R1 は炭
素数1〜8のアルキル基、アリール基またはビニル基を
表わし、R2 は炭素数1〜4のアルキル基、アリール基
またはビニル基を表わし、nは0〜3の整数である。)
で示されるアルコキシシランの1種または2種以上を、
有機溶媒、水およびアルカリ触媒の存在下で部分加水分
解し、次いで得られた部分加水分解物を、水および酸触
媒の存在下でさらに部分加水分解する方法(特開平3−
54279号)。
In the present invention, the partial hydrolyzate of the alkoxysilane is obtained by such a method, but it can also be obtained by the following method. 1) General formula R 1 n Si (OR 2 ) 4-n (In the formula, R 1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or a vinyl group, and R 2 represents an alkyl group having 1 to 4 carbon atoms. , An aryl group or a vinyl group, and n is an integer of 0 to 3.)
One or more of alkoxysilanes represented by
A method in which partial hydrolysis is carried out in the presence of an organic solvent, water and an alkali catalyst, and then the resulting partially hydrolyzed product is further partially hydrolyzed in the presence of water and an acid catalyst.
54279).

【0042】2)一般式R1 n Si(OR2 4-n (式
中、R1 は炭素数1〜8のアルキル基、アリール基また
はビニル基を表わし、R2 は炭素数1〜4のアルキル
基、アリール基またはビニル基を表わし、nは0〜3の
整数である。)で示されるアルコキシシランの1種また
は2種以上を、有機溶媒、水および酸触媒の存在下で部
分加水分解し、次いで得られた部分加水分解物をアルカ
リと接触させ、こうして得られた液を必要に応じて酸を
加えて酸性にする方法(特開平3−115379号)。
2) General formula R 1 n Si (OR 2 ) 4-n (In the formula, R 1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group or a vinyl group, and R 2 has 1 to 4 carbon atoms. Which represents an alkyl group, an aryl group or a vinyl group, and n is an integer of 0 to 3) is partially hydrolyzed in the presence of an organic solvent, water and an acid catalyst. A method of decomposing, then contacting the obtained partial hydrolyzate with an alkali, and adding an acid to the solution thus obtained to make it acidic (JP-A-3-115379).

【0043】上記方法において用いられる有機溶媒、酸
触媒およびアルカリ触媒としては、前述したものが挙げ
られる。本発明では、上記のようにして得られたアルコ
キシシランの部分加水分解物を含む液に対して、陽イオ
ン交換樹脂および陰イオン交換樹脂による脱イオン処理
を行なってもよい。
Examples of the organic solvent, acid catalyst and alkali catalyst used in the above method include those mentioned above. In the present invention, the liquid containing the partially hydrolyzed product of the alkoxysilane obtained as described above may be subjected to deionization treatment with a cation exchange resin and an anion exchange resin.

【0044】本発明に係る被膜形成用塗布液を製造する
際には、上記のようなシリカゾル(A)と、アルコキシ
シランまたはその部分加水分解物(B)とを、シリカゾ
ル(A)中に含まれているシリカ粒子のSiO2 換算重
量(WA )/アルコキシシランまたはその部分加水分解
物(B)のSiO2 換算算重量(WB)が0.1〜1
0.0、好ましくは0.25〜4.0となるような重量
比で混合させることが好ましい。
When the coating solution for forming a coating film according to the present invention is produced, the silica sol (A) as described above and the alkoxysilane or its partial hydrolyzate (B) are contained in the silica sol (A). in terms of SiO 2 by weight of the silica particles that are (W a) / alkoxysilane or a partial hydrolyzate thereof calculated as SiO 2 calculated weight of (B) (W B) is 0.1 to 1
It is preferable to mix them in a weight ratio of 0.0, preferably 0.25 to 4.0.

【0045】重量比(WA /WB )が10.0を超える
と、このようなシリカゾル(A)と、アルコキシシラン
またはその部分加水分解物(B)との反応物を含む被膜
形成用塗布液から形成された被膜は、耐熱性および耐湿
性に優れるものの、膜厚が厚くなるとクラックが発生し
易くなる傾向があり、他方、重量比(WA /WB )が
0.1未満では、同被膜の耐熱性および耐湿性が劣悪に
なる傾向がある。
When the weight ratio (W A / W B ) exceeds 10.0, a coating for forming a film containing a reaction product of such a silica sol (A) and an alkoxysilane or a partial hydrolyzate (B) thereof. The coating film formed from the liquid has excellent heat resistance and moisture resistance, but when the film thickness increases, cracks tend to easily occur, while on the other hand, when the weight ratio (W A / W B ) is less than 0.1, The heat resistance and moisture resistance of the film tend to be poor.

【0046】シリカ系被膜の形成に用いられる被膜形成
用塗布液は、上記のようなシリカゾル(A)と、アルコ
キシシランまたはその部分加水分解物(B)とを混合し
た後、約100℃以下、好ましくは80℃以下の温度
で、通常、0.5〜5時間、好ましくは1〜3時間の加
熱処理を行なうことによって得られる。なお、この加熱
処理の下限は特に限定されないが、低温になる程反応時
間が長くなり、生産性が低下する傾向がある。他方、1
00℃を超えると、アルコキシシランの加水分解反応が
進行し過ぎるため好ましくない。
The coating solution for forming a coating used for forming the silica-based coating is about 100 ° C. or lower after mixing the silica sol (A) and the alkoxysilane or its partial hydrolyzate (B) as described above. It is preferably obtained by performing heat treatment at a temperature of preferably 80 ° C. or lower for usually 0.5 to 5 hours, preferably 1 to 3 hours. The lower limit of this heat treatment is not particularly limited, but the lower the temperature, the longer the reaction time and the lower the productivity. On the other hand, 1
If the temperature exceeds 00 ° C, the hydrolysis reaction of the alkoxysilane proceeds too much, which is not preferable.

【0047】次いで、このようにして得られた被膜形成
用塗布液に陽イオン交換樹脂および陰イオン交換樹脂に
よる脱イオン処理を行ない、塗布液中のイオン濃度が規
定値以下にされる。なお、上記のようにシリカゾル
(A)およびアルコキシシランの部分加水分解物(B)
を含む液に陽イオン交換樹脂および陰イオン交換樹脂に
よる脱イオン処理が予め行なわれていて、これらを用い
て得られた被膜形成用塗布液のイオン濃度が規定値以下
であれば、改めて被膜形成用塗布液に上記のような脱イ
オン処理を行なう必要はない。
Next, the coating solution for forming a film thus obtained is subjected to a deionization treatment with a cation exchange resin and an anion exchange resin, and the ion concentration in the coating solution is adjusted to a specified value or less. As described above, the silica sol (A) and the alkoxysilane partial hydrolyzate (B) are used.
If the cation-exchange resin and anion-exchange resin have been previously deionized with a solution containing, and the ion concentration of the coating liquid for film formation obtained using these is below the specified value, the film is formed again. It is not necessary to subject the coating solution for deionization as described above.

【0048】本発明では、このようにしてイオン濃度が
1.0ミリモル/リットル以下である本発明に係る被膜
形成用塗布液が得られる。本発明に係る被膜形成用塗布
液を用いて基材上に被膜を形成する際には、ガラス、プ
ラスチック、セラミックなどの基材の表面に、スプレー
法、スピンコート法、ディッピング法、ロールコート
法、スクリーン印刷法、転写印刷法などの各種方法で上
記のようにして得られた被膜形成用塗布液を塗布し、次
いで得られた塗膜を乾燥・焼成することによってシリカ
系被膜が形成された基材が得られる。
In the present invention, the coating liquid for forming a coating film having an ion concentration of 1.0 mmol / liter or less is thus obtained. When a coating film is formed on a substrate using the coating liquid for forming a coating film of the present invention, a spray method, a spin coating method, a dipping method, a roll coating method is applied to the surface of the substrate such as glass, plastic, or ceramic. The silica-based coating was formed by applying the coating liquid for film formation obtained as described above by various methods such as a screen printing method and a transfer printing method, and then drying and baking the obtained coating film. A substrate is obtained.

【0049】上記の焼成温度は、通常、150℃〜80
0℃、好ましくは200℃〜800℃程度である。さら
に、上記の塗布工程、または乾燥工程の後に、あるいは
乾燥工程中に、未硬化の被膜に、可視光線より波長の短
い電磁波、たとえば紫外線、電子線、X線などを照射す
るか、あるいは被膜の硬化を促進するガス雰囲気、たと
えばアンモニア、オゾンなどのガス雰囲気中で加熱する
ことにより被膜の硬化を促進することができる。
The above firing temperature is usually 150 ° C. to 80 ° C.
The temperature is 0 ° C, preferably about 200 ° C to 800 ° C. Further, after the coating step, the drying step, or during the drying step, the uncured film is irradiated with an electromagnetic wave having a wavelength shorter than visible light, such as ultraviolet rays, electron beams, or X-rays, or The coating can be cured by heating in a gas atmosphere that promotes curing, for example, a gas atmosphere of ammonia, ozone, or the like.

【0050】このようにして形成される被膜の膜厚は、
通常0.05〜2μm、好ましくは0.1〜1μm程度
である。上記のようにして本発明に係る被膜形成用塗布
液から得られた被膜は、さらにボイド、ピンホールなど
の欠陥がほとんどなく、密着性に優れ、耐薬品性、耐湿
性などに優れ、また比誘電率が極めて小さく、さらにク
ラックの発生もない。このため、本発明に係る被膜形成
用塗布液は、各種保護膜、半導体用絶縁膜などの形成用
として好適である。
The film thickness of the film thus formed is
It is usually 0.05 to 2 μm, preferably 0.1 to 1 μm. The coating film obtained from the coating liquid for forming a coating film according to the present invention as described above has almost no defects such as voids and pinholes, excellent adhesion, excellent chemical resistance, excellent moisture resistance, etc. It has a very low dielectric constant and does not generate cracks. Therefore, the coating liquid for forming a coating film according to the present invention is suitable for forming various protective films, insulating films for semiconductors, and the like.

【0051】なお、ガラス基板にITO膜などの電極膜
が形成されているような液晶表示素子などの素子におい
て、ガラス基板と電極膜との間に、本発明に係る被膜形
成用塗布液を用いて被膜を形成すると、アルカリアッタ
ック、すなわちガラス基板中に含まれているNaなどの
アルカリ成分が電極膜中に侵入することを防止すること
ができるので、いわゆるアルカリパッシベーション膜と
して好適である。
In a device such as a liquid crystal display device in which an electrode film such as an ITO film is formed on a glass substrate, the coating liquid for forming a film according to the present invention is used between the glass substrate and the electrode film. Forming the coating by using the above method can prevent an alkali attack, that is, an alkali component such as Na contained in the glass substrate from entering the electrode film, and is therefore suitable as a so-called alkali passivation film.

【0052】[0052]

【発明の効果】本発明に係る被膜形成用塗布液によれ
ば、ボイド、ピンホールなどがほとんどなく、緻密であ
って、密着性、機械的強度、耐薬品性、耐湿性、絶縁性
などに優れ、さらに比誘電率が低いシリカ系被膜を基材
上に形成することができる。
EFFECT OF THE INVENTION According to the coating solution for forming a coating film of the present invention, there are almost no voids, pinholes, etc., and it is dense and has excellent adhesion, mechanical strength, chemical resistance, moisture resistance, insulation, etc. A silica-based coating film which is excellent and has a low relative dielectric constant can be formed on a substrate.

【0053】また、本発明に係る被膜形成用塗布液の製
造方法によれば、このような優れた性質を有する被膜を
形成することができる被膜形成用塗布液を簡単かつ確実
に製造できる。
Further, according to the method for producing a coating liquid for forming a coating film of the present invention, a coating liquid for forming a coating film capable of forming a coating film having such excellent properties can be easily and reliably produced.

【0054】[0054]

【実施例】以下、本発明を実施例により説明するが、本
発明はこれら実施例に限定されるものではない。
EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

【0055】[0055]

【実施例1】 −シリカゾルの調製− 純水101.5gとメタノール406.1gの混合溶液
にエチルシリケート−28(SiO2 濃度;28重量
%、多摩化学工業(株)社製)110.4gを加えた
後、この液を加熱して液の温度を65℃に保持しなが
ら、5%アンモニア水89.5gを3時間かけて添加
し、これにより液中にシリカ粒子を生成させた。添加終
了後の液をさらに同様の温度で1時間保持し、液中のシ
リカ粒子を熟成させた。次いでこのシリカ粒子を含む液
から、限外ろ過により液中に含まれている未反応のエチ
ルシリケート、メタノールおよびアンモニアを除去する
と同時に純水を加え、SiO2 濃度が5重量%であり、
平均粒径が100オングストロームのシリカ粒子が分散
したシリカゾルAを得た。
Example 1 —Preparation of silica sol— 110.4 g of ethyl silicate-28 (SiO 2 concentration; 28% by weight, manufactured by Tama Chemical Industry Co., Ltd.) was added to a mixed solution of 101.5 g of pure water and 406.1 g of methanol. After the addition, 89.5 g of 5% aqueous ammonia was added over 3 hours while the liquid was heated to maintain the temperature of the liquid at 65 ° C., whereby silica particles were generated in the liquid. The liquid after the addition was maintained at the same temperature for 1 hour to age the silica particles in the liquid. Then, from the liquid containing the silica particles, unreacted ethyl silicate, methanol and ammonia contained in the liquid were removed by ultrafiltration, and pure water was added at the same time, and the SiO 2 concentration was 5% by weight.
A silica sol A in which silica particles having an average particle diameter of 100 Å were dispersed was obtained.

【0056】−アルコキシシラン部分加水分解物の調製
− 357.1gの前記エチルシリケート−28、エタノー
ル402.9gおよび純水240.0gの混合溶液に濃
硝酸を添加して、混合溶液のpHを1.5に調節した。
この混合溶液を50℃で1時間加熱することによりアル
コキシシラン部分加水分解物aを得た。
-Preparation of Partial Hydrolyzate of Alkoxysilane- Concentrated nitric acid was added to a mixed solution of 357.1 g of ethyl silicate-28, 402.9 g of ethanol and 240.0 g of pure water to adjust the pH of the mixed solution to 1 Adjusted to .5.
The alkoxysilane partial hydrolyzate a was obtained by heating this mixed solution at 50 ° C. for 1 hour.

【0057】−塗布液の調製− 上記のようにして得られたシリカゾルAとアルコキシシ
ラン部分加水分解物aとを、固形分重量比で7/3の割
合で混合した後、50℃で1時間加熱してシリカゾルと
アルコキシシラン部分加水分解物との反応を行なっ
た。。次いで、この反応物を含む液を、陽イオン交換樹
脂と陰イオン交換樹脂との等量混合樹脂(AG501、
バイオ−レッド社製)を充填したカラムに通して脱イオ
ン処理を行なった。
-Preparation of coating liquid-Silica sol A obtained as described above and alkoxysilane partial hydrolyzate a were mixed at a solid content weight ratio of 7/3 and then at 50 ° C for 1 hour. By heating, the silica sol and the partial hydrolysis product of the alkoxysilane were reacted. . Then, a liquid containing this reaction product is mixed with an equal amount of a cation exchange resin and an anion exchange resin (AG501,
Deionization treatment was performed by passing through a column packed with Bio-Red Co., Ltd.).

【0058】次いでこの液に含まれている水およびアル
コールを、ロータリーエバポレータで留去した後、プロ
ピレングリコールモノプロピルエーテルで置換し、Si
2濃度が20重量%である塗布液を得た。
Then, the water and alcohol contained in this solution were distilled off by a rotary evaporator, and then replaced with propylene glycol monopropyl ether to obtain Si.
A coating solution having an O 2 concentration of 20% by weight was obtained.

【0059】−被膜の評価− このようにして得られた塗布液のイオン濃度を測定する
とともに、この塗布液をガラス基板にスピナー法で塗布
して乾燥させて後、350℃で30分間焼成して膜厚が
約2.0μmの被膜を形成し、次の評価を行なった。
-Evaluation of coating- The ion concentration of the coating liquid thus obtained is measured, and this coating liquid is applied to a glass substrate by a spinner method, dried, and then baked at 350 ° C for 30 minutes. To form a coating film having a thickness of about 2.0 μm, and the following evaluation was performed.

【0060】(1)クラックの有無; 目視観察により
判定。 (2)緻密性 ; 50%HFと60%HNO3
との混酸(HF/HNO3 =5/100重量比)に1分
間浸漬し、膜厚変化を測定。
(1) Presence or absence of cracks; judged by visual observation. (2) Denseness; 50% HF and 60% HNO 3
Immersed in a mixed acid with (HF / HNO 3 = 5/100 weight ratio) for 1 minute and measure the change in film thickness.

【0061】(3)耐アルカリ性 ; 40℃の5重量
%NaOH水溶液に20分間浸漬し、膜厚変化を測定。 (4)絶縁性 ; 絶縁抵抗計で測定。
(3) Alkali resistance: Immersed in a 5 wt% NaOH aqueous solution at 40 ° C. for 20 minutes, and measured the change in film thickness. (4) Insulation: Measured with an insulation resistance meter.

【0062】(5)アルカリパッシベーション性;上記
のようにして得られたシリカ系被膜付ガラス基板のシリ
カ系被膜の表面にNESA膜をCVD法で形成した後、
このシリカ系被膜付ガラス基板を450℃で加熱処理
し、加熱前後のシリカ系被膜の表面抵抗値の差異で評
価。
(5) Alkali passivation property: After the NESA film is formed by the CVD method on the surface of the silica-based coating of the glass substrate with the silica-based coating obtained as described above,
This silica-coated glass substrate was heat-treated at 450 ° C., and evaluated by the difference in surface resistance of the silica-based coating before and after heating.

【0063】(6)比誘電率 ; 塗布液をシリコ
ンウェハの表面にスピナー法で塗布・乾燥し、次いで3
0分間窒素気流中で焼成して膜厚が約1μmの被膜を形
成し、さらにこの被膜の表面にアルミニウム膜をスパッ
タ法で形成し、比誘電率を測定。
(6) Relative permittivity; The coating liquid is applied to the surface of a silicon wafer by a spinner method and dried, and then 3
It is baked in a nitrogen stream for 0 minutes to form a film having a thickness of about 1 μm, and an aluminum film is formed on the surface of this film by a sputtering method, and the relative dielectric constant is measured.

【0064】塗布液のイオン濃度および上記評価結果を
表1に示す。なお、塗布液のイオン濃度は前記第3頁に
示す方法で測定した。
Table 1 shows the ion concentration of the coating liquid and the above evaluation results. The ion concentration of the coating solution was measured by the method shown on page 3 above.

【0065】[0065]

【実施例2】 −シリカゾルの調製− 純水203.0gとメタノール812.2gの混合溶液
にメチルシリケート−51(SiO2 濃度;51重量
%、多摩化学工業(株)社製)126.4gを加えた
後、この液を加熱して液の温度を45℃に保持しなが
ら、5%アンモニア水150gを5時間かけて添加し、
これにより液中にシリカ粒子を生成させた。添加終了後
の液をさらに同様の温度で1時間保持し、液中のシリカ
粒子を熟成させた。次いでこのシリカ粒子を含む液から
限外ろ過により液中に含まれている未反応のエチルシリ
ケート、メタノールおよびアンモニアを除去すると同時
に純水を加え、SiO2 濃度が5重量%であり、平均粒
径が110オングストロームのシリカ粒子が分散したシ
リカゾルBを得た。
Example 2 —Preparation of silica sol— 126.4 g of methyl silicate-51 (SiO 2 concentration; 51% by weight, manufactured by Tama Chemical Industry Co., Ltd.) was added to a mixed solution of 203.0 g of pure water and 812.2 g of methanol. After the addition, 150 g of 5% aqueous ammonia was added over 5 hours while heating the liquid to keep the temperature of the liquid at 45 ° C.
This produced silica particles in the liquid. The liquid after the addition was maintained at the same temperature for 1 hour to age the silica particles in the liquid. Then, the unreacted ethyl silicate, methanol and ammonia contained in the liquid are removed from the liquid containing the silica particles by ultrafiltration, and pure water is added at the same time, and the SiO 2 concentration is 5% by weight. To obtain a silica sol B in which silica particles having a particle size of 110 Å were dispersed.

【0066】−アルコキシシラン部分加水分解物の調製
− 196.1gのメチルシリケート−51、エタノール6
83.9gおよび純水120.0gの混合溶液に1%ア
ンモニア水を添加して、混合溶液のpHを8.0に調節
した。この混合溶液を50℃で1時間加熱してメチルシ
リケートの加水分解を行なった後、濃硝酸でpHを2.
5に調整し、さらに50℃で30分間加熱することによ
りアルコキシシラン部分加水分解物bを得た。
-Preparation of partial hydrolysis product of alkoxysilane- 196.1 g of methyl silicate-51, ethanol 6
1% ammonia water was added to a mixed solution of 83.9 g and pure water 120.0 g to adjust the pH of the mixed solution to 8.0. This mixed solution was heated at 50 ° C. for 1 hour to hydrolyze methyl silicate, and then the pH was adjusted to 2. with concentrated nitric acid.
It was adjusted to 5 and further heated at 50 ° C. for 30 minutes to obtain an alkoxysilane partial hydrolyzate b.

【0067】−塗布液の調製− 上記のようにして得られたシリカゾルBとアルコキシシ
ラン部分加水分解物bとを固形分重量比で1/1の割合
で混合した以外は、実施例1と同様にしてシリカゾルと
アルコキシシラン部分加水分解物との反応、得られた反
応物を含む液の脱イオン処理および溶媒置換を順次行な
い、SiO2 濃度が20重量%である塗布液を得た。
-Preparation of coating liquid-Same as in Example 1 except that the silica sol B thus obtained and the alkoxysilane partial hydrolyzate b were mixed in a solid content weight ratio of 1/1. Then, the reaction between the silica sol and the partial hydrolyzate of alkoxysilane, the deionization treatment of the solution containing the obtained reaction product and the solvent substitution were sequentially carried out to obtain a coating solution having a SiO 2 concentration of 20% by weight.

【0068】−被膜の評価− 上記のようにして得られた塗布液のイオン濃度を実施例
1と同様に測定し、さらに実施例1と同様にして被膜の
評価を行なった。
-Evaluation of Coating- The coating solution obtained as described above was measured for ionic concentration in the same manner as in Example 1, and the coating was evaluated in the same manner as in Example 1.

【0069】結果を表1に示す。The results are shown in Table 1.

【0070】[0070]

【実施例3】 −シリカゾルの調製− 実施例1で得られたシリカゾルAに実施例1の塗布液と
同様にして脱イオン処理を行ない、シリカゾルCを得
た。
Example 3 —Preparation of Silica Sol— Silica sol A obtained in Example 1 was subjected to deionization treatment in the same manner as in the coating liquid of Example 1 to obtain silica sol C.

【0071】−アルコキシシラン部分加水分解物の調製
− 実施例2で得られたアルコキシシラン部分加水分解物b
を含む液に実施例1の塗布液と同様にして脱イオン処理
を行ない、アルコキシシラン部分加水分解物cを得た。
-Preparation of Partial Hydrolyzate of Alkoxysilane-Partial Hydrolyzate of Alkoxysilane Obtained in Example 2
The solution containing the same was subjected to deionization treatment in the same manner as the coating solution of Example 1 to obtain an alkoxysilane partial hydrolyzate c.

【0072】−塗布液の調製− 上記のようにして得られたシリカゾルCとアルコキシシ
ラン部分加水分解物cとを固形分重量比で3/7の割合
で混合し、実施例1と同様の条件で反応させた。次い
で、この反応物を含む液に実施例1と同様の脱イオン処
理を行なった後、この液に含まれている水およびアルコ
ールを、ロータリーエバポレータで留去した後、乳酸エ
チルで置換し、SiO2 濃度が20重量%である塗布液
を得た。
-Preparation of coating liquid- The silica sol C thus obtained and the alkoxysilane partial hydrolyzate c were mixed at a solid content weight ratio of 3/7, and the same conditions as in Example 1 were applied. It was made to react with. Then, the liquid containing this reaction product was subjected to the same deionization treatment as in Example 1, the water and alcohol contained in this liquid were distilled off by a rotary evaporator, and then replaced with ethyl lactate to obtain SiO 2. 2 A coating solution having a concentration of 20% by weight was obtained.

【0073】−被膜の評価− 上記のようにして得られた塗布液のイオン濃度を実施例
1と同様に測定し、さらに実施例1と同様にして被膜の
評価を行なった。
-Evaluation of coating- The ion concentration of the coating liquid obtained as described above was measured in the same manner as in Example 1, and the coating was evaluated in the same manner as in Example 1.

【0074】結果を表1に示す。The results are shown in Table 1.

【0075】[0075]

【実施例4】 −シリカゾルの調製− 純水139.1gとメタノール169.9gの混合溶液
を60℃に加熱保持しながら、この混合溶液に、前記エ
チルシリケート−28の水/メタノール混合溶液(エチ
ルシリケート;532.5g、水/メタノール混合溶
媒;2450g、水/メタノールの重量比;1/4)2
982.5gと0.25%アンモニア水596.4gと
を同時に52時間かけて添加し、これにより混合溶液中
にシリカ粒子を生成させた。添加終了後の液をさらに同
様の温度で3時間保持し、液中のシリカ粒子を熟成させ
た。次いでこのシリカ粒子を含む液から限外ろ過により
液中に含まれている未反応のエチルシリケート、メタノ
ールおよびアンモニアを除去すると同時に純水を加え、
SiO2 濃度が10重量%であり、平均粒径が250オ
ングストロームのシリカ粒子が分散したシリカゾルDを
得た。
[Example 4] -Preparation of silica sol-While maintaining a mixed solution of 139.1 g of pure water and 169.9 g of methanol at 60 ° C while heating, a mixed solution of ethyl silicate-28 in water / methanol (ethyl) was added to the mixed solution. Silicate; 532.5 g, water / methanol mixed solvent; 2450 g, water / methanol weight ratio; 1/4) 2
982.5 g and 596.4 g of 0.25% aqueous ammonia were simultaneously added over 52 hours, thereby forming silica particles in the mixed solution. The liquid after the addition was maintained at the same temperature for 3 hours to age the silica particles in the liquid. Then, unreacted ethyl silicate, methanol and ammonia contained in the liquid are removed from the liquid containing the silica particles by ultrafiltration, and at the same time pure water is added,
A silica sol D having a SiO 2 concentration of 10% by weight and having silica particles having an average particle diameter of 250 Å dispersed therein was obtained.

【0076】−アルコキシシラン部分加水分解物の調製
− メチルトリメトキシシラン454.5g、エタノール1
85.5gおよび純水360.0gの混合溶液に濃硝酸
を添加して、混合溶液のpHを1.0に調節した。この
混合溶液を50℃で2時間加熱することによりアルコキ
シシランの部分加水分解を行ない、次いでこの液に1%
アンモニア水を添加してpHを7.0に調整した後、こ
の液を50℃で2時間加熱することによりアルコキシシ
ラン部分加水分解物dを得た。
-Preparation of partial hydrolyzate of alkoxysilane-454.5 g of methyltrimethoxysilane, ethanol 1
Concentrated nitric acid was added to a mixed solution of 85.5 g and pure water 360.0 g to adjust the pH of the mixed solution to 1.0. This mixed solution is heated at 50 ° C. for 2 hours to partially hydrolyze the alkoxysilane.
Aqueous ammonia was added to adjust the pH to 7.0, and this solution was heated at 50 ° C. for 2 hours to obtain an alkoxysilane partial hydrolyzate d.

【0077】−塗布液の調製− 上記のようにして得られたシリカゾルDとアルコキシシ
ラン部分加水分解物dとを固形分重量比で7/3の割合
で混合し、実施例3と同様にしてシリカゾルとアルコキ
シシラン部分加水分解物との反応、得られた反応物を含
む液の脱イオン処理および溶媒置換を順次行ない、Si
2 濃度が20重量%である塗布液を得た。
-Preparation of coating liquid- Silica sol D obtained as described above and alkoxysilane partial hydrolyzate d were mixed at a solid content weight ratio of 7/3, and the same as in Example 3. Reaction of silica sol with partial hydrolysis product of alkoxysilane, deionization treatment of the liquid containing the obtained reaction product, and solvent replacement are sequentially carried out, and Si
A coating solution having an O 2 concentration of 20% by weight was obtained.

【0078】−被膜の評価− 上記のようにして得られた塗布液のイオン濃度を実施例
1と同様に測定し、さらに実施例1と同様にして被膜の
評価を行なった。
-Evaluation of coating film- The ion concentration of the coating liquid obtained as described above was measured in the same manner as in Example 1, and the coating film was evaluated in the same manner as in Example 1.

【0079】結果を表1に示す。The results are shown in Table 1.

【0080】[0080]

【実施例5】 −シリカゾルの調製− エチルシリケト−28に代えてメチルトリメトキシシラ
ン169.4gとエチルシリケト−28 266.3g
を用いた以外は実施例4と同様にしてシリカゾルを調製
し、SiO2 濃度が10重量%であり、平均粒径が25
0オングストロームのシリカ粒子が分散したシリカゾル
Eを得た。
Example 5-Preparation of silica sol-In place of ethyl silicate-28, 169.4 g of methyltrimethoxysilane and 266.3 g of ethyl silicate-28 were used.
A silica sol was prepared in the same manner as in Example 4 except that the SiO 2 concentration was 10 wt% and the average particle size was 25.
Silica sol E having 0 angstrom silica particles dispersed therein was obtained.

【0081】−アルコキシシラン部分加水分解物の調製
− メチルトリメトキシシラン227.3g、エチルシリケ
ト−28 357.1g、エタノール175.0gおよ
び純水240.0gの混合溶液に1%アンモニア水を添
加して、混合溶液のpHを8.5に調節した。この混合
溶液を50℃で2時間加熱することによりアルコキシシ
ランの部分加水分解を行ない、次いでこの液に95%酢
酸水溶液を添加してpHを4に調整した後、この液を5
0℃で5時間加熱することによりアルコキシシラン部分
加水分解物eを得た。
-Preparation of partial hydrolyzate of alkoxysilane- 17.3% ammonia water was added to a mixed solution of 227.3 g of methyltrimethoxysilane, 357.1 g of ethyl silicate-28, 175.0 g of ethanol and 240.0 g of pure water. The pH of the mixed solution was adjusted to 8.5. The mixed solution is heated at 50 ° C. for 2 hours to partially hydrolyze the alkoxysilane, and then a 95% aqueous acetic acid solution is added to adjust the pH to 4 and then the solution is adjusted to 5
By heating at 0 ° C. for 5 hours, an alkoxysilane partial hydrolyzate e was obtained.

【0082】−塗布液の調製− 上記のようにして得られたシリカゾルEとアルコキシシ
ラン部分加水分解物eとを固形分重量比で4/1の割合
で混合した以外は実施例3と同様にしてシリカゾルとア
ルコキシシラン部分加水分解物との反応、得られた反応
物を含む液の脱イオン処理および溶媒置換を順次行な
い、SiO2 濃度が20重量%である塗布液を得た。
-Preparation of coating liquid-Same as in Example 3 except that the silica sol E thus obtained and the alkoxysilane partial hydrolyzate e were mixed at a solid content weight ratio of 4/1. The silica sol was partially reacted with the alkoxysilane partially hydrolyzed product, and the solution containing the obtained reaction product was sequentially subjected to deionization treatment and solvent substitution to obtain a coating liquid having a SiO 2 concentration of 20% by weight.

【0083】−被膜の評価− 上記のようにして得られた塗布液のイオン濃度を実施例
1と同様に測定し、さらに実施例1と同様にして被膜の
評価を行なった。
-Evaluation of coating film- The ion concentration of the coating liquid obtained as described above was measured in the same manner as in Example 1, and the coating film was evaluated in the same manner as in Example 1.

【0084】結果を表1に示す。The results are shown in Table 1.

【0085】[0085]

【比較例1〜4】塗布液の脱イオン処理を行なわない以
外はそれぞれ実施例1、2、4、5と同様にして塗布液
を調製し、得られた塗布液のイオン濃度を実施例1と同
様に測定し、さらに実施例1と同様にして被膜の評価を
行なった。
[Comparative Examples 1 to 4] A coating solution was prepared in the same manner as in Examples 1, 2, 4, and 5 except that the coating solution was not deionized, and the ion concentration of the resulting coating solution was determined in Example 1. The coating was evaluated in the same manner as in Example 1 and the same as in Example 1.

【0086】結果を表2に示す。The results are shown in Table 2.

【0087】[0087]

【表1】 [Table 1]

【0088】[0088]

【表2】 [Table 2]

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成4年3月25日[Submission date] March 25, 1992

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0064[Correction target item name] 0064

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0064】塗布液のイオン濃度および上記評価結果を
表1に示す。なお、塗布液のイオン濃度は前記第頁に
示す方法で測定した。
Table 1 shows the ion concentration of the coating liquid and the above evaluation results. The ion concentration of the coating liquid was measured by the method shown on page 4 .

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0065[Correction target item name] 0065

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0065】[0065]

【実施例2】 −シリカゾルの調製− 純水203.0gとメタノール812.2gの混合溶液
にメチルシリケート−51(SiO2 濃度;51重量
%、多摩化学工業(株)社製)121.6gを加えた
後、この液を加熱して液の温度を45℃に保持しなが
ら、5%アンモニア水150gを5時間かけて添加し、
これにより液中にシリカ粒子を生成させた。添加終了後
の液をさらに同様の温度で1時間保持し、液中のシリカ
粒子を熟成させた。次いでこのシリカ粒子を含む液から
限外ろ過により液中に含まれている未反応のエチルシリ
ケート、メタノールおよびアンモニアを除去すると同時
に純水を加え、SiO2 濃度が5重量%であり、平均粒
径が110オングストロームのシリカ粒子が分散したシ
リカゾルBを得た。
Example 2 —Preparation of silica sol— 121.6 g of methyl silicate-51 (SiO 2 concentration; 51 wt%, manufactured by Tama Chemical Industry Co., Ltd.) in a mixed solution of 203.0 g of pure water and 812.2 g of methanol. After that, 150 g of 5% aqueous ammonia was added over 5 hours while maintaining the temperature of the liquid at 45 ° C. by heating the liquid,
This produced silica particles in the liquid. The liquid after the addition was maintained at the same temperature for 1 hour to age the silica particles in the liquid. Then, the unreacted ethyl silicate, methanol and ammonia contained in the liquid are removed from the liquid containing the silica particles by ultrafiltration, and pure water is added at the same time, and the SiO 2 concentration is 5% by weight. To obtain a silica sol B in which silica particles having a particle size of 110 Å were dispersed.

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0080[Correction target item name] 0080

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0080】[0080]

【実施例5】 −シリカゾルの調製− エチルシリケト−28に代えてメチルトリメトキシシ
ラン169.4gとエチルシリケト−28 266.
3gを用いた以外は実施例4と同様にしてシリカゾルを
調製し、SiO2 濃度が10重量%であり、平均粒径が
250オングストロームのシリカ粒子が分散したシリカ
ゾルEを得た。
Example 5 - Preparation of silica sol - Echirushirike over preparative -28 methyltrimethoxysilane 169.4g and Echirushirike over preparative -28 instead of 266.
A silica sol was prepared in the same manner as in Example 4 except that 3 g was used to obtain silica sol E in which silica particles having a SiO 2 concentration of 10% by weight and an average particle diameter of 250 Å were dispersed.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0081[Name of item to be corrected] 0081

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0081】−アルコキシシラン部分加水分解物の調製
− メチルトリメトキシシラン227.3g、エチルシリケ
ト−28 357.1g、エタノール175.0gお
よび純水240.0gの混合溶液に1%アンモニア水を
添加して、混合溶液のpHを8.5に調節した。この混
合溶液を50℃で2時間加熱することによりアルコキシ
シランの部分加水分解を行ない、次いでこの液に95%
酢酸水溶液を添加してpHを4に調整した後、この液を
50℃で5時間加熱することによりアルコキシシラン部
分加水分解物eを得た。
-Preparation of partial hydrolyzate of alkoxysilane- 227.3 g of methyltrimethoxysilane, ethylsilike
A 28% 357.1 g of ethanol, 175.0 g of ethanol, and 240.0 g of pure water were added to 1% aqueous ammonia to adjust the pH of the mixed solution to 8.5. The mixed solution is heated at 50 ° C. for 2 hours to partially hydrolyze the alkoxysilane.
An aqueous acetic acid solution was added to adjust the pH to 4, and this solution was heated at 50 ° C. for 5 hours to obtain an alkoxysilane partial hydrolyzate e.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 一般式Rn Si(OR’)4-n (式中、
R、R’は炭素数1〜8のアルキル基、アリール基また
はビニル基を表わし、nは0〜3の整数である。)で示
されるアルコキシシランを加水分解重縮合して得られる
シリカゾル(A)と、 前記アルコキシシランまたはその部分加水分解物(B)
との反応物を含む被膜形成用塗布液であって、 該塗布液中のイオン濃度が1.0ミリモル/リットル以
下であることを特徴とする被膜形成用塗布液。
1. The general formula R n Si (OR ′) 4-n (wherein
R and R'represent an alkyl group having 1 to 8 carbon atoms, an aryl group or a vinyl group, and n is an integer of 0 to 3. ) A silica sol (A) obtained by hydrolytic polycondensation of an alkoxysilane represented by the formula (1), and the alkoxysilane or a partial hydrolyzate thereof (B).
A coating solution for forming a coating film containing a reaction product with the coating liquid, wherein the coating solution has an ion concentration of 1.0 mmol / liter or less.
【請求項2】 被膜形成用塗布液の製造過程で、少なく
とも前記シリカゾル(A)、前記アルコキシシランまた
はその部分加水分解物(B)を含む液および被膜形成用
塗布液のいずれかに、陽イオン交換樹脂による処理と陰
イオン交換樹脂による処理とを行なって、得られた被膜
形成用塗布液中のイオン濃度を1.0ミリモル/リット
ル以下とすることを特徴とする請求項1記載の被膜形成
用塗布液の製造方法。
2. A cation is added to any of a liquid containing at least the silica sol (A), the alkoxysilane or a partial hydrolyzate thereof (B) and a coating liquid for forming a film in the process of producing the coating liquid for forming a film. The film formation according to claim 1, wherein the treatment with the exchange resin and the treatment with the anion exchange resin are carried out to adjust the ion concentration in the obtained coating liquid for film formation to 1.0 mmol / liter or less. For producing coating liquid for use in cosmetics.
JP06005792A 1992-03-17 1992-03-17 Coating liquid for film formation and method for producing the same Expired - Lifetime JP3320440B2 (en)

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JPH05263045A true JPH05263045A (en) 1993-10-12
JP3320440B2 JP3320440B2 (en) 2002-09-03

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US5905117A (en) * 1995-09-21 1999-05-18 Asahi Glass Company Ltd. Low dielectric resin composition
WO2000012640A1 (en) * 1998-09-01 2000-03-09 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
WO2000018847A1 (en) * 1998-09-25 2000-04-06 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
US6083314A (en) * 1997-08-07 2000-07-04 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming porous silica coating, coated substrate and short fiber silica
JP2002020688A (en) * 2000-07-06 2002-01-23 Jsr Corp Process for producing film forming composition film forming composition, film forming process and silica film
US6376634B1 (en) * 1999-06-04 2002-04-23 Jsr Corporation Composition for film formation and material for insulating film formation
US6413647B1 (en) * 2000-02-28 2002-07-02 Jsr Corporation Composition for film formation, method of film formation, and silica-based film
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US7528207B2 (en) 2004-01-16 2009-05-05 Jsr Corporation Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
US7736748B2 (en) 2004-05-11 2010-06-15 Jsr Corporation Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same
WO2010150861A1 (en) * 2009-06-24 2010-12-29 旭化成イーマテリアルズ株式会社 Product of polysiloxane condensation
US7875317B2 (en) 2004-01-16 2011-01-25 Jsr Corporation Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming same
JP2011026570A (en) * 2009-06-24 2011-02-10 Asahi Kasei E-Materials Corp Polysiloxane condensation reaction product
JP2012136563A (en) * 2010-12-24 2012-07-19 Asahi Kasei E-Materials Corp Method for producing polysiloxane condensation reaction product varnish
US8268403B2 (en) 2004-05-11 2012-09-18 Jsr Corporation Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
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WO1991016999A1 (en) * 1990-04-30 1991-11-14 E.I. Du Pont De Nemours And Company Process for improving adhesion of polysiloxane coatings to polymeric substrates and products prepared thereby
JPH03263476A (en) * 1990-03-13 1991-11-22 Catalysts & Chem Ind Co Ltd Coating dope for coating film formation
JPH05163464A (en) * 1991-12-12 1993-06-29 Catalysts & Chem Ind Co Ltd Coating liquid for forming film, its production and substrate with film

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JPH03263476A (en) * 1990-03-13 1991-11-22 Catalysts & Chem Ind Co Ltd Coating dope for coating film formation
WO1991016999A1 (en) * 1990-04-30 1991-11-14 E.I. Du Pont De Nemours And Company Process for improving adhesion of polysiloxane coatings to polymeric substrates and products prepared thereby
JPH05507512A (en) * 1990-04-30 1993-10-28 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー Method for improving the adhesion of polysiloxane coatings to polymeric substrates and products made thereby
US5035745A (en) * 1990-06-29 1991-07-30 Ppg Industries, Inc. Ion-exchanged abrasion resistant coatings
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Publication number Priority date Publication date Assignee Title
US5905117A (en) * 1995-09-21 1999-05-18 Asahi Glass Company Ltd. Low dielectric resin composition
US6083314A (en) * 1997-08-07 2000-07-04 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming porous silica coating, coated substrate and short fiber silica
KR100549715B1 (en) * 1997-08-07 2006-12-27 쇼쿠바이가세고교 가부시키가이샤 Coating solution for forming porous silica film, coated substrate and short fiber silica
US6455154B1 (en) 1997-08-07 2002-09-24 Catallysts & Chemicals Industries Co., Ltd. Production of short fiber silica
WO2000012640A1 (en) * 1998-09-01 2000-03-09 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
US6451436B1 (en) 1998-09-25 2002-09-17 Catalysts & Chemicals Industries Co., Ltd. Coating liquid for forming a silica-containing film with a low-dielectric constant and substrate coated with such a film
WO2000018847A1 (en) * 1998-09-25 2000-04-06 Catalysts & Chemicals Industries Co., Ltd. Coating fluid for forming low-permittivity silica-based coating film and substrate with low-permittivity coating film
US6376634B1 (en) * 1999-06-04 2002-04-23 Jsr Corporation Composition for film formation and material for insulating film formation
US6413647B1 (en) * 2000-02-28 2002-07-02 Jsr Corporation Composition for film formation, method of film formation, and silica-based film
JP2002020688A (en) * 2000-07-06 2002-01-23 Jsr Corp Process for producing film forming composition film forming composition, film forming process and silica film
US7875317B2 (en) 2004-01-16 2011-01-25 Jsr Corporation Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming same
US7528207B2 (en) 2004-01-16 2009-05-05 Jsr Corporation Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating film
US7736748B2 (en) 2004-05-11 2010-06-15 Jsr Corporation Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the same
US8268403B2 (en) 2004-05-11 2012-09-18 Jsr Corporation Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
JP2006073889A (en) * 2004-09-03 2006-03-16 Jsr Corp Composition for forming insulating film, insulating film and method of forming it
WO2010150861A1 (en) * 2009-06-24 2010-12-29 旭化成イーマテリアルズ株式会社 Product of polysiloxane condensation
JP2011026570A (en) * 2009-06-24 2011-02-10 Asahi Kasei E-Materials Corp Polysiloxane condensation reaction product
US8906153B2 (en) 2009-06-24 2014-12-09 Asahi Kasei E-Materials Corporation Product of polysiloxane condensation
JP2012136563A (en) * 2010-12-24 2012-07-19 Asahi Kasei E-Materials Corp Method for producing polysiloxane condensation reaction product varnish
JP2012251204A (en) * 2011-06-02 2012-12-20 Hitachi Chemical Co Ltd Surface treatment agent for silver and silver alloy, substrate coated with light-reflective film, and light-emitting device
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JP2015191090A (en) * 2014-03-28 2015-11-02 三菱マテリアル株式会社 Film formation liquid composition

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