JP5869093B1 - control panel - Google Patents

Abstract

A control panel capable of effectively cooling an object to be cooled in the control panel. A duct is installed in a casing 10 of a control panel 1, and cooling air introduced from outside the casing is directly guided to a cooling target in the control panel through the duct. For example, the exhaust port 67 for discharging the cooling air after passing through the cooling target to the outside is formed at a position facing the cooling target, and an exhaust fan 66 is provided between the exhaust port and the cooling target. A partition wall 30 for partitioning the inside of the control panel is installed, and the interior of the partition wall is configured as a ventilation path and is used as a duct. [Selection] Figure 1

Description

  The present invention relates to a control panel, and more particularly to a cooling structure of a control panel that houses equipment that needs to be cooled in a casing of the control panel.

  The control panel is a panel (cabinet) that houses various electrical devices such as switches, distributors, and breakers for supplying power necessary for mechanical devices and electrical devices. A device that generates heat, such as a semiconductor power device, is installed in a housing of a control panel used for a high-frequency power supply device or the like. Since the performance of semiconductor power devices and the like deteriorates due to temperature rise, for example, as described in Patent Document 1, a cooling structure is provided that cools air in the housing by supplying air from the outside into the housing of the control panel. It is done.

  In patent document 1, even if it is a place where there is no maintenance space on the ceiling part of the control panel, the power conversion device is required by installing an exhaust fan on the side surface and configuring a plurality of cooling air passages. The air volume is secured.

JP-A-2014-90640

  Conventionally, the cooling structure of the control panel, including the one described in Patent Document 1, supplies cooling air from the outside into the casing of the control panel via an intake port formed below the control panel. Warm air in the housing of the control panel is discharged through an exhaust port formed above. The cooling air supplied into the casing of the control panel flows through the entire control panel. Depending on the arrangement of equipment in the control panel, the cooling air passes through various equipment installed in the control panel and reaches equipment that requires cooling (equipment that requires strong cooling, such as semiconductor power devices). There is also. The equipment installed in the control panel generates more or less heat. For this reason, there is a possibility that the temperature of the cooling air rises before the cooling air reaches the device that requires cooling, and the device that requires cooling cannot be effectively cooled. Further, depending on the position of the exhaust port, the air that has been induced may remain in the housing of the control panel, and there is a possibility that the equipment that requires cooling in the control panel cannot be cooled effectively.

  The objective of this invention is providing the control panel which can cool effectively the apparatus which requires the cooling in a control panel.

  The present invention is characterized in that a duct is installed in the casing of the control panel, and the cooling air introduced from the outside of the casing through the duct is directly guided to an object to be cooled in the control panel.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to cool the cooling object in a control panel effectively.
Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

The side sectional view of the control panel which looked at the control panel which is one example of the present invention from the side. The front sectional view of the control panel which looked at the control panel which is one example of the present invention from the front. 1 is a rear cross-sectional view of a control panel as viewed from the back of a control panel according to an embodiment of the present invention. 1 is a plan view of a control panel according to an embodiment of the present invention, and is a cross-sectional plan view of the lower part of the control panel along line AA shown in FIG. FIG. 2 is a plan view of the control panel according to an embodiment of the present invention, and is a plan sectional view of the upper part of the control panel taken along line BB shown in FIG. 1. The perspective view around the heat exchanger used for one Example of this invention. The perspective view which shows an example of the flame | frame which comprises the housing | casing of the control panel which is one Example of this invention. The side view which shows the connection structure of the heat sink unit, the semiconductor power device, etc. which comprise the heat exchanger used for one Example of this invention. The top view of the heat sink unit shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 is a side sectional view of a control panel as viewed from the side of a control panel according to an embodiment of the present invention, FIG. 2 is a front sectional view of the control panel as viewed from the front, and FIG. FIG. 4 is a plan view of the control panel when the control panel is viewed from the back, and FIG. 4 is a plan view of the control panel, showing a plan sectional view of the lower part of the control panel along line AA shown in FIG. FIG. 5 is a plan view of the control panel, and shows a plan sectional view of the upper part of the control panel along line BB shown in FIG. In this embodiment, the present invention is applied to a control panel of a high frequency power supply device. The high-frequency power supply device is used, for example, in a system that performs non-contact power supply to a secondary battery of a moving body (such as a bus).

  The control panel 1 has a housing 10 that houses equipment (electrical equipment) that constitutes the control board. The housing 10 is composed of a front door panel 11, a rear panel 12, a left side panel 13, a right side panel 14, and a ceiling panel 15, which are attached to the frame 20 by fastening means such as screws. A floor surface 16 is formed at the lower part of the frame 20. The floor 16 is installed on a base 18. A roof 17 is attached above the ceiling panel 15. Since the high frequency power supply device of this embodiment is installed outdoors, the roof 17 is attached. However, in the case of indoor installation, the roof 17 can be omitted. Further, in this embodiment, since a high frequency power supply device installed outdoors is targeted, packing (not shown) is attached around each panel, and is attached to the frame via the packing. This prevents entry of dust and rainwater from the outside into the housing.

  Further, in the present embodiment, a device installation wall 30 to which devices constituting the control panel 1 are attached is provided at the center of the control panel 1 so as to be divided into a front side and a back side of the control panel. The device installation wall 30 is fixed to the left and right side panels 13 and 14 or the frame 20 and a mounting portion 31 provided on the floor 16 via fastening means such as screws. In this embodiment, the device installation wall 30 is provided so as to partition the front side and the back side of the control panel, and has a function as a partition wall. As shown in FIG. 1, the upper part of the device installation wall 30 is spaced from the ceiling panel 15 so that air from the back side of the control panel 1 can move to the front side. Moreover, as will be described later, the device installation wall 30 in this embodiment has a function as a cooling air blowing duct. In other words, the device installation wall 30 in the present embodiment has the front device mounting wall 30a and the rear device mounting wall 30b spaced from each other. A space between the front-side device mounting wall 30a and the back-side device mounting wall 30b functions as a cooling air blow duct described later. In this embodiment, since the air duct is formed by the wall, the air duct of this embodiment can be referred to as a “wall duct” or a “wall duct”. The front-side device mounting wall 30a and the back-side device mounting wall 30b may be made of a heat insulating material so that the cooling air in the air duct is not heated by the surrounding warm air.

In the control panel 1, for example, the following devices constituting the control panel of the high frequency power supply device are installed.
On the front side of the control panel 1, a reactor 40, an instrument current transformer 41, a power supply unit 42, a changeover switch 43, a breaker 44, a fuse 45, an inrush current prevention resistor 46, and the like are attached to the equipment installation wall 30. Yes. A communication unit 47 is installed on the floor 16.
On the back side of the control panel 1, a semiconductor power device (IGBT: Insulated Gate Bipolar Transistor) 48, a control unit (gate driver) 49, a capacitor 50, and the like constituting the power supply unit are attached to the device installation wall 30. In the present embodiment, the semiconductor power device (IGBT) 48 and the control unit (gate driver) 49 are attached to the equipment installation wall 30 via the heat exchanger 64. That is, the heat exchanger 64 is directly attached to the equipment installation wall 30, and the semiconductor power device (IGBT) 48 and the control unit (gate driver) 49 are indirectly attached to the equipment installation wall 30. A connection structure of the heat exchanger 64, the semiconductor power device (IGBT) 48, and the control unit (gate driver) 49 will be described later. A reactor coil 51 is installed on the floor 16.
In this embodiment, the semiconductor power device (IGBT) 48 is a device that requires strong cooling. That is, the semiconductor power device generates heat and becomes high temperature by operating the apparatus. The performance of a semiconductor power device or the like is degraded due to a temperature rise. For example, when the temperature rises from about 50 degrees to about 120 degrees, the rated current becomes about 1/2. The performance can be maintained by effectively cooling the semiconductor power device. However, as will be described later, in this embodiment, the semiconductor power device (IGBT) 48 is cooled via the heat exchanger 64, so that devices that require strong cooling are directly connected to the heat exchanger 64. Become. Moreover, the electric equipment which needs cooling is not limited to a semiconductor power device.

  Next, the cooling structure of the equipment in the control panel in the present embodiment will be described.

  As described above, the device installation wall 30 of this embodiment functions as a cooling air blowing duct. An air inlet (duct inlet) 60 is formed in the lower part of the front device mounting wall 30a of the device mounting wall 30. Below the front door panel 11, an air inlet 61 for taking in external air is formed at a position facing the air inlet 60 of the front device mounting wall 30a. A blower fan 62 is installed between the panel inlet 61 of the front door panel 11 and the inlet 60 of the front device mounting wall 30a. In this embodiment, the blower fans 62 are provided at two locations in the width direction of the control panel. The panel air inlet 61 and the air inlet 60 of the mounting wall may be provided at two places in the width direction of the control panel as in the case of the blower fan 62, or one that covers the air intake area shown in FIG. It may be formed as two large inlets. The blower fan 62 is attached to the frame 20 in this embodiment, but may be attached to the front door panel 11. A louver (not shown) is formed in the air inlet 61 of the front door panel 11 so that rainwater or the like does not enter. In addition, a filter (not shown) is installed to prevent dust and the like from entering the housing.

  In the present embodiment, the cooling air from the air inlet 61 of the front door panel 11 and the blower fan 62 is once taken into the air inlet 60 of the front device mounting wall 30a via the space in the control panel. Since the cooling air is hardly heated even once passing through the lower space in the control panel, the cooling formed by the device mounting wall 30 hardly increases the temperature of the cooling air introduced from the outside of the housing. Cooling air from outside the housing can be taken into the air blowing duct. In other words, it can be said that the cooling air substantially introduced from the outside of the housing can be directly introduced into the air duct. In addition, you may provide the duct which connects directly between the inlet 61 and the ventilation fan 62 of the front door panel 11, and the inlet 60 of the front side apparatus mounting wall 30a.

  The fan that guides the cooling air outside the control panel 1 into the control panel is mainly an exhaust fan, which will be described later. Therefore, the blower fan 62 is not essential, but it effectively guides the cooling air into the housing. Is installed. In other words, the blower fan 62 assists the exhaust fan that guides the cooling air into the housing or the duct.

  An axial fan is used as the blower fan 62, but is not limited thereto. For example, a cross flow fan (cross-flow fan) may be used. In the case of a cross flow fan, since the thickness of the fan is small, it does not become an obstacle on the front side of the control panel. In addition, the cooling air can be introduced to the front side of the control panel with one blower fan.

An exhaust port (duct exhaust port) 63 is formed in the upper part and the middle part of the rear surface side device mounting wall 30 b of the device installation wall 30. The exhaust port 63 which is the duct outlet of the introduced cooling air is provided so as to face the cooling target in order to directly guide the cooling air introduced from the outside of the housing to the cooling target in the control panel. In the present embodiment, an exhaust port is provided in the rear side device mounting wall 30b for each mounting position of the heat exchanger 64 to which the semiconductor power device (IGBT) 48 and the control unit (gate driver) 49 are mounted on the rear side device mounting wall 30b. 63 is formed. In the present embodiment, exhaust holes 63 on the mounting wall are provided at two locations in the width direction of the control panel in each of the upper part and the middle part. It is good also as one exhaust port corresponding to the magnitude | size of the opening part of the heat exchanger cover 65 mentioned later.
As shown in FIG. 6, the heat exchanger 64 is provided with a heat exchanger cover 65 that covers a heat exchanger (a heat sink unit described later). The heat exchanger cover 65 is positioned such that the opening (positioned on the rear side device mounting wall 30b side in FIG. 6; not shown) and the exhaust port 63 of the rear side device mounting wall 30b face each other. The flange portion of the exchanger cover 65 is attached to the back side device mounting wall 30b by using fastening means such as screws. In addition, two exhaust fans 66 are provided in an opening formed on the opposite side of the heat exchanger cover 65 from the back side device mounting wall 30b. Thus, the heat exchanger cover 65 effectively guides the cooling air from the exhaust port 63 of the back side device mounting wall 30b to the heat exchanger, and forms a wind tunnel for the cooling air to effectively pass through the heat exchanger. It will be. In addition to the heat exchanger cover 65, a duct connecting the opening of the heat exchanger cover 65 and the exhaust port 63 of the back side device mounting wall 30 b may be provided. In this way, by introducing the cooling air from the exhaust port 63 of the back side device mounting wall 30b to the heat exchanger 64, the air warmed in the control panel is mixed (wraps around) into the air flowing into the heat exchanger 64. This can be prevented, and cooling air can be effectively introduced into the heat exchanger 64. In particular, air that has been warmed by the heat of other equipment or the cooling target itself exists above the control panel, so preventing the warm air from flowing in effectively reduces the cooling air to the cooling target. The effect is great in introducing.

  In this embodiment, the exhaust fan 66 is attached to the heat exchanger cover 65 that covers the object to be cooled (the heat exchanger in this embodiment), but the exhaust fan 66 is installed on the frame 20 constituting the housing 10. You may make it support. In this case, it is desirable to provide a duct connecting the cover of the exhaust fan 66 and the opening on the exhaust fan side of the heat exchanger cover 65.

  In the present embodiment, the heat exchanger 64 is supported by the rear device mounting wall 30b, but may be installed and supported on the frame 20 constituting the housing 10. As shown in FIG. 7, the frame to which the heat exchanger 64 is attached is provided at a height at which the heat exchanger is located, separately from the frame 20 constituting the outer frame of the casing, and the column of the outer frame of the casing. It is a frame 20b extending in the lateral direction with both ends supported by the frame 20a. In this case, the exhaust fan 66 and the heat exchanger 64 are attached to the frame 20b with the frame 20b interposed therebetween. As described above, the exhaust fan 66 generates a main working force for guiding the cooling air into the control panel or the air duct. An axial fan is used as the exhaust fan 66, but is not limited thereto.

  A panel exhaust port 67 is provided at the position of the back panel 12 facing the exhaust fan 66. In other words, a panel exhaust port is formed in the housing at a position facing a heat exchanger that is a cooling target, and an exhaust fan is disposed between the panel exhaust port and the cooling target. The panel exhaust port 67 may be formed at two locations corresponding to the position of the exhaust fan 66, or one large exhaust port that covers the exhaust area shown in FIG. Each of them may be formed. The panel exhaust 67 is provided with a louver (not shown) for preventing rainwater and the like from entering.

  Thus, by providing the panel air inlet 61, the air fan 62, the air duct formed by the device mounting wall 30, the heat exchanger cover 65, the exhaust fan 66, and the panel air outlet 67, as shown in FIG. Then, a cooling air intake / exhaust path is formed in which air is introduced from the outside of the housing and is discharged to the outside of the housing via the heat exchanger 64. And the air outside a housing | casing can be directly induced | guided | derived to cooling object (a heat exchanger in a present Example) with low temperature.

  In addition, although each fan is operated by regular operation, it is not limited to this. For example, a temperature sensor may be provided on the cooling target, and the fan drive may be controlled based on the output of the temperature sensor.

  Next, a connection structure of the heat exchanger 64, the semiconductor power device (IGBT) 48, and the control unit (gate driver) 49 will be described with reference to FIGS. 8 shows a side view of the connection structure of the heat exchanger 64, the semiconductor power device (IGBT) 48, and the control unit (gate driver) 49, and FIG. 9 shows a top view of the connection structure.

  The heat exchanger 64 is configured as a heat sink unit, and includes a plurality of heat pipes 70 and a connection plate 71 in which one end side of the plurality of heat pipes 70 is embedded. The other end side of the plurality of heat pipes 70 is formed to rise vertically from the connection plate 71. A plurality of fins 72 are attached to the plurality of heat pipes 70 in order to enhance heat exchange with the cooling air. The heat pipe 70, the connection plate 71, and the fin 72 are each made of a material having excellent thermal conductivity such as copper.

  As shown in FIG. 6, the upper surface side of the connection plate 71 is attached to the heat exchanger cover 65 with a fastening member such as a screw. On the lower surface side of the connection plate 71, as shown in FIG. 8, a mounting plate (not shown) with excellent thermal conductivity on which the semiconductor power device (IGBT) 48 and the control unit (gate driver) 49 are mounted is a screw or the like. It is attached by the fastening member. With such a configuration, the heat exchanger 64 can be effectively cooled by the cooling air transferred to the heat exchanger 64 at a low temperature, and the semiconductor power is supplied via the connection plate 71 of the heat exchanger 64. The device (IGBT) 48 and the control unit (gate driver) 49 can be effectively cooled.

In addition to the semiconductor power device (IGBT), electrical equipment that generates heat during operation is installed inside the control panel. It is desirable to cool these heat generating devices even if they do not require strong cooling like semiconductor power devices (IGBT).
In the present embodiment, a ceiling fan (exhaust fan) 80 is attached to the ceiling panel 15 in order to cool the electrical equipment located on the front side of the equipment installation wall 30. A part of the cooling air introduced into the housing 1 through the air inlet 61 formed in the front door panel 11 and the blower fan 62 attached to the frame 20 is moved to the front side of the equipment installation wall 30 by the operation of the ceiling fan 80. In the meantime, heat from various devices is taken away, and finally it is discharged outside the casing through the ceiling fan 80. In this embodiment, as shown in FIG. 2, ceiling fans 80 are provided at two locations in the width direction of the control panel 1.

  Further, devices other than the semiconductor power device (IGBT) are also installed on the back side of the device installation wall 30. In this embodiment, these devices are also cooled. That is, as shown in FIG. 3, a panel intake port 81 and a blower fan 82 are provided below the left side panel 13 on the back side of the device installation wall 30. These are provided in the same manner as a panel air inlet and a blower fan provided on the front door panel 11 side, and a louver and a filter are also provided in the same manner. The louvers and filters prevent rainwater and dust from entering the housing. Then, the cooling air introduced into the housing 1 on the back side of the device installation wall 30 through the panel intake port and the blower fan rises the space on the back side of the device installation wall 30, and various devices are in the meantime. Heat is taken away from the control panel 1 and moved from the back side to the front side via the space between the upper part of the equipment installation wall 30 and the ceiling panel 15, and finally the ceiling fan 80. It is discharged to the outside of the housing through. Alternatively, it is also discharged through the panel exhaust port 67. In this embodiment, the ceiling fan 80 is provided only on the front side of the control panel 1. Although the number of ceiling fans increases and the cost increases, when the ceiling fans are also installed on the back side of the control panel 1, the upper part of the device installation wall 30 may be extended to the ceiling panel 15. When the control panel is installed indoors, a ceiling plate may be provided at the ceiling exhaust port.

  As described above, in this embodiment, the air duct formed by the wall for equipment installation is installed in the casing of the control panel, and the cooling air introduced from the outside of the casing through the air duct is the cooling target in the control panel. Because it is directly guided to the cooling target, it is isolated from the air heated by other electrical equipment in the process up to the cooling target, and the cooling air introduced from the outside remains at a low temperature in the control panel (this embodiment Then, the air can be blown to the heat exchanger to which the semiconductor power device is connected. As a result, the object to be cooled in the control panel can be effectively cooled. In particular, when the inside of the control panel is densely packed with electrical equipment, it is difficult to guide the cooling air to equipment that requires cooling with the conventional structure. Devices that require cooling can be guided to and devices that require cooling can be efficiently cooled. And the performance fall by the temperature rise of a semiconductor power device can be suppressed effectively.

  In addition, since the position of the air duct can be set arbitrarily, the degree of freedom of arrangement of devices that require cooling is improved. As a result, in order to effectively cool equipment that needs to be cooled, the structure of the control panel has tended to increase in size, but in this embodiment, special consideration should be given to the arrangement of equipment that needs to be cooled. In addition, since it is possible to arrange the devices in pursuit of miniaturization of the control panel, the control panel can be greatly miniaturized.

  In this embodiment, a ceiling fan or the like for cooling the entire equipment installed in the control panel is provided. That is, in this embodiment, the equipment in the control panel is divided into equipment that requires a large cooling strength (such as a semiconductor power device in this embodiment) and other equipment. The cooling air is blown directly from the outside through the air duct to locally cool the equipment that requires strong cooling. For other equipment, cooling by a conventional method, for example, a ceiling fan Thus, the cooling inside the control panel is entirely cooled by introducing the cooling air into the entire casing of the control panel. Accordingly, it is possible to effectively cool a device that requires strong cooling without introducing a large amount of external air to cool the device that requires strong cooling. In addition, when a large amount of external air is introduced, it is necessary to secure a large space for the cooling air to pass through. However, in this embodiment, such a necessity is not required, so that the size of the control panel can be reduced. .

  Further, in this embodiment, the control panel is separated into the front side and the back side by the device mounting wall. Thereby, when cooling air is blown to equipment that requires strong cooling, mixing of warm air in the control panel (particularly warm air warmed on the front side of the control panel) can be suppressed. In addition, because the control panel is separated from the front side and the back side by the equipment installation wall, the equipment in the control panel can be effectively installed by installing the equipment with different cooling needs on the front side and the back side separately. Can be cooled.

  Further, in this embodiment, since the device installation wall is also used as the air duct, the device that requires strong cooling can be cooled without increasing the size of the control panel. However, it is not essential to use the device installation wall as the air duct. For example, a square columnar air duct may be provided separately from the device installation wall. In this case, it is desirable to form a flange or the like at the outlet of the air duct and connect it to the flange of the heat exchanger cover so that ambient air does not enter the heat exchanger cover.

  In this embodiment, equipment that requires strong cooling is installed on the back side of the control panel. Therefore, the positions of the panel intake port and the panel exhaust port are formed apart from each other on the front surface and the back surface of the control panel. Thereby, exhaust (warm air) discharged from the panel exhaust port can be prevented from being sucked into the panel intake port.

  In this embodiment, an exhaust fan 66 is provided for each device that requires strong cooling (in this embodiment, it is installed for each of the upper and middle heat exchangers). Thereby, for example, if the number of rotations of the exhaust fan is changed according to the degree of cooling requirement of the equipment that needs to be cooled, the cooling according to the equipment can be easily realized.

  In the above-described embodiment, a semiconductor power device or the like is connected to the heat exchanger, and the semiconductor power device is indirectly cooled by cooling air. Although the cooling efficiency is lowered, the heat exchanger may be omitted and the cooling air may be directly blown to the semiconductor power device or the like. Also, in this case, it is desirable to provide a cover that covers the periphery of the semiconductor power device, connect the cover to the air duct, and allow cooling air to flow so that warm air around the semiconductor power device does not enter.

  Further, in the above-described embodiment, air is sucked from the lower part on the front side of the control panel and exhausted from the upper part or middle part on the rear side, but this is not a limitation. An intake port and an exhaust port may be installed according to the arrangement state of the devices that need cooling. However, in view of the flow of cooling air, it is desirable to take in air from the lower part on the front side of the control panel and exhaust air from the upper part or middle part on the rear side.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Moreover, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  DESCRIPTION OF SYMBOLS 1 ... Control panel, 10 ... Housing, 11 ... Front door panel, 12 ... Rear panel, 13 ... Left side panel, 14 ... Right side panel, 15 ... Ceiling Panel, 16 ... floor surface, 17 ... roof, 18 ... base, 20, 20a, 20b ... frame, 30 ... device mounting wall, 30a ... front side device mounting wall, 30b ... rear-side equipment mounting wall, 31 ... mounting portion, 40 ... reactor, 41 ... current transformer for instrument, 42 ... power supply unit, 43 ... changeover switch, 44 .. Breaker, 45... Fuse, 46... Inrush current prevention resistor, 47 .. Communication unit, 48... Semiconductor power device (IGBT), 49. ... Capacitors, 51 ... Reactor coils, 60・ Installation wall intake port, 61... Panel intake port, 62... Blower fan, 63 ..Installation wall exhaust port, 64... Heat exchanger, 65. 66 ... Exhaust fan, 67 ... Panel exhaust port, 70 ... Heat pipe, 71 ... Connection plate, 72 ... Fin, 80 ... Ceiling fan, 81 ... Panel intake port, 82 ... Blower fan.

Claims (7)

A housing,
A control panel comprising various electrical devices housed in the housing,
A partition wall that is provided in the casing, is provided so as to divide the casing into a front side and a back side, and to which the various electric devices are attached, and is a front side device mounting wall located on the front side; A rear-side device mounting wall located on the back side and spaced from the front-side device mounting wall; and a space between the front-side device mounting wall and the back-side device mounting wall as a blow duct Partition wall,
Before provided to the door panel before configuring Kikatamitai, taken in as cooling air to the casing outside air into the housing panel inlet,
A duct inlet provided in the front device mounting wall and formed at a position facing the panel inlet;
A duct exhaust port provided on the back side device mounting wall and formed at a position facing a cooling target requiring strong cooling in the control panel;
Before provided on the back panel constituting the Kikatamitai, the strong cooling is formed at a position facing the cooling target required panels outlet,
An exhaust fan provided between the panel exhaust port and the cooling target requiring strong cooling,
The front side device mounting wall and the back side device mounting wall are installed separately with different electrical requirements, and the back side device mounting wall is installed with electrical equipment that requires strong cooling,
The control object characterized in that the cooling object that requires strong cooling is an electric device that requires strong cooling or a heat exchanger that is thermally connected to the electric device that requires strong cooling. The control panel according to claim 1,
The cooling air intake / exhaust path to the cooling target that requires strong cooling is the panel intake port, the duct intake port, the air duct formed by the partition wall, the duct exhaust port, and the cooling that requires strong cooling. A control panel formed in the order of an object, the exhaust fan, and the panel exhaust port. The control panel according to claim 1 or 2,
A control panel, wherein a blower fan is installed at the panel air inlet. In the control board as described in any one of Claims 1-3,
A cover is provided to cover the object to be cooled that requires strong cooling, one opening of the cover is connected to the duct exhaust port, and the exhaust fan is installed on the other opening side of the cover. Characteristic control panel. In the control panel according to any one of claims 1 to 4,
A plurality of cooling objects that require strong cooling are provided,
The duct exhaust port is formed for each of the plurality of cooling objects that require strong cooling on the back side device mounting wall where the cooling object that requires strong cooling is installed,
The control panel, wherein the exhaust fan is provided for each of the plurality of objects to be cooled that require strong cooling. In the control panel according to any one of claims 1 to 5,
A ceiling fan that exhausts air inside the housing is installed on the ceiling panel of the housing,
The electrical equipment other than the electrical equipment that requires strong cooling , wherein the electrical equipment provided on the front equipment mounting wall is cooled from the panel air inlet to the inside of the housing by the operation of the ceiling fan. The cooling air, which is an electric device other than the electric device that requires strong cooling, is deprived of heat generated by the electric device provided on the front-side device mounting wall, through the ceiling fan. A control panel that discharges outside the body. In the control panel as described in any one of Claims 1-6 ,
The electrical equipment installed on the back side equipment mounting wall includes a semiconductor power device,
The electrical device installed on the front device mounting wall includes a reactor and a power supply unit.

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