JPH05226892A - Surface package method - Google Patents

Abstract

PURPOSE:To observe directly an entire of a board attaching part of a mate contact attached on a circuit board and to enable exchange of a mate contact whose attachment is defective by directly attaching and fixing the mate contact which fits to a contact such as a PGA module on a circuit board. CONSTITUTION:A jig 10 is prepared which is provided with a dummy contact 11 whose size, number and arrangement are the same as those of a contact of an electronic part to be mounted on a circuit board 1. A mate contact 12 which fits to a contact of an electronic part is fit to each dummy contact 11 of the jig 10. The jig 10 whereto the mate contact 12 is fit is mounted on a specified place. The mate contact 12 is attached and fixed on the circuit board 1. The jig 10 is removed from on the circuit board 1. A contact of an electronic part is fit to the mate contact 12 attached and fixed on the circuit board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting electronic components on a circuit board, and more particularly to a surface mounting method for mounting electronic components on which contact is established at small intervals on a circuit board.

[0002]

2. Description of the Related Art The number of input and output (I / O) terminals per unit area of a circuit board has dramatically increased with the improvement of high-density packaging technology of ICs. In response to the dramatic increase in the number of I / O terminals, a pin grid array system or PGA system is adopted for mounting electronic components such as a central processing unit module for a large computer. FIGS. 6A and 6B show a state in which the PGA module is mounted on the circuit board by the surface mounting technique. Figure 6
The means (a) is a surface mounting method for directly fixing the PGA module on the circuit board. In the figure, (1) is the circuit board, (2) is the PGA module, (3) is the pin contact of the PGA module, and ( 4) is a land of a circuit pattern provided on the surface of the circuit board (1), and (5) is a solder for connecting the pin contact (3) and the land (4) of the circuit pattern. Further, the means shown in FIG. 6B is one in which a connector is first mounted on the circuit board and then the PGA module is mounted on the connector. In the figure, as in FIG. 6A, (1) is a circuit board and (2) is PGA.
Modules, (3) are pin contacts of the PGA module, and (4) are land of the circuit pattern on the circuit board. Further, (6) is a connector that fits with the PGA module, and (7) is its base, which is generally made of an insulating material such as ceramics or plastic.
Reference numeral (8) denotes a contact portion of a contact attached to the base of the connector, which is fitted with the pin contact of the PGA module (2). Reference numeral (9) denotes a terminal portion of the contact attached to the base (7) of the connector, which is fixed to the land (4) of the circuit pattern of the circuit board (1) by the solder (5).

[0003]

Since the conventional device has been described with reference to FIG. 6, there are the following problems to be solved, for example. (1) In a recent PGA module having a large number of pin contacts (3), for example, 50 to 300 arranged in vertical and horizontal rows, not to mention the case shown in FIG. 6A. That is, even when the soldering condition is through the connector (6) as shown in FIG. 6B, the soldering condition of the outer peripheral part can be visually inspected and the soldering condition of the central part is , PGA module, etc., it is difficult to perform reliable inspection easily by using a mirror or X-ray. (2) In the case where the pin contact (3) of the PGA module of FIG. 6 (a) is directly soldered to the land (4) of the circuit pattern of the circuit board (1), the height of the pin contact (3) of the PGA module is high. In addition, high accuracy is required, and if this is not satisfied, reliable soldering is difficult.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a surface mounting method capable of extremely easily and easily achieving highly reliable mounting of a PGA module on a circuit board.

[0005]

The above object can be achieved by taking the following means. (1) Attach a mating contact to the contact of a circuit board mounted component such as a PGA module to the circuit board,
(2) PGA to the mating contact mounted on the circuit board.
Mate contacts such as modules.

[0006]

By taking the above-mentioned means, the following actions occur. According to the present invention, the mating contact that fits the contact of the PGA module or the like is directly mounted and fixed on the circuit board, so that the entire board mounting portion of the mating contact mounted on the circuit board can be directly observed.
Also, if there is a mating contact that has been improperly installed, it is possible and easy to replace it.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of the surface mounting method of the present invention will be described below with reference to the drawings. 1 (a) (b) (c)
(D) and (e) are time-course diagrams of the present invention, and the same reference numerals as those in FIG. 6 denote the same parts. FIG. 1A shows a dummy contact (1) having the same size as the pin contact (3) of the PGA module (2) to be mounted on the circuit board (1).
Jigs (1) attached with the same number and the same arrangement
0) shows a step of fitting a mating contact (12) which is fitted to the pin contact (3) of the PGA module. In FIG. 1B, the dummy contacts (11) of the jig (10) are provided with the mating contacts (12).
The jig (10) fitted with is mounted on a predetermined position of the circuit board (1), and a means such as hot wire or hot air is added thereto,
The stage in which the mating contact (12) is attached and fixed to the circuit board (1) by solder (5) is shown. Figure 1
(C) is a contact (1) on the circuit board (1).
2 shows the stage where the jig (10) to which the dummy contact (11) is attached is removed from the circuit board (1) after the attachment of 2) so that the fixed state such as the soldered state can be observed. FIG. 1D shows the insertion hole (13a) of the mating contact (12) on the circuit board (1) for the purpose of protecting the mating contact (12) mounted on the circuit board (1) from external danger. It shows a stage in which the insulator (13) having is attached. Further, FIG. 1 (e) shows that the pin contact (3) of the PGA module (2) is inserted into the mating contact (12) on the circuit board (1) with the insulator (13) attached. , The circuit of the circuit board (1) and the PGA module (2) are electrically connected to complete the mounting. Here, the insulator (13) in FIGS. 1 (d) and (e) is not an essential means for the method of the present invention, but after the mating contact (12) is attached to the circuit board (1), the PGA module (2) is attached. This is effective when the step of mounting is carried out with another step sandwiched therebetween. 2 is a mating contact (12) mounted on the circuit board (1) shown in FIG. 1 (c).
FIG. 2 is an enlarged detail view showing a state where an insulator (13) is applied, in which (1) is a circuit board, (4) is a land of a circuit pattern, (5) is solder, (12) is a mating contact, (13) is an insulator. Further, FIG. 3 shows an arrangement state of mating contacts (12) mounted and fixed on a circuit board (1) not shown, and an insulator (1).
FIG. 3 is a partial view showing an example of an arrangement state of insertion holes (13a) of mating contacts (12) provided in 3). The mating contact (1) attached to the circuit board (1)
The number of 2) corresponds to the number of pin contacts of the PGA module (2) to be mounted, and when this number reaches 3000 or more, the contacts are arranged in a grid pattern.

Although one embodiment of the present invention has been described above, the form of the mating contact to be mounted on the circuit board (1) may correspond to the contact of the electronic component to be mounted, and the contact of the electronic component is a plug type. If so, the socket type, if the socket type, the plug type. Figure 4
(A) is an example of a coaxial type contact mounted and fixed on the circuit board (1), and a coaxial plug type contact is shown. In the figure, (1) is a circuit board, (4) is a land of a circuit pattern, (20) is a pin-shaped center conductor,
It has the shape shown in FIG. 4B, and its pedestal portion (20a) is soldered to the land (4) of the circuit board (1), for example.
(21) is an insulator, (22) is an outer conductor, and the pedestal part (22) is coaxial with the pin-shaped center conductor (20).
In a), the land (4) of the circuit pattern is soldered, for example. The insulator (21) is not essential,
It can be omitted. FIG. 5A shows a socket type contact among coaxial type contacts attached to the circuit board (1). In the figure, (20 ') is a socket type center conductor having the shape of FIG. 5 (b), and its pedestal part (20a')
At circuit pattern land of circuit board (1) (4)
For example, it is soldered. (21 ') is an insulator, (2
2 ') is an outer conductor and has a shape shown in FIG.
For example, it is soldered to the land (4) of the circuit pattern of the circuit board (1). The insulator (21 ′) can be omitted similarly to the insulator (21) shown in FIG.

[0009]

The surface mounting method according to the present invention has the above-mentioned means and actions, and therefore exhibits the following remarkable effects peculiar to the present invention. (1) According to the method of the present invention, all the circuit board mounting portions of the mating contacts mounted on the circuit board can be directly observed, so that the inspection is extremely easy. (2) According to the method of the present invention, since the mating contact is exposed on the circuit board, if the mating contact mounted on the circuit board has an improper board mounting portion,
The corresponding contact can be repaired or replaced. (3) According to the method of the present invention, if the mating contact mounted on the circuit board is covered with the insulator, it can be protected from the danger from the outside even if the manufacturing process of the electronic component is separated. (4) According to the method of the present invention, electrical contact can be made by fitting the contact of the electronic component with the mating contact mounted on the circuit board, and the contact of the electronic component can be fixed directly to the land on the circuit board. Higher precision is not required for the contact dimensions (height) compared to.

[Brief description of drawings]

FIG. 1 is a step-by-step explanatory view of the method of the present invention.

FIG. 2 is a diagram showing a protection means for a contact attached to a circuit board.

FIG. 3 is an explanatory diagram of an arrangement example of mounting contacts on a circuit board.

FIG. 4 illustrates a plug type contact mounted on a circuit board.

FIG. 5 illustrates a socket type contact mounted on a circuit board.

FIG. 6 illustrates an example of mounting components on a circuit board by a conventional surface mounting technique.

[Explanation of symbols]

 (1) Circuit board (2) PGA module (3) Pin contact (4) Circuit pattern land (5) Solder (6) Connector (7) Base (8) Contact contact part (9) Contact terminal part (10) ) Jig (11) Dummy contact (12) Counter contact (13) Insulator

Claims (1)

[Claims] 1. A jig in which dummy contacts are provided in the same size, number and arrangement as the contacts of the electronic components to be mounted on the circuit board is prepared. A mating contact that fits with the contact of the electronic component is fitted into each of the dummy contacts of the jig. The jig fitted with the mating contact is mounted on the circuit board at a predetermined location. The mating contact is mounted and fixed on the circuit board. The jig is removed from the circuit board. The contact of the electronic component is fitted to the mating contact mounted and fixed on the circuit board. A surface mounting method characterized in that the steps are sequentially performed.