JP2006261215A - Heat dissipation structure of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain sufficient heat dissipation by making the flow of cooling direct in the juxtaposition direction of a plurality of solid-state relays. <P>SOLUTION: A plurality of heat dissipation plates 15 are arranged in a shape of a shelf in a radiator 2, and passages 16 of the cooling air are formed between the top surface 14A of the radiator 2 and the topmost heat sinks 15, between the up-and-down heat sinks 15, and between the lowermost heat sink 15 and the lower surface 14B of the radiator 2 in the passage 16 of the cooling air. These passages 16 are mutually parallel, natural air cooling from the juxtaposition (longitudinal direction) of the solid-state relay 1 is turned to the longitudinal direction so that the forced air-cooling can be carried out, and a plurality of the solid-state relays 1 are equipped with the dissipator 2, respectively. These radiators 2 are arranged horizontally in a blast way F and is composed of each passages 16, the cooling air I is sent to the blast way F, and the air warmed by heat dissipation from the radiator 2 is discharged to the open air from the longitudinal direction with respect to the solid-state relay 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat dissipation structure for an electronic device in which a semiconductor power element is accommodated in a case and a heat generating structure such as a solid state relay or an inverter is used for arranging a plurality of power elements in parallel.

  In general, this type of electronic device, for example, a solid state relay (SSR), mainly includes a photocoupler and a semiconductor switch, and is used for load on / off control. Its characteristics are that the input and output are electrically separated by a photocoupler, so it is resistant to noise, quiet because it has no moving parts and no wear, and is highly reliable, has a long life, and has a high frequency. While it has various advantages such as being able to be opened and closed, since it is made of a semiconductor, the power consumption corresponding to the ON resistance of the relay contact is large, and heat is generated considerably. For this reason, heat radiation is required.

  9 to 12 show a heat dissipation structure for radiating heat of a solid state relay as such an electronic device. This heat dissipation structure is incorporated in the control panel 40 together with the solid state relay 41. This heat radiating structure includes a plurality of heat radiators 42. These heat radiators 42 include a relay mounting side surface portion 43 and a DIN rail mounting side surface portion 44 parallel to the relay mounting side surface portion 43 as shown in FIG. A radiator body 42A composed of an upper end surface portion 46, a lower end surface portion 47, and left and right side portions 48 and 49, and the radiator body 42A includes left and right side surfaces. A plurality of vertical heat radiating plate portions 50 parallel to the portions 48 and 49 are arranged. One end side of these heat radiating plate portions 50 is on the relay mounting side surface portion 43 side, and the other end side is a DIN rail mounting side surface portion 44. It is connected to the side.

  Cooling as a cooling medium is performed between the adjacent heat radiating plate portions 50, between the left heat radiating plate portion 50 and the left side surface portion 48, and between the right heat radiating plate portion 50 and the right side surface portion 49. Air flow paths 51 are provided, and these flow paths 51 are parallel to each other and are directed in the vertical direction in FIG. 11 so that they can be air-cooled from the vertical direction. 47, each flow path 51 is open.

  In the radiator 42, the solid state relay 41 is attached to the relay attachment side surface portion 43, and the DIN rail attachment plate 53 is attached to the DIN rail attachment side surface portion 44.

  Then, as shown in FIG. 12, the plurality of solid state relays 41 are arranged in the left-right direction by engaging the rail engaging portions 54 of the respective DIN rail mounting plates 53 with the DIN rails 55, and are adjacent to each other. The container 42 has the side end face parts 46 and 47 facing each other in close contact with each other.

  In the control panel 40, an upper wiring duct 56 is disposed above the solid state relay 41, and a lower wiring duct 57 is disposed below the solid state relay 41. Each solid state relay 41 is connected to wirings 58 </ b> A and 58 </ b> B inserted through the upper wiring duct 56 and the lower wiring duct 57. A ventilation port (not shown) is provided in the peripheral wall portion of the control panel 40.

  When the solid state relay 41 is energized, the internal semiconductor element generates heat and the temperature rises. As shown in FIGS. 11 and 12, this heat is transmitted from the relay mounting side surface portion 43 of the radiator 42 to the entire radiator body 42 </ b> A and the plurality of radiator plates 50 inside thereof, and is radiated to the atmosphere.

  Therefore, as shown in FIG. 10, the cooling air a that has entered the inside of the control panel 40 from the ventilation port of the control panel 40 is convected to cool the solid state relay 41. That is, as shown in FIGS. 9 and 10, the cooling air a flows into the respective flow paths 51 of the radiator 42 from the space K1 between the radiator 42 and the lower wiring duct 57 and rises. The solid state relay 41 is cooled by carrying the air heated by the heat radiation from the outside through the space K <b> 2 between the radiator 42 and the upper wiring duct 56 and out of the ventilation port.

In addition to the above-described natural heat dissipation by convection, forced air cooling may be performed in the upward direction using a blower (not shown). Similarly, in this forced air cooling, the cooling air is a space K1. Then, the solid state relay 41 is cooled by flowing into the respective flow paths 51 of the radiator 42 and rising, and carrying out the air heated by the heat radiation from the radiator 42 through the space K2 (see Patent Documents 1 to 3). .
Japanese Patent Laid-Open No. 11-233977 JP 11-233980 A JP 2004-158757 A

  In the conventional solid state relay heat dissipation structure shown in FIGS. 9 to 12, the space K1 between the radiator 42 and the lower wiring duct 57 is used to cool the solid state relay 41 by convection of the cooling air. Since the space K2 between the radiator 42 and the upper wiring duct 56 is necessary, the upper and lower wiring ducts 56 and 57 provide a sufficient space (convection space) for the solid state relay 41. Otherwise, the solid state relay 41 may be broken (in some cases, ignited) or have a reduced life due to insufficient heat dissipation. For this reason, even if the control plate 40 can be downsized, A large installation space including the lower wiring ducts 56 and 57 had to be taken.

  Also, in the case of forced air cooling, considering the cooling efficiency and the life reduction due to the air flow obstruction in the upper and lower wiring ducts 56 and 57, the space of the upper and lower wiring ducts 56 and 57 with respect to the solid state relay is again. It was necessary to provide sufficient.

  Further, in the case of forced air cooling, since only one solid state relay 41 can be cooled by one blower, when using a large number of solid state relays 41, the number of solid state relays 41 to be used is required. There was a problem.

  Further, in the case of forced air cooling, the cooling efficiency is not lowered due to obstruction of the air flow in the upper and lower wiring ducts 56, 57, and the failure (in some cases, ignition) and the life of the solid state relay 41 are not caused. Therefore, it is necessary to use the solid state relay 41 having a larger capacity than the energization current, and the amount of heat generation increases as the number of the solid state relays 41 used increases. There was a problem that a separate fan for large ventilation was required.

  The present invention solves the above-described problems, and the object of the present invention is to provide a heat generating structure that can make the flow of cooling air lateral, can obtain sufficient heat dissipation, and is suitable for energizing current ( It is to provide a heat dissipation structure for an electronic device in which a solid state relay or the like can be used.

  In order to achieve the above object, a heat dissipation structure for an electronic device according to the present invention includes a heat dissipator that dissipates heat generated by a heat generating structure, and heat dissipation of a kind of electronic device that is used in parallel. The radiator has a plurality of flow paths through which cooling air passes, and these flow paths are formed to extend along the direction in which the electronic devices are juxtaposed. It is characterized by that.

  With such a configuration, cooling air is sent to the flow path of the radiator, and the air heated by the heat radiation from the radiator is released to the outside air from the direction in which the electronic device is juxtaposed, that is, from the lateral direction to the heat generating structure. The structure can be cooled. Therefore, it is not necessary to provide convection spaces above and below the heat generating structure, and the entire apparatus can be reduced. Along with this, the wiring connected to the heat generating structure is accommodated, and the lower wiring duct can be brought close to the heat generating structure, so that the wiring length to the heat generating structure is shortened, and the wiring (wire) The amount of use can be reduced.

  For this reason, failure of the heat generation structure due to insufficient heat dissipation (firing in some cases) and life reduction due to the fact that the wiring duct approaches the heat generation structure and sufficient space is not obtained with the miniaturization of the control panel etc. The problem can be solved. Further, in the case of forced air cooling, it is possible to solve problems such as a decrease in cooling efficiency due to obstruction of air flow in the wiring duct, and a failure of the heat generating structure (according to circumstances, ignition) and a decrease in life.

  Moreover, since the flow of the cooling air can be made lateral and sufficient heat dissipation is obtained, a heat generating structure suitable for the energization current can be used.

  Here, the heat generating structure corresponds to, for example, an electronic device such as a solid state relay or an inverter.

  Further, in the heat dissipation structure of the electronic device according to the present invention, in the heat dissipation structure of the electronic device according to the present invention described above, when a plurality of electronic devices having the heat radiator are used in parallel, An air passage is configured by communicating with each other along the juxtaposition direction of the electronic devices.

  With this configuration, the heat generating structure can be cooled by sending the cooling air to the air blowing path and releasing the air heated by the heat radiation from the radiator to the outside air from the lateral direction with respect to the heat generating structure. Therefore, it is not necessary to provide convection spaces above and below the heat generating structure, and the entire apparatus can be reduced. Along with this, the wiring connected to the heat generating structure is accommodated, and the lower wiring duct can be brought close to the heat generating structure, so that the wiring length to the heat generating structure is shortened, and the wiring (wire) The amount of use can be reduced.

  For this reason, failure of the heat generation structure due to insufficient heat dissipation (firing in some cases) and life reduction due to the fact that the wiring duct approaches the heat generation structure and sufficient space is not obtained with the miniaturization of the control panel etc. Trouble can be solved. Further, in the case of forced air cooling, it is possible to solve problems such as a decrease in cooling efficiency due to obstruction of air flow in the wiring duct, and a failure of the heat generating structure (according to circumstances, ignition) and a decrease in life.

  Moreover, since the flow of the cooling air can be made lateral and sufficient heat dissipation is obtained, a heat generating structure suitable for the energization current can be used.

  Here, the heat generating structure corresponds to, for example, an electronic device such as a solid state relay or an inverter.

  Moreover, the heat dissipation structure of the electronic device according to the present invention is such that, in the heat dissipation structure of the electronic device according to the present invention described above, a blower that blows cooling air is disposed in the air passage at one end of the air passage. It is characterized by.

  With this configuration, the heat generating structure can be cooled by sending the cooling air to the air passage with the blower and releasing the air warmed by the heat dissipation from the radiator to the outside air from the lateral direction with respect to the heat generating structure. . As described above, the plurality of heat generating structures can be cooled by one blower arranged at one end of the air passage, so that the cost can be reduced and the entire apparatus can be made small.

  Further, since the cooling air can be discharged to the outside of the control panel with a single blower, a fan for ventilation of the control panel itself is not required by providing an outside air introduction port that also serves as a ventilation port on the side surface of the control panel.

  Further, the heat dissipation structure for an electronic device according to the present invention is the above-described heat dissipation structure for an electronic device according to the present invention. It is characterized in that the radiators adjacent to each other when installed are closely attached.

  With such a configuration, when the adjacent radiators are attached in a state in which the heat generating structures are arranged side by side in the lateral direction, there is no gap between the radiators, and a reduction in ventilation loss can be prevented.

  Moreover, the heat dissipation structure of the electronic device according to the present invention is the above heat dissipation structure of the electronic device according to the present invention, in which the blower is an axial fan, and the shape of the flow path of the radiator is the shape of the air outlet of the axial fan. It is characterized by being approximated to.

  With this configuration, the cooling air sent out from the blower port of the axial fan follows the shape of the blower port, so that the cooling air flows without resistance into the flow path that approximates the shape of the blower port. Loss can be prevented.

  In addition, the heat dissipation structure of the electronic device according to the present invention is the above-described heat dissipation structure of the electronic device according to the present invention, in which a heat dissipation fin is provided on the peripheral wall portion of the flow path corresponding to the mounting portion of the heat generating structure in the radiator. It is characterized by.

  With this configuration, heat exchange efficiency can be improved while maintaining the manufacturing yield of the radiator.

  Moreover, the heat dissipation structure for an electronic device according to the present invention is characterized in that, in the heat dissipation structure for an electronic device according to the present invention, the heat generating structure is a solid state relay.

  With such a configuration, the cooling air is sent to the air flow path composed of each flow path of the adjacent radiator, and the air heated by the heat radiation from the radiator is discharged to the outside air from the side to the solid state relay. The state relay can be cooled. Therefore, it is not necessary to provide convection spaces above and below the solid state relay, and the entire apparatus can be made small. As a result, the wiring connected to the solid state relay is accommodated, and the lower wiring duct can be brought closer to the solid state relay, and the wiring length to the solid state relay is shortened. The amount of use can be reduced.

  For this reason, failure of solid state relay due to insufficient heat dissipation caused by shortage of wiring duct and proximity of solid state relay due to miniaturization of control panel etc. (in some cases ignition) and life reduction Trouble can be solved. Further, in the case of forced air cooling, it is possible to solve problems such as a decrease in cooling efficiency due to the inhibition of air flow in the wiring duct, and a failure of the solid state relay (in some cases, ignition) and a decrease in life.

  According to the heat dissipation structure of the electronic device according to the present invention, the cooling air is sent to the air flow path composed of the flow paths of the adjacent radiators, and the air heated by the heat dissipation from the radiator is converted into the heat generating structure (solid state relay). Etc.), the heat generating structure can be cooled. Therefore, it is not necessary to provide convection spaces above and below the radiator, and the entire apparatus can be made small. Along with this, the wiring connected to the heat generating structure is accommodated, and the lower wiring duct can be brought close to the heat generating structure, so that the wiring length to the heat generating structure is shortened, and the wiring (wire) The amount of use can be reduced.

  For this reason, failure of the heat generation structure due to insufficient heat dissipation (firing in some cases) and life reduction due to the fact that the wiring duct approaches the heat generation structure and sufficient space is not obtained with the miniaturization of the control panel etc. Trouble can be solved. Further, in the case of forced air cooling, it is possible to solve problems such as a decrease in cooling efficiency due to obstruction of air flow in the wiring duct, and a failure of the heat generating structure (according to circumstances, ignition) and a decrease in life.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a heat dissipation structure for an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

(Embodiment 1)
Embodiment 1 of a heat dissipation structure for an electronic device according to the present invention is shown in FIGS. 1 is a schematic front view of Embodiment 1 of a heat dissipation structure for an electronic device according to the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and FIG. FIG. 4 is a schematic perspective view of the entire first embodiment of the heat dissipation structure of the electronic device, and FIG. 5 is a heat dissipation structure of the electronic device. FIG. 3 is a perspective view of a part of the exploded state of the first embodiment.

  As shown in FIGS. 1 and 2, in the control panel 30, a DIN rail 32 is attached to the attachment panel 31 along the horizontal direction. In the control panel 30, a solid state relay 1 as a plurality of heat generating structures is attached to a DIN rail 32 by a DIN rail mounting plate 3 with a radiator (heat sink) 2 to which these solid state relays 1 are attached. It is arranged side by side. A blower 4 is mounted on the outer surface of the rightmost radiator 2.

  In the control panel 30, the upper wiring duct 5 is positioned above the solid state relay 1 and the blower 4, and the lower wiring duct 6 is positioned below the solid state relay 1 and the blower 4. It is arranged. Each solid state relay 1 is connected to wirings 33A and 33B inserted through the upper wiring duct 5 and the lower wiring duct 6.

  Further, an outside air introduction port 34 that also serves as a ventilation port is provided on the right side wall portion of the control panel 30, and an exhaust port 35 is provided on the left side wall portion. The outside air introduction port 34 faces the blower 4. The opening 35 faces the outlet of the air passage F formed by the flow path 16 of the radiator 2 arranged in parallel along the direction in which the solid state relays 1 are arranged (lateral direction).

  As shown in FIG. 5, an input terminal 10 and an output terminal 11 are provided on the front surface portion 1 </ b> A of the solid state relay 1.

  As shown in FIGS. 3 and 5, the radiator 2 includes a relay mounting side surface portion 12 that constitutes a mounting portion of the radiator 2, a DIN rail mounting side surface portion 13 that is substantially parallel to the relay mounting side surface portion 12, and It has a radiator body 2A composed of an upper surface portion 14A and a lower surface portion 14B. Inside the radiator body 2A, a plurality of radiator plate portions 15 are arranged in a shelf shape. One end side of the heat radiating plate portion 15 is connected to the relay mounting side surface portion 12 side, and the other end side is connected to the DIN rail mounting side surface portion 13 side. The flow of cooling air as a cooling medium is between the upper surface portion 14A and the uppermost heat radiation plate portion 15, between the upper and lower heat radiation plate portions 15, and between the lowermost heat radiation plate portion 15 and the lower surface portion 14B. The flow paths 16 are parallel to each other. In FIG. 5, the horizontal direction in FIG. 5 enables natural air cooling and forced air cooling from the side-by-side direction of the radiator 2 and the solid state relay 1, that is, the horizontal direction. Each flow path 16 is opened in the both end surface parts 18a and 18b of the radiator main body 2A.

  Further, as shown in FIG. 3, the width dimension X1 of the radiator main body 2A is slightly wider than the width dimension X2 of the solid state relay 1. As shown in FIG. 5, the relay mounting side surface 12 of the radiator body 2A is provided with mounting screw holes 17 at the top and bottom, and similarly, the DIN rail mounting side surface portion 13 is vertically mounted with mounting screw holes ( (Not shown). Further, in FIG. 5 of the radiator main body 2A, mounting screw holes 19 are provided at the four corners of the right end surface portion 18b.

  The DIN rail mounting plate 3 is substantially the same size as the DIN rail mounting side surface portion 13 of the radiator body 2A, and a rail engaging portion 20 is provided at the center of the outer surface portion. Mounting holes 21 are provided on the upper and lower sides.

  The radiator 2 is mounted with the mounting bolts 22 on the relay mounting side surface 12 using the mounting screw holes 17 on the relay mounting side surface 12. In this case, since the width dimension X1 of the radiator main body 2A is slightly larger than the width dimension X2 of the solid state relay 1, as shown in FIG. 3, than the both side edges 12a and 12b of the relay mounting side surface portion 12. The solid state relay 1 comes to be located inside. Further, the DIN rail mounting plate 3 is mounted on the DIN rail mounting side surface portion 13 of the radiator 2 with mounting bolts 23 using the mounting screw holes.

  And as shown in FIG.1 and FIG.4, the several solid state relay 1 has arrange | positioned the rail engaging part 20 of each DIN rail mounting plate 3 to the DIN rail 30, and has arrange | positioned in the left-right direction, Adjacent radiators 2 have end face portions 18a and 18b facing each other in close contact with each other, and the flow paths 16 on the same floor are in communication with each other to form a blower path F. In this case, as described above, since the solid state relay 1 is located inside the side edge portions 12a and 12b of the relay mounting side surface portion 12, when the adjacent radiators 2 are closely attached, the gap between the radiators 2 is increased. Lost.

  The blower 4 is attached to the end face portion 18b of the radiator 2 of the solid state relay 1 located on the rightmost side, that is, the outside air introduction port 34 side, using the mounting screw hole 19 with the mounting bolt 24. .

  With the plurality of solid state relays 1 mounted side by side on the mounting panel 31 as described above, the solid state relay 1 is connected to the wirings 33A and 33B inserted into the upper wiring duct 5 and the lower wiring duct 6. It is. In this case, since the air passage F is formed in the horizontal direction, the upper wiring duct 5 and the lower wiring duct 6 can be brought close to the solid state relay 1. Further, the right side portions of the upper wiring duct 5 and the lower wiring duct 6 are positioned above and below the blower 4.

  Next, the heat radiation operation of the solid state relay 1 configured as described above will be described.

  When the solid state relay 1 is energized, the semiconductor elements inside the solid state relay 1 generate heat and the temperature rises. This heat is transferred from the relay mounting side surface portion 12 of the radiator 2 to the entire radiator main body 2A and the plurality of radiator plate portions 15 inside thereof, and is radiated to the atmosphere. Therefore, by rotating the blower 4, the cooling air taken in from the outside air introduction port 34 of the control panel 30 is sent to the blower path F including the respective flow paths 16 on the same floor formed by the adjacent radiators 2, The solid state relay 1 is cooled by discharging the air heated by the heat radiation from the radiator 2 to the outside air from the exhaust port 35.

  According to the first embodiment of the present invention described above, the cooling air A is sent to the air flow path F including the respective flow paths 16 of the adjacent radiators 2, and the air heated by the heat radiation from the radiator 2 is converted into the solid state. The solid state relay 1 can be cooled by releasing the air from the lateral direction to the relay 1. Therefore, it is not necessary to provide convection spaces above and below the solid state relay 1, and the entire apparatus can be made small. Accordingly, the wirings 33A and 33B connected to the solid state relay 1 are accommodated, and the lower wiring ducts 5 and 6 can be brought close to the solid state relay 1, so that the wiring to the solid state relay 1 can be performed. The length is shortened, and the amount of wiring (electric wires) used can be reduced.

  For this reason, with the downsizing of the control panel 30 or the like, the failure of the solid state relay 1 due to insufficient heat dissipation caused by the lower wiring ducts 5 and 6 approaching the solid state relay 1 and not obtaining sufficient space ( In some cases, it is possible to eliminate problems such as ignition) and life reduction. In addition, in the case of forced air cooling, the cooling efficiency is lowered due to the obstruction of the air flow in the upper and lower wiring ducts 5 and 6, and the failure of the solid state relay 1 (according to circumstances, ignition) and the lifespan are reduced. Can be eliminated.

  Further, according to Embodiment 1 of the present invention, since the blower 4 that blows the cooling air b is disposed in the air passage F at one end of the air passage F, the air blower 4 generates the cooling air i. The solid state relay 1 can be cooled by discharging the air warmed by the heat radiation from the radiator 2 to the blower path F and releasing the air to the outside from the lateral direction with respect to the solid state relay 1. In this way, a plurality of solid state relays 1 can be cooled with a single blower 4, cost can be reduced, and the entire apparatus can be made smaller.

  Further, according to the first embodiment of the present invention, the cooling air can be discharged out of the control panel 30 with one blower 4, so that the outside air introduction port 34 that also serves as a ventilation port is provided on the side surface of the control panel 30. By providing, the fan for ventilation of the control panel 30 itself becomes unnecessary.

  Moreover, according to Embodiment 1 of this invention, the width dimension X1 of the heat sink 2 is made larger than the width dimension X2 of the solid state relay 1, and it adjoins mutually when the several heat sink 2 is arranged in parallel by the horizontal direction. Since the matching radiators 2 are brought into close contact with each other, the gaps between the radiators 2 are eliminated when the adjacent radiators 2 are brought into close contact with each other in a state where the solid state relays 1 are arranged in the horizontal direction. Decline can be prevented.

(Embodiment 2)
Embodiment 2 of the heat dissipation structure for the electronic device according to the present invention is shown in FIGS.

  The second embodiment of the present invention is different from the first embodiment of the present invention described above in that an axial fan 4-1 is used as a blower and a radiator having a different shape of the flow path 16 is used. Since other configurations are the same as those of the first embodiment of the present invention, the same reference numerals are given and description thereof is omitted.

  As shown in FIG. 8, the axial fan 4-1 as a blower has an annular shape of the air outlet 40, and the arrangement shape of the flow path of the radiator 2-1 is an annular shape of the air outlet 40. Imitated. That is, the flow path of the radiator 2-1 is disposed at the four corners of the radiator 2 around the central flow path 16-1 and the circular central flow path 16-1 at the center of the radiator 2. The four flow paths 16-2, 16-3, 16-4, and 16-5, and the partition wall and the flow path 16 that partition these flow paths 16-2, 16-3, 16-4, and 16-5 -1 peripheral wall portion forms a heat radiating plate portion 15-1.

  Further, the vertical inner surface portions of the flow paths 16-3 and 16-4 are the back surfaces of the relay mounting side surface portions 12, and the radiation fins 15-2 protrude from the vertical inner surface portions of the flow paths 16-3 and 16-4. It is set up.

  And these flow paths 16-1 to 16-5 are parallel to each other, and are directed in the left-right direction (lateral direction) in FIG. 8 so that forced air cooling can be performed from the lateral direction, and the radiator body 2A-1 The flow paths 16-1 to 16-5 are opened in both end face portions 18a and 18b.

  The radiator 2-1 has the solid state relay 1 attached to the relay mounting side surface 12 using mounting bolts 22 and the DIN rail mounting side surface 13 using mounting bolts 23 to mount the DIN rail. A plate 3 is attached. Then, in the same manner as in the first embodiment of the present invention described above, adjacent radiators 2-1 are brought into close contact with each other in a state where the solid state relays 1 are arranged in the horizontal direction, and the air flow caused by forced air cooling is reduced. In the direction.

  When the solid state relay 1 is energized, the semiconductor elements inside the solid state relay 1 generate heat and the temperature rises. This heat is transmitted from the relay mounting side surface portion 12 of the radiator 2-1 to the entire radiator main body 2A-1 and to the plurality of radiator plate portions 15-1 and the radiation fins 15-2 therein, and is radiated to the atmosphere. Therefore, by rotating and driving the axial fan 4-1, the respective flow paths 16-1 to 16-5 formed by the adjacent radiators 2-1 form the cooling air taken in from the outside air inlet 34 of the control panel 30. The solid state relay 1 is cooled by discharging the air heated by the heat radiation from the radiator 2-1 to the outside air from the exhaust port 35.

  According to the second embodiment of the present invention described above, not only the effects of the first embodiment of the present invention described above can be achieved, but also the shapes of the flow paths 16-1 to 16-5 of the radiator 2-1 are By making it approximate to the annular shape of the air outlet 40 of the axial fan 4-1 as a blower, the cooling air a sent out from the air outlet 40 of the axial fan 4-1 follows the shape of the air outlet 40. Therefore, the cooling air a flows into the flow paths 16-1 to 16-5 approximate to the shape of the air outlet 40 without resistance, and loss of the air flow rate can be prevented.

  Further, according to the above-described second embodiment of the present invention, the radiation fin 15- is provided at a portion (vertical inner surface portion of the flow paths 16-2, 16-3) corresponding to the back surface of the relay mounting side surface portion 12 of the radiator 2. By projecting 2, the heat exchange efficiency can be improved while maintaining the manufacturing yield of the radiator 2-1.

  In the above-described first and second embodiments of the present invention, the heat generating structure is limited to the solid state relay 1, but the heat dissipation structure of the electronic device according to the present invention is an electronic device that generates heat such as an inverter as the heat generating structure. Is also applicable.

  According to the heat dissipation structure for an electronic device according to the present invention, it is not necessary to provide convection spaces above and below the heatsink, and the entire apparatus can be reduced, and accordingly, connected to a heat generating structure (such as a solid state relay). In addition to containing the wiring, the lower wiring duct can be brought closer to the heat generating structure, the wiring length to the heat generating structure can be shortened, and the amount of wiring (wires) used can be reduced. Eliminate problems such as failure of the heat generating structure due to insufficient heat dissipation (in some cases ignition) and reduced life even if the wiring duct approaches the heat generating structure due to downsizing of the control panel etc. and sufficient space is not obtained Because it has the effect of being able to carry out, the semiconductor power element is housed in the case, and the heat is dissipated from the heat generating structure such as a solid-state relay or inverter that is used in parallel. It is suitable for heat dissipation structure of the vessel.

It is a schematic front view of Embodiment 1 of the heat dissipation structure of the electronic device which concerns on this invention. It is sectional drawing which follows the AA line of FIG. It is explanatory drawing of the solid state relay in Embodiment 1 of the heat dissipation structure of the same electronic device, a radiator, and a width dimension. It is a schematic perspective view of the whole Embodiment 1 of the heat dissipation structure of the same electronic device. It is a perspective view of the one part decomposition | disassembly state of Embodiment 1 of the thermal radiation structure of the same electronic device. It is a schematic front view of Embodiment 2 of the thermal radiation structure of the electronic device which concerns on this invention. It is sectional drawing which follows the BB line of FIG. It is a perspective view of the one part decomposition | disassembly state of Embodiment 2 of the thermal radiation structure of the same electronic device. It is a schematic front view of the heat dissipation structure of the conventional electronic device. It is sectional drawing which follows the CC line of FIG. It is explanatory drawing of the solid state relay and heat radiator in Embodiment 1 of the heat dissipation structure of the same electronic device. It is a schematic perspective view of the whole heat dissipation structure of the same electronic device.

Explanation of symbols

1 Solid state relay (heat generation structure)
2 Radiator 2-1 Radiator 3 DIN rail mounting plate 4 Blower 4-1 Axial fan 5 Upper wiring duct 6 Lower wiring duct 12 Relay mounting side surface (mounting portion)
13 DIN rail mounting side surface portion 15 Heat radiation plate portion 15-1 Heat radiation plate portion 16 Channel 16-1 to 16-5 Channel 30 Control panel 31 Mounting panel 32 DIN rail 34 Outside air inlet 35 Exhaust port 40 Blower port F Blower channel

Claims (7)

A heat dissipating structure of a kind of electronic equipment that includes a heat dissipator that dissipates heat generated by the heat generating structure and that is used in parallel. The heat dissipator has a plurality of flow paths through which cooling air passes. The heat dissipation structure for electronic equipment is characterized in that these flow paths are formed so as to extend along the parallel direction of the electronic equipment. In the case where a plurality of electronic devices having the heat radiator are used in parallel, the air flow path is configured by communicating the flow paths with each other along the parallel arrangement direction of the electronic devices. Item 2. A heat dissipation structure for an electronic device according to Item 1. The heat dissipating structure for an electronic device according to claim 2, wherein a blower for blowing the cooling air to the air passage is disposed at one end of the air passage. The width of the radiator is made larger than the width of the heat generating structure, and the radiators adjacent to each other when the plurality of radiators are arranged side by side are brought into close contact with each other. 3. A heat dissipation structure for an electronic device according to 3. 5. The electron according to claim 3, wherein the blower is an axial fan, and the shape of the flow path of the radiator is approximated to the shape of a blower opening of the axial fan. Equipment heat dissipation structure. The heat dissipation structure for an electronic device according to claim 5, wherein a heat dissipation fin is provided on a peripheral wall portion of the flow path corresponding to a mounting portion of the heat generating structure in the radiator. The heat dissipation structure for an electronic device according to claim 1, wherein the heat generating structure is a solid state relay.

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