JPH05244771A - Semiconductor power conversion unit - Google Patents

Abstract

PURPOSE:To obtain a semiconductor power conversion unit which can prevent malfunctions and declines in service lives of housed components by forming a partition between a cooling chamber and sealed chamber of a partition duct through which part of cooling air flows. CONSTITUTION:A partition duct 4 which divides the right side of the housing 1 of the title unit into an upper and lower sections is formed of a pair of plates between the partition 1d and end plate 1c of the housing 1. When an air blower 5 is started, the outside air for cooling is taken into the housing 1 from the outside through an air filter fitted to the left-end inside of the housing 1 and most of the air is sent into a cooling chamber 3 from an opening 1j. The cooling air is discharged from the end plate 1C at the right end of the housing 1 after cooling a heat radiating section 7A, reactor 12, heat radiating sections 7B and 7C, and snubber resistor 8. On the other hand, part of the cooling air discharged by means of the air blower 5 is sent into the duct 4 from its left end and discharged from the end plate 1C at the right end of the housing 1 after flowing rightward through the duct 4. Therefore, malfunctions caused by overheating and a decline in service life of housed components can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor power conversion unit in which, for example, main circuit parts of a variable voltage variable frequency power supply device are housed.

[0002]

2. Description of the Related Art FIG. 4 is a longitudinal sectional view showing a conventional forced air cooling type semiconductor power conversion unit attached to the lower portion of a vehicle body of a railway vehicle. In FIG. 4, a partition 1d for vertically partitioning the box body 31 is provided vertically to the left of the middle part of the box body 31 whose outer periphery is formed of a mild steel plate, and an opening is formed between the middle and the upper end of the partition 1d. The portion 1j is formed. A perforated iron plate 1b is detachably attached to the left end of the box body 31, and an air filter (not shown) incorporating a stainless steel filter medium is detachably attached to the inner surface of the perforated iron plate 1b. There is. A blower 5 is housed between the perforated iron plate 1b and the partition 1d and is fixed to the left side surface of the opening 1j.

An end plate 1c is provided at the right end of the box body 31,
A mesh plate (not shown) is attached between the middle part and the upper end of the end plate 1c. Central part of partition 1d and end plate 1c
An intermediate plate 1e, which divides the right side of the box body 31 into upper and lower parts and divides it into an upper cooling chamber 3 and a lower closed chamber 2, is attached to an intermediate part of the intermediate plate 1e. 6a, a hole 6b is provided in the center, and a hole 6c is provided on the right side of the hole 6b. An opening is formed in the upper part of the box 31 from the partition 1d to the right end, and a ceiling plate 1h is detachably attached to the opening with a bolt (not shown).

A plurality of snubber capacitors 9A are housed at the left end of the lower closed chamber 2 and the snubber capacitors 9A
The lower end surface of the heat radiating portion 7A of the heat pipe is on the right side of the hole 6
In the heat receiving part at the lower end of the heat pipe fixed to the upper surface of a,
The semiconductor stack 6A is fixed. Gate amplifiers 10A and 10B and a plurality of snubber capacitors 9B are sequentially housed on the right side of the semiconductor stack 6A, and the reactor 12 and the heat radiating sections 7B and 7 of the heat pipe are located on the right side of the heat radiating section 7A.
C and a plurality of snubber resistors 8 are housed in order on the upper surface of the intermediate plate 1e. Among these, the lower part of the heat pipe of the heat dissipation part 7B penetrates the hole 6b downward, and the semiconductor stack 6B is fixed to the heat receiving part at the lower end of this heat pipe.
Similarly, the lower portion of the heat pipe of the heat radiating portion 7C penetrates the hole 6c downward, and the semiconductor stack 6C is fixed to the heat receiving portion at the lower end of the heat pipe. A plurality of snubber capacitors 9C are housed below the semiconductor stack 6C, and a small gate amplifier 10C and a power supply unit 11 are housed in order on the right side of the snubber capacitors 9C.

In the semiconductor power conversion unit configured as described above, when the blower 5 is started, the outside air for cooling is drawn in from the left end of the box body 31 as indicated by arrow E, and the opening 1j is indicated by arrow F. As shown, it is fed into the cooling chamber 3. Then, this cooling air is transferred to the heat radiating portions 7A and 7A.
B, 7C, the reactor 12 and the snubber resistor 8 are cooled and discharged from the end plate 1c at the right end of the box body 31 to the outside as shown by an arrow G. As a result, the semiconductor stacks 6A, 6B, and 6C housed in the closed chamber 2 have their respective heat radiating portions 7A, 7B, and
It is cooled by a heat pipe that transfers heat to 7C.

[0006]

However, in the semiconductor power conversion unit configured as described above, the snubber capacitors 9A, 9B, 9C and the gate amplifier among the components housed in the lower closed chamber 2 are included. 10A, 10B, 10
The C and the power supply unit 11 are not not only cooled by the cooling air but also warmed by the heat transfer from the cooling chamber 3 through the inner air heated by the semiconductor stacks 6A, 6B, 6C which are heat generating parts and the intermediate plate 1e. Temperature rises, gate amplifier 10A,
10B, 10C malfunctions, snubber capacitors 9A, 9
The life of B and 9C may be impaired. Then, the objective of this invention is to obtain the semiconductor power conversion unit which can prevent the malfunction of a unit and the shortening of the life of a storage component.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided a semiconductor power supply in which a cooling chamber and a hermetically sealed chamber through which cooling air is forced to flow are partitioned by a partition wall, a heat radiating portion is housed in the cooling chamber, and electric parts are housed in the hermetically sealed chamber. In the conversion unit, the partition wall is a partition duct through which a part of the cooling air flows.

[0008]

In the sealed chamber, heat transfer from the cooling chamber is blocked by the partition duct, and is cooled by the cooling air flowing through the partition duct.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor power conversion unit of the present invention will be described below with reference to the drawings. However, the same parts as those in FIG. FIG. 1 is a longitudinal sectional view showing a semiconductor power conversion unit of the present invention, which is a view corresponding to FIG.

In FIG. 1, between the partition 1d of the box 1 and the end plate 1c, a partition duct 4 for partitioning the right side of the box 1 into upper and lower parts is formed by a pair of plates. This partition duct 4
The net-like short pipes 4a, 4b and 4c are welded to the lower portions of the heat pipes of the heat radiating portions 7A, 7B and 7C, respectively. In the inside of the upper and lower cooling chambers 3 and the hermetically sealed chamber 2, as in the conventional case, in addition to the heat dissipation portions 7A, 7B, 7C, semiconductor stacks 6A, 6B, 6C; snubber resistors 8, snubber capacitors 9A, 9B, 9C; Gate amplifier 10A, 10B,
10C, the power supply unit 11, and the reactor 12 are stored respectively.

In the semiconductor power conversion unit configured as described above, when the blower 5 is started, the outside air for cooling is attached to the inside of the left end of the box 1 as shown by the arrow A, as in the conventional case. The air is sucked in through an air filter (not shown), and most of the air is sent into the cooling chamber 3 through the opening 1j as shown by an arrow B1. Then, this cooling air is radiated by the heat radiation portion 7A, the reactor 12, and the heat radiation portion 7
B and 7C and the snubber resistor 8 are cooled, and as shown by arrow C, discharged from the end plate 1c at the right end of the box body 1.

On the other hand, a part of the cooling air discharged by the blower 5 is sent inside from the left end of the partition duct 4 as shown by arrow B2, and as shown by arrows D1, D2, D4. Flows through the inside to the right, and is discharged to the outside from the end plate 1c at the right end of the box 1. In addition, the air heated inside the closed chamber 2 and rising inside the closed chamber 2 is separated by the partition duct 4
Is cooled by the bottom plate of the partition duct 4 cooled by the cooling air flowing through the inside of the.

Therefore, in the semiconductor power conversion unit thus constructed, the closed chamber 2 is insulated from the cooling chamber 3 by the partition duct 4, and the partition duct 4 is cooled by a part of the cooling air. Since the components housed in the chamber 2 are cooled, it is possible to prevent the malfunction of the gate amplifiers 10A, 10B, 10C due to overheating and the shortening of the life of the snubber capacitors 9A, 9B, 9C as in the conventional case.

Next, FIG. 2 is an enlarged vertical cross-sectional view showing another embodiment of the semiconductor power conversion unit of the present invention.
A vertical section at the position of the X-ray is shown. In FIG. 2, the box body 21
Inside, a substantially U-shaped hollow partition duct 24 forms an intermediate upper cooling chamber 33, and closed chambers 22 are formed on the left and right sides and the lower portion of this cooling chamber 33. In this case, the components in the sealed chamber 22 can be cooled as in the case of FIG. 1, and the sealed chamber 22 is widened, so that the storage components can be easily arranged.

FIG. 3 is a partial vertical sectional view showing another embodiment of the semiconductor power conversion unit of the present invention. For example, a heat radiating portion of a heat pipe is provided at the upper end of the snubber capacitor 9A, and this heat radiating portion is provided. An example in which the partition duct 4 projects inside is shown. At this time, among the parts of the closed chamber 2,
Particularly, by preventing the temperature rise of the parts close to the allowable rise limit and the parts with a large temperature rise value (for example, the gate amplifiers 10A, 10B, 10C and the power supply unit 11), it is possible to prevent the characteristic of the unit and the life of the parts from being shortened. You can

[0016]

As described above, according to the present invention, in the semiconductor power conversion unit in which the cooling chamber and the closed chamber through which the cooling air is forced to flow are partitioned by the partition wall, and the cooling chamber and the sealed chamber contain the electric components, the partition wall is formed. By providing a partition duct through which a part of the cooling air flows, the closed chamber is insulated from the cooling chamber, and the partition duct is cooled to cool the closed chamber to prevent overheating of electrical parts. It is possible to obtain a semiconductor power conversion unit capable of preventing a decrease in the life of the semiconductor power conversion unit.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of a semiconductor power conversion unit of the present invention.

FIG. 2 is a partial vertical sectional view showing another embodiment of the semiconductor power conversion unit of the present invention.

FIG. 3 is a partial vertical cross-sectional view showing another embodiment of the semiconductor power conversion unit of the present invention.

FIG. 4 is a vertical cross-sectional view showing an example of a conventional semiconductor power conversion unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Box body, 2 ... Sealing chamber, 3 ... Cooling chamber, 4 ... Partition duct, 5 ... Blower, 6A, 6B, 6C ... Semiconductor stack,
7A, 7B, 7C ... Heat dissipation part, H1, H2, H3 ... Communication port.

Claims (1)

[Claims] 1. A semiconductor power conversion unit in which a cooling chamber and a hermetically sealed chamber through which cooling air is forced to flow are partitioned by a partition wall, a heat radiating section is housed in the cooling chamber, and electric parts are housed in the hermetically sealed chamber. Is a partition duct through which a part of the cooling air flows, and a semiconductor power conversion unit.