JPH05243449A - Cutting and molding apparatus - Google Patents

Abstract

PURPOSE:To shorten a processing time by cutting and molding leads from a lead frame, and then removing a semiconductor device such as a QFP, etc., which is hardly discharged from a die. CONSTITUTION:Leads of a semiconductor device 1 are merely cut and molded by a cutting and molding die 2. The device 1 is conveyed out of the die 2 while being held via a hanging pin by a lead frame, separated from the frame by a hanging pin cutter 3, simultaneously removed by a receiving unit 7, and contained in a containing tray 5 positioned by an X-Y table 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cutting and molding leads of a semiconductor device used in a semiconductor manufacturing process, and more particularly to a cutting and molding apparatus of a type in which a semiconductor device is housed in a tray after completion of cutting and molding.

[0002]

2. Description of the Related Art FIG. 3 is a partial side view showing an example of a conventional cutting and forming apparatus. Conventionally, in this type of cutting and molding apparatus, when it is difficult to discharge the semiconductor device 1 that has become a solid piece after the lead cutting and molding process through a chute tunnel from the viewpoint of the shape of the semiconductor device, as shown in FIG. After the processing is completed, when the upper mold 12 is lifted and the mold is opened, the take-out unit 11 enters the mold 13, takes out the semiconductor device 1, and stores it in the storage tray 5.

For example, in the cross-sectional view of FIG. 4, the QFP type semiconductor device having leads in four directions can push only the upper half of the semiconductor device when the tunnel in the chute 15 is conveyed by the pusher 14. Therefore, it cannot be stably transported. In addition, when a plurality of semiconductor devices are simultaneously conveyed in a row, leads of the front and rear semiconductor devices come into contact with each other. Therefore, the QFP type semiconductor device is taken out by using the take-out unit 11 shown in FIG.

[0004]

In the conventional cutting and molding apparatus described above, the semiconductor device remaining in the mold after processing is completed is lifted up and then taken out, so that the processing speed becomes slow. . Moreover, when the semiconductor device is taken out after the processing is completed, the gap between the upper die and the lower die is not so wide,
Moreover, since there are guide posts and the like, there is a drawback that the size and operation of the take-out frame are restricted. An object of the present invention is to solve the above drawbacks and to provide a cutting and molding apparatus capable of increasing the processing speed even in a semiconductor device of a type such as QFP or TSOP.

[0005]

DISCLOSURE OF THE INVENTION A cutting and molding apparatus of the present invention is a mold for cutting and molding only leads of a semiconductor device that has been completely sealed on a lead frame, and a semiconductor device held by a hanging pin on the lead frame. A transport mechanism for transporting the semiconductor device out of the mold as it is, a hanging pin cutting unit for separating the semiconductor device from the transported lead frame, a receiving unit for receiving the semiconductor device at the same time when the hanging pin is cut, and a storage tray for the semiconductor device. It has an XY table which is moved in the Y direction and aligned with the position of the receiving unit.

[0006]

The present invention will be described below with reference to the drawings. Figure 1
Is a diagram showing a first embodiment of the present invention, and FIG.
The same figure (b) is a side view. As shown in FIGS. 1A and 1B, the cutting and molding machine of this embodiment has a rail 4 for carrying a lead frame, a cutting and molding die 2, and a hanging pin cutting portion separated from the cutting and molding die 2. 3 and a storage tray 5 for storing the semiconductor device 1 immediately below the storage tray 3 are mounted on the XY table 6.

Next, the operation of this cutting molding machine will be described. The lead frame is sequentially fed on the rails 4, and the leads are cut and molded by the cutting mold 2. The semiconductor device 1 is further forwarded while being held by the lead frame with the hanging pins, and is received from the bottom by the receiving unit 7 that is raised through the holes provided in the storage tray 5 at the hanging pin cutting portion 3, and is pushed down the pushing block 8 The suspending pins are cut by, the receiving unit 7 is lowered, and the semiconductor device 1 is stored in the storage tray 5. Storage tray 5 is X
-The table is moved to the next storage position on the Y table 6, and the next semiconductor device 1 is stored in the same manner.

With the cutting and molding apparatus having such a structure, compared with the conventional operation of opening the cutting and molding die, and then taking out the semiconductor device with the take-out unit entering the die, the stroke of the die is Since it is small, cutting the hanging pins and storing them in the tray is possible in one operation, and the processing time can be reduced from about 3 seconds in the past to about 1.5 seconds.

FIG. 2 is a plan view of the second embodiment of the present invention. It has an index table 9 and an index table 10 as a receiving unit of the hanging pin cutting unit 3,
A storage tray 5 is provided below the index table 10. Next, the operation of this embodiment will be described. This embodiment is an example in which a plurality of lead frames are taken, and the pitch between the plurality of semiconductor devices 1 is different from the storage pitch of the storage tray 5. First, the receiving unit of the index table 9 simultaneously receives a plurality of semiconductor devices cut by the hanging pin cutting unit 3. The semiconductor device 1 rotated by the index table 9 is transferred to the index table 10, converted into the storage pitch of the storage tray 5 during the rotation of the index table 10, and stored in the storage tray 5.

In the cutting and molding apparatus having such a structure, a plurality of lead frames can be taken at one time, and the pitch of the lead frame semiconductor device and the storage tray 5 are used.
Even if the pitches are different, or even if the space of the hanging pin cutting portion is limited, the processing speed can be reduced to about half that of the conventional method.

[0011]

As described above, according to the present invention, only the leads are cut and molded by the cutting mold, and the semiconductor device is conveyed while being held on the lead frame only by the hanging pins.
Since it is equipped with a mechanism that separates it from the lead frame at the hanging pin cutting part and takes it out with the receiving unit,
This has the effect of reducing the processing time to about half that of conventional products.

[Brief description of drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention, in which FIG. 1 (a) is a plan view and FIG. 1 (b) is a side view.

FIG. 2 is a plan view of a second embodiment of the present invention.

FIG. 3 is a partial side view of a conventional cutting and forming apparatus.

FIG. 4 is a cross-sectional view showing a transportation state of a conventional semiconductor device.

[Explanation of Codes] 1 semiconductor device 2 cutting mold 3 hanging pin cutting part 4 rail 5 storage tray 6 XY table 7 receiving unit 8 pushing block 9 index table 10 index table 11 take-out unit 12 upper mold 13 mold 14 Pusher 15 shoot

Claims (1)

[Claims] 1. A cutting molding die for cutting and molding a lead of a semiconductor device which has been completely sealed on a lead frame, and a lead frame is carried after the completion of the cutting molding while the semiconductor device is held on the lead frame by a hanging pin. The transport mechanism, the suspension pin cutting unit that separates the semiconductor device from the transported lead frame, the receiving unit that receives the semiconductor device simultaneously with the suspension pin cutting, and the storage tray for the semiconductor device are X-
Move in Y direction and align with receiving unit position X-
A cutting and forming apparatus having a Y table.