JPH05226701A - Epoxy resin composition for sealing optical semiconductor - Google Patents
Epoxy resin composition for sealing optical semiconductorInfo
- Publication number
- JPH05226701A JPH05226701A JP4028044A JP2804492A JPH05226701A JP H05226701 A JPH05226701 A JP H05226701A JP 4028044 A JP4028044 A JP 4028044A JP 2804492 A JP2804492 A JP 2804492A JP H05226701 A JPH05226701 A JP H05226701A
- Authority
- JP
- Japan
- Prior art keywords
- acid anhydride
- epoxy resin
- resin composition
- hardener
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は透明性が高く、耐熱性に
優れ、かつ短時間成形が可能な光半導体封止用エポキシ
樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for encapsulating an optical semiconductor, which has high transparency and excellent heat resistance and can be molded in a short time.
【０００２】[0002]
【従来の技術】一般に発光素子および受光素子封止用に
は、透明性の優れた酸無水物硬化系のエポキシ樹脂組成
物が使用されている。例えばトランスファ成形用のエポ
キシ樹脂組成物においては、特開平１−１６７３５９号
公報、特開平２−２２２１６５号公報に開示されている
ように、硬化剤としてテトラヒドロ無水フタル酸やヘキ
サヒドロ無水フタル酸等の二塩基酸無水物が使用されて
いる。2. Description of the Related Art Generally, an acid anhydride-cured epoxy resin composition having excellent transparency is used for sealing a light emitting element and a light receiving element. For example, in an epoxy resin composition for transfer molding, as disclosed in JP-A-1-167359 and JP-A-2-222165, as a curing agent, tetrahydrophthalic anhydride, hexahydrophthalic anhydride or the like is used. Basic acid anhydrides have been used.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、一般の
エポキシ樹脂組成物は、透明性に関しては使用可能な水
準にあるものの、トランスファ成形時間に３分間〜５分
間（１５０℃）を要し、成形サイクルの点で問題があっ
た。また、耐熱性に点においても必ずしも満足できるレ
ベルとは言い難かった。本発明の目的は、透明性、耐熱
性に優れ、かつ速硬化性を有する光半導体封止用エポキ
シ樹脂組成物を提供することにある。However, although the general epoxy resin composition is at a usable level in terms of transparency, it requires a transfer molding time of 3 minutes to 5 minutes (150 ° C.) and a molding cycle. There was a problem with. Further, it was difficult to say that the heat resistance is always at a satisfactory level. An object of the present invention is to provide an epoxy resin composition for optical semiconductor encapsulation, which is excellent in transparency and heat resistance and has a fast curing property.
【０００４】[0004]
【課題を解決するための手段】本発明は上記課題を解決
するために、エポキシ樹脂、硬化剤、硬化促進剤を主体
とするエポキシ樹脂組成物において、四塩基酸無水物を
含有する硬化剤を用いるこを特長とする。更には、四塩
基酸無水物が脂環式四塩基酸無水物であり、これと脂環
式二塩基酸無水物との混合硬化剤を使用することを特長
とする。In order to solve the above-mentioned problems, the present invention provides an epoxy resin composition mainly containing an epoxy resin, a curing agent and a curing accelerator, which comprises a curing agent containing a tetrabasic acid anhydride. The feature is that it is used. Furthermore, it is characterized in that the tetrabasic acid anhydride is an alicyclic tetrabasic acid anhydride, and a mixed curing agent of this and an alicyclic dibasic acid anhydride is used.
【０００５】本発明で用いるエポキシ樹脂としては、従
来公知のもので着色の少ない物であれば特に制限されな
い。例えばビスフェノールＡ型エポキシ樹脂、水添ビス
フェノール型エポキシ樹脂、ビスフェノールＦ型エポキ
シ樹脂、脂環式エポキシ樹脂、フェノールノボラック型
エポキシ樹脂、トリグリシジルイソシアヌレート等の含
複素環エポキシ樹脂等が挙げられ、単独でもしくは併せ
て用いられる。The epoxy resin used in the present invention is not particularly limited as long as it is a conventionally known epoxy resin with little coloring. Examples thereof include bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, phenol novolac type epoxy resin, and heterocyclic epoxy resin containing triglycidyl isocyanurate, etc. Or used together.
【０００６】本発明に使用される硬化剤は、脂環式二塩
基酸無水物としてはヘキサヒドロフタル酸無水物又はメ
チルヘキサヒドロフタル酸無水物が挙げられ、脂環式四
塩基酸無水物としては、５−（２，５−ジオキソテトラ
ヒドロ−３−フラニル）−３−シクロヘキセン−１，２
−ジカルボン酸無水物等が挙げられる。これら二塩基酸
無水物と四塩基酸無水物からなる混合硬化剤の配合割合
は、四塩基酸無水物の配合量が硬化剤全体の５０ｗｔ％
以下であることが望ましい。四塩基酸無水物の配合量が
硬化剤全体の５０ｗｔ％を越えた場合、速硬化性、耐熱
性は殆ど向上せず、むしろ透明性、ポットライフ、経済
性が不利になるからである。The curing agent used in the present invention includes hexahydrophthalic anhydride or methylhexahydrophthalic anhydride as an alicyclic dibasic acid anhydride, and an alicyclic tetrabasic anhydride. Is 5- (2,5-dioxotetrahydro-3-furanyl) -3-cyclohexene-1,2.
-Dicarboxylic acid anhydride etc. are mentioned. The blending ratio of the mixed curing agent composed of these dibasic acid anhydrides and tetrabasic acid anhydrides is such that the blending amount of the tetrabasic acid anhydride is 50 wt% of the total curing agent.
The following is desirable. This is because when the amount of the tetrabasic acid anhydride compounded exceeds 50 wt% of the total amount of the curing agent, the rapid curing property and heat resistance are hardly improved, and the transparency, pot life and economy are rather disadvantageous.
【０００７】エポキシ樹脂の酸無水物硬化剤に対する当
量比は０．８〜１．１が好ましく、当量比０．８未満で
は耐熱性、透明性の低下を招く。また、当量比が１．１
を越えた場合には、吸水率が増大し耐湿性が低下する。
更に、本発明で用いる硬化促進剤は、特に限定されず公
知のものでよく、イミダゾール類、ＤＢＵ及びその塩、
三級アミン類、アンモニウム塩、ホスホニウム塩などが
例示されるが、この添加量はエポキシ樹脂と硬化剤との
合計量に対して０．１〜５ｗｔ％とすればよい。The equivalent ratio of the epoxy resin to the acid anhydride curing agent is preferably 0.8 to 1.1. If the equivalent ratio is less than 0.8, heat resistance and transparency will be deteriorated. The equivalence ratio is 1.1
If it exceeds, the water absorption rate increases and the moisture resistance decreases.
Further, the curing accelerator used in the present invention is not particularly limited and may be a known one, such as imidazoles, DBU and salts thereof,
Examples include tertiary amines, ammonium salts, phosphonium salts, and the like, and the addition amount may be 0.1 to 5 wt% with respect to the total amount of the epoxy resin and the curing agent.
【０００８】また、本発明のエポキシ樹脂組成物には、
上記各成分以外に必要に応じて離型剤、酸化防止剤、着
色剤、紫外線吸収剤、可視光吸収剤、充填材等の従来公
知の添加剤が用いられる。上記酸化防止剤としては、フ
ェノール系化合物、フォスファイト系化合物、有機硫黄
系化合物等従来公知のものが挙げられる。The epoxy resin composition of the present invention also contains
In addition to the above components, conventionally known additives such as a release agent, an antioxidant, a colorant, an ultraviolet absorber, a visible light absorber, and a filler are used as necessary. Examples of the above-mentioned antioxidant include phenol compounds, phosphite compounds, organic sulfur compounds, and other conventionally known compounds.
【０００９】[0009]
【実施例】本発明を実施例により、さらに詳細に説明す
るが、本発明はこれに限定されるものではない。 （１）光透過率 分光光度計（日立製Ｕ−２０００型）を使用し、厚さ２
ｍｍの試料について５７０ｎｍにおける光透過率を測定
した。 （２）ガラス転移温度 直径４ｍｍ、長さ２０ｍｍの試料についてＴＭＡ（理学
製ＰＴＣ−１０Ａ型）を用い、５℃／分で昇温したとき
の試料の伸び率が急変する温度とした。 （３）速硬化性 下記条件のトランスファ成形を行い、成形品およびカル
（厚さ５ｍｍ）の硬化性（型からの離型性）を下記のご
とく評価した。 《トランスファ条件》 成形温度−−−１５０℃ 成形時間−−−１分間，３分間 成形圧力−−−７０ｋｇｆ／ｃｍ2 《成形品及びカル硬化性》 Ａ−−−成形品，カルとも離型性良 Ｂ−−−成形品離型性良，カル未硬化 Ｃ−−−成形品，カルとも離型不良EXAMPLES The present invention will be described in more detail with reference to examples, but the present invention is not limited thereto. (1) Light transmittance A spectrophotometer (Hitachi U-2000 type) was used to obtain a thickness of 2
The light transmittance at 570 nm of the mm sample was measured. (2) Glass transition temperature TMA (PTC-10A type manufactured by Rigaku) was used for a sample having a diameter of 4 mm and a length of 20 mm, and the temperature was set to a temperature at which the elongation rate of the sample suddenly changed when the temperature was raised at 5 ° C / min. (3) Fast Curing Property Transfer molding under the following conditions was performed, and the curability (mold release property) of the molded product and the cull (thickness 5 mm) was evaluated as follows. "Transfer Conditions" molding temperature --- 0.99 ° C. molding time --- 1 minute, 3 minutes molding pressure --- 70 kgf / cm 2 "molded article and cull curable" A --- moldings, Cal both releasability Good B --- Mold release of the molded product is good, uncured Cul C --- Mold release of both molded product and Cull is poor.
【００１０】実施例１〜４，比較例１ 下記の表１にしたがって、各原料を配合し、９０℃の熱
ロールにて１０分間混練後、冷却粉砕し、目的とする微
粉末状のエポキシ樹脂組成物を得た。次に、これらの樹
脂組成物を上記のトランスファ条件で成形し、離型可能
なものについては１５０℃、３時間アフタキュアを行
い、光透過率、ガラス転移温度を測定した。更に光透過
率についてはＩＲリフロー炉を使用し、２４０℃で１２
秒間の処理を行った後に再び光透過率を求めた。これら
の測定結果を表１に併せて示す。Examples 1 to 4 and Comparative Example 1 In accordance with Table 1 below, each raw material was blended, kneaded on a hot roll at 90 ° C. for 10 minutes, cooled and pulverized, and the desired fine powdery epoxy resin was obtained. A composition was obtained. Next, these resin compositions were molded under the above-mentioned transfer conditions, and those which could be released were subjected to aftercure for 3 hours at 150 ° C., and the light transmittance and the glass transition temperature were measured. Furthermore, regarding the light transmittance, an IR reflow furnace is used, and it is 12 at 240 ° C.
After the treatment for 2 seconds, the light transmittance was determined again. The results of these measurements are also shown in Table 1.
【００１１】[0011]
【表１】 ＊硬化剤当量＝０．９ ※１：油化シェル社製 ※２：日産化学社製。 ※３：新日本理化社製脂環式二塩基酸無水物。 ※４：大日本インキ社製脂環式四塩基酸無水物。 ※５：２Ｅ４ＭＺ 四国化成社製イミダゾール。[Table 1] * Curing agent equivalent = 0.9 * 1: Yuka Shell Co., Ltd. * 2: Nissan Chemical Co., Ltd. * 3: An alicyclic dibasic acid anhydride manufactured by Shin Nippon Rika. * 4: An alicyclic tetrabasic acid anhydride manufactured by Dainippon Ink and Chemicals. * 5: 2E4MZ Shikoku Kasei's imidazole.
【００１２】[0012]
【発明の効果】表１の結果から明らかなように、本発明
によれば、光透過性、耐熱性に優れ、かつ速硬化性を有
する光半導体封止用エポキシ樹脂組成物を提供すること
が可能である。As is clear from the results of Table 1, according to the present invention, it is possible to provide an epoxy resin composition for encapsulating an optical semiconductor, which is excellent in light transmission and heat resistance and has a fast curing property. It is possible.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年３月３１日[Submission date] March 31, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】全文[Name of item to be corrected] Full text
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【書類名】 明細書[Document name] Statement
【発明の名称】 光半導体封止用エポキシ樹脂組成物Title: Epoxy resin composition for optical semiconductor encapsulation
【特許請求の範囲】[Claims]
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は透明性が高く、耐熱性に
優れ、かつ短時間成形が可能な光半導体封止用エポキシ
樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for encapsulating an optical semiconductor, which has high transparency and excellent heat resistance and can be molded in a short time.
【０００２】[0002]
【従来の技術】一般に発光素子および受光素子封止用に
は、透明性の優れた酸無水物硬化系のエポキシ樹脂組成
物が使用されている。例えばトランスファ成形用のエポ
キシ樹脂組成物においては、特開平１−１６７３５９号
公報、特開平２−２２２１６５号公報に開示されている
ように、硬化剤としてテトラヒドロ無水フタル酸やヘキ
サヒドロ無水フタル酸等の二塩基酸無水物が使用されて
いる。2. Description of the Related Art Generally, an acid anhydride-cured epoxy resin composition having excellent transparency is used for sealing a light emitting element and a light receiving element. For example, in an epoxy resin composition for transfer molding, as disclosed in JP-A-1-167359 and JP-A-2-222165, as a curing agent, tetrahydrophthalic anhydride, hexahydrophthalic anhydride or the like is used. Basic acid anhydrides have been used.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、一般の
エポキシ樹脂組成物は、透明性に関しては使用可能な水
準にあるものの、トランスファ成形時間に３分間〜５分
間（１５０℃）を要し、成形サイクルの点で問題があっ
た。また、耐熱性に点においても必ずしも満足できるレ
ベルとは言い難かった。本発明の目的は、透明性、耐熱
性に優れ、かつ速硬化性を有する光半導体封止用エポキ
シ樹脂組成物を提供することにある。However, although the general epoxy resin composition is at a usable level in terms of transparency, it requires a transfer molding time of 3 minutes to 5 minutes (150 ° C.) and a molding cycle. There was a problem with. Further, it was difficult to say that the heat resistance was always at a satisfactory level. An object of the present invention is to provide an epoxy resin composition for encapsulating an optical semiconductor, which is excellent in transparency and heat resistance and has a fast curing property.
【０００４】[0004]
【課題を解決するための手段】本発明は上記課題を解決
するために、エポキシ樹脂、硬化剤、硬化促進剤を主体
とするエポキシ樹脂組成物において、四塩基酸無水物を
含有する硬化剤を用いるこを特長とする。更には、四塩
基酸無水物が脂環式四塩基酸無水物であり、これと脂環
式二塩基酸無水物との混合硬化剤を使用することを特長
とする。In order to solve the above-mentioned problems, the present invention provides an epoxy resin composition mainly containing an epoxy resin, a curing agent and a curing accelerator, which comprises a curing agent containing a tetrabasic acid anhydride. The feature is that it is used. Furthermore, it is characterized in that the tetrabasic acid anhydride is an alicyclic tetrabasic acid anhydride, and a mixed curing agent of this and an alicyclic dibasic acid anhydride is used.
【０００５】本発明で用いるエポキシ樹脂としては、従
来公知のもので着色の少ない物であれば特に制限されな
い。例えばビスフェノールＡ型エポキシ樹脂、水添ビス
フェノール型エポキシ樹脂、ビスフェノールＦ型エポキ
シ樹脂、脂環式エポキシ樹脂、フェノールノボラック型
エポキシ樹脂、トリグリシジルイソシアヌレート等の含
複素環エポキシ樹脂等が挙げられ、単独でもしくは併せ
て用いられる。The epoxy resin used in the present invention is not particularly limited as long as it is a conventionally known epoxy resin with little coloring. Examples thereof include bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, phenol novolac type epoxy resin, and heterocyclic epoxy resin containing triglycidyl isocyanurate, etc. Or used together.
【０００６】本発明に使用される硬化剤は、脂環式二塩
基酸無水物としてはヘキサヒドロフタル酸無水物又はメ
チルヘキサヒドロフタル酸無水物が挙げられ、脂環式四
塩基酸無水物としては、５−（２，５−ジオキソテトラ
ヒドロ−３−フラニル）−３−シクロヘキセン−１，２
−ジカルボン酸無水物等が挙げられる。これら二塩基酸
無水物と四塩基酸無水物からなる混合硬化剤の配合割合
は、四塩基酸無水物の配合量が硬化剤全体の５０ｗｔ％
以下であることが望ましい。四塩基酸無水物の配合量が
硬化剤全体の５０ｗｔ％を越えた場合、速硬化性、耐熱
性は殆ど向上せず、むしろ透明性、ポットライフ、経済
性が不利になるからである。The curing agent used in the present invention includes hexahydrophthalic anhydride or methylhexahydrophthalic anhydride as an alicyclic dibasic acid anhydride, and an alicyclic tetrabasic anhydride. Is 5- (2,5-dioxotetrahydro-3-furanyl) -3-cyclohexene-1,2.
-Dicarboxylic acid anhydride etc. are mentioned. The blending ratio of the mixed curing agent composed of these dibasic acid anhydrides and tetrabasic acid anhydrides is such that the blending amount of the tetrabasic acid anhydride is 50 wt% of the total curing agent.
The following is desirable. This is because when the amount of the tetrabasic acid anhydride compounded exceeds 50 wt% of the total amount of the curing agent, the rapid curing property and heat resistance are hardly improved, and the transparency, pot life and economy are rather disadvantageous.
【０００７】エポキシ樹脂の酸無水物硬化剤に対する当
量比は０．８〜１．１が好ましく、当量比０．８未満で
は耐熱性、透明性の低下を招く。また、当量比が１．１
を越えた場合には、吸水率が増大し耐湿性が低下する。
更に、本発明で用いる硬化促進剤は、特に限定されず公
知のものでよく、イミダゾール類、ＤＢＵ及びその塩、
三級アミン類、アンモニウム塩、ホスホニウム塩などが
例示されるが、この添加量はエポキシ樹脂と硬化剤との
合計量に対して０．１〜５ｗｔ％とすればよい。The equivalent ratio of the epoxy resin to the acid anhydride curing agent is preferably 0.8 to 1.1. If the equivalent ratio is less than 0.8, heat resistance and transparency will be deteriorated. The equivalence ratio is 1.1
If it exceeds, the water absorption rate increases and the moisture resistance decreases.
Further, the curing accelerator used in the present invention is not particularly limited and may be a known one, such as imidazoles, DBU and salts thereof,
Examples include tertiary amines, ammonium salts, phosphonium salts, and the like, and the addition amount may be 0.1 to 5 wt% with respect to the total amount of the epoxy resin and the curing agent.
【０００８】また、本発明のエポキシ樹脂組成物には、
上記各成分以外に必要に応じて離型剤、酸化防止剤、着
色剤、紫外線吸収剤、可視光吸収剤、充填材等の従来公
知の添加剤が用いられる。上記酸化防止剤としては、フ
ェノール系化合物、フォスファイト系化合物、有機硫黄
系化合物等従来公知のものが挙げられる。The epoxy resin composition of the present invention also contains
In addition to the above components, conventionally known additives such as a release agent, an antioxidant, a colorant, an ultraviolet absorber, a visible light absorber, and a filler are used as necessary. Examples of the above-mentioned antioxidant include phenol compounds, phosphite compounds, organic sulfur compounds, and other conventionally known compounds.
【０００９】[0009]
【実施例】本発明を実施例により、さらに詳細に説明す
るが、本発明はこれに限定されるものではない。 （１）光透過率 分光光度計（日立製Ｕ−２０００型）を使用し、厚さ２
ｍｍの試料について５７０ｎｍにおける光透過率を測定
した。 （２）ガラス転移温度 直径４ｍｍ、長さ２０ｍｍの試料についてＴＭＡ（理学
製ＰＴＣ−１０Ａ型）を用い、５℃／分で昇温したとき
の試料の伸び率が急変する温度とした。 （３）速硬化性 下記条件のトランスファ成形を行い、成形品およびカル
（厚さ５ｍｍ）の硬化性（型からの離型性）を下記のご
とく評価した。 《トランスファ条件》 成形温度−−−１５０℃ 成形時間−−−１分間，３分間 成形圧力−−−７０ｋｇｆ／ｃｍ2 《成形品及びカル硬化性》 Ａ−−−成形品，カルとも離型性良 Ｂ−−−成形品離型性良，カル未硬化 Ｃ−−−成形品，カルとも離型不良EXAMPLES The present invention will be described in more detail with reference to examples, but the present invention is not limited thereto. (1) Light transmittance A spectrophotometer (Hitachi U-2000 type) was used to obtain a thickness of 2
The light transmittance at 570 nm of the mm sample was measured. (2) Glass transition temperature TMA (PTC-10A type manufactured by Rigaku) was used for a sample having a diameter of 4 mm and a length of 20 mm, and the temperature was set to a temperature at which the elongation rate of the sample suddenly changed when the temperature was raised at 5 ° C / min. (3) Fast Curing Property Transfer molding under the following conditions was performed, and the curability (mold release property) of the molded product and the cull (thickness 5 mm) was evaluated as follows. "Transfer Conditions" molding temperature --- 0.99 ° C. molding time --- 1 minute, 3 minutes molding pressure --- 70 kgf / cm 2 "molded article and cull curable" A --- moldings, Cal both releasability Good B --- Mold release of the molded product is good, uncured Cul C --- Mold release of both molded product and Cull is poor.
【００１０】実施例１〜４，比較例１ 下記の表１にしたがって、各原料を配合し、９０℃の熱
ロールにて１０分間混練後、冷却粉砕し、目的とする微
粉末状のエポキシ樹脂組成物を得た。次に、これらの樹
脂組成物を上記のトランスファ条件で成形し、離型可能
なものについては１５０℃、３時間アフタキュアを行
い、光透過率、ガラス転移温度を測定した。更に光透過
率についてはＩＲリフロー炉を使用し、２４０℃で１２
秒間の処理を行った後に再び光透過率を求めた。これら
の測定結果を表１に併せて示す。Examples 1 to 4 and Comparative Example 1 In accordance with Table 1 below, each raw material was blended, kneaded on a hot roll at 90 ° C. for 10 minutes, cooled and pulverized, and the desired fine powdery epoxy resin was obtained. A composition was obtained. Next, these resin compositions were molded under the above-mentioned transfer conditions, and those which could be released were subjected to aftercure for 3 hours at 150 ° C., and the light transmittance and the glass transition temperature were measured. Furthermore, regarding the light transmittance, an IR reflow furnace is used, and it is 12 at 240 ° C.
After the treatment for 2 seconds, the light transmittance was determined again. The results of these measurements are also shown in Table 1.
【００１１】[0011]
【表１】 ＊硬化剤当量＝０．９ ※１：三井石油化学工業社製 ※２：日産化学社製。 ※３：新日本理化社製脂環式二塩基酸無水物。 ※４：大日本インキ社製脂環式四塩基酸無水物。 ※５：２Ｅ４ＭＺ 四国化成社製イミダゾール。[Table 1] * Curing agent equivalent = 0.9 * 1: Mitsui Petrochemical Co., Ltd. * 2: Nissan Chemical Co., Ltd. * 3: An alicyclic dibasic acid anhydride manufactured by Shin Nippon Rika. * 4: An alicyclic tetrabasic acid anhydride manufactured by Dainippon Ink and Chemicals. * 5: 2E4MZ Shikoku Kasei's imidazole.
【００１２】[0012]
【発明の効果】表１の結果から明らかなように、本発明
によれば、光透過性、耐熱性に優れ、かつ速硬化性を有
する光半導体封止用エポキシ樹脂組成物を提供すること
が可能である。 ─────────────────────────────────────────────────────
As is clear from the results of Table 1, according to the present invention, it is possible to provide an epoxy resin composition for encapsulating an optical semiconductor, which is excellent in light transmission and heat resistance and has a fast curing property. It is possible. ─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年１２月２４日[Submission date] December 24, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００３[Name of item to be corrected] 0003
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００３】しかしながら、一般のエポキシ樹脂組成物
は、透明性に関しては使用可能な水準にあるものの、ト
ランスファ成形時間に３分間〜５分間（１５０℃）を要
し、成形サイクルの点で問題があった。また、耐熱性の
点においても必ずしも満足できるレベルとは言い難かっ
た。However, although the general epoxy resin composition is at a usable level in terms of transparency, it requires a transfer molding time of 3 minutes to 5 minutes (150 ° C.), which causes a problem in molding cycle. It was Further, it was difficult to say that the heat resistance was always at a satisfactory level.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００６[Correction target item name] 0006
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００６】本発明に使用される硬化剤は、脂環式二塩
基酸無水物としてはヘキサヒドロフタル酸無水物又はメ
チルヘキサヒドロフタル酸無水物が挙げられ、脂環式四
塩基酸無水物としては、５−（２，５−ジオキソテトラ
ヒドロ−３−フラニル）−３−メチル−３−シクロヘキ
セン−１，２−ジカルボン酸無水物等が挙げられる。こ
れら二塩基酸無水物と四塩基酸無水物からなる混合硬化
剤の配合割合は、四塩基酸無水物の配合量が硬化剤全体
の５０ｗｔ％以下であることが望ましい。四塩基酸無水
物の配合量が硬化剤全体の５０ｗｔ％を越えた場合、速
硬化性、耐熱性は殆ど向上せず、むしろ透明性、ポット
ライフ、経済性が不利になるからである。The curing agent used in the present invention includes hexahydrophthalic anhydride or methylhexahydrophthalic anhydride as an alicyclic dibasic acid anhydride, and an alicyclic tetrabasic anhydride. Examples include 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride and the like. As for the blending ratio of the mixed curing agent composed of these dibasic acid anhydride and tetrabasic acid anhydride, it is desirable that the blending amount of the tetrabasic acid anhydride is 50 wt% or less of the entire curing agent. This is because when the amount of the tetrabasic acid anhydride compounded exceeds 50 wt% of the total amount of the curing agent, the rapid curing property and heat resistance are hardly improved, and the transparency, pot life and economy are rather disadvantageous.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01L 23/31
Claims (3)
体とするエポキシ樹脂組成物において、四塩基酸無水物
を含有する硬化剤を用いることを特徴とする光半導体封
止用エポキシ樹脂組成物。1. An epoxy resin composition for encapsulating an optical semiconductor, comprising an epoxy resin composition containing an epoxy resin, a curing agent and a curing accelerator as a main component, and using a curing agent containing a tetrabasic acid anhydride. ..
である請求項１記載の光半導体封止用エポキシ樹脂組成
物。2. The epoxy resin composition for optical semiconductor encapsulation according to claim 1, wherein the tetrabasic acid anhydride is an alicyclic tetrabasic acid anhydride.
二塩基酸無水物からなる混合硬化剤である請求項１記載
の光半導体封止用エポキシ樹脂組成物。3. The epoxy resin composition for optical semiconductor encapsulation according to claim 1, wherein the curing agent is a mixed curing agent composed of an alicyclic tetrabasic acid anhydride and an alicyclic dibasic acid anhydride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4028044A JP2864842B2 (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for optical semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4028044A JP2864842B2 (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for optical semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05226701A true JPH05226701A (en) | 1993-09-03 |
| JP2864842B2 JP2864842B2 (en) | 1999-03-08 |
Family
ID=12237750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4028044A Expired - Fee Related JP2864842B2 (en) | 1992-02-14 | 1992-02-14 | Epoxy resin composition for optical semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2864842B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117134A3 (en) * | 2000-01-11 | 2002-05-29 | Toyoda Gosei Co., Ltd. | Encapsulant for light-emitting devices |
| WO2006009115A1 (en) * | 2004-07-23 | 2006-01-26 | Daicel Chemical Industries, Ltd. | Thermosetting resin composition, sealing material for optical device and cured product |
-
1992
- 1992-02-14 JP JP4028044A patent/JP2864842B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1117134A3 (en) * | 2000-01-11 | 2002-05-29 | Toyoda Gosei Co., Ltd. | Encapsulant for light-emitting devices |
| US6617787B2 (en) | 2000-01-11 | 2003-09-09 | Toyoda Gosei Co., Ltd. | Light-emitting system with alicyclic epoxy sealing member |
| WO2006009115A1 (en) * | 2004-07-23 | 2006-01-26 | Daicel Chemical Industries, Ltd. | Thermosetting resin composition, sealing material for optical device and cured product |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2864842B2 (en) | 1999-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111826105B (en) | Packaging adhesive for LED and use method and application thereof | |
| JP3623530B2 (en) | Optical semiconductor device | |
| JPS60124617A (en) | Resin-sealed emitter | |
| JPH05226701A (en) | Epoxy resin composition for sealing optical semiconductor | |
| JP2018009090A (en) | Resin composition for optical semiconductors and method for producing the same, and optical semiconductor device | |
| JPH06128359A (en) | Epoxy resin composition and photosemiconductor device sealed therewith | |
| JPH06279568A (en) | Epoxy resin composition and photosemiconductor device used the same | |
| JP2646391B2 (en) | Liquid epoxy resin composition | |
| JPH03277654A (en) | Epoxy resin composition | |
| JPH0797432A (en) | Epoxy resin composition and photosemiconductor device sealed therewith | |
| JPS60140884A (en) | Epoxy resin composite for optical semiconductor sealing | |
| JP2724499B2 (en) | Epoxy resin composition | |
| JPH04153213A (en) | Resin composition | |
| JP2712876B2 (en) | Transparent epoxy resin composition for transfer mold | |
| JP2970214B2 (en) | Epoxy resin composition for optical semiconductor encapsulation | |
| JPS59174618A (en) | Epoxy resin composition for photo-semiconductor sealant having excellent moisture resistance | |
| JPH04363054A (en) | Epoxy resin composition for optical-semiconductor sealing use | |
| JPH05152464A (en) | Epoxy resin composition for photosemiconductor sealing | |
| JPH0827253A (en) | Photosemiconductor apparatus | |
| JP2011037996A (en) | Transparent resin composition and method for producing the same, and optical semiconductor device | |
| JPH06228281A (en) | Epoxy resin composition for sealing semiconductor | |
| JPH02219814A (en) | Epoxy resin composition | |
| JP2001240652A (en) | Epoxy resin composition for sealing optical semiconductor and optical semiconductor device | |
| JPH03166221A (en) | Epoxy resin composition | |
| JP3644711B2 (en) | Optical semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |