JPH0523499B2 - - Google Patents

Info

Publication number
JPH0523499B2
JPH0523499B2 JP61233602A JP23360286A JPH0523499B2 JP H0523499 B2 JPH0523499 B2 JP H0523499B2 JP 61233602 A JP61233602 A JP 61233602A JP 23360286 A JP23360286 A JP 23360286A JP H0523499 B2 JPH0523499 B2 JP H0523499B2
Authority
JP
Japan
Prior art keywords
bonding
pellet
pad
substrate
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61233602A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6387733A (ja
Inventor
Takao Ishibashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61233602A priority Critical patent/JPS6387733A/ja
Publication of JPS6387733A publication Critical patent/JPS6387733A/ja
Publication of JPH0523499B2 publication Critical patent/JPH0523499B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

Landscapes

  • Wire Bonding (AREA)
JP61233602A 1986-09-30 1986-09-30 自動ワイヤボンデイング方法 Granted JPS6387733A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61233602A JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61233602A JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6387733A JPS6387733A (ja) 1988-04-19
JPH0523499B2 true JPH0523499B2 (https=) 1993-04-02

Family

ID=16957625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61233602A Granted JPS6387733A (ja) 1986-09-30 1986-09-30 自動ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6387733A (https=)

Also Published As

Publication number Publication date
JPS6387733A (ja) 1988-04-19

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