JPH0525239Y2 - - Google Patents

Info

Publication number
JPH0525239Y2
JPH0525239Y2 JP1987028049U JP2804987U JPH0525239Y2 JP H0525239 Y2 JPH0525239 Y2 JP H0525239Y2 JP 1987028049 U JP1987028049 U JP 1987028049U JP 2804987 U JP2804987 U JP 2804987U JP H0525239 Y2 JPH0525239 Y2 JP H0525239Y2
Authority
JP
Japan
Prior art keywords
motor
slider
horn
capillary
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987028049U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63136334U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987028049U priority Critical patent/JPH0525239Y2/ja
Publication of JPS63136334U publication Critical patent/JPS63136334U/ja
Application granted granted Critical
Publication of JPH0525239Y2 publication Critical patent/JPH0525239Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1987028049U 1987-02-28 1987-02-28 Expired - Lifetime JPH0525239Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987028049U JPH0525239Y2 (enrdf_load_stackoverflow) 1987-02-28 1987-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987028049U JPH0525239Y2 (enrdf_load_stackoverflow) 1987-02-28 1987-02-28

Publications (2)

Publication Number Publication Date
JPS63136334U JPS63136334U (enrdf_load_stackoverflow) 1988-09-07
JPH0525239Y2 true JPH0525239Y2 (enrdf_load_stackoverflow) 1993-06-25

Family

ID=30830650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987028049U Expired - Lifetime JPH0525239Y2 (enrdf_load_stackoverflow) 1987-02-28 1987-02-28

Country Status (1)

Country Link
JP (1) JPH0525239Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230838Y2 (enrdf_load_stackoverflow) * 1985-01-25 1990-08-20

Also Published As

Publication number Publication date
JPS63136334U (enrdf_load_stackoverflow) 1988-09-07

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