JPH052401U - Electronic component mounting structure - Google Patents

Abstract

(57) [Summary] [Object] To provide a mounting structure capable of suppressing deterioration of characteristics due to heat generation when an electronic component such as a dielectric filter or an antenna duplexer is mounted on a printed circuit board. [Structure] A metal heat sink 9 is attached to the printed circuit board 6, and an opening 10 is cut out in the printed circuit board 6. Then, the case 2 of the antenna duplexer 1 is mounted on the heat dissipation plate 9 in the opening 10.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a mounting structure of an electronic component that can suppress deterioration of characteristics due to heat generation of the electronic component when the electronic component such as a dielectric filter or an antenna duplexer is mounted on a printed board.

[0002]

[Prior Art]

 For example, an antenna duplexer used in mobile communication devices such as mobile phones has a function of separating transmitted and received radio waves so that transmitted and received radio waves do not mix with each other. This antenna duplexer is mounted on a printed circuit board together with other electronic components and incorporated in the communication device. When mounting such an antenna duplexer on a printed circuit board, conventionally, a structure as shown in FIG. 3 has been adopted. Reference numeral 20 denotes an antenna duplexer, which mainly houses a reception filter and a transmission filter in a metal case 21, and a reception terminal 22, a transmission terminal 23, and an antenna terminal 24 connected to the respective filters from the case 21. It is configured to project. Reference numeral 25 is a printed circuit board, which is formed by patterning input / output electrodes 27 and a ground electrode 28 on the surface of an insulating PCB substrate, for example. Then, the antenna duplexer 20 is arranged at a predetermined position on the printed circuit board 25, the fixing piece 21b of the metal case 21 is fixed to the printed circuit board 25 by soldering, and each ground terminal of the case 21 is fixed. 21 a is connected to the ground electrode 28, the reception terminal 22, the transmission terminal 23, and the antenna terminal 24 are respectively inserted, and soldered to the output electrode 27.

[0003]

[Problems to be solved by the device]

 By the way, in mobile communication devices such as the above-mentioned mobile phones, miniaturization is demanded from the viewpoint of their application, and along with this, miniaturization of antenna duplexers is also progressing. However, if the conventional antenna duplexer is miniaturized, the insertion loss of the transmission filter is likely to be deteriorated. As a result, the antenna duplexer heats up, which further deteriorates the insertion loss, causing a vicious circle. Here, in order to suppress the deterioration of insertion loss, it is effective to dissipate the heat generated by the antenna duplexer. However, it is difficult at present because the heat dissipation effect of the conventional PCB substrate is small.

The present invention has been made in view of the above conventional circumstances, and an object thereof is to provide a mounting structure of an electronic component capable of improving the heat dissipation effect of an antenna duplexer and suppressing deterioration of insertion loss due to heat generation. There is.

[0005]

[Means for Solving the Problems]

 Therefore, in the present invention, in a structure in which a heat-generating electronic component is mounted on a printed circuit board, a metal heat dissipation plate is attached to the printed circuit board, and an opening having a size into which the electronic component is inserted is formed in the printed circuit board. The electronic component is mounted on the heat dissipation plate in the opening.

[0006]

[Action]

 According to the electronic component mounting structure of the present invention, the heat sink is attached to the printed circuit board, the opening is formed in the printed circuit board, and the electronic component is mounted on the heat sink in the opening. The plate promotes heat dissipation from electronic components, and the deterioration of characteristics due to heat generation can be suppressed accordingly.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are views for explaining a mounting structure of an electronic component according to an embodiment of the present invention. In this embodiment, a case where an antenna duplexer used in a mobile phone is surface-mounted on a printed circuit board will be described as an example. In the figure, reference numeral 1 denotes an antenna duplexer, in which a reception filter and a transmission filter (not shown) are arranged in a metal case 2, and an earth terminal 2a and a connecting piece 2b are integrally projected from the case 2. Formed and configured. The transmission filter and reception filter have a structure in which multiple dielectric resonators are coupled together via a coupling substrate. One end of the antenna terminal 3 is connected to a branch portion between the transmission filter and the reception filter, and the other end of the terminal 3 projects outward from the central opening of the case 2. Further, one ends of the transmission terminal 4 and the reception terminal 5 are connected to the outer ends of the transmission filter and the reception filter, respectively, and the other ends of the terminals 4 and 5 are connected to the openings of both ends of the case 2. It is projected outward.

Further, 6 is a first printed circuit board, and a second printed circuit board 7 faces the lower surface of this printed circuit board 6. The first and second printed circuit boards 6 and 7 are formed by patterning circuit wiring (not shown) on the surfaces of the PCB boards 6a and 7a, respectively. A large number of electronic components 8 ... Are mounted on the first and second printed circuit boards 6 and 7, and the input and output portions of each electronic component 8 are connected to the circuit wiring.

A thin metal heat dissipation plate 9 is disposed between the first and second printed boards 6 and 7, and the heat dissipation plate 9 is attached to both the boards 6 and 7. There is. The grounding portion of each electronic component 8 is connected to the heat sink 9 through the through holes formed in the substrates 6 and 7, whereby the heat sink 9 also functions as a grounding shield plate. There is.

An opening 10 having a size into which the case 2 is inserted is cut out and formed in the first printed circuit board 6, whereby heat is dissipated into the opening 10 of the first printed circuit board 6. The plate 9 is exposed. A transmission line 11, an antenna line 12, and a reception line 13 are patterned on one edge of the opening 10 of the printed circuit board 6, and a ground line 14 is patterned between the patterns 11 to 13. Is made. The case 2 of the antenna duplexer 1 is inserted and arranged on the upper surface of the heat sink 9 inside the opening 10. The case 2 mechanically connects the connecting piece 2b of the case 2 to the heat sink 9 via the solder 15. ， Electrically connected. Further, the transmission terminal 4, the antenna terminal 3, and the reception terminal 5 of the antenna duplexer 1 are soldered to the transmission line 11, the antenna line 12, and the reception line 13, respectively, and each earth of the case 2 is grounded. The terminal 2a is connected to the earth line 14 by soldering.

Next, the function and effect of this embodiment will be described. According to the mounting structure of the present embodiment, the heat dissipation plate 9 is arranged between the first and second printed circuit boards 6 and 7, and the opening 10 is formed in the first printed circuit board 6 so that the opening 10 Since the antenna duplexer 1 is directly connected to the heat dissipation plate 9, the heat generated by the antenna duplexer 1 is dissipated through the heat dissipation plate 9, so that the deterioration of the insertion loss due to the heat generation can be suppressed, and by extension the antenna described above. It is possible to respond to downsizing of the shared device 1. Moreover, the heat dissipation plate 9 of this embodiment can also be used as a grounding shield plate of each electronic component 8, and the increase in cost can be reduced. In addition, in this embodiment, since the antenna duplexer 1 is inserted into the opening 10 of the printed circuit board 6, the mounting height can be reduced as compared with the case of mounting on the conventional printed circuit board. Only can be downsized.

In the above embodiment, the antenna duplexer has been described as an example, but the present invention is not limited to this, and the point is that it can be applied to the case where a heat-generating electronic component is mounted on a printed circuit board.

[0013]

[Effect of the device]

 As described above, according to the electronic component mounting structure of the present invention, the metal heat sink is attached to the printed circuit board, the opening is formed in the printed circuit board, and the electronic component is mounted on the heat sink in the opening. Since it is mounted, this heat dissipation plate promotes heat dissipation from electronic components, and thus has the effect of suppressing deterioration of characteristics due to heat generation.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a mounting structure of an antenna duplexer according to an exemplary embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a state in which the antenna duplexer of the above embodiment is mounted on a printed board.

FIG. 3 is an exploded perspective view showing a conventional mounting structure.

[Explanation of symbols]

 1 Antenna duplexer (electronic parts) 6 Printed circuit board 9 Heat sink 10 Opening

Claims (1)

[Claims for utility model registration] [Claim 1] In a structure in which electronic components that generate heat are mounted on a printed circuit board, a metal radiator plate is attached to the back surface of the printed circuit board, and the electronic component is inserted into the printed circuit board. An electronic component mounting structure, characterized in that an opening of a size corresponding to the above is formed, and the electronic component is mounted inside the opening of the heat dissipation plate.