JPH05235079A - Electric-discharge device for wire bonder - Google Patents
Electric-discharge device for wire bonderInfo
- Publication number
- JPH05235079A JPH05235079A JP4039217A JP3921792A JPH05235079A JP H05235079 A JPH05235079 A JP H05235079A JP 4039217 A JP4039217 A JP 4039217A JP 3921792 A JP3921792 A JP 3921792A JP H05235079 A JPH05235079 A JP H05235079A
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- wire
- bonder
- high voltage
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はボンディングワイヤ先端
に対するボール形成技術、特に、金線の先端に放電によ
り金ボールを形成するために用いて効果のある技術に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball forming technique for a tip of a bonding wire, and more particularly to a technique effective for forming a gold ball on the tip of a gold wire by electric discharge.
【０００２】[0002]
【従来の技術】半導体チップのパッドまたは基板のパタ
ーンに対し、金線を用いてワイヤボンディングを行う場
合、金線の先端に金ボールを形成してボンディングし、
必要な接続強度を得る方法がある。金ボールは、金線先
端に放電装置の放電電極を接近させて放電を行い、その
際の溶融固化により形成される。そして、金ボールは、
放電電極に対する通電電流、印加電圧、放電時間などを
条件として所定のサイズが形成される。2. Description of the Related Art When wire bonding is performed on a pad of a semiconductor chip or a pattern of a substrate by using a gold wire, a gold ball is formed at the tip of the gold wire,
There are ways to get the required connection strength. The gold ball is formed by bringing the discharge electrode of the discharge device close to the tip of the gold wire to cause discharge, and melting and solidifying at that time. And the gold ball is
A predetermined size is formed under the conditions of the current supplied to the discharge electrode, the applied voltage, the discharge time, and the like.
【０００３】[0003]
【発明が解決しようとする課題】本発明者の検討によれ
ば、金線の先端に放電を利用して金ボールを形成する技
術は、リードとリードを結線するグランド（ＧＮＤ）ボ
ンド時にファースト側の圧着に用いる金ボール径を大き
めに作りたいという要求に応えられないという問題があ
る。According to the study by the present inventor, the technique of forming a gold ball by utilizing an electric discharge at the tip of a gold wire is the first side at the time of a ground (GND) bond connecting the leads. There is a problem that it is not possible to meet the demand for making the diameter of the gold ball used for the crimping of a large size.
【０００４】また、多種のチップを１サイクル中でボン
ディングする必要がある場合においても、パッド部の大
きさや開口部が変化していても同一ボール径でボンディ
ングを行っている。さらに、ボール径を安定させる為に
必要不可欠なスパークギャップの安定化においても、リ
ードフレームの状態やテールクランパ部の作動不安定に
よる変動や金ワイヤの伸びなどにより、形成したボール
径のばらつき及び断線を招いている。Further, even when various types of chips need to be bonded in one cycle, bonding is performed with the same ball diameter even if the size of the pad portion or the opening portion changes. Furthermore, even in the stabilization of the spark gap, which is essential for stabilizing the ball diameter, variations in the formed ball diameter and wire breakage due to fluctuations due to lead frame conditions, instability of the tail clamper operation, and elongation of the gold wire. Is invited.
【０００５】そこで、本発明の目的は、ボール径を所望
の大きさにすることのできる技術を提供することにあ
る。Therefore, an object of the present invention is to provide a technique capable of making a ball diameter a desired size.
【０００６】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述及び添付図面から明らかにな
るであろう。The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.
【０００７】[0007]
【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
以下の通りである。Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.
【０００８】すなわち、ボンディングワイヤの先端と放
電トーチの間に印加した高電圧により放電を行って前記
ボンディングワイヤの先端にボールを形成するワイヤボ
ンダの放電装置であって、放電条件に従ってボンディン
グワイヤに対する放電制御を行う放電制御部と、該放電
制御部に設定された放電圧及び放電流に従って発生した
高電圧を前記放電トーチに印加する高圧発生部と、前記
放電制御部に設定された放電時間に従って前記高圧発生
部の動作時間を制御するタイマ部と、入力された放電条
件を前記放電制御部へ転送すると共にボンディング制御
を行うボンダ制御部とを設けるようにしている。That is, a discharge device of a wire bonder that discharges by a high voltage applied between the tip of a bonding wire and a discharge torch to form a ball at the tip of the bonding wire. And a high voltage generator for applying a high voltage generated according to the discharge voltage and discharge current set in the discharge controller to the discharge torch, and the high voltage according to the discharge time set in the discharge controller. A timer unit that controls the operation time of the generation unit and a bonder control unit that transfers the input discharge conditions to the discharge control unit and performs bonding control are provided.
【０００９】[0009]
【作用】上記した手段によれば、放電条件をボンダ制御
部で入力し、これを放電制御部に転送することで、ソフ
トウェアにより放電条件を外部から制御することができ
る。したがって、ボール径を所望の大きさにすることが
可能になる。According to the above means, the discharge condition can be externally controlled by software by inputting the discharge condition to the bonder control unit and transferring it to the discharge control unit. Therefore, the ball diameter can be set to a desired size.
【００１０】[0010]
【実施例】図１は本発明によるワイヤボンダの放電装置
の一実施例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of a wire bonder discharge device according to the present invention.
【００１１】キャピラリ１からは金線２が引き出され、
この金線２に対向させて放電トーチ３が配設されてい
る。放電トーチ３には放電装置本体部４の出力が印加さ
れ、この放電装置本体部４はボンダ制御部５によって制
御される。また、キャピラリ１のＺ方向の駆動は、Ｚ駆
動モータ６によって行われる。A gold wire 2 is drawn out from the capillary 1,
A discharge torch 3 is arranged so as to face the gold wire 2. The output of the discharge device body 4 is applied to the discharge torch 3, and the discharge device body 4 is controlled by the bonder controller 5. Further, the driving of the capillary 1 in the Z direction is performed by the Z drive motor 6.
【００１２】放電装置本体部４は、ボンダ制御部５を上
位として放電処理を実行する放電制御部７（ＣＰＵを主
体に構成されている）、放電制御部７の管理のもとに放
電トーチ３に高電圧を印加する高圧発生部８、高圧発生
部８の動作時間を設定するタイマ部９、及び高圧発生部
８から流れ出た電流値を検出して放電ミスが発生した際
に自動復帰動作をさせて金線２に電位を与えたときの該
電位のモニタを行う制御部１０の各々から構成され、放
電時の条件である電流、電圧、時間をワイヤ単位あるい
はグループ単位（放電条件を複数のワイヤをまとめて設
定）で任意に設定することができる。また、制御部１０
に接続される点線部分は、ワイヤボンダで使用する放電
トーチユニットの概略を示し、放電電圧、放電電流、放
電時間を放電制御部７から与えられたデータに従ってア
ーク放電を行うためのものである。なお、１３はボンダ
制御部５と放電制御部７を結ぶデータバスである。The main body 4 of the discharge device includes a discharge controller 7 (mainly composed of a CPU) for executing a discharge process with the bonder controller 5 as a host, and the discharge torch 3 under the control of the discharge controller 7. A high voltage generator 8 that applies a high voltage to the battery, a timer 9 that sets the operating time of the high voltage generator 8, and a current value that flows out from the high voltage generator 8 are detected, and an automatic recovery operation is performed when a discharge error occurs. The control unit 10 is configured to monitor the electric potential when the electric potential is applied to the gold wire 2. Wires can be set at once). In addition, the control unit 10
The dotted line portion connected to indicates the outline of the discharge torch unit used in the wire bonder, and is for performing arc discharge according to the data given from the discharge control unit 7 regarding the discharge voltage, discharge current, and discharge time. A data bus 13 connects the bonder controller 5 and the discharge controller 7.
【００１３】さらに、ボンダ制御部５には、Ｚ駆動モー
タ６を制御するためのモータ制御部１１が接続され、こ
のモータ制御部１１にはＺ駆動モータ６を駆動するドラ
イバ１２が接続されている。Further, the bonder control section 5 is connected to a motor control section 11 for controlling the Z drive motor 6, and the motor control section 11 is connected to a driver 12 for driving the Z drive motor 6. ..
【００１４】以上の構成において、放電の開始時間はボ
ンダ制御部５より発せられる指令によって放電制御部７
が実行し、また、放電時の電流、電圧、放電時間などの
条件は放電制御部７によって設定される。設定された時
間に基づく実行はタイマ部９によってなされ、設定され
た電流及び電圧による高電圧の発生は高圧発生部８によ
って実行される。放電に際しては、スパークギャップが
キャピラリ１の上下動によって行われ、この制御はボン
ダ制御部５及びモータ制御部１１が担当する。In the above structure, the discharge start time is determined by the command issued from the bonder controller 5 as the discharge start time.
The discharge control unit 7 sets conditions such as the current, voltage, and discharge time during discharge. The execution based on the set time is performed by the timer unit 9, and the high voltage generation by the set current and voltage is performed by the high voltage generation unit 8. At the time of discharging, a spark gap is performed by the vertical movement of the capillary 1, and this control is performed by the bonder control unit 5 and the motor control unit 11.
【００１５】高圧発生部８で生成した高電圧は放電トー
チ３に印加され、金線２との間で放電を開始する。この
放電の持続時間はタイマ部９で設定された時間である。
放電によって金線２の先端は溶融し、ボール状になる。
このときのボール径は、放電時の電流、電圧、放電時間
によって一義的に定まる。The high voltage generated by the high voltage generator 8 is applied to the discharge torch 3 to start discharge with the gold wire 2. The duration of this discharge is the time set by the timer unit 9.
Due to the electric discharge, the tip of the gold wire 2 is melted into a ball shape.
The ball diameter at this time is uniquely determined by the current, voltage, and discharge time during discharge.
【００１６】なお、ボンダ制御部５は、放電制御部７に
対して割り込みをかけ、あるいはＺ駆動モータ６の制御
を一定の範囲（金ボールを形成できる範囲であって装置
ごとに異なる）内で可能とし、スパークギャップも同時
に制御（ボール形成後のボールと放電トーチ３との間の
ギャップを、電流値を検出しながらキャピラリを下降さ
せて制御）することができる。The bonder control unit 5 interrupts the discharge control unit 7 or controls the Z drive motor 6 within a certain range (a range in which gold balls can be formed and varies depending on the device). It is possible to control the spark gap at the same time (the gap between the ball after ball formation and the discharge torch 3 can be controlled by lowering the capillary while detecting the current value).
【００１７】また、トーチロッドと金線の先端部を接触
させて金線先端の位置を検出することで、スパークギャ
ップの安定化を図ることができる。一般に、このスパー
クギャップはボンディングサイクルの中でリード側ボン
ディング後の上昇サイクル時のクランパーによるクラン
ピングによって決定され、クランパーの動作不良などに
より変動が発生し易いが、本発明により安定化が可能に
なる。Further, the spark gap can be stabilized by bringing the torch rod into contact with the tip of the gold wire and detecting the position of the tip of the gold wire. Generally, this spark gap is determined by clamping by the clamper during the ascending cycle after the lead side bonding in the bonding cycle, and is likely to fluctuate due to malfunction of the clamper or the like, but the present invention enables stabilization. ..
【００１８】また、放電制御に必要なデータは、ワイヤ
リングデータ作成時にボンダ制御部５へ入力し、これを
放電制御部７のデータエリア（不図示）へ転送する。さ
らに、動作中はボンダ制御部５のＣＰＵと放電制御部７
のＣＰＵとの間でワイヤリングなどに関するデータ通信
が行われる。Data required for discharge control is input to the bonder control unit 5 when the wiring data is created and transferred to the data area (not shown) of the discharge control unit 7. Further, during operation, the CPU of the bonder controller 5 and the discharge controller 7
Data communication regarding wiring and the like is performed with the CPU.
【００１９】以上のように本実施例によれば、初期の金
ボール（金線先端と放電トーチ間のアーク放電による熱
によって溶かされた金線が形成するボール）を長期に渡
って安定（従来は、放電終了後に形成されるボールの大
きさを安定にすることは難しかった）にすることができ
る。また、ボンディングパッドの大きさやボンディング
ポイントの状態に合わせて金ボールを変化させることも
できる。As described above, according to this embodiment, the initial gold ball (the ball formed by the gold wire melted by the heat of the arc discharge between the tip of the gold wire and the discharge torch) is stable for a long time (conventional). It was difficult to stabilize the size of the ball formed after the end of discharge). Further, the gold ball can be changed according to the size of the bonding pad and the state of the bonding point.
【００２０】また、放電時間と放電電流を次のように設
定することにより、再結晶幅を調整することができる。
ここでは、再結晶幅を大と小の２つに形成する場合を例
にする。Further, the recrystallization width can be adjusted by setting the discharge time and the discharge current as follows.
Here, the case where the recrystallization width is formed into two large and small widths is taken as an example.
【００２１】 放電時間：短め、放電電流：大 ⇒ 再結晶幅小 放電時間：長め、放電電流：小 ⇒ 再結晶幅大 このように再結晶幅を形成することで、アーチ高さの調
整が容易になり、千鳥パッドボンディングなどに適用す
るのに最適となる。Discharge time: short, discharge current: large ⇒ small recrystallization width Discharge time: long, discharge current: small ⇒ large recrystallization width By thus forming the recrystallization width, the arch height can be easily adjusted. This makes it ideal for application in staggered pad bonding.
【００２２】以上、本発明者によってなされた発明を実
施例に基づき具体的に説明したが、本発明は前記実施例
に限定されるものではなく、その要旨を逸脱しない範囲
で種々変更可能であることは言うまでもない。Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.
【００２３】[0023]
【発明の効果】本願において開示される発明のうち、代
表的なものによって得られる効果を簡単に説明すれば、
下記の通りである。The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.
【００２４】すなわち、ボンディングワイヤの先端と放
電トーチの間に印加した高電圧により放電を行って前記
ボンディングワイヤの先端にボールを形成するワイヤボ
ンダの放電装置であって、放電条件に従ってボンディン
グワイヤに対する放電制御を行う放電制御部と、該放電
制御部に設定された放電圧及び放電流に従って発生した
高電圧を前記放電トーチに印加する高圧発生部と、前記
放電制御部に設定された放電時間に従って前記高圧発生
部の動作時間を制御するタイマ部と、入力された放電条
件を前記放電制御部へ転送すると共にボンディング制御
を行うボンダ制御部とを設けるようにしたので、放電条
件をソフトウェアで外部から制御でき、ボール径を所望
の大きさにすることが可能になる。That is, a discharge device of a wire bonder that discharges by a high voltage applied between the tip of a bonding wire and a discharge torch to form a ball at the tip of the bonding wire. And a high voltage generator for applying a high voltage generated according to the discharge voltage and discharge current set in the discharge controller to the discharge torch, and the high voltage according to the discharge time set in the discharge controller. Since a timer unit that controls the operating time of the generator and a bonder controller that transfers the input discharge conditions to the discharge controller and performs bonding control are provided, the discharge conditions can be controlled externally by software. It is possible to make the ball diameter a desired size.
【図１】本発明によるワイヤボンダの放電装置の一実施
例を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of a wire bonder discharge device according to the present invention.
１ キャピラリ ２ 金線 ３ 放電トーチ ４ 放電装置本体部 ５ ボンダ制御部 ６ Ｚ駆動モータ ７ 放電制御部 ８ 高圧発生部 ９ タイマ部 １０ 制御部 １１ モータ制御部 １２ ドライバ １３ データバス 1 Capillary 2 Gold Wire 3 Discharge Torch 4 Discharge Device Main Unit 5 Bonder Control Unit 6 Z Drive Motor 7 Discharge Control Unit 8 High Voltage Generation Unit 9 Timer Unit 10 Control Unit 11 Motor Control Unit 12 Driver 13 Data Bus
Claims (4)
の間に印加した高電圧により放電を行って前記ボンディ
ングワイヤの先端にボールを形成するワイヤボンダの放
電装置であって、放電条件に従ってボンディングワイヤ
に対する放電制御を行う放電制御部と、該放電制御部に
設定された放電圧及び放電流に従って発生した高電圧を
前記放電トーチに印加する高圧発生部と、前記放電制御
部に設定された放電時間に従って前記高圧発生部の動作
時間を制御するタイマ部と、入力された放電条件を前記
放電制御部へ転送すると共にボンディング制御を行うボ
ンダ制御部とを具備することを特徴とするワイヤボンダ
の放電装置。1. A discharge device of a wire bonder, which discharges by a high voltage applied between the tip of a bonding wire and a discharge torch to form a ball at the tip of the bonding wire, wherein discharge control for the bonding wire is performed according to discharge conditions. And a high voltage generator for applying a high voltage generated according to the discharge voltage and discharge current set in the discharge controller to the discharge torch, and the high voltage according to the discharge time set in the discharge controller. A wire bonder discharge device comprising: a timer unit for controlling an operation time of a generation unit; and a bonder control unit for transferring an inputted discharge condition to the discharge control unit and for performing bonding control.
ープ単位で設定することを特徴とする請求項１記載のワ
イヤボンダの放電装置。2. The discharge device for a wire bonder according to claim 1, wherein the discharge condition is set in a wire unit or a group unit.
流を反比例させることを特徴とする請求項１記載のワイ
ヤボンダの放電装置。3. The discharge device for a wire bonder according to claim 1, wherein the discharge current is made inversely proportional to the increase / decrease in the discharge time.
ことを特徴とする請求項１記載のワイヤボンダの放電装
置。4. The wire bonder discharge device according to claim 1, wherein the bonding wire is a gold wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4039217A JPH05235079A (en) | 1992-02-26 | 1992-02-26 | Electric-discharge device for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4039217A JPH05235079A (en) | 1992-02-26 | 1992-02-26 | Electric-discharge device for wire bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05235079A true JPH05235079A (en) | 1993-09-10 |
Family
ID=12546975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4039217A Pending JPH05235079A (en) | 1992-02-26 | 1992-02-26 | Electric-discharge device for wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05235079A (en) |
-
1992
- 1992-02-26 JP JP4039217A patent/JPH05235079A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6232211B1 (en) | Two-step projecting bump for semiconductor chip and method for forming the same | |
| US3934108A (en) | Lead bonding method and apparatus | |
| JPS60227432A (en) | Ball forming device of bonding wire | |
| US10410992B2 (en) | Ball forming device, wire-bonding apparatus, and ball formation method | |
| JPH05235079A (en) | Electric-discharge device for wire bonder | |
| JPH06101491B2 (en) | Wire bonding method and apparatus | |
| JP3091701B2 (en) | Wire bonding equipment | |
| JP2722886B2 (en) | Wire bonding equipment | |
| TW202102080A (en) | Wire bonding method and wire bonding apparatus | |
| JP3313568B2 (en) | Wire bonding apparatus and control method therefor | |
| JP3060852B2 (en) | Wire bonding method | |
| JP3417659B2 (en) | Wire bonding equipment | |
| US6739494B2 (en) | Device with electrodes for the formation of a ball at the end of a wire | |
| JP3932235B2 (en) | Ball forming apparatus and method for wire bonder | |
| JPH0536748A (en) | Wire bonding device | |
| JP2534136B2 (en) | Ball forming method in wire bonder | |
| JPH10223676A (en) | Wire ball growing method and wire bonding device | |
| JP2733363B2 (en) | Wire bonding method | |
| JP3754538B2 (en) | Bonding method and bump bonder | |
| JP2904618B2 (en) | Ball forming device for wire bonder | |
| JPH05243315A (en) | Electrode of wire bonder | |
| JPH039525A (en) | Bump forming method and its forming apparatus | |
| JPH11284008A (en) | Wire bonding method and device thereof | |
| JPS61281533A (en) | Wire bonding device | |
| JPH0536749A (en) | Wire bonder ball formation device and formation method thereof |