JPH0525660A - Etching device - Google Patents

Etching device

Info

Publication number
JPH0525660A
JPH0525660A JP20459391A JP20459391A JPH0525660A JP H0525660 A JPH0525660 A JP H0525660A JP 20459391 A JP20459391 A JP 20459391A JP 20459391 A JP20459391 A JP 20459391A JP H0525660 A JPH0525660 A JP H0525660A
Authority
JP
Japan
Prior art keywords
etching
solns
liquid
tanks
valves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20459391A
Other languages
Japanese (ja)
Inventor
Hiroshi Watanabe
宏 渡辺
Katsushi Danjiyou
桂志 檀上
Mayumi Akena
真弓 安慶名
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP20459391A priority Critical patent/JPH0525660A/en
Publication of JPH0525660A publication Critical patent/JPH0525660A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • ing And Chemical Polishing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To allow >=2 kinds of etching treatments with the same device by providing plural etching cells in one unit of the etching device, adapting the circulating systems of etching solns. to respective soln. tanks and commonly disposing a liquid spraying part. CONSTITUTION:The plural etching soln. tanks 3 are provided within the same etching device and the respectively different etching solns. 1, 2 are housed therein. The spraying part 11 and liquid recovering tank 12 of the etching solns. 1, 2 are commonly provided. The circulating systems (pump 4, valves 5, 6, valves 7, 8) of the above-mentioned etching solns. 1, 2 are provided with each of the soln. tanks 3 of the etching solns. 1, 2. The washing of the common pipes 18, 19, the spraying device 11 and the recovering tank 12 is executed by the washing water supplied from a pure water line 16 for washing at the time of switching of the above-mentioned etching solns. 1, 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、エッチング装置に関
し、特に画像表示等に用いられる液晶パネルの製造にお
いてエッチング液を用いガラス基板上に微細電極を形成
するために使用して好適なエッチング装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching apparatus, and more particularly to an etching apparatus suitable for use in forming a fine electrode on a glass substrate by using an etching solution in the production of a liquid crystal panel used for image display or the like. It is a thing.

【0002】[0002]

【従来の技術】従来の液晶パネル製造のフォトリソライ
ンにおけるエッチング装置は、1つのエッチング装置ご
とに設けられるエッチング液槽は1つであった。このた
め、2種類以上のエッチングを行なう場合はエッチング
液の総入れ替えをするか、または別のエッチング装置を
導入することにより対応していた。
2. Description of the Related Art In a conventional photolithography line for manufacturing a liquid crystal panel, one etching liquid tank is provided for each etching device. For this reason, when two or more types of etching are performed, it is necessary to replace the total etching solution or to introduce another etching apparatus.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、2種類
以上のエッチングを行なう場合、上記従来例のように、
エッチングの種類が変わるたびにエッチング液の総入れ
替えを行なっていたのでは時間的なロスは多大なものが
あり、またエッチング液の無駄使いも大きい。
However, when two or more types of etching are performed, as in the conventional example described above,
If the etching solution is totally replaced every time the type of etching is changed, the time loss is enormous and the etching solution is wasted.

【0004】また、別のエッチング装置を新たに設置す
ることについても、設置スペースの確保やその設備投資
の額の大きさ等の問題が発生してくる。
Further, when another etching apparatus is newly installed, there are problems such as securing an installation space and the amount of equipment investment.

【0005】本発明は、上記従来装置の問題点を解決す
るためになされたもので、同一エッチング装置でエッチ
ング液を総入れ替えをすることなしに同一エッチング装
置で2種類以上のエッチングを実施することが可能なエ
ッチング装置を提供することを目的とする。
The present invention has been made in order to solve the problems of the above-mentioned conventional apparatus, and it is possible to perform two or more kinds of etching in the same etching apparatus without totally replacing the etching solution in the same etching apparatus. It is an object of the present invention to provide an etching apparatus capable of performing the above.

【0006】[0006]

【課題を解決するための手段】上記の目的を解決するた
め、本発明においては同一エッチング装置内に2つ以上
のエッチング液槽を設けるとともに、エッチング液の散
布部分は共通とし、かつそのエッチング液の循環系統を
それぞれのエッチング液槽に対応させることができるよ
うにした。
In order to solve the above-mentioned object, in the present invention, two or more etching solution tanks are provided in the same etching apparatus, and the etching solution is sprayed in common, and the etching solution is the same. The circulation system of was able to correspond to each etching solution tank.

【0007】[0007]

【作用】上記構成によれば、第1の種類のエッチングを
実施する際には第1のエッチング液槽および循環系を用
い、第2の種類のエッチングへの切り換えはエッチング
液槽および循環系を切り換えることにより行なう。した
がって、切り換え時の洗浄は必要となる場合があるとし
ても、エッチング液の総入れ替えは不要であり、エッチ
ング液切り換えに要する時間および労力ならびにエッチ
ング液の無駄使いを大幅に軽減することができる。ま
た、エッチング液散布部分を共通にしたため、エッチン
グの種類に対応する数のエッチング装置を設置する場合
に比べて、設置スペースやその設備投資の額の節減効果
も大きい。
According to the above construction, when the first type of etching is carried out, the first etching solution tank and the circulation system are used, and when switching to the second type etching, the etching solution tank and the circulation system are used. This is done by switching. Therefore, even if cleaning may be required at the time of switching, it is not necessary to totally replace the etching liquid, and the time and labor required for switching the etching liquid and waste of the etching liquid can be greatly reduced. Further, since the etching liquid is sprayed in common, the effect of reducing the installation space and the amount of capital investment is large compared to the case where the number of etching apparatuses corresponding to the type of etching is installed.

【0008】[0008]

【実施例】以下、図面を用いて本発明の実施例を説明す
る。図1は、本発明の一実施例に係るエッチング装置の
構成を示す。ここでは実施例として、エッチング液槽を
2つ備えた装置について説明する。図1において、1,
2はエッチング液、3は液槽、4はポンプ、5〜10は
バルブ、11は散布器、12は液回収槽を表わす。13
はエッチング対象の基板、15は基板搬送ライン、16
は洗浄用純水ライン、17は廃水・廃液ラインである。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the configuration of an etching apparatus according to an embodiment of the present invention. Here, as an example, an apparatus provided with two etching solution tanks will be described. In FIG. 1, 1,
2 is an etching liquid, 3 is a liquid tank, 4 is a pump, 5 to 10 are valves, 11 is a sprayer, and 12 is a liquid recovery tank. Thirteen
Is a substrate to be etched, 15 is a substrate transfer line, 16
Is a pure water line for cleaning, and 17 is a wastewater / waste liquid line.

【0009】この構成においてエッチング液1を使用す
る場合は、バルブ5,6を開け、他のバルブ7〜10を
閉じることによりエッチング液1側の系統のみの装置と
なりエッチング液1のみのエッチングができる。同様に
エッチング液2でエッチングしたい場合はバルブ7,8
を開け、他のバルブ5,6および9,10を閉じること
により実施できる。また、エッチング液の切り替え時に
共通パイプ18,19、散布器11および回収槽12の
洗浄を行なう場合は、バルブ9,10を開け、他のバル
ブ5〜8を閉じることにより実施できる。
When the etching solution 1 is used in this configuration, the valves 5 and 6 are opened and the other valves 7 to 10 are closed, so that only the etching solution 1 side device can be etched and only the etching solution 1 can be etched. .. Similarly, valves 7 and 8 can be used to etch with the etchant 2.
It can be carried out by opening and closing the other valves 5, 6 and 9, 10. Further, when the common pipes 18 and 19, the sprayer 11 and the recovery tank 12 are cleaned at the time of switching the etching liquid, the valves 9 and 10 can be opened and the other valves 5 to 8 can be closed.

【0010】[0010]

【実施例の変形例】図1においてはエッチング液槽が2
つの場合を上げたが3つ以上の場合も同様にエッチング
液の循環系統を個別に設定できるようにすれば同じ効果
を上げられる。
[Modification of the Embodiment] In FIG.
Although the three cases have been described, the same effect can be obtained also in the case of three or more cases by similarly setting the circulation systems of the etching solution individually.

【0011】[0011]

【発明の効果】以上説明したように、本発明によれば、
1台のエッチング装置に2つ以上のエッチング液槽を設
けるとともに、エッチング液の散布部分を共通とし、か
つそのエッチング液の循環系統をそれぞれの液槽に対応
させることにより、同一エッチング装置で、エッチング
液の交換なしに2種類以上のエッチングが可能となる。
このように、エッチングの対象(種類)が変わるたびに
エッチング液を総入れ替えする必要がなくなったことに
より、大幅な効率アップの効果と、別のエッチング装置
を設置するというスペース的な無駄の排除と多大な設備
投資を押さえられるというコストダウン効果が実現され
る。
As described above, according to the present invention,
By providing two or more etching solution tanks in one etching apparatus, sharing the etching solution spray section, and making the etching solution circulation system correspond to each solution tank, the same etching apparatus can be used for etching. Two or more types of etching are possible without changing the liquid.
In this way, since it is not necessary to replace the etching liquid all over every time the etching target (type) is changed, it is possible to greatly improve the efficiency and eliminate the space waste of installing another etching device. A cost reduction effect is realized in which a large amount of capital investment can be suppressed.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の一実施例に係るエッチング装置の構
成を示す概略側面図である。
FIG. 1 is a schematic side view showing the configuration of an etching apparatus according to an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1,2:エッチング液、3:液槽、4:ポンプ、5〜1
0:バルブ、11:散布器、12:液回収槽。
1, 2: Etching solution, 3: Liquid tank, 4: Pump, 5-1
0: valve, 11: sprinkler, 12: liquid recovery tank.

Claims (1)

【特許請求の範囲】 【請求項1】 同一エッチング装置内において2つ以上
のエッチング液槽を設けるとともに、エッチング液の散
布部分は共通とし、かつエッチング液の循環系統をそれ
ぞれの液槽ごとに設けたことを特徴とするエッチング装
置。
Claim: What is claimed is: 1. Two or more etching solution tanks are provided in the same etching apparatus, and the etching solution is sprayed in common, and an etching solution circulation system is provided for each solution tank. An etching apparatus characterized in that
JP20459391A 1991-07-22 1991-07-22 Etching device Pending JPH0525660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20459391A JPH0525660A (en) 1991-07-22 1991-07-22 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20459391A JPH0525660A (en) 1991-07-22 1991-07-22 Etching device

Publications (1)

Publication Number Publication Date
JPH0525660A true JPH0525660A (en) 1993-02-02

Family

ID=16493041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20459391A Pending JPH0525660A (en) 1991-07-22 1991-07-22 Etching device

Country Status (1)

Country Link
JP (1) JPH0525660A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904863A (en) * 1997-04-30 1999-05-18 Coates Asi, Inc. Process for etching trace side walls
JP2004018867A (en) * 2002-06-12 2004-01-22 Nissan Motor Co Ltd Pretreatment apparatus to coating and pretreatment method to coating
US8791026B2 (en) 2010-10-01 2014-07-29 Mmtech Co., Ltd. Method and apparatus for treating silicon substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904863A (en) * 1997-04-30 1999-05-18 Coates Asi, Inc. Process for etching trace side walls
JP2004018867A (en) * 2002-06-12 2004-01-22 Nissan Motor Co Ltd Pretreatment apparatus to coating and pretreatment method to coating
US8791026B2 (en) 2010-10-01 2014-07-29 Mmtech Co., Ltd. Method and apparatus for treating silicon substrate

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