JPH05243335A - Bonding method - Google Patents

Abstract

PURPOSE:To greatly shorten processing time and improve productivity in the case of bonding one electronic component onto other ones by performing image processing and moving one electronic component in parallel. CONSTITUTION:During a calculation period when a shift in position of a semiconductor chip 1 attracted to a lower end face of a component attracting head 6 is being calculated by an image processor 10, the component attracting head 6 together with the semiconductor chip 1 being attracted to its lower end face is moved over a bonding stage 5. Then the position of the component attracting head 6 is fine-adjusted based on the calculation results of the image processor 10 to correct the shift in position of the semiconductor chip 1 being attracted to the lower end face. Since image processing and movement of a liquid crystal display panel 4 upward is thus performed in parallel, processing time can be largely shortened and productivity can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method for bonding one electronic component to another electronic component.

[0002]

2. Description of the Related Art When mounting one electronic component on another electronic component such as mounting a semiconductor chip for driving the liquid crystal display panel on the liquid crystal display panel, the alignment of the two is performed. After bonding, there is a method of bonding and mounting.

FIG. 4 schematically shows a conventional bonding apparatus used in such a mounting method.
In this bonding apparatus, a component standby unit 2 in which a semiconductor chip 1 is on standby, a component positioning stage 3, a bonding stage 5 on which a liquid crystal display panel 4 is positioned and mounted, a component suction head 6, a bonding head 7, a camera 8, a memory The device 9, the image processing device 10, and the like are provided. Of these, alignment marks (not shown) are provided at predetermined locations on the bottom surface of the semiconductor chip 1. The parts standby unit 2 is arranged at a fixed position. The component positioning stage 3 is arranged at a fixed position, but the position in the X, Y, and θ directions is finely adjusted. The bonding stage 5 is arranged at a fixed position. Parts suction head 6
Is vertically movable and movable between a position above the component standby unit 2, a position above the component positioning stage 3 and a position above a predetermined portion of the bonding stage 5. ing. The bonding head 7 is vertically movable above a predetermined portion of the bonding stage 5. The camera 8 is arranged below a light transmitting portion made of glass or the like in a predetermined portion of the component positioning stage 3. The memory device 9 temporarily stores an image signal corresponding to an image captured by the camera 8, and stores the stored image signal in the image processing device 1.
It is designed to be sent to 0. The image processing device 10 uses the image signal sent from the memory device 9 as a preset reference position signal (position signal corresponding to the arrangement position of the liquid crystal display panel 4 positioned and mounted on the bonding stage 5). By comparing the former, the positional deviations in the X, Y, and θ directions with respect to the latter are calculated, and the position correction of the component positioning stage 3 in the X, Y, and θ directions is controlled based on the calculation result. It has become.

Next, the liquid crystal display panel 4 in which the semiconductor chip 1 waiting in the component waiting section 2 of this bonding apparatus is positioned and placed on the bonding stage 5.
The case of bonding and mounting on top will be described with reference to the timing chart shown in FIG.

In this case, first, the component suction head 6 located above the component standby portion 2 is lowered, and the semiconductor chip 1 is sucked at its lower end surface and then raised, whereby the semiconductor chip 1 is moved to the component suction head. The lower end surface of 6 is adsorbed and lifted. Next, the component suction head 6 is mounted on the lower end surface of the semiconductor chip 1 together with the component positioning stage 3
Move above. Next, the component suction head 6 descends to release the suction to the semiconductor chip 1, and the semiconductor chip 1 is placed on the upper surface of the component positioning stage 3. Next, when the component suction head 6 rises and stops, the camera 8 is turned on (FIG. 5a) at this timing, and the image signal corresponding to the image including the alignment mark on the bottom surface of the semiconductor chip 1 captured by the camera 8 is generated. It is supplied to the memory device 9 and temporarily stored. When the camera 8 is turned off (FIG. 5a) after a certain period of time, the timing shown in FIG.
As shown in b, the image processing device 10 receives the image signal once stored in the memory device 9, starts image processing, compares the supplied image signal with a preset reference position signal, and Alignment marks X, Y on the bottom surface of the semiconductor chip 1 placed on the upper surface of the positioning stage 3,
The positional deviation of θ in each direction is calculated. After this calculation is completed, the image processing apparatus 10 subsequently controls the position correction of the component positioning stage 3 in each of the X, Y, and θ directions based on the calculation result, as shown in FIG.
In order to correct the positional deviation of the semiconductor chip 1, the position of the component positioning stage 3 in the X, Y and θ directions is finely adjusted,
As a result, the displacement of the semiconductor chip 1 placed on the upper surface of the component positioning stage 3 is corrected. When the correction of the positional deviation is completed, at this timing, as shown in FIG. 5d, in order to move the semiconductor chip 1 above the bonding stage 5, first, the component suction head 6 is lowered, and the semiconductor chip 1 is lowered at its lower end surface. And then rises,
Next, the component suction head 6 moves above the bonding stage 5 together with the semiconductor chip 1 sucked on the lower end surface thereof. Next, the component suction head 6 descends to release the suction to the semiconductor chip 1, and the semiconductor chip 1 is placed at a predetermined position on the liquid crystal display panel 4. next,
After the component suction head 6 moves up, it moves above the component standby unit 2. Next, the bonding head 7 descends, and the semiconductor chip 1 is bonded to a predetermined position on the liquid crystal display panel 4 by the lower end surface of the descending bonding head 7. This bonding is performed by solder bumps or liquid crystal display panel 4 which are previously provided on the bottom surface of the semiconductor chip 1.
Is performed through an anisotropic conductive adhesive that is previously provided on the upper surface of the. Next, when the bonding head 7 rises, the semiconductor chip 1 is bonded and mounted at a predetermined position on the liquid crystal display panel 4.

[0006]

However, in such a conventional bonding apparatus, as shown in FIG. 5C, after image processing by the image processing apparatus 10 shown in FIG. 5B,
By finely adjusting the position of the component positioning stage 3 in the X, Y, and θ directions, the misalignment of the semiconductor chip 1 is corrected, and then FIG.
As shown in d, since the semiconductor chip 1 mounted on the component positioning stage 3 is moved above the liquid crystal display panel 4, there is a problem that the processing takes a considerable amount of time and the productivity is poor. . Further, since the semiconductor chip 1 after the positional deviation is corrected is placed at a predetermined position on the liquid crystal display panel 4 and then bonded by the bonding head 7, the positional deviation is caused by the impact at the time of bonding by the bonding head 7. There is a problem that may occur. An object of the present invention is to provide a bonding method capable of significantly shortening processing time and improving productivity. Another object of the present invention is to provide a bonding method capable of preventing a positional deviation during bonding.

[0007]

The invention according to claim 1 is
When bonding one electronic component onto another electronic component,
First, the one electronic component is located above the camera, and in this state, an image signal corresponding to an image of the one electronic component taken by the camera is stored in a memory device, and then stored in the memory device. While calculating the positional deviation of the one electronic component with respect to the other electronic component by the image processing device based on the image signal, the one electronic component is moved above the other electronic component during the calculation period, Next, the positional deviation of the one electronic component with respect to the other electronic component is corrected based on the calculation result of the image processing apparatus, and then the one electronic component is bonded onto the other electronic component. It was done. According to a second aspect of the present invention, the bonding head with a suction mechanism sucks the one electronic component to position it above the camera, and then the bonding head with a suction mechanism is sucked onto the one electronic component. Together with the other electronic component, by finely adjusting the position of the bonding head with a suction mechanism based on the calculation result of the image processing device after that, the other electronic component of the one electronic component. The positional deviation with respect to is corrected.

[0008]

According to the invention described in claim 1, during the calculation period in which the position deviation of one electronic component with respect to another electronic component is calculated by the image processing device, the one electronic component is placed above the other electronic component. After that, the positional deviation of one electronic component with respect to another electronic component is corrected based on the calculation result of the image processing device, that is, image processing and movement of the one electronic component are performed in parallel. Therefore, the processing time can be significantly shortened and the productivity can be improved. According to the second aspect of the present invention, since the bonding head with the suction mechanism is used, one electronic component after the positional deviation is corrected is placed at a predetermined position on another electronic component and immediately bonded. Therefore, it is possible to prevent misalignment during bonding.

[0009]

1 is a schematic view of a bonding apparatus according to a first embodiment of the present invention. In this figure, the same reference numerals are given to the same names as those in FIG. 4, and the description thereof will be omitted as appropriate. The major difference between this bonding apparatus and the conventional one shown in FIG. 4 is that the component suction head 6 is movable in the X, Y, Z, and θ directions, and the component positioning stage 12 is omitted.

Now, the liquid crystal display panel 4 in which the semiconductor chip 1 waiting in the component waiting section 2 in this bonding apparatus is positioned and placed on the bonding stage 5.
The case of bonding and mounting on top will be described with reference to the timing chart shown in FIG.

In this case, first, the component suction head 6 located above the component standby portion 2 is lowered, and the semiconductor chip 1 is suctioned at its lower end surface and then raised, so that the semiconductor chip 1 is moved to the component suction head. The lower end surface of 6 is adsorbed and lifted. Next, the component suction head 6 moves above the camera 8 and stops together with the semiconductor chip 1 sucked on the lower end surface thereof. Then, at this timing, the camera 8 is turned on (FIG. 2A), and the image signal corresponding to the image including the alignment mark on the bottom surface of the semiconductor chip 1 captured by the camera 8 is supplied to the memory device 9 and temporarily stored. When the camera 8 is turned off (FIG. 2a) after a certain period of time, the image processing apparatus 10 receives the image signal once stored in the memory apparatus 9 and performs image processing at this timing, as shown in FIG. 2b. Then, the supplied image signal is compared with a preset reference position signal, and the alignment marks in the X, Y, and θ directions of the alignment mark on the bottom surface of the semiconductor chip 1 attracted to the lower end surface of the component suction head 6 are compared. Calculate the displacement.
Similarly, when the camera 8 is turned off (FIG. 2a), at this timing, as shown in FIG. 2d, the component suction head 6 is sucked onto the lower end surface thereof in order to move the semiconductor chip 1 above the bonding stage 5. Semiconductor chip 1
At the same time, it moves above the bonding stage 5. That is, the component suction head 6 is moved above the bonding stage 5 together with the semiconductor chip 1 sucked on the lower end surface thereof during the calculation period in which the image processing apparatus 10 is calculating the displacement. Then, when the calculation of the positional deviation by the image processing device 10 is completed, the image processing device 10 subsequently follows the X, Y, θ of the component suction head 6 based on the calculation result.
2c, the position of the component suction head 6 in the X, Y, and θ directions is finely adjusted in order to correct the positional deviation of the semiconductor chip 1 as shown in FIG. 2c. Thus, the displacement of the semiconductor chip 1 attracted to the lower end surface of the component suction head 6 is corrected. When the correction of the positional deviation is completed, the component suction head 6 descends to release the suction to the semiconductor chip 1, and the semiconductor chip 1 is placed at a predetermined position on the liquid crystal display panel 4. Next, the component suction head 6 moves up and then moves above the component standby unit 2. Next, the bonding head 7 is lowered, and the lower end surface of the lowered bonding head 7 bonds the semiconductor chip 1 to a predetermined position on the liquid crystal display panel 4. Next, the bonding head 7
When is raised, the semiconductor chip 1 is bonded and mounted at a predetermined position on the liquid crystal display panel 4.

As described above, in this bonding apparatus,
The bonding stage 5 together with the semiconductor chip 1 sucked on the lower end surface of the component suction head 6 during the calculation period in which the image processing apparatus 10 calculates the positional deviation of the semiconductor chip 1 sucked on the lower end surface of the component suction head 6. And then the position of the component suction head 6 is finely adjusted based on the calculation result of the image processing apparatus 10 to correct the displacement of the semiconductor chip 1 sucked on the lower end surface thereof.
That is, image processing and liquid crystal display panel 4 of semiconductor chip 1
The processing time is significantly shortened and productivity can be improved because the upward movement of the sheet is performed in parallel.

Next, FIG. 3 shows an outline of a bonding apparatus in a second embodiment of the present invention. In this figure, the same symbols are attached to the same names as those in FIG.
The description will be omitted as appropriate. Figure 1
The major difference from the first embodiment shown in FIG. 2 is that the bonding head 7 has a suction mechanism, and X, Y, Z,
It is movable in the θ direction, and the component suction head 6 is omitted.

Now, in this bonding apparatus, the semiconductor chip 1 waiting in the component waiting section 2 is positioned on the bonding stage 5 and mounted on the liquid crystal display panel 4.
In the case of bonding and mounting the semiconductor chip 1 on the upper side, first, the bonding head 7 located above the component standby unit 2 descends, and the semiconductor chip 1 is adsorbed by the lower end surface thereof and then ascends, so that the semiconductor chip 1 is bonded. The lower end surface of the head 7 is attracted and lifted. Next, the bonding head 7 moves above the camera 8 together with the semiconductor chip 1 attracted to the lower end surface thereof and stops. Then, the camera 8 is turned on at this timing and turned off after a certain period of time. When the camera 8 is turned off, the image processing apparatus 10 receives the image signal once stored in the memory device 9 to start the image processing at this timing, similarly to the case of the first embodiment, and the bonding head 7 The misalignment in the X, Y, and θ directions of the alignment mark on the bottom surface of the semiconductor chip 1 adsorbed on the lower end surface of is calculated. Similarly, when the camera 8 is turned off, the bonding head 7 moves above the bonding stage 5 together with the semiconductor chip 1 attracted to the lower end surface thereof at this timing. When the calculation of the positional deviation by the image processing device 10 is completed, the image processing device 10 subsequently controls the position correction of the bonding head 7 in each of the X, Y, and θ directions based on the calculation result. The position of the bonding head 7 in the X, Y, and θ directions is finely adjusted, and thereby the positional deviation of the semiconductor chip 1 attracted to the lower end surface of the bonding head 7 is corrected. When the correction of the positional deviation is completed, the bonding head 7 is lowered, the semiconductor chip 1 is placed at a predetermined position on the liquid crystal display panel 4, and the semiconductor chip 1 is immediately moved to the liquid crystal display panel 4 by the lower end surface of the bonding head 7. Bonded in place on top. Next, when the bonding head 7 is lifted after releasing the suction to the semiconductor chip 1, the semiconductor chip 1 is bonded and mounted at a predetermined position on the liquid crystal display panel 4.

Therefore, even with this bonding apparatus,
As in the case of the first embodiment, the image processing and the upward movement of the liquid crystal display panel 4 of the semiconductor chip 1 are performed in parallel, so that the processing time is greatly shortened and the productivity is improved. be able to. Also, in this bonding device,
Since the semiconductor chip 11 after the positional deviation is corrected is placed at a predetermined position on the liquid crystal display panel 13 and immediately bonded, the positional deviation can be prevented during the bonding.

[0016]

As described above, according to the first aspect of the invention, the image processing and the movement of one electronic component are performed in parallel, so that the processing time is greatly shortened and the productivity is improved. Can be improved. According to the second aspect of the invention, since the bonding head with the suction mechanism is used, one electronic component after the positional deviation is corrected is placed at a predetermined position on the other electronic component and immediately bonded. Therefore, it is possible to prevent misalignment during bonding.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a timing chart of this bonding apparatus.

FIG. 3 is a schematic view of a bonding apparatus in a second embodiment of the present invention.

FIG. 4 is a schematic view of a conventional bonding apparatus.

FIG. 5 is a timing chart of this conventional bonding apparatus.

[Explanation of symbols]

 1 semiconductor chip 2 component standby unit 4 liquid crystal display panel 5 bonding stage 6 component suction head 7 bonding head 8 camera 9 memory device 10 image processing device

Claims (2)

[Claims] 1. When bonding one electronic component to another electronic component, first, the one electronic component is positioned above a camera, and in this state, an image of the one electronic component is taken by the camera. A corresponding image signal is stored in a memory device, and then an image processing device calculates the positional deviation of the one electronic component with respect to the other electronic component based on the image signal stored in the memory device. During the period, the one electronic component is moved above the other electronic component, and then the positional deviation of the one electronic component with respect to the other electronic component is corrected based on the calculation result of the image processing apparatus. After that, the one electronic component is bonded onto the other electronic component. 2. A bonding head with a suction mechanism sucks the one electronic component and positions it above the camera,
After that, the bonding head with the suction mechanism is moved above the other electronic component together with the one electronic component attracted thereto, and then the bonding head with the suction mechanism is moved based on the calculation result of the image processing apparatus. 2. The bonding method according to claim 1, wherein the positional deviation of the one electronic component with respect to the other electronic component is corrected by finely adjusting the position.