JPH05243168A - Substrate temperature control device - Google Patents

Abstract

PURPOSE:To enable a substrate to be quickly heated and cooled by a method wherein a heater is arranged adjacent to a container of coolant which cools the substrate from its rear side coming into contact with it. CONSTITUTION:A substrate 2 placed on a substrate holder 3 is made to bear against a case 21 through the intermediary of a support plate 11 and a support pole 4 by moving an up-down mechanism upwards. The case 21 is wound with a resistive heater 22 which releases heat with a power supply 26 and heats the substrate 2 by thermal conduction. At this point, a thermocouple wire 24 is fitted to the case 21 to measure temperatures, and the output of the power supply 26 is controlled by a controller 25 to keep the substrate 2 at a certain temperature. On the other hand, when the substrate 2 is cooled, the coolant is circulated in the case 21. By this setup, a substrate can be quickly heated and cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to substrate temperature control in an apparatus for forming a thin film on a substrate in vacuum.

[0002]

2. Description of the Related Art FIG. 2 shows, for example, Open Technical Report 91-17446.
FIG. 5 is a cross-sectional view showing a conventional apparatus for heating and cooling the substrate shown in FIG. 1, in which 1 is a vacuum chamber, 2 is a substrate, 3 is a substrate holder, 4 is a support column, 5 is a rotating body, 6 is a bearing, 8 is a bellows, 12 is a joint having a clutch mechanism, 13
Is a motor, 15 is a column, 18 is a pneumatic cylinder, 19
Is a motor mount, 20 is a substrate heater, 42 is an insulator, 44 is a ring having a thrust bearing function, 45 is a pulley, 46 is a belt, 47 is a pulley, and 48 is a rotational force that isolates atmospheric pressure and vacuum from each other. A rotation introducing mechanism for transmitting, 49 is an insulating cylinder, 50 is a container, 51 is a pin, and 52 is a tube.

Next, the operation will be described. A cooling body, that is, a cooling medium for cooling the substrate 2 is introduced into the container 50 through the tube 52 and comes into contact with the back surface of the substrate 2. The substrate 2 is held by the substrate holder 3, and the support column 4 supporting the holder 3 is held by the rotating body 5 having the bearing 6 on the inner diameter and the gear on the outer diameter. The rotational force generated by a motor (not shown) includes a joint 12 having a clutch mechanism, a pulley 45, a belt 46, a pulley 47, a rotation introducing mechanism 48 that isolates atmospheric pressure from vacuum and transmits the rotational force, an insulating cylinder 49, It is transmitted through the container 50, the pin 51, and the substrate holder 3 to rotate the substrate 2. The load lock operation of the substrate 2 is performed by the pneumatic cylinder 18, and its movement is performed via the support column 15, the ring 44 having the thrust bearing function, the bearing 6, the rotating body 5, the insulator 42, the support column 4, and the substrate holder 3. Is transmitted to move the substrate 2 up and down. When the substrate 2 moves upward, the backside of the substrate contacts the container 50, where the tube 5 is transferred via heat transfer.
It is cooled by the refrigerant injected into the chamber 2 and controlled to a temperature lower than the temperature in the vacuum container (not shown). When depositing a thin film on the substrate 2 at a temperature higher than the temperature in the vacuum container, heating is performed by the substrate heating heater 20 and the temperature is controlled as in the conventional case.

[0004]

The conventional substrate temperature control device is configured as described above, and since the container 50 is interposed between the substrate 2 and the substrate heating heater 20, when the substrate is heated. , Indirectly heating the substrate,
There is a problem that it takes time to heat the substrate.

The present invention has been made to solve the above problems, and an object thereof is to obtain a substrate temperature control device capable of quickly heating and cooling a substrate.

[0006]

SUMMARY OF THE INVENTION A substrate temperature control device according to the present invention includes a heater heater wire (a resistance heating element) at a position close to a substrate in a coolant container for contacting the substrate to cool the substrate from the back side. ) Is arranged.

[0007]

In the substrate temperature control device according to the present invention, the heater is provided between the container and the substrate, and the amount of heat generated by the heater is directly transferred to the substrate by heat conduction.

[0008]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a vacuum chamber, 2 is a substrate, 3 is a substrate holder, 4 is a column, and 7 is a thin film formed on the substrate. Reference numeral 9 is an atom or cluster of thin film material, or ion or cluster ion, 10 is an evaporation source that generates the substance 9, 11 is a support plate that supports the column 4, 14 is a vertical axis that separates atmospheric pressure from vacuum and moves up and down the central axis. Up and down mechanism,
21 is a hollow closed container for containing a refrigerant (liquid nitrogen), 21
a and 21b are inlets and outlets of the refrigerant, 22 is a heater (resistive heating element) embedded in the lower part of the container in a spiral and wound around the periphery of the container, 23 is a disk arranged at the lower part of the container 21, Reference numeral 24 is a thermocouple wire embedded in the disc, and 25 is a controller for controlling the output of the power supply 26 so that the electromotive force of the thermocouple wire 24 is converted into temperature and kept constant at a predetermined temperature. The arrow A is connected to the vacuum exhaust device.

Next, the operation will be described. The substrate 2 placed on the substrate holder 3 is pressed against the container 21 via the support plate 11 and the support 4 by the upward movement of the vertical mechanism 14. A resistance heating element 22 which is heated by a power source 26 is wound around the container 21 to heat the substrate 2 by heat conduction. At this time, the temperature is measured by the thermocouple wire 24 attached to a part of the container close to the substrate 2, and the controller 2
5, the output of the power supply 26 is controlled so that the temperature becomes constant. On the other hand, when the substrate 2 is cooled, the refrigerant is circulated in the container 21.

[0010]

As described above, according to the present invention, since the heater is arranged in the container for accommodating the refrigerant so as to be in contact with the substrate, the heater is quickly heated. It can be cooled or cooled.

[Brief description of drawings]

FIG. 1 is a sectional side view showing a substrate temperature control device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional side view showing a conventional substrate temperature control device.

[Explanation of symbols]

 1 Vacuum Tank 2 Substrate 3 Substrate Holder 4 Support 14 Vertical Mechanism 21 Container 22 Resistance Heating Element 23 Disc 24 Thermocouple Wire 25 Controller 26 Power Supply

Claims (1)

[Claims] 1. A hollow airtight container having a refrigerant inlet / outlet and airtight in a high vacuum, a heater and a thermocouple wire arranged at the bottom of the container, and a holder for holding a substrate are vertically moved. Substrate temperature including an up-and-down mechanism for bringing the substrate into and out of the container from below, and a control device for taking in the thermoelectromotive force from the thermocouple wire and controlling the output power of the power source of the heating heater to reach a predetermined temperature Control device.